Abstract: A semiconductor memory device includes memory modules which have memories and a data bus which transfers data to the memory modules, in which the data bus comprises a low frequency band data pass unit which removes the high frequency component of the data and sends the data to the memory modules. The low frequency band data pass unit comprises a plurality of stubs which are connected to the data bus in parallel and are formed as printed circuit board (PCB) patterns. The low frequency band data pass unit comprises a plurality of plates that are connected to the data bus in parallel and are formed as PCB patterns. The low frequency band data pass unit has a shape in which parts having a wide width and parts having a narrow width are alternately connected.

Abstract: A stripline structure. The stripline structure includes a stripline transmission line, a first ground plane, a first dielectric layer overlaying the first ground plane, a conductive trace overlaying the first dielectric layer, a second dielectric layer overlaying the conductive trace, a second ground plane overlaying the second dielectric layer, multiple first conductive vias, and multiple second conductive vias. Each first conductive via and each second conductive via electrically connects the first ground plane to the second ground plane. The multiple first conductive vias are located along a first line parallel to the conductive trace, and the multiple second conductive vias are located along a second line parallel to the conductive trace. The first line and the second line are located on opposite sides of the conductive trace.

Abstract: Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.

Abstract: A directional coupler for low frequencies that is small and can handle high power levels. The directional coupler includes a pair of circuit lines having an input port, an output port, a forward coupled port and a reverse coupled port. The circuit lines are located proximate to each other such that they are electromagnetically coupled. A low pass filter is connected to the forward coupled port. The low pass filter shifts the operating frequency of the directional coupler.

Abstract: A system and method are disclosed for improving the reliability of parallel-coupled line filters. In one embodiment, a parallel-coupled line filter system is disclosed which comprises at least one open-line resonator, at least one defected ground structure arranged on opposite sides of the line resonator having a first lattice and a second lattice in a skew-symmetrical fashion and coupled through a slim gap, wherein the first and second lattices are formed on a ground plane.

Abstract: An electrical connecting element (1) comprises a dielectric substrate (2) on which a plurality of coplanar and substantially parallel conductor paths (3, 4, 5; 11, 12 13; 23, 24, 25, 26, 27) is arranged. At least one of these conductor paths constitutes a signal-carrying conductor path (3; 11; 23, 24), and at least one conductor path (4, 5; 12, 13; 25, 26, 27) on each side of the signal-carrying conductor path constitutes a ground plane, so that the three conductor paths together constitute a waveguide. The dielectric substrate (2) is formed by a flexible sheet. In a method of making such an electrical connecting element, a carrier member (31) is caused to rotate at a high rate, and then plastics material (32) in liquid form is placed on the rotating carrier member, so that the plastics material is slung into a thin sheet (33). Metallic conductor paths (37) are subsequently arranged on the plastic sheet thus produced, and the plastics sheet (33) is then removed from the carrier member (31).

Abstract: In one embodiment, a switch includes first and second mated substrates defining therebetween a number of cavities. A plurality of electrically conductive elements extends to near at least a first of the cavities. A switching fluid, held within at least the first of the cavities, serves to electrically, but not physically, couple and decouple at least a pair of the electrically conductive elements, in response to forces that are applied to the switching fluid. A passivation layer covers at least a first of the electrically conductive elements and i) separates the first of the electrically conductive elements from at least the first of the cavities, and ii) is a dielectric for a capacitor formed between the first of the electrically conductive elements and the switching fluid. Other switches, and methods for making same, are also disclosed.

Abstract: An impedance-matching electrical connection system, for use with high-frequency communication signals, includes a circuit board and a plurality of contact pads mounted on the circuit board. The contact pads are for coupling with a plurality of complementary connectors of an external electrical device. Each coupling is associated with an excess shunt capacitance. The electrical connection system further includes a plurality of inductive traces mounted on the circuit board, each of which is connected to a respective contact pad, and is associated with a compensating series inductance. Additionally, the electrical connection system includes a plurality of signal lines mounted on the circuit board, each of which is connected to a respective inductive trace. Each inductive trace is configured so that its associated compensating series inductance substantially offsets the excess shunt capacitance associated with the coupling between the contact pad connected to the inductive trace and a complementary connector.

Abstract: A signal transmission structure including a signal line, a first reference plane with a first opening, and a second reference plane with a second opening is provided. The first reference plane is disposed beside the signal line, and a portion of the signal line passes through a position of the first opening. In addition, the second reference plane is disposed beside the first reference plane, and the second opening is in a position corresponding to the position of the first opening, while the outline of the second opening projected onto the first reference plane does not overlap with the position of the first opening. Therefore, at high frequency-transmission, the above structure can reduce the insertion loss resulted from impedance mismatch as the signal passes through the opening, and reduce the resonance induced by the coupling between two reference planes to enhance the quality of signal transmission.

Abstract: Since a width of an edge portion of a signal line of a first high frequency transmission line is changed with respect to a width of another portion thereof, a deviation of impedances in a connection portion of the first and second high frequency transmission lines can be suppressed, so that signal reflections occurred in the connection portion can be lowered and a signal passing characteristic is improved.

Abstract: A novel package includes a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate, a die located on the upper ground plane and including a die pad, a transmission path including, on the upper surface of the substrate, a bonding pad connected to a first transmission line itself connected to a transition pad, and on the lower surface of the substrate, a second transmission line connected to the transition pad by a via through the substrate. A wire bond extends from the bonding pad to the die pad. A portion of the upper surface ground plane and the lower surface ground plane are connected by vias defining opposing walls on either side of the transmission path for signal isolation.

Abstract: In one aspect, a signal path is described. The signal path has a nominal impedance over a specified bandwidth and interconnects a port of a microwave circuit package and a microwave component mounted in the microwave circuit package. The signal path includes an inductive transition and first and second capacitive structures. The inductive transition extends from a first point on the signal path to a second point on the signal path and has an excess impedance above the nominal impedance. The first and second capacitive structures respectively shunt the first and second points on the signal path to compensate the excess impedance of the inductive transition. The inductive transition and the first and second capacitive structures approximate a filter having an impedance substantially matching the nominal impedance over the specified bandwidth.

Abstract: Circuit board having a plurality of bus lines (6), which run on the circuit board (1) essentially parallel to a preferred direction of the circuit board (1), and having at least one integrated circuit (3) for the high-speed data processing of data, which integrated circuit is arranged on the circuit board (1), is integrated in a housing (4) having a plurality of housing sides (5) and has a plurality of parallel interfaces for connection to the bus lines (6), in which case the housing sides (5) of the integrated circuits (3) are oriented at an inclination with respect to the preferred direction of the circuit board (2).

Abstract: A circuit structure may include first and second transmission lines, each with a center conductor extending along or between one or more spaced-apart conducting surfaces. A conducting surface, such as a ground, reference, or signal-return plane, of the first transmission line may have an orientation that is transverse to the orientation of a conducting surface of the second transmission line. Each of the conducting surfaces of the first transmission line may contact one or more of the conducting surfaces of the second transmission line. In some examples, one or both of the transmission lines are slablines, and in some examples, the contacting edges or edges adjacent the contacting edges of the respective conductive surfaces are curved.

Abstract: Transmission line impedance matching is described for matching an impedance discontinuity on a transmission signal trace. The apparatus includes a transmission signal trace and a non-transmission trace. The transmission signal trace has an impedance discontinuity, a first length, and a predetermined first width. The non-transmission trace is disposed near the transmission signal trace at a region corresponding to the impedance discontinuity. The non-transmission trace has a second length that is substantially less than the first length of the transmission signal trace. Additionally, the non-transmission trace is configured to be electromagnetically coupled to the transmission signal trace in the presence of a current on the transmission signal trace to provide a matched impedance on the transmission signal trace.

Abstract: If a transmission oscillator is incorporated into a communication semiconductor integrated circuit, such as high a frequency IC, constituting a wireless communication system, a problem arises. The accuracy of control of the output power of a power amplifier is degraded. This degradation in accuracy is caused by coupling noise between the output pins of the transmission oscillator and an input pin for detection signals (feedback signals) associated with the output level of the power amplifier or crosstalk. To prevent this, a transmission oscillator of differential output configuration is incorporated into a high frequency IC and an impedance equivalent to the impedance connected with a regular output terminal or a dummy external terminal for outputting transmit signals in opposite phase is provided.

Abstract: A coupler may include four ports, and first and second sets of conductive strips. Each set of conductive strips may include a plurality of interconnected conductive strips connected between two ports. Each conductive strip of the first set may be electromagnetically coupled to a conductive strip of the second set. Conductive tabs capacitively coupled directly or indirectly to the ground conductor may extend from conductive strips of the first and second sets. An interconnection may be positioned between adjacent tabs, the interconnection connecting conductive strips of one of the sets of conductive strips. The adjacent tabs may be spaced different distances from the interconnection.

Abstract: Methods of assembling a coupler are provided in which a first printed circuit board is provided, and a second printed circuit board is then surface mounted on the first printed circuit board. The first printed circuit board and the second printed circuit board are then electrically and mechanically connected to provide a coupler having a shielded region defined between the first printed circuit board and the second printed circuit board. The shielded region at least partly surrounds a coupler circuit disposed therein.

Abstract: A signal transmission structure is provided. The signal transmission structure has salients. The salients are corresponding to the position of the non-reference region and protrude from a lateral side of the signal traces. When the signals are transmitted on the signal traces, the parasitic capacitance between the salients and the reference plane can improve the characteristic impedance mismatch. Hence, when the signals are transmitted in a high frequency/high speed environment, the salients of the signal transmission structure reduce the effect of the near-end and far-end crosstalk generated by the other signal trace when a signal trace passes through a non-reference region, in order to keep the good quality of the signals.

Abstract: Methods and apparatus for implementing standing wave oscillators (SWOS) using coplanar striplines (CPS). One example is given by a quarter-wavelength (?/4) coplanar stripline standing wave oscillator (SWO), while another implementation utilizes a closed-loop coplanar stripline configuration. In various aspects, SWOs are configured to optimize sinusoidal performance at high frequencies with low power dissipation by incorporating various features that dramatically increase the quality factor Q of the oscillator. In particular, in one aspect, an amplitude-dependent tailored distributed amplification scheme is employed as a mode control technique using multiple amplifiers having different gains along the length of the coplanar stripline. In another aspect, a coplanar stripline configured such that its resistance per unit length R and conductance per unit length G are discreet or continuous functions of position along the coplanar stripline is employed to reduce SWO losses.

Abstract: A signal transmission structure is disclosed. The signal transmission structure is adapted for a circuit substrate, including at least a signal line, a plating bar and a reference plane. The plating bar is disposed on a side of the reference plane and connected to the signal line. In addition, the plating bar is disposed on the side of the reference plane, and the reference plane has a non-reference area corresponding to the plating bar. The signal transmission structure can reduce the impedance mismatch at the conjunction of the signal line and the plating bar, and the resonant frequency of the plating bar can be improved as to generate a desired transmission quality of the signal.

Abstract: The transmission line is provided with a signal strip, a resistive layer opposed to the signal strip across a dielectric layer, and a ground conductor electrically connected to the resistive layer, wherein, in the case where resistance per unit length occurring when a high frequency current induced in the resistive layer through capacitance formed by the dielectric layer between the signal strip and the resistive layer flows in the resistive layer and between the resistive layer and the ground conductor at the time of transmission of a high frequency signal of a predetermine frequency through the signal strip is defined as additional resistance and resistance per unit length occurring when the high frequency current flows through the ground conductor is defined as ground resistance, the additional resistance is larger than the ground resistance.

