Abstract: A feeding apparatus includes a substrate, an annular grounded metal sheet having a first opening and a second opening, a rectangular grounded metal sheet extending from the annular grounded metal sheet toward an interior according to a configuration of a septum polarizer of a waveguide, a first parasitic grounded metal sheet extending from a side of the rectangular grounded metal sheet along a first direction, a second parasitic grounded metal sheet extending from another side of the rectangular grounded metal sheet along a second direction, a first feeding metal sheet extending from the first opening toward the interior and including a first portion, a second portion and a third portion and a second feeding metal sheet extending from the second opening toward the interior and including a fourth portion, a fifth portion and a sixth portion.

Abstract: A stacked diode limiter, which can suppress and eliminate a malicious high-power electromagnetic pulse signal and an Intentional Electromagnetic Interference (IEMI) signal that are input to the antenna line of a wireless system and that include a communication service frequency component having a power of several kW or more, includes a stacked diode unit including one or more diode stack parts formed on a center electrode of a coaxial line formed between an input connector and an output connector, each diode stack part being configured such that a plurality of diodes are arranged in series and stacked on top of one another, and an impedance matching unit for configuring dielectrics between the connectors and the coaxial line as heterogeneous dielectrics and matching impedances between the connectors and the coaxial line.

Abstract: A signal transmission line is disclosed. The signal transmission line includes a dielectric substrate, a signal line formed on a first surface of the dielectric substrate, a first conductive layer formed on a second surface of the dielectric substrate, and a first stub formed on the first surface of the dielectric substrate, the first stub being electrically connected with the signal line. The first stub includes a plurality of straight areas each extending from a different position of the signal line, a conductor part extending in parallel with the signal line, the conductor part being electrically connected with straight areas, a projection part connected with the conductor part, the projection part extending from the conductor part, and an opening provided between the conductor part and the signal line.

Abstract: Various embodiments may provide a monolithic transformer for a radio frequency (RF) power amplifier module, such as a microwave frequency power amplifier module. The transformer may include a plurality of pairs of edge-coupled transmission lines, with individual pairs including first and second edge-coupled transmission lines. The first transmission lines may include first ends coupled with one another and second ends coupled with an input terminal of the transformer. The second transmission lines may include first ends coupled with the input terminal and second ends coupled with an output terminal of the transformer. The transformer may pass a communication signal from the input terminal to the output terminal, and provide a first impedance at the input terminal and a second impedance at the output terminal. The second impedance may be higher than the first impedance (e.g., by a factor of four).

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: A high-frequency signal transmission line includes a flexible body including a plurality of insulating layers. A linear signal line is located in or on the body. A first ground conductor is located opposite to the signal line via at least one of the insulating layers. A second ground conductor extends along the signal line. An interlayer connection portion that connects the first ground conductor and the second ground conductor includes a plurality of interlayer connection conductors individually pierced in some of6 the insulating layers and connected to each other. The plurality of interlayer connection conductors includes two interlayer connection conductors that are pierced in adjacent ones of the insulating layers with respect to a layer-stacking direction and that have central axes located in different positions when viewed from the layer-stacking direction.

Abstract: A first line stub SB1 and one end of each of two switches SW1 and SW2 are connected to a transmission line 11L at spacings L1, L2 and L3 in order from the input end of the transmission line 11L, the other ends of the two switches are connected to a second line stub SB2, the first and second line stubs have an open end or short-circuit end, and matching at any of four frequency bands can be selected by combining on and off of the two switches SW1 and SW2.

Abstract: In a high frequency filter, a multilayer structure includes a plurality of insulator layers, a first transmission line transmits an input signal, and a second transmission line is electromagnetic coupled with the first transmission line on the same insulator layer and transmits an output signal. A conductor layer defines capacitors with the first transmission line and the second transmission line with the insulator layer in between. A dielectric constant of the insulator layer that comes in contact with the first transmission line and the second transmission line is higher than a dielectric constant of an insulator layer other than the insulator layer.

Abstract: In one embodiment, a vertical microcoaxial interconnect includes a dielectric substrate having a top side and a bottom side, an inner conductor extending through the substrate from its top side to its bottom side, an outer conductor that extends through the substrate from its top side to its bottom side, the outer conductor surrounding the inner conductor, a signal line extending to the inner conductor without contacting the outer conductor, and a ground line extending to the outer conductor without contacting the inner conductor or the signal line.

Abstract: The invention relates to a circuit for transition from a microstrip line to a slot line. According to the invention, the slot line of the transition circuit is equipped with a filter for providing on the slot line, at the crossover zone of the microstrip line and the slot line, an impedance substantially equal to the impedance of an open circuit for at least one desired frequency of the signal and an impedance substantially equal to the impedance of a short circuit for at least one undesirable frequency of the signal. Advantageously, the microstrip line is also equipped with a filter for providing on the microstrip line, at the crossover zone, an impedance substantially equal to the impedance of a short circuit for the desired frequency and an impedance substantially equal to the open-circuit impedance for the undesirable frequency.

Abstract: Presently disclosed is a matching network provided from a slow wave, wrapped, tapered-transformer transmission line.

Abstract: A microstrip line structure includes a conductive ground plane having a strip opening encircled by the ground plane. The strip opening extends from a top surface to a bottom surface of the ground plane. The microstrip line structure further includes a dielectric strip filling the strip opening; a dielectric layer over and contacting the ground plane; and a signal line over the dielectric layer, wherein the signal line has a portion directly above a portion of the dielectric strip, and wherein the signal line and the dielectric strip are non-parallel.

Abstract: An apparatus includes: a transmission circuit configured to output a differential signal; a first filter configured to filter the differential signal; a differential line that is configured to transmit the differential signal filtered and has an electrical length of m·?/2 (m: a positive integer); a second filter configured to filter the differential signal transmitted on the differential line; and a reception circuit to which the differential signal filtered by the second filter is input, wherein the first filter and the second filter are each constituted by a reactance element, and wherein impedance matching is implemented regarding a differential component of the differential signal at a frequency times as high as the basis frequency, and impedance mismatching is caused regarding a differential component of the differential signal at a frequency other than the frequency times as high as the basis frequency and a common-mode component of the differential signal.

Abstract: Various embodiments may provide a monolithic transformer for a radio frequency (RF) power amplifier module, such as a microwave frequency power amplifier module. The transformer may include a plurality of pairs of edge-coupled transmission lines, with individual pairs including first and second edge-coupled transmission lines. The first transmission lines may include first ends coupled with one another and second ends coupled with an input terminal of the transformer. The second transmission lines may include first ends coupled with the input terminal and second ends coupled with an output terminal of the transformer. The transformer may pass a communication signal from the input terminal to the output terminal, and provide a first impedance at the input terminal and a second impedance at the output terminal. The second impedance may be higher than the first impedance (e.g., by a factor of four).

Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.

Abstract: A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity.

Abstract: Disclosed is an insulation circuit comprising: a first pattern formed on a first layer of a substrate, that receives high-frequency signals; a second pattern formed on this first layer next to the first pattern and that outputs the high-frequency signals received by the first pattern; a third pattern formed on a second layer different from the first layer of the substrate and connected with a signal ground, in such a way that the first and second patterns respectively overlap in plan view; and a fourth pattern formed on the second layer next to the third pattern and connected with a frame ground, in such a way that the first and second patterns respectively overlap in plan view.

Abstract: A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

Abstract: The present technology relates to a transmission line and transmission method that allow multi-mode transmission to be easily performed using electrical signals as a transmission target. A multi-mode waveguide is connected to a metal wire configured to transmit an electrical signal via a matching structure configured to perform impedance matching between the multi-mode waveguide and the metal wire. For example, the electrical signal can be a signal of a millimeter wave band. For example, the multi-mode waveguide, the metal wire, and the matching structure can be arranged to be aligned on a plane. The present technology can be applied to, for example, transmission for electrical signals such as millimeter waves.

Abstract: A transmission system transmits a signal from a transmission terminal to a reception terminal via a pair of transmission lines. The transmission terminal side of the transmission lines is connected to a first resistor having a predetermined resistance value depending on the characteristic impedance of the transmission lines.

Abstract: A microstrip to airstrip transition is provided. The microstrip to airstrip transition includes a ground plane, a printed circuit board, a microstrip, a solder mask, and an airstrip. The ground plane has first and second sides. The printed circuit board has first and second sides and is disposed on the first side of the ground plane. The microstrip is disposed on a portion of the first side of the printed circuit board, and the solder mask is disposed over at least a portion of the microstrip. The airstrip is disposed over the at least portion of the solder mask, and the solder mask prevents direct contact between the microstrip and the airstrip.

Abstract: Tunable interconnect structures, integrated circuits containing the tunable interconnect structures and methods of manufacturing the same are disclosed. The interconnect transmission line structure includes a signal conductor and a plurality of conductors in proximity to the signal conductor. The structure further includes one or more switchable conductors in proximity to at least the signal conductor. The one or more switchable conductors has a programmable wiring switch with a terminal connected to the one or more switchable conductors and another terminal connected to ground.

Abstract: A signal converter configured to convert a signal between a substrate unit and a hollow waveguide includes a substrate unit, including a first conductor layer formed on one face of a dielectric substrate, and a second conductor layer formed on another face of the dielectric substrate, a plurality of conduction units that penetrate the dielectric substrate and provide conduction between the first conductor layer and the second conductor layer, an dielectric waveguide formed by the dielectric substrate, the first and second conductor layers, and the conduction units, and a conversion unit that converts the signal between the hollow waveguide and the dielectric waveguide, the conversion unit including a conductor patch having a separator region between itself and the first conductor layer, with the conductor patch being disposed on the substrate unit within an aperture of the hollow waveguide.

Abstract: A high-speed feedthrough (HSFT) is disclosed for transmitting a signal having a highest frequency of at least 10 GHz between first and second locations separated by a vertical distance of at least approximately half of the shortest transmitted wavelength, and separated by a horizontal distance. A substrate structure includes multiple stacked layers. An RF transmission line is connected through the structure between the first and second locations for transmitting the signal. The RF transmission line comprises a series of sequentially connected horizontal conductors having lengths less than half of the effective wavelength and vertical conductors having heights less than one quarter of the effective wavelength, thereby spanning the horizontal and vertical distance between the two locations in a stairs-like shape through the structure's layers. Each conductor's geometry may deviate from standard 50 ohm buried strip lines and is optimized for complete 3-dimensional structure.

Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.

Abstract: A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.

Abstract: Discloses are a transmission line having variable characteristic impedance and a combiner configured to combine a plurality of filter by use of the transmission line. The transmission line in accordance with an embodiment of the present invention includes: a first filter junction being connected with a first RF filter and configured to obtain an output signal of the first RF filter; a second filter junction being connected with a second RF filter and configured to obtain an output signal of the second RF filter; a first variable impedance section in which a phase of the output signal of the first RF filter is matched with a preset phase; and a second variable impedance section in which a phase of the output signal of the second RF filter is matched with the preset phase.

Abstract: An optical modulation device includes: an optical modulator; an insulating layer; an RC circuit including a resistor and a capacitor connected in series; a bonding wire connected between the optical modulator and the RC circuit; a first metal layer provided on the insulating layer; and a second metal layer that has a width larger than that of the first metal layer and is provided on the insulating layer, the second metal layer being connected with a ground potential and being connected to the RC circuit via the first metal layer.

Abstract: A transmission line having a plurality of branch lines that respectively include a first end part and a second end part and have a same line length, in which at least part of the plurality of branch lines includes bent shapes, the first end parts of the plurality of branch lines are connected to a common terminal, and the second end parts of the plurality of branch lines are connected to a common terminal. The plurality of branch lines may include two micro strip lines that are formed on substrates having the same dielectric constant and have bent shapes in symmetry with each other with respect to a straight line.

Abstract: A signal line that can be easily bent and significantly reduces loss generated in a high-frequency signal includes a main body including a plurality of insulating sheets made of a flexible material and stacked on each other in a stacking direction. Ground conductors are provided in the main body on the positive z-axis direction side of a signal line. The ground conductors have a slit S formed therein that overlaps the signal line when viewed in plan from the z-axis direction. A ground conductor is provided in the main body on the negative z-axis direction side of the signal line, and is overlapped by the signal line when viewed in plan from the z-axis direction. The ground conductors and the signal line define a strip line structure. A distance between the ground electrodes and the signal line is smaller than a distance between the ground electrode and the signal line.

Abstract: A signal transmission method suppresses a reflected wave of a transmission signal on a transmission line, by obtaining level and time information related to the reflected wave by computing a correlation between a data pattern of the transmission signal and the reflected wave, and correcting a waveform of the transmission signal based on the level and time information related to the reflected wave.

Abstract: Provided is an optical waveguide element module which suppresses reflection of a modulation signal and attenuation of a modulation signal, even when an impedance of a modulation electrode of an optical waveguide element and an impedance of a transmission line for inputting the modulation signal from the external of the optical waveguide element are different from each other. The optical waveguide element module is provided with an optical waveguide element, which has a substrate (1) composed of a material having electro-optical effects, an optical waveguide (2) formed on the substrate, and a modulation electrode (3) which modules optical waves propagating in the optical waveguide; a connector (8), wherein an external signal line which inputs the modulation signal to the modulation electrode is connected to the modulation electrode; and a relay line which connects the connector and the modulation electrode and is formed on a relay substrate (7).

Abstract: Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%.

Abstract: One embodiment of an axial rotary joint having rotary transmission lines for the bi-directional propagation of radio frequency electromagnetic waves and light waves across a rotary interface. Each section is capable of fully independent rotation about a common longitudinal axis. The radio frequency rotary transmission line comprises waveguide tubing at each end that transitions to a coax transmission line at the rotary interface. The waveguide tubing also functions as the axial support structure. The second transmission line for light wave propagation is fully integrated into the waveguide-to-coax transition and the inner coaxial conductor, and uses optical coupling devices to form an optical coupling path across the rotary interface. This embodiment of the rotary joint can be sealed and pressurized to minimize contamination of the optics and to increase the electromagnetic wave power handling.

Abstract: A printed circuit board includes a plurality of wiring layers and a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via.

Abstract: The invention relates to a coaxial-impedance synthesizer, comprising: a longitudinal central (0x) conductor (1); an outer conductive tube (2) arranged coaxially to the conductor (1); and at least one probe (4) mounted so as to longitudinally translate around the conductor (1), the coaxial-impedance synthesizer being characterized in that the outer tube (2) includes two separable half-tubes, such that the probe (4) is permitted to move longitudinally, relative to the central conductor (1), to a desired position when the two half-tubes are spaced apart from each other, and when the two half-tubes are near each other, the outer periphery of the probe (4) and the inner wall of the outer tube are in contact with each other.

Abstract: A high-frequency signal transmission line includes a dielectric body including a plurality of dielectric sheets. A signal line is provided in the dielectric body. A connector is mounted on a first main surface of the dielectric body and electrically connected to the signal line. A ground conductor is provided on a second main surface side of the dielectric body, compared with the signal line, and faces the signal line across the dielectric sheet. In the ground conductor, conductor-missing portions are provided in which no conductors are provided in at least portions of regions overlapping with the signal line in planar in connection portions. Adjustment conductors are provided in the second main surface of the dielectric body, and overlap with at least portions of the conductor-missing portions in the planar view.

Abstract: A printed circuit board (PCB) includes a receiver component, a transmission line including a positive signal transmission line and a negative signal transmission line, a transmitter component, and a capacitance unit. The transmitter component transmits a different signal to the receiver component via the transmission line. The capacitance unit is spaced from the receiver component a predetermined distance S, therein, the predetermined distance S is calculated by a formula S=Vx (n*UI?(C1+C2)×Zo/2)/2, and V is a speed of the transmission line. C1 is an equivalent capacitance value of the receiver component, C2 is a capacitance value of the capacitance unit, Zo is a resistance value of the transmission line, UI is a half of one cycle of the differential signal, and n is a value less than or equal to 1.5 and greater than or equal to 0.5.

Abstract: A transmission device that establishes efficient match with an impedance mismatch section of a differential transmission system. The transmission device includes: a differential driver; a differential receiver; a differential line that connects between the differential driver and the differential receiver, the differential line including in-phase signal wiring and inverted-phase signal wiring; a delay increasing structure interposed in the differential line at an upstream of the impedance mismatch section; and a delay increasing structure interposed at a downstream of the impedance mismatch section. The delay increasing structure is interposed only in one of the in-phase signal wiring and the inverted-phase signal wiring, and the delay increasing structure is interposed only in another of the in-phase signal wiring and the inverted-phase signal wiring.

Abstract: A transmission line has a triplate line including a first outer conductor and a second outer conductor disposed in parallel with each other at a predetermined interval, and a central conductor disposed in a space between the first outer conductor and the second outer conductor; and a dielectric spacer interposed between the first and second outer conductors and the central conductor and configured to support the central conductor. The central conductor has a supported portion supported by the dielectric spacer, and first and second high-impedance portions having characteristic impedances higher than a characteristic impedance in the supported portion. The first and second high-impedance portions are disposed on input and output sides, respectively, of the supported portion.

