Abstract: For a T-coil IC, a first inductor core is on an Mx layer and has n turns (n?15/8). The first inductor core has a first-inductor-core-first end and a first-inductor-core-second end. A second inductor core is on an Mx-2 layer and has n turns. The second inductor core has a second-inductor-core-first end and a second-inductor-core-second end. The first-inductor-core-second end is connected to the second-inductor-core-first end by a via stack between the Mx and Mx-2 layers. A center tap is on an Mx-1 layer. The center tap is connected to the second inductor core at a node of the second inductor core. A first inductor is formed by the first inductor core between the first-inductor-core-first end and the first-inductor-core-second end and by the second inductor core between the second-inductor-core-first end and the node. A second inductor is formed by the second inductor core between the node and the second-inductor-core-second end.

Abstract: A reconfigurable multiplexer that can support more frequency bands than a traditional multiplexer is disclosed. For example, the reconfigurable multiplexer can handle frequencies of several hundred megahertz up to 10 gigahertz. Further, certain implementations of the reconfigurable multiplexer can reduce or eliminate frequency dead zones that exist with traditional multiplexers. The reconfigurable multiplexer includes a filter bank capable of supporting a number of frequency bands and a bypass circuit that enables the multiplexer to support a variety of sets of frequencies. For instance, unlike traditional multiplexers, the reconfigurable multiplexer can support both frequency bands with relatively narrow spacing and frequency bands with relatively wide spacing. Further, the inclusion of the bypass circuit enables the reduction or elimination of dead zones between supported frequencies.

Abstract: A frequency selective limiter (FSL) is provided having a transmission line structure with a tapered width. The FSL includes a substrate having a magnetic material, a signal (or center) conductor disposed on the substrate and first and second ground plane conductors disposed on the substrate. The signal conductor having a first end with a first width and a second end with a second different width such that the signal conductor is provided having a taper between the first and second ends of the signal conductor. First and second ground plane conductors are spaced apart from first and second edges of signal conductor, respectively, by a distance that changes from the first end of signal conductor to the second end of signal conductor such that signal conductor, and first and second ground plane conductors form a co-planar waveguide transmission line.

Abstract: A high-frequency module includes a propagation path that has a simple structure and improves filter characteristics by causing an inductor and a matching network to electromagnetic field couple with each other such that attenuation characteristics outside of a frequency band of a transmission signal are improved without increasing the size of the high-frequency module. In addition, unintended electromagnetic field coupling between a first filter and the inductor is significantly reduced or prevented by a shield electrode. Therefore, unintended propagation of a high-frequency signal is significantly reduced or prevented. Therefore, the attenuation characteristics outside of the frequency band of transmission signal input to the transmission terminal are improved more effectively.

Abstract: A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.

Abstract: A method for identifying the existence of a failure of a relay device in an electrical power supply system of a device to be supplied with power, the power supply system comprising at least one power generator configured to generate a power supply signal and a load comprising at least one relay device; the power generator comprising a frequency variator; each relay device comprising a quadripole and at least one antenna linked to the quadripole. The identification method comprises the following steps: a) selecting a characteristic frequency, b) determining the impedance of the load, then when the supply signal has the selected characteristic frequency, c) repeating steps a) and b) for several distinct characteristic frequencies, d) identifying the existence of a failure from several impedances determined for different characteristic frequencies.

Abstract: A vertical-transition structure comprises a microstrip line and a combination of a coaxial connector and a metallic ring underneath the microstrip line. A first through hole is created next to the microstrip line and near one end of its signal line. The metallic ring has a second through hole. The coaxial connector has a center conductor including an extended portion to be inserted into the second through hole via its center, and subsequently through the first through hole to connect to the signal line vertically. Specially, the extended portion is not inserted through the center of the first through hole. The present structure can improve the high-frequency insertion loss of the vertical transition caused by the sudden change of electromagnetic field distributions from a coaxial line to a microstrip line and the resonant response of the coaxial connector, and therefore, increase the 1-dB transmission passband of the vertical transition substantially.

Abstract: A coaxial transmission line, e.g. a coaxial cable, includes an inner electrical conductor, an outer electrical conductor, a dielectric region between the inner electrical conductor and the outer electrical conductor, and an electrically thin resistive layer within the dielectric region and concentric with the inner electrical conductor and the outer electrical conductor. The electrically thin resistive layer is a resistive layer configured to be transparent to a subtantially transverse-electromagnetic (TEM) mode of transmission, while absorbing higher order modes of transmission.

Abstract: A planar differential aperture antenna that has a high gain and wide bandwidth at a millimeter wave band is provided. The differential aperture antenna has a cavity within it that has a height of roughly a quarter of a wavelength of the desired transmission band. The cavity is H-shaped, and has a cross shaped patch within the cavity that is fed differentially by two grounded coplanar waveguides. Two ends of the patch extend towards the ports on either side of the differential aperture antenna, and the other two ends of the patch extend into the cavity lobes, perpendicular with respect to the ports.

Abstract: An electronic apparatus having a coplanar waveguide transmission line configured to reduce impedance discontinuity in the coplanar waveguide transmission line is introduced. The electronic apparatus includes a coplanar waveguide transmission line including a substrate, at least one signal line and a plurality of reference planes, and the electronic apparatus includes at least one passive component. Each of the reference planes is coupled to a DC voltage. The at least one passive component is electrically connected between the reference planes and acts as a short circuit at relatively high frequencies.

Abstract: According to one embodiment, a high-frequency semiconductor amplifier includes an input terminal, an input matching circuit, a high-frequency semiconductor amplifying element, an output matching circuit and an output terminal. The input terminal is inputted with a fundamental signal. The fundamental signal has a first frequency band and a first center frequency in the first frequency band. The input matching circuit includes an input end and an output end. The input end of the input matching circuit is connected to the input terminal. The high-frequency semiconductor amplifying element includes an input end and an output end. The input end of the high-frequency semiconductor amplifying element is connected to the output end of the input matching circuit. The high-frequency semiconductor amplifying element is configured to amplify the fundamental signal.

Abstract: Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.

Abstract: A transmission line impedance transformer including at least two different dielectric media having different dielectric properties, each of the dielectric media being configured to taper in thickness along the length of the impedance transformer in an inverse relationship with respect to each other so as to form a combined dielectric medium having an effective dielectric property that is graded along the transmission path. The two or more dielectric media may be disposed between two conductors to provide an impedance transformer in which a characteristic impedance of the transmission line varies along its length in response to the gradation of the effective dielectric property of the combined dielectric medium.

Abstract: According to one embodiment, a high-frequency semiconductor amplifier includes an input terminal, an input matching circuit, a high-frequency semiconductor amplifying element, an output matching circuit and an output terminal. The input terminal is inputted with a fundamental signal. The fundamental signal has a first frequency band and a first center frequency in the first frequency band. The input matching circuit includes an input end and an output end. The input end of the input matching circuit is connected to the input terminal. The high-frequency semiconductor amplifying element includes an input end and an output end. The input end of the high-frequency semiconductor amplifying element is connected to the output end of the input matching circuit. The high-frequency semiconductor amplifying element is configured to amplify the fundamental signal.

Abstract: According to one embodiment, a high-frequency semiconductor amplifier includes an input terminal, an input matching circuit, a high-frequency semiconductor amplifying element, an output matching circuit and an output terminal. The input terminal is inputted with a fundamental signal. The fundamental signal has a first frequency band and a first center frequency in the first frequency band. The input matching circuit includes an input end and an output end. The input end of the input matching circuit is connected to the input terminal. The high-frequency semiconductor amplifying element includes an input end and an output end. The input end of the high-frequency semiconductor amplifying element is connected to the output end of the input matching circuit. The high-frequency semiconductor amplifying element is configured to amplify the fundamental signal.

Abstract: An external device may recognize, in the case of including a communication unit that executes communication via a communication path made up of a pair of differential transmission paths included in a transmission path, information relating to the communication unit thereof. A disk recorder transmits function information indicating that a communication unit (high-speed data line I/F 213) configured to execute communication with an external device via a communication path made up of a reserve line and an HPD line of an HDMI cable to a television receiver via a CEC line that is a control data line of the HDMI cable. The television receiver receives function information, whereby whether or not the disk recorder is an eHDMI-compatible device can be determined, and in the case of an eHDMI-compatible device, a compatible transmission format (application) can be recognized.

Abstract: Antenna structures and methods of operating the same are described. One antenna structure having a stacked patch antenna including a first patch structure disposed in a first plane and a second patch structure disposed in a second plane, a first parasitic patch antenna that is coplanar with the second patch structure, and a second parasitic patch antenna that is coplanar with the second patch structure. The first patch structure includes a first substrate with a ground plane and a first patch element. The second patch structure includes a second substrate with a second patch element. The first parasitic patch antenna is disposed adjacent a first side of the second patch structure in the second plane. The second parasitic patch antenna is disposed adjacent a second side of the second patch structure in the second plane.

Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a multiband circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the multiband circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.

Abstract: A method and apparatus are provided for manufacturing a packaged electronic device (200) which includes a carrier substrate (120) in which conductive interconnect paths (122) extend between first and second opposed surfaces, an integrated circuit die (125) affixed to the first surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, and an array of conductors (110), such as BGA, LGA, PGA, C4 bump or flip chip conductors, affixed to the second surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, where the array comprising a signal feed ball (112) and an array of shielding ground balls (111) surrounding the signal feed ball.

Abstract: An electric battery for the propulsion of vehicles in an underwater environment, comprising a cylindrical tubular casing defining a main chamber housing an anhydrous electrolyte; intake members to transfer a flow of water from the marine environment to the main chamber, to form, following execution of a water-intake command, a liquid electrolyte; a plurality of electrochemical cells housed in the tubular casing; a heat exchanger receiving as input electrolyte taken from the main chamber and an outlet communicating with an inlet of the electrochemical cells. The heat exchanger is provided in the cylindrical tubular portion and comprises at least one channel made in an inner wall of the cylindrical tubular portion, and extending along a helical path coaxial to the axis of the tubular portion.

Abstract: A printed circuit board includes a signal transmitting part and a ground part disposed having an insulating layer therebetween. The ground part includes an impedance adjusting part.

Abstract: A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other.

Abstract: A multi-layer circuit member includes first and second electrically connected reference regions. At least a portion of a signal conductor is in proximity to the first region and a circuit component is in proximity to the second region. An area of increased impedance exists between the first and second electrically connected regions.

Abstract: In various embodiments, a broadband matching circuit is disclosed. In one embodiment. the broadband matching circuit comprises a low-pass matching section, a quarter-wavelength transformer, and a high-pass matching section.

Abstract: An ablation system which transmits radio frequency (RF) energy for the ablation of biological tissues has a transmission line and an RF antenna disposed at the distal portion of the transmission line. An RF signal generator supplies RF energy to the proximal end of the cable for transmission to the antenna, and an electrically tunable transformer is connected between the signal generator and the antenna. The transformer is tuned based on detection of the reflected power level from the antenna so as to reduce or minimize reflected power, thereby increasing RF energy coupling between the antenna and tissue.

Abstract: A frequency-scalable device for interfacing a planar medium with a coaxial medium to propagate a primary signal, the device comprises a transition medium connectable between the coaxial medium and the planar medium. The transition medium suppresses excitation of secondary electrical signals by the primary signal when the primary signal is propagated through the transition medium at a frequency below an upper limit.

Abstract: A semiconductor device includes a first electrode formed on a substrate, the first electrode being a first electrical potential; and a second electrode formed on the first electrode, the second electrode including a signal wiring that transmits a signal and a planar electrode part with a prescribed area. A shape of the first electrode corresponding to the planar electrode part is made into a slit shape such that a longitudinal direction of a slit is parallel to a direction in which the signal proceeds in the planar electrode part.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Disclosed herein are an asymmetrical multilayer substrate, an RF module, and a method for manufacturing the asymmetrical multilayer substrate. The asymmetrical multilayer substrate includes a core layer, a first pattern layer formed on one side of the core layer and including a first signal line pattern, a second pattern layer formed on the other side and including a second metal plate and a second routing line pattern, a first insulating layer thinner than the core layer formed on the second pattern layer and including a first via, and a third pattern layer formed on the first insulating layer and including a third signal line pattern, wherein an impedance transformation circuit including an impedance load and a parasitic capacitance load on the transmission line is formed for impedance matching in signal transmission between the signal line patterns formed in the upper and lower side directions of the core layer.

Abstract: A printed circuit board (PCB) may include antipads, used to provide clearance for backdrilling, which may be sized to allow backdrilling in a way that minimizes the presence of stubs. The PCB may include pads to connect a component to the PCB and vertically disposed vias connected to at least some of the pads. The PCB may further include horizontally disposed signal layers, electrically connected by the vias, to route signals from the component, received from the vias, to an edge of the component, in which signals associated with the component closer to an inner portion of the component are routed to the edge of the component on higher ones of the signal layers than signals associated with the component further from the inner portion of the component.

Abstract: A differential transmission transition interface is disclosed which can include first and a second buried conducting tracks providing respectively first and second differential couplings between a differential RF transmission output and a waveguide; the first buried conducting track extending over an opening of the waveguide to provide a first RF coupling element; and the second buried conducting track extending over the opening to provide a second RF coupling element. At least a portion of the first RF coupling element extends over the waveguide opening in a first angular direction; and at least a portion of the second RF coupling element extends over the waveguide opening in a second angular direction that is opposed to the first angular direction.

Abstract: An electrosurgical system for treating tissue is disclosed. The system includes an electrosurgical generator, a printed circuit board, a generator ground and a patient ground. The printed circuit board is disposed in mechanical cooperation with the electrosurgical generator and includes a plurality of conductive layers. The generator ground includes a first portion and a second portion. The first portion is electro-mechanically connected to a conductive layer of the printed circuit board and the second portion is electro-mechanically connected to another conductive layer of the printed circuit board. The patient ground includes a portion that is at least partially interposed between the first portion of the generator ground and the second portion of the generator ground.

Abstract: Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.

Abstract: For broadband applications of a balun in a magnetic field, the balun includes at least three line transformers each having two transformer sides. At least two transformer sides of the balun that belong to different line transformers of the at least three line transformers are embodied for the same voltage drop at least in terms of magnitude. The at least two transformer sides of the balun are also embodied with an identical number of turns. Two transformer sides connected in parallel are replaced by a single coil, with the result that the balun may be produced from a five-wire structure.

Abstract: In an antenna coupler, a multilayer printed-circuit board has conductor levels which are electrically isolated from one another in the depth direction. A first radio-frequency line coupled to the antenna is arranged in a first conductor level, while a second radio-frequency line coupled on the appliance side is arranged in a second conductor level of the board. The board has an electrically insulating core layer, with the first and second conductor levels extending on the same of the two faces of the core layer and with the second radio-frequency line at a greater distance from the core layer than the first radio-frequency line. Furthermore, the second radio-frequency line is arranged on an outer surface of the board. The antenna coupler comprises an electrically conductive shielding structure designed to shield the first radio-frequency line and appliance-side metal parts, which are not part of the antenna coupler, against interaction with radio-frequency signals.

Abstract: A compensating resistance adapter spans the distance from a mechanical point of contact of an electrical test probe and at least one signal testing point. The compensating resistance adapter has at least one transmission path extending longitudinally therewith. At least one compensating network is configured with the transmission path and positioned substantially near the probing end thereof. For preferred compensating resistance adapters, the at least one compensating network compensates for inductance caused by the conductive connector adapter. For preferred compensating resistance adapters, the at least one compensating network when used in combination with the electrical test probe is optimized to the signal testing point. Exemplary preferred compensating resistance adapters include a probing blade adapter, a twisted pair adapter, a Y-lead adapter, and a swivel pogo tip pair adapter.

Abstract: Embodiments disclosed include transmission line phase shifters and methods for fabricating transmission line phase shifters that switch signal and ground conductors to reverse electromagnetic fields in a transmission line structure.

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: For associating different technologies of a microstrip line and of a rectangular waveguide, for example on a ceramic, in a transition device including a mode transformer between the line integrated into a printed circuit board, and the waveguide, the board includes a housing containing the waveguide with a large sidewall coplanar and coaxial to the strip of the line and another large sidewall fixed onto a metallic layer of the board at the bottom of the housing. A linking metallic element bridges a mechanical tolerance gap between the transformer and one of the line and the waveguide. The transformer can be integrated into the board, or into the waveguide in a microwave component.

Abstract: A printed circuit board (PCB) includes a receiver component, a transmission line including a positive signal transmission line and a negative signal transmission line, a transmitter component, and a capacitance unit. The transmitter component transmits a different signal to the receiver component via the transmission line. The capacitance unit is spaced from the receiver component a predetermined distance S, therein, the predetermined distance S is calculated by a formula S=Vx (n*UI?(C1+C2)×Zo/2)/2, and V is a speed of the transmission line. C1 is an equivalent capacitance value of the receiver component, C2 is a capacitance value of the capacitance unit, Zo is a resistance value of the transmission line, UI is a half of one cycle of the differential signal, and n is a value less than or equal to 1.5 and greater than or equal to 0.5.