Abstract: The present invention provides a mechanism for supporting high digital bandwidth in a multi-drop bus system. A first device of the system is electrically coupled to a bus. Multiple receiving devices are coupled to the bus through associated electromagnetic couplers having coupling coefficients in a specified range. The geometries of the electromagnetic couplers are selected to reduce variations in the coupling coefficients with changes in the relative positions of the coupler components.

Abstract: A miniaturized multi-layer balun includes a pair of capacitive elements, at least one section of broadside coupled lines connected in series to an unbalanced and two balanced ports through a pair of transmission lines. Each section has first and second coupled lines. A ground connection is located between two central second coupled lines, and connected to a ground. By means of a multi-layer structure and the addition of a ground connection, the balun of the invention can be fabricated with five conductor layers. This not only greatly decreases the size of the balun device, but also enhances the stability of the device. From the measured return loss and differences in magnitude and phase to the frequency response, it shows that the balun of the invention has good impedance match.

Abstract: A composite waveguide termination structure including two different waveguide conductor geometries operatively located upon a common substrate, wherein each such waveguide geometry includes a ground conductor on the same surface of the substrate.

Abstract: A high frequency substrate includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a high-frequency signal transmission line. The first dielectric layer is formed on the first metal layer, and the second metal layer is formed on the first dielectric layer. The first and second metal layers are maintained in a stable voltage status due to the high dielectric coefficient of the first dielectric layer. Besides, the second dielectric layer is formed on the second metal layer. High speed and high frequency transmission are achieved when signals transmitting in the high-frequency transmission line formed on the second dielectric layer due to the low dielectric coefficient of the second dielectric layer.

Abstract: High frequency matching in a multilayer ceramic package is accomplished by a radial stub arrangement provided in one or more of the ground planes of a stack of layers forming the package. A signal via extends vertically upwardly between a ball grid array at a bottom surface of the stack and a coplanar waveguide in the form of a signal trace on a top surface of the stack. Each radial stub arrangement surrounds the signal via and is formed by a central space in the ground plane which surrounds the via and a plurality of stub-forming spaces in the ground plane which extend radially outwardly from the central space. The stub-forming spaces form a plurality of radial stubs which extends inwardly from the ground plane to locations adjacent but spaced apart from the signal via. The discontinuities provided by the spaces behave as a shunt inductance connected to a series capacitance.

Abstract: A directional coupler has a multi-layered low temperature co-fired ceramic substrate. A circuit line is located on one of the layers and is connected to an input port and an output port. Another circuit line is located on a different layer and is connected to a forward coupled port and a reverse coupled port. The circuit lines are located close to each other such that they are electromagnetically coupled. Ground planes are located on the top and bottom surfaces of the substrate.

Abstract: A scalable and compact computer system of three-dimensional subsystems each having capacitive couplers on its external surfaces for transmitting and receiving electrical signals to and from adjacent subsystems. Each surface having an electrically non-conducting substrate, one or more electrically conducting pads on the substrate, and electrical leads for coupling the pads to the subsystem's circuits. Two adjacent pads, each from a different subsystem, form a capacitive coupler to carry the signals between the subsystems. The pads are covered by a low-loss dielectric material having a large dielectric constant for improved signal transmission. A differential signal may be supported using two capacitive couplers to respectively carry the positive and negative signals of the differential signal. The subsystems might be replaced or left in place when they failed. Additional subsystems might be added to the system to expand its capacity.

Abstract: A suspended and truncated co-planar waveguide is described. The waveguide has a substrate with a substantially flat top surface and two lateral faces. A signal conductor and two ground conductors are placed on the top surface forming a ground-signal-ground pattern along a common plane. The waveguide has respective electrical side-wall boundaries on each of the two lateral faces of the substrate.

Abstract: The invention relates to a balun transformer for converting an unbalanced signal into a balanced signal or vice versa and having a bandpass characteristic for bandpass filtering the signal being converted. Such balanced transformers are substantially known in the art and comprise a first electronic circuit for transceiving the unbalanced signal and a second electronic circuit for transceiving the balanced signal wherein the first and the second electronic circuit are non-galvanically coupled via coupling elements. It is the object of the present invention to reduce the size of such known balun transformer. This object is achieved by embodying both electronic circuits as individual resonance circuits 100-1, 100-2 being operated at their individual resonance frequencies representing the centre frequencies of the bandpass filter characteristic.

Abstract: In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the substrate, including at least the recessed portion of the substrate, and a dielectric support film is on the substrate opposite the recessed portion of the substrate with an air space between the dielectric support film and the substrate. A second interconnecting conductor is on a part of a surface of the dielectric support film. The high frequency apparatus has a simple structure and reduced transmission loss and can be made in a simple manufacturing process.

Abstract: The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.

Abstract: A second strip conductor is located, in a lamination direction of a multilayer substrate, at a is different position from that of a first strip conductor. A first grounding conductor and a second grounding conductor are disposed sequentially in the lamination direction of the multilayer substrate and sandwich the first strip conductor and the second strip conductor. The first grounding conductor includes a first grounding conductor portion for a wiring prohibited area in which no wiring may be placed, and a second grounding conductor portion for an area other than the wiring prohibited area. The second grounding conductor portion is positioned, in the lamination direction of the multilayer substrate, at a location is different from that of the first grounding conductor portion.

Abstract: An apparatus and system may include a microstrip line capable of being coupled to an amplifier, wherein the microstrip line is to transform an input impedance of the amplifier to a substantially resistive value, and wherein the microstrip line has a characteristic impedance approximately equal to a selected system reference impedance. The apparatus and system may include a transformer coupled to the microstrip line, wherein the transformer is to transform the substantially resistive value into approximately a resistance of a source impedance included in a source. An article may include data, which, when accessed, results in a machine performing a method including simulating selecting a system having a reference impedance and simulating coupling an amplifier having an input impedance to a source having a source impedance using a transformer coupled to a microstrip line.

Abstract: An RF signal transition includes a channelized microstrip transmission structure, and a coplanar wave guide structure in electrical communication with the channelized microstrip transmission structure. A caged troughline transition structure is in electrical communication with the coplanar wave guide structure. A caged coaxial transmission structure is in electrical communication with the troughline transition structure. The signal transition may be embedded in a flexible printed wiring board structure with a circulator for a conformal antenna structure.

Abstract: An efficient solution to transform an output from a single ended source to a pair of differential signals that are provided to a differential receiver. The differential receiver is any number of devices including a differential clock receiver. The differential signals may be referenced to voltages used to receiver power supply voltages. The present invention obviates the need for an additional differential driver and its required additional devices that are needed to perform transformation of a single ended signal to a pair of differential signals. In one embodiment, two independent power and ground planes are communicatively coupled via a transmission line, or transmission line-like traces on a printed circuit board, and are used to provide uniform impedance control for all return paths within a system.

Abstract: A high-frequency circuit formed on a surface of a dielectric substrate includes: a signal strip formed on a first face of the dielectric substrate for transmitting a signal therethrough; a pair of ground strips formed on the first face astride the signal strip, with an interspace on each side of the signal strip; a ground conductor layer formed on a second face of the dielectric substrate, the second face being opposite to the first face; and a plurality of through-vias formed in the dielectric substrate astride the signal strip for electrically connecting the pair of ground strips to the ground conductor layer. First and second through-vias, which are a pair of opposing through-vias located closest to a terminating end of the signal strip, are disposed apart from each other by a distance smaller than a distance between any other pair of opposing through-vias.

Abstract: A cut via is formed in an end of a multilayer circuit board of the first transmission line, and a clearance is provided between the cut via and a ground pattern for achieving an impedance matching between the first and second transmission lines. The cut via of a first transmission line which may be a stripline or a microstrip line, and an electrode of the second transmission line are connected to each other, and ground patterns of the first and second transmission lines are connected to each other. The first and second transmission lines have respective signal lines positioned substantially coaxially with each other.

Abstract: A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. Such a coupler has a vertically-connected stripline structure in which multiple sets of stripline layers are separated by interstitial groundplanes, and wherein more than one set of layers has a segment of coupled stripline. A typical implementation operates at frequencies from approximately 0.5 to 6 GHz, although other frequencies are achievable.

Abstract: A surface mount technology (“SMT”) apparatus for use in routing radio frequencies (“RF”) between cavities that require a high level of isolation on a single printed circuit board (“PCB”). The SMT part is attached to the PCB over a stripline-ready trace which transitions to microstrip before and after the SMT stripline part to maintain consistent characteristic impedance. When presented with a high isolation need between two cavities using microstrip transmission lines, the proposed stripline SMT apparatus under the isolation wall will tend to provide the necessary isolation. The present invention provides a repeatable and reliable interconnect while improving the electrical match between the two cavities. Furthermore, the invention removes the costs associated with manually forming and soldering cables between PCBs.

Abstract: The transmission line is provided with a signal strip, a resistive layer opposed to the signal strip across a dielectric layer, and a ground conductor electrically connected to the resistive layer, wherein, in the case where resistance per unit length occurring when a high frequency current induced in the resistive layer through capacitance formed by the dielectric layer between the signal strip and the resistive layer flows in the resistive layer and between the resistive layer and the ground conductor at the time of transmission of a high frequency signal of a predetermine frequency through the signal strip is defined as additional resistance and resistance per unit length occurring when the high frequency current flows through the ground conductor is defined as ground resistance, the additional resistance is larger than the ground resistance.

Abstract: A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.

Abstract: A monolithically integrated microwave guide component for overcoupling high frequencies includes a first micro-waveguide that is structured on a micro-waveguide chip, and comprises a second micro-waveguide that is structured on a carrier substrate. The microwave guides are contacted to one another by a chip through-plating. The microwave guides each include, in the contact region, an integrated compensating structure that serves to compensate for reflections.

Abstract: A method relating to a balun for transmitting a high degree of high-frequency power where metal sheet element is soldered onto the loop conductor tract of the symmetrical circuit loop, the conductor track being configured as a printed circuit. The metal sheet element is leaked with a cooling element on the electrically cold mass point of the loop.

Abstract: A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Abstract: In a high-frequency module, a setting pattern formed on a circuit board has band-shaped first and second grounding lands, and first and second lands. External conductors of first and second forms of coaxial connectors are solderable to the grounding lands, and central conductors of first and second forms of coaxial connectors are solderable to the first and second lands. Accordingly, the first and second forms of coaxial connectors can be mounted on one circuit board. The circuit board can be manufactured more easily and at a lower cost in comparison with conventional art.

Abstract: A high frequency circuit substrate comprises a first high frequency circuit substrate including at least a first dielectric material layer, a first conductor layer, a second dielectric material layer and a second conductor layer, which are laminated in the named order, the first conductor layer having a first slot formed therein, and the second conductor layer forming a transmission line, the first dielectric material layer having a first opening exposing the first slot at its bottom. The high frequency circuit substrate also comprises a second high frequency circuit substrate including at least a third dielectric material layer, a third conductor layer, a fourth dielectric material layer and a fourth conductor layer, which are laminated in the named order, the third conductor layer having a second slot formed therein, and the fourth conductor layer forming a transmission line, the third dielectric material layer having a second opening exposing the second slot at its bottom.

Abstract: An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.