Abstract: The invention is related to a microstrip line structure, which comprises: a first microstrip line and a second microstrip line, paralleled with the first mircostrip line for transferring a transmission signal, and a plurality of grooves periodically arranged on both sides of the second microstrip line by using subwavelength, and each period length in the plurality of grooves is smaller than the wavelength of the transmission signal.

Abstract: A coaxial to microstrip transition is introduced in a multi layer mixed dielectric printed circuit board environment that provides a 50 Ohm impedance system between a coaxial antenna feed and a surface mount diplexer at Ku-band frequencies. The 50 Ohm transition from the coaxial antenna feed to the diplexer at microwave frequencies lossy FR-4 style laminate is provided by constructing a PCB internal coax using the center conductor of the antenna feed and a dual ring of plated through hole VIAs. The transition from the PCB internal coax to the microstrip section of the high frequency laminate PCB layer uses a “D”-style opening in the ground layer and a VIA ring arrangement between the layers to optimize or tune the performance of the transition. Additional features in the interface construction are implemented to guaranty that its microwave and mechanical performance does not degrade in extreme environmental conditions.

Abstract: The power combiner/distributor for performing one of power combination and power division, includes: a first branch circuit (117) having a plurality of first branch side terminals (113, 114) connected in parallel and one first combination side terminal (115), which are connected through a first power combination point (116); and a second branch circuit (137) having a plurality of second branch side terminals (133, 134) connected in parallel and one second combination side terminal (135) connected through a second power combination point (136), the one first combination side terminal and the one of plurality of second branch side terminals being connected to each other, in which a length from the first power combination point to the second power combination point is an integral multiple of ½ wavelength.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: Methods for transformer signal coupling and impedance matching for flip-chip circuit assemblies are presented. In one embodiment, a method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer. In another embodiment, a method for matching impedance in an RF circuit fabricated using flip-chip techniques may include passing an RF input signal through a first inductor formed using a passive process, inducing a time varying magnetic flux in proximity to a second inductor formed using an active process, and passing an RF signal induced by the time varying magnetic flux through the second inductor.

Abstract: Disclosed is an optical modulator module including an optical modulator configured to have a signal electrode and a ground electrode; a conductive package configured to accommodate the optical modulator and have electrical continuity with the ground electrode of the optical modulator; a substrate configured to have a ground electrode on a first surface thereof electrically connected to the package by solder or a conductive adhesive and have a signal electrode on another surface thereof; and a lead pin configured to electrically connect the signal electrode of the optical modulator to the signal electrode of the substrate.

Abstract: The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement.

Abstract: There are provided a matching circuit which is less prone to impedance mismatch even with variations in pattern dimension, and a wiring board, and also a transmitter, a receiver, a transceiver, and a radar apparatus that succeed in offering stable characteristics with the installation of the matching circuit. Characteristic impedance of a first transmission line including a connection portion is varied between a reflection source including a stub portion and a bonding wire serving as a load. Impedance variation is achieved by varying a distance from the connection portion to a back conductor layer coupled thereto with respect to a distance from the stub portion and a transmission line portion to an inner conductor layer coupled to them.

Abstract: An impedance matching circuit is connected to a first circuit block (impedance matching target circuit) that requires impedance matching and that has one terminal connected to a signal line and the other terminal connected to a ground, the impedance matching circuit having a second circuit block that has a first circuit and a second circuit connected in parallel. In the first circuit, a first capacitor having a variable capacitance and a first inductor having a first inductance are connected in series, and in the second circuit, a second inductor having a second inductance and a switch are connected are connected in series. The impedance matching circuit has one terminal connected to the signal line of the first circuit block and the other terminal connected to the ground of the first circuit block.

Abstract: An apparatus configured to create a resistive pathway for an electronic assembly is disclosed. In one embodiment, the pathway can be formed with a resistive film in conjunction with a conductive adhesive and a coverlay. In another embodiment, the resistive film, the conductive adhesive and the coverlay can be relatively transparent. In yet another embodiment, the resistive pathway can couple directly with traces on an electronic assembly saving space and easing assembly.