Abstract: A method is provided for selectively detecting the presence and concentration of at least four analytes in a mixture. In certain embodiments, the method comprises contacting a single sensor with the mixture of analytes, wherein the sensor comprises at least one resonant sensor circuit comprising a sensing material that comprises at least two material properties that change in the presence of four or more analytes in their mixtures, and generating a multivariate sensor response pattern. The methods disclosed herein further optionally comprise performing analyte classification and analyte quantitation. Methods for selectively detecting the concentration of at least one analyte in a mixture further comprising at least one interference are also described in the instant application.

Abstract: A connector with a capacitively coupled connector interface for interconnection with a mating portion with a sidewall. A connector body has an outer conductor coupling surface at an interface end, covered by an outer conductor dielectric spacer. The outer conductor coupling surface is dimensioned to seat, spaced apart from the sidewall by the outer conductor dielectric spacer, when the connector body and the mating portion are in an interlocked position. A releasable retainer may be provided, the releasable retainer dimensioned to secure the connector body and the mating portion in the interlocked position.

Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.

Abstract: The present invention is directed to an impedance transformation device for use in a system having a characteristic system impedance, the device being characterized by a predetermined bandwidth having a center frequency. The device housing size is one-eighth wavelength of the center frequency. A first coupler is characterized by an even mode impedance and an odd mode impedance. The bandwidth is a function of the even mode impedance and the odd mode impedance substantially corresponds to the component port impedance. At least one second coupler is disposed in parallel with the first coupler and is characterized by the even mode impedance and the odd mode impedance.

Abstract: In one embodiment, an apparatus includes a line side of a network device. The line side is configured to connect to a device external to the network device. The apparatus also includes a physical side of the network device. The physical side is configured to communicate with an external entity. An isolation device is configured to isolate the physical side from the line side. An inductor is coupled between the line side and the physical side. The inductor has a value configured to control a matching of an impedance of the line side with an impedance of the physical side as seen through the isolation device.

Abstract: A high-frequency signal transmission line includes a plate-shaped dielectric element assembly, a linear signal line, and a first ground conductor. The linear signal line is provided at the dielectric element assembly and includes a plurality of thick portions and a plurality of thin portions with a smaller width than the thick portions. The first ground conductor is provided at the dielectric element assembly and positioned on one side in a normal direction to the dielectric element assembly relative to the signal line. The first ground conductor includes a plurality of openings overlapping with the signal line and also includes bridge portions provided between the openings so as to cross the thin portions. The bridge portions cross the thin portion obliquely when viewed in a plan view in the normal direction to the dielectric element assembly.

Abstract: The high-frequency wiring board of the present invention includes: first coplanar lines provided with a first signal line and a first planar ground pattern formed on the same wiring layer as the first signal line; second coplanar lines provided with a second signal line formed on a different wiring layer than the first signal line and a second planar ground pattern formed on the same wiring layer as the second signal line; and a first ground pattern formed on the same wiring layer as the first coplanar lines. The first coplanar lines and the second coplanar lines are connected. At least the first ground pattern and the first planar ground pattern are separated in a region following the second signal line from the connection of the first signal line and the second signal line.

Abstract: A transmission line includes two tapered lines having a tapered planar shape and arranged in parallel, opposite lines provided in opposition to the narrower width sides of the two tapered lines, and a bonding wire for connecting the narrower width sides of the two tapered lines and the opposite lines, wherein the width between two outer edges on the narrower width sides of the two tapered lines arranged in parallel is greater than the width between outer edges on the opposite side of the opposite lines in opposition to the narrower width sides of the two tapered lines.

Abstract: Embodiments are directed to a transition structure for interfacing an integrated circuit chip and a substrate, comprising: a co-planar waveguide (CPW) structure formed based on ground-signal-ground (GSG) pads on the integrated circuit chip, a grounded co-planar waveguide (CPWG) structure coupled to the GSG pads, and a microstrip coupled to the CPWG structure.

Abstract: Disclosed is an optical modulator module including an optical modulator configured to have a signal electrode and a ground electrode; a conductive package configured to accommodate the optical modulator and have electrical continuity with the ground electrode of the optical modulator; a substrate configured to have a ground electrode on a first surface thereof electrically connected to the package by solder or a conductive adhesive and have a signal electrode on another surface thereof; and a lead pin configured to electrically connect the signal electrode of the optical modulator to the signal electrode of the substrate.