Abstract: A balun may include series-coupled balanced-signal lines. In some examples, a balun may include a first transmission line having a first unbalanced signal port on which an unbalanced signal may exist relative to circuit ground; a second transmission line having a first balanced-signal port may be connected in series with a third transmission line having a second balanced-signal port. In some examples, a fourth transmission line may be coupled to the first transmission line and have a third balanced-signal port. A fifth transmission line may be connected in series with the fourth transmission line and have a fourth balanced-signal port. In some examples, the transmission lines may be coaxial. Balanced signals may exist between the first and second balanced-signal ports and between the third and fourth balanced-signal ports. Series-connected coaxial transmission lines may be formed of a single coaxial line with a gap in the outer conductor separating the two coaxial transmission lines.

Abstract: The invention provides an improved memory system that addresses signal degradation due to transmission line effects. The improved memory system includes a first buffer, at least one first memory device coupled to the first buffer, and a plurality of signal traces. The first buffer and memory device are mounted on a motherboard. Likewise, the plurality of signal traces is routed on the motherboard. Doing so eliminates stub loads that cause signal reflection that, in turn, result in signal degradation.

Abstract: Provided is a matching circuit, radio-frequency power amplifier, and mobile phone whereby the second harmonic can be suppressed and the loss of fundamental due to the self resonant frequency of components can be reduced. The output matching circuit includes: a transmission line through which a radio-frequency signal is transmitted; and resonators each of which includes a capacitor. The resonators respectively have (i) first terminals connected to substantially a same connecting point on the transmission line and (ii) second terminals that are grounded.

Abstract: A mechanism is provided for coupling a coaxial cable to a planar circuit to provide galvanic isolation between the coaxial cable and the planar circuit while providing low transmission loss and reflections between the coaxial cable and the circuit. The mechanism comprises a co-planar waveguide coupled to the coaxial cable, a microstrip line connected to the circuit, a galvanic isolation component and a ground plane. The co-planar waveguide, the microstrip line and the galvanic isolation component are formed on one side of a two-sided substrate. The ground plane is formed on the other side of the substrate and underlies at least a portion of the co-planar waveguide to form a grounded co-planar waveguide. The ground plane includes a notch underlying a portion of the co-planar waveguide to provide a transition region from the co-planar waveguide to the grounded co-planar waveguide.

Abstract: The impulse generator comprises a nonlinear transmission line capable of obtaining an impulse with a small half value width and a large amplitude, in which a plurality of transmission line units having a unit line unit and a diode are connected in series, a pulse generator connected to the transmission terminal of the nonlinear transmission line, and a bias-dependent element connected to the reception terminal of the nonlinear line, wherein the anode of the diode of the transmission line unit is connected to the transmission line and the cathode is connected to the ground, and one end of the bias-dependent element is connected to the reception terminal of the transmission line and the other end is biased to a negative potential.

Abstract: In accordance with various aspects of the disclosure, a method and apparatus is disclosed that includes feature of a transmitter and receiver having a substantially two-dimensional resonator structure including a flat coil; and an impedance-matching structure operably connected to the resonator structure, the transmitter configured to transmit power wirelessly.

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: A parallel coupled CPW line filter is provided, including a first and a second coupled lines arranged on one side of an insulating body and connected in parallel with each other, and a ground arranged on the same plane as the first and the second coupled lines, comprising a pair of ground parts spaced apart from the first and the second coupled lines, respectively, the ground parts each comprising recesses sunken from areas close to the first and the second coupled lines.

Abstract: A substrate module includes a first substrate and a second substrate. The first substrate comprises a base material; a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material; a ground pattern on the rear surface of the base material; and an exposed portion in which the ground pattern on the substrate surface is exposed by partially cutting out the base material and the ground pattern on the substrate rear surface. The second substrate comprises a base material and a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material. In connecting a transmission line of the first substrate and that of the second substrate, the ground patterns of the first and second substrates are fused with each other at the exposed portion and fixed.

Abstract: A dielectric member comprising a laminated balun and a matching circuit, wherein the matching circuit is integrally mounted within the laminated balun. The matching circuit comprises a patterned conductive film formed on a surface of an existing dielectric substrate in the balun such that the balun is not increased in size.

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: First, second and third matching parts 110, 120, and 130 are connected in series between a circuit element 199 whose impedance has a frequency characteristic and a circuitry 198 having a constant impedance. The second matching part 120 has the capability of converting impedances. The first matching part 110 operates as an element having reactance values according to any of frequency bands selected by exclusive switching between on and off of switches 118, 119 and the third matching part 130 operates as an element having reactance values according to any of the frequency bands selected by switching between on and off of a switch 133, thereby providing matching in each frequency band. A seventh reactance circuit 131 is configured on the basis of an interdependence relation with the configuration of a fifth reactance circuit 115 and an eighth reactance circuit 132.

Abstract: A termination block for connecting a first signal device and a second signal device. The termination block includes a housing, first and second pair of connectors, and an electrical circuit having passive elements that connect the first and second pair of connectors and provide impedance matching.

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract: A signal transmission structure includes two power planes, a signal line and a first pillar. The power planes spaced by an interval space provide a first voltage and a second voltage respectively. The signal line, disposed on first surfaces of the power planes, is disposed across the interval space. The first pillar is disposed within the interval space and is aside the signal line, in which the first pillar is apart from the power planes and the signal line.

Abstract: An exemplary device that operates as a differential splitter includes a plurality of differential signal conductors. Each of the conductors is coupled to at least one other of the conductors by a connector and a resistor. The coupled conductors are impedance matched by a combination of a spacing between the connector and the resistor, an impedance of the conductors and a resistive value of the resistor. An input is associated with two of the differential signal conductors. A plurality of outputs are each associated with a respective two of the differential conductors.

Abstract: An RF hybrid coupler is described having a coupling section and impedance matching transformer sections. The coupler, constructed of Stripline patterns, accepts an RF input signal at a first impedance value and outputs a plurality of RF signals at a second impedance value. The output RF signals are at equal amplitudes to one another and at lower amplitude than the input RF signal.

Abstract: An apparatus includes a multi-layer printed circuit board having a first through-hole via for a signal connection and a second through hole via for power/ground connections. The printed circuit includes a transmission line connected to at least one through-hole via. A resistor is connected between the first and second through-hole vias to eliminate a resonance notch and achieve a flat frequency response for insertion loss.

Abstract: Provided is a signal transmission line for a millimeter-wave band. The signal transmission line includes: a dielectric substrate; an input line formed on the dielectric substrate; a pair of serial transmission lines formed on the dielectric substrate, the serial transmission lines being branched at, separated from, and electromagnetically connected in series with one end of the input line; a pair of parallel transmission lines respectively formed on the dielectric substrate at both sides of the input line and the serial transmission lines, and having both ends separated from and electromagnetically connected in parallel with one end of each of the input line and the serial transmission lines; and a pair of wires electrically connected between the other ends of the parallel transmission lines and a connection pad of a monolithic microwave integrated circuit (MMIC). An electrical signal of about 57 to 63 GHz generated from a monolithic microwave integrated circuit (MMIC) can be efficiently transferred.

Abstract: A coplanar waveguide CPW using multi-layer interconnection CMOS technology is provided. In the CPW including an interlayer insulator disposed on a substrate, metal multilayers disposed on the interlayer insulator, and a ground line-a signal line-a ground line formed of an uppermost metal layer, when a ground line of a lowermost layer is connected to the ground line of the uppermost layer, intermediate metal layers are designed to gradually increase or decrease in width, or to be uneven so as to maximize an area where an ultra-high frequency spreads, thereby minimizing CPW loss and maximizing a slow wave effect. As a result, it is possible to improve performance of an ultra-high frequency circuit and miniaturize the circuit.

Abstract: A semiconductor device comprising a signal transmission line of a microstrip structure, capable of increasing the characteristic impedance of the signal transmission line and reducing coupling between a plurality of signal lines. In a signal transmission line of a microstrip structure composed of a signal line and a ground plate, the capacitance between wires is reduced and the characteristic impedance can be increased by forming holes in the signal line or in the ground plate. The coupling between a plurality of signal lines can also be reduced.

Abstract: An object of the invention is to provide a semiconductor device and an adjusting method for a semiconductor device wherein power source noises and noises radiated as radio waves can be reduced and power source noises inside the semiconductor device can be cut. The open stub OS1 is formed in the upper wiring layer of the semiconductor device 1. The stub length L1 is set to a length of ¼ of the wavelength of the known frequency containing peak components of noises. The noise receiving part AT1 is disposed adjacent to the open stub OS1. The open stub OS1 is connected to the power source wiring 4 by an interlayer wiring 6. The noise receiving part AT1 is biased to a ground potential. The basