Abstract: Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Abstract: A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line.

Abstract: A connector comprises a coaxial connector and a metallic plate. The coaxial connector has an outer conductor, a dielectric material, a mounting wall, and a center conductor. The space between the two conductors is filled with the dielectric material. The center conductor is extended from the inside of the coaxial connector to the other side of the mounting wall. The metallic plate has a through hole and is attached to the mounting wall of the coaxial connector. The outside center conductor of the coaxial connector is placed within the through hole. Hence, the connector improves the transmission passband of the transition between a coaxial line and a microstrip line at high frequencies.

Abstract: A multiband matching circuit includes a first matching unit, a second matching unit, and a third matching unit, with all units being connected in series in a signal path. Matching with target impedance is established at a first frequency by appropriately designing the first matching unit and at a second frequency by appropriately designing the second and third matching units. The second matching unit and the third matching unit are designed to make the conversion ratio of the impedance viewed from the connection point between the second matching unit and the third matching unit to a circuit element to the target impedance smaller than the conversion ratio of the impedance viewed from the connection point between the first matching unit and the second matching unit to the circuit element to the target impedance, at the second frequency.

Abstract: A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line.

Abstract: In a CO2 gas discharge laser energized by a radio frequency (RF) power source a transformer having selectively variable output impedance is used to match output impedance of the power source to the impedance of discharge electrodes of the laser. A similar transformer can be used to impose a selective variable phase-shift on the RF power from the source. The variable impedance transformer can also be used for impedance matching between amplifier stages in the power source.

Abstract: A broadband-operable impedance filter has capacitive elements of variable capacitance in the signal path, an inductive element in a parallel path connected in parallel to the signal path, and inductive elements in the ground path. The impedance filter allows communication in a first frequency band and the reception of HF signals in a second frequency band.

Abstract: Methods and apparatuses for transformer signal coupling for flip-chip circuit assemblies are presented. A device for coupling dies in flip-chip circuit assembly may include a first die associated with a first fabrication process and a first inductor physically coupled to the first die, where the first inductor receives an RF input signal. The device may further include a second die associated with a second fabrication process, and a second inductor physically coupled to the second die, where the second inductor is positioned so the first inductor can inductively couple the RF signal in the second inductor. A method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer.

Abstract: A connector assembly includes, but is not limited to, a body having a top side and a bottom side. A bottom signal plate is connected to the bottom side and is configured for capacitive coupling to a conductor of a coplanar waveguide. A bottom grounding plate is connected to the bottom side and is spaced apart from the bottom signal plate. The bottom grounding plate is configured for capacitive coupling to a grounding plane of the coplanar waveguide. A first electrically conductive pathway is electrically connected to the bottom signal plate and extends to the top side. A second electrically conductive pathway is electrically connected to the bottom grounding plate and extends to the top side. A dielectric adhesive at least partially covers a bottom portion of the connector assembly.

Abstract: Methods, systems, and apparatuses for circuit boards are provided herein. An electrically insulating material is formed over one or more traces on a circuit board. One or more further electrically conductive features are present on the circuit board. A layer of an electrically conductive material is formed over the one or more traces that is electrically isolated from the one or more traces by the electrically insulating material, and is in electrical contact with the one or more further electrically conductive features. The electrically conductive material confines magnetic and electric fields produced when the one or more traces conduct an alternating current. By confining the magnetic and electric field distributions in this manner, problems of interference and/or crosstalk with adjacent signal traces are reduced or eliminated.

Abstract: Disclosed herein is a dual band high frequency amplifier using a composite right/left handed (CRLH) transmission line (TL). Accordingly, a CRLH TL structure having a dual band characteristic is inserted into an input matching circuit and/or an output matching circuit in the high frequency amplifier, and a matching circuit is designed so that impedance matching is performed at two frequencies, thereby obtaining both gain and matching characteristics at the two frequencies.

Abstract: A coupled microstrip line structure having tunable characteristic impedance and wavelength are provided. In accordance with one aspect of the invention, a coupled microstrip line structure comprises a first ground plane having a plurality of first conductive strips separated by a dielectric material, and a first dielectric layer over the first ground plane. The coupled microstrip line further comprises a first signal line over the first dielectric layer, wherein the first signal line is directly above the plurality of first conductive strips, and wherein the first signal line and the plurality of first conductive strips are non-parallel, and a second signal line over the first dielectric layer, wherein the second signal line is directly above the plurality of first conductive strips, and wherein the second signal line and the plurality of first conductive strips are non-parallel, and wherein the second signal line is substantially parallel to the first signal line.

Abstract: Disclosed is a waveguide adapter able to generate a circularly polarized wave. The waveguide adapter to be coupled with a horn antenna realizes a polarized wave conversion function for converting a linearly polarized wave signal into a circularly polarized wave signal, or vice versa, and an adapter function for converting a waveguide signal into an external transmission line signal, resulting in a simplified configuration and small size of a communication system using a circularly polarized wave signal. The waveguide adaptor includes a probe to transmit a linearly polarized wave signal from an external transmission line to a waveguide transmission line, a polarized wave conversion line reflector located in the rear of the probe to convert a vertically polarized wave into a horizontally polarized wave, and a back-short member to forwardly transmit a rearward signal. The waveguide adapter is applicable to communication systems using circularly polarized wave signals.

Abstract: A microstrip line is constituted by including a grounding conductor and a strip conductor with a dielectric substrate being sandwiched between the grounding conductor and the strip conductor. The microstrip line includes a conductor section having at least one groove formed to sterically intersect the strip conductor, thereby exhibiting a substantially more uniform passing characteristic as compared with a prior art microstrip line.

Abstract: Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Abstract: An integrated circuit structure includes an interconnect structure over a semiconductor substrate and a coaxial transmission line. The coaxial transmission line includes a signal line, a top plate over the signal line and electrically insulated from the signal line, and a bottom plate under the signal line and electrically insulated from the signal line. At least one of the top plate and the bottom plate includes metal strip shields and dielectric strips, with each of the dielectric strips being between two of the metal strip shields. The integrated circuit structure further includes a ground conductor electrically connecting the top plate and the bottom plate. The ground conductor is insulated from the signal line by a dielectric material.

Abstract: A metamaterial includes a dielectric substrate and an array of discrete resonators at the dielectric substrate, wherein each of the discrete resonators has a shape that is independently selected from: an F-type shape; an E-type shape; or a y-type shape. A parameter of a chiral metamaterial is determined and a chiral metamaterial having such a parameter is prepared by the use of a model of the chiral metamaterial. The metamaterial model includes an array of discrete resonators. In one embodiment, each of the discrete resonators has a shape that is independently selected from the group consisting of: an F-type shape; an E-type shape; and a y-type shape. To the metamaterial model, electromagnetic (EM) radiation, preferably plane-polarized EM radiation in a visible, ultraviolet or near-infrared region, having at least one wavelength that is larger than the largest dimension of at least resonator of the metamaterial model, is applied.

Abstract: A coaxial connector that includes: a first inner conductor and a second inner conductor; a capacitor that is electrically coupled to the first inner conductor and the second inner conductor; an outer conductor that surrounds the first and second inner conductors, and the capacitor; a first support member that fixes the first inner conductor to the outer conductor; a second support member that fixes the second inner conductor to the outer conductor; a first dielectric material that is provided between the outer conductor and the first inner conductor and between the outer conductor and the second inner conductor, and a second dielectric material that is provided between the outer conductor and the capacitor.

Abstract: A mobile device includes an adjustable impedance matching network coupled between a power amplifier and an antenna and has an adjustable impedance element. An impedance sensor is coupled between the power amplifier and adjustable impedance matching network. A processor is configured to a) calculate a corrected antenna load impedance based upon a sensed impedance at inputs of the impedance matching network and a current value of the adjustable impedance element, and b) determine a new value for the adjustable impedance element based upon the corrected antenna load impedance. The processor is also configured to c) set the adjustable impedance element to the new value, and d) sense a new impedance at the inputs and determine if the sensed new impedance is within a threshold value of the power amplifier impedance, and repeat steps a), b), and c) if the sensed new impedance is not within the threshold value.

Abstract: A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other.

Abstract: A termination block for connecting a first signal device and a second signal device. The termination block includes a housing, first and second connectors, and an electrical circuit having passive elements that connect the first and second connectors and provide impedance matching.

Abstract: A plurality of vias is disposed side by side on a multilayer board. A first via which is one of the vias disposed at one outer portion is electrically connected to a first outgoing line provided on the multilayer board. A second via at the other outer portion is electrically connected to a second outgoing line provided on the multilayer board. A plurality of the vias is connected to a first fixed potential layer (a ground layer, for example) of the multilayer board. At least one second fixed potential layer is provided, with a plurality of the vias through a clearance and having the same potential as that of the first fixed potential layer, as an inner layer of the multilayer board between the first and second outgoing lines and the fixed potential layer. Therefore, a BPF whose rate of occupied area is low is formed on the multilayer board without additional production processes.

Abstract: An example of a transmission-line transformer may include a transmission-line assembly and a balun assembly. The transmission-line assembly may include first and second conductors forming at least first and second transmission-line sections. The transmission-line assembly may provide a signal path through the first conductor and second conductor in series to a circuit ground. Balanced lines of the balun assembly may be connected to respective intermediate points on the first and second conductors between the first and second transmission-line sections. The transmission-line transformer may provide a signal path between a first end of the first conductor of the transmission-line assembly and the unbalanced line of the balun assembly.

Abstract: A balun comprising first and second transmission lines having a shared intermediate conductor. The first transmission line may include first and second conductors. The first conductor may have a first end for conducting an unbalanced signal relative to a circuit ground and a second end for conducting a balanced signal. The second conductor may have first and second ends proximate the respective first and second ends of the first conductor. The first end of the second conductor is open circuited. The second transmission line may include the second conductor and a third conductor having a first end connected to circuit ground and a second end for conducting the balanced signal. A resistor may connect the second end of the second conductor to circuit ground.

Abstract: The present invention provides a transmission line portion for a circuit board including a conductive strip and a pad portion including a conductive pad connected to the conductive strip, wherein an impedance discontinuity or mismatch between the transmission line portion and the pad portion is reduced or controlled. Impedance discontinuity or mismatch may be controlled by controlling the dimensions of the pad portion, for example the pad width or distance between pad and ground. A ground pad associated with the pad portion may be provided on a different layer than a ground plane of the transmission line portion. The ground pad and ground plane may be connected by vias. The ground pad may comprise a patterned conductive region, the pattern configured so as to desirably configure impedance of the pad portion. Also provided are a method, circuit board layout, and the like, related to the above.

Abstract: The invention relates to a method and a device for pseudo-differential transmission in interconnections used for sending a plurality of electrical signals. The ends of an interconnection having 4 transmission conductors and a return conductor distinct from the reference conductor are each connected to a termination circuit. Three damping circuits are connected between the return conductor and the reference conductor. The transmitting circuits receive at their inputs the signals from the 4 channels of the two sources, and are connected to the conductors of the interconnection. The receiving circuits are connected to the conductors of the interconnection, each receiving circuit being such that the 4 channels of a source connected to a transmitting circuit in the activated state are sent to the four channels of the destinations without noticeable external crosstalk.

Abstract: A monolithic microwave integrated circuit (MMIC) compatible broadside-coupled transformer including (i) a first transmission line, (ii) a second transmission line, and (iii) a third transmission line. The first and the second transmission lines generally form the broadside-coupled transformer. The third transmission line is generally connected in series with the broadside-coupled transmission line forming a ground return path of the broadside-coupled transformer.

Abstract: Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.

Abstract: A sequential rotated feeding circuit for sequential rotated feeding of a signal with a wavelength ?g is provided. The sequential rotated feeding circuit comprises a feed transformer, a resistance transforming unit, a first antenna transformer, a second antenna transformer, a third antenna transformer and a fourth antenna transformer. The feed transformer has a feed line width resistance Zin. The resistance transforming unit is connected to the feed transformer, the first antenna transformer, the second antenna transformer, the third antenna transformer and the fourth antenna transformer. The resistance transforming unit has a transforming line width resistance Zl.

Abstract: A DC blocking device using impedance matching is disclosed. The disclosed DC blocking device comprises: a first strip line configured to receive a signal and including a first line section and a first joining section joined to a part where a signal is received; and a second strip line separated from the first strip line at a designated distance and including a second line section and a second joining section for joining an output signal, where coupling occurs from the first strip line to the second strip line, the first strip line and the second strip line each have at least one bending section, and the first line section and the second line section have smaller line widths than the first joining section and the second joining section. The disclosed DC blocking device has the advantage of minimizing spatial constraints when it is installed in a mobile communication apparatus, and of achieving proper coupling even if the length of the part of the DC blocking device where coupling occurs is reduced.

Abstract: Embodiments of the present invention are directed to providing an increased trace width when traversing a void in another layer in a printed circuit board or package design. By increasing the trace width or alternatively increasing the capacitance, the degradation due to the void can be reduced. This approach works for microstrip, stripline as well as other transmission lines that use a reference plane. The void can be the result of an antipad associated with a via, or any other disruption in an otherwise uniform reference plane.

Abstract: A multilayer dielectric substrate includes a first cavity-resonance suppressing circuit that suppresses cavity resonance of a first signal wave and a second cavity-resonance suppressing circuit that suppresses cavity resonance of a second signal wave, a frequency thereof being different from that of the first signal wave. These cavity-resonance suppressing circuits respectively include openings formed in a surface-layer ground conductor, an impedance transformer with a length of an odd multiple of about ¼ of in-substrate effective wavelength of a signal wave, a tip-short-circuited dielectric transmission line with a length of an odd multiple of about ¼, of in-substrate effective wavelength of a signal wave, a coupling aperture formed in an inner-layer ground conductor, and a resistor formed in the coupling aperture. The multilayer dielectric substrate that suppresses cavity resonance of signal waves of a plurality of frequencies.

Abstract: An array antenna is provided that operates at high-band and low-band, comprising a first array of high-band radiators and a second array of low-band radiators, each respective low-band radiator disposed so as to be interleaved between the high-band radiators so as to share an aperture with the high-band radiators. Each low-band radiator comprises a coaxial section, a dielectric section, a waveguide, and a planar section. The dielectric section is formed of a continuous piece of dielectric material and includes a hollow opening formed perpendicular to the coaxial section, and a plurality of step transitions, wherein at least one of the step transitions is disposed within and partially fills the waveguide operably coupled to the planar section. The planar section is oriented to the portion of high-band radiators such that the output of the respective low-band radiator is disposed between and within the spacing between adjacent high-band-radiators.

Abstract: A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thickness of the carrier according to the high frequency signal and defining layout parameters according to the impedance and the thickness. The layout parameters include a conducting layer formed on the conducting wires, a coplanar waveguide encompasses both the reference planes and the conducting wires as a part thereof, roughness portions formed on the conducting wires, recessed portions formed on the conducting wires, and the substrate being a high loss tangent substrate. The layout is performed according to the layout parameters defined thereabove, so as to increase loss of the high frequency signal in transmission.

Abstract: An impedance matched circuit board utilizes a series of vias, one signal via that is surrounded by four ground vias in order to effect impedance matching with a coaxial signal transmission line. The vias are plated and extend through the thickness of the circuit board. Both opposing surfaces of the circuit board are provided with a conductive ground layer and each such ground layer has an opening formed there that encompasses one or more of the vias. On the top surface the opening surrounds the signal and ground via and on the bottom surface the opening only partially surrounds the signal via and the opening includes a convex portion formed therein.

Abstract: A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric. First and second ground lines are proximate to the first and second dielectrics, respectively, and the ground lines are approximately parallel to the signal line. The device has a transverse cross-section that varies along the principal axis.

Abstract: The invention relates to a method and a device for pseudo-differential transmission through interconnections used for sending a plurality of electrical signals. An interconnection having 4 transmission conductors and a return conductor distinct from the reference conductor cannot be modeled as a uniform multiconductor transmission line. Each end of the interconnection is connected to a termination circuit. Three damping circuits are connected between the return conductor and the reference conductor. The transmitting circuits receive at their inputs the signals from the 4 channels of the two sources, and are connected to the interconnection. The receiving circuits are connected to the interconnection, each receiving circuit being such that the signals of the 4 channels of a source connected to a transmitting circuit in the activated state are sent to the four channels of the destinations, without noticeable echo, internal crosstalk and external crosstalk.

Abstract: The invention is related to a microstrip line structure, which comprises: a first microstrip line and a second microstrip line, paralleled with the first mircostrip line for transferring a transmission signal, and a plurality of grooves periodically arranged on both sides of the second microstrip line by using subwavelength, and each period length in the plurality of grooves is smaller than the wavelength of the transmission signal.

Abstract: In a circuit (1) comprising first and second transmission lines (11,12) with first and second line widths, the transmission lines (11,12) are coupled to each other via a coupling (13,14) with first and second coupling widths at its ends, such that a smaller one of the line widths and a larger one of the coupling widths are combined, and such that a larger one of the line widths and a smaller one of the coupling widths are combined. Such a coupling (13,14) introduces relatively small reflection coefficients, for example for distances between ends of the transmission lines (11,12) smaller than a wavelength of frequency signals to be exchanged via the transmission lines (11,12) and the coupling (13,14). The circuit (1) can then become more compact. The coupling (13,14) may comprise one single taper or may comprise a first taper (13) with a first, larger coupling width and a second taper (14) with a second, smaller coupling width.

Abstract: Printed circuit board having a termination of a T-shaped signal line having at least two line ends, one line end being terminated using a terminating resistor against a supply voltage, and the other line end being terminated against the reference potential of the supply voltage.

Abstract: The invention relates to a method and a device for transmission through interconnections used for sending a plurality of electrical signals. An interconnection having 4 transmission conductors and a reference conductor cannot be modeled as a uniform multiconductor transmission line. Each end of the interconnection is connected to a termination circuit. The transmitting circuits receive at their inputs the signals from the 4 channels of the two sources, and are connected to the interconnection. A transmitting circuit in the activated state produces modal electrical variables, each modal electrical variable being allocated to one and only one channel. The receiving circuits are connected to the interconnection, each receiving circuit being such that the signals of the 4 channels of a source connected to a transmitting circuit in the activated state are sent to the four channels of the destinations, without noticeable echo and internal crosstalk.

Abstract: An electronic circuit includes a first transmission line connected to a DC power source, a second transmission line having one end connected to the first transmission line at a connecting node, a narrow portion formed in the second transmission line and provided at a position that is away from a specific position by equal to or greater than ? wavelength of a signal, the specific position being away from the connecting node at a distance equal to ¼ wavelength, and a capacitor having one end connected to the other end of the second transmission line and the other end connected to a reference potential.

Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.

Abstract: A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission.

Abstract: A high-speed feedthrough (HSFT) is disclosed for transmitting a signal having a highest frequency of at least 10 GHz between first and second locations separated by a vertical distance of at least approximately half of the shortest transmitted wavelength, and separated by a horizontal distance. A substrate structure includes multiple stacked layers. An RF transmission line is connected through the structure between the first and second locations for transmitting the signal. The RF transmission line comprises a series of sequentially connected horizontal conductors having lengths less than half of the effective wavelength and vertical conductors having heights less than one quarter of the effective wavelength, thereby spanning the horizontal and vertical distance between the two locations in a stairs-like shape through the structure's layers. Each conductor's geometry may deviate from standard 50 ohm buried strip lines and is optimized for complete 3-dimensional structure.

Abstract: A method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications. A method includes: forming a plurality of openings in a ground plane associated with a signal line; forming a plurality of capacitance plates in the plurality of openings; and connecting the plurality of capacitance plates to the signal line with a plurality of posts extending between the signal line and the plurality of capacitance plates.

Abstract: The present invention provides a harmonic processing circuit capable of miniaturizing a circuit, and an amplifier circuit using this harmonic processing circuit. A first impedance adjustment section and a second impedance adjustment section are provided. The first impedance adjustment section is provided with a coupled distributed constant line CT. The coupled distributed constant line CT receive as input the output of an amplification transistor S, and have a length of ¼ the wavelength (?) of the fundamental wave at the output of the amplification transistor S. Further, the first impedance adjusting section is configured to adjust input impedance with respect to the even harmonics to one of effectively infinity or zero. The first impedance adjusting section and the second impedance adjustment section are configured to adjust input impedance with respect to the odd harmonics to the other of effectively infinity or zero.

Abstract: A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

Abstract: A variable impedance adapter that has a value of characteristic impedance that is responsive to changes in the configuration of the adapter. In one embodiment, the variable impedance adapter includes an elongated section and a telescoping section that surround a center conductor that transmits an electrical signal across the adapter. A pair of tuning elements is disposed on a portion of the center conductor, one or more of the elements being shaped and configured to move along the center conductor amongst a plurality of positions in response to relative movement between the elongated section and the telescoping section. The first position and the second position correspond to different values of characteristic impedance of the variable impedance adapter.

Abstract: A substrate for mounting a filter has a connection line layer having a transmission line for connecting a filter, a ground layer placed below the connection line layer and having a ground, and an insulation layer placed between the transmission line and the ground layer and having a thickness which satisfies a characteristic impedance of the transmission line in a range 0.1 to 50 ohms, the characteristic impedance determined by the thickness and a dielectric constant of the insulation layer and a width of the transmission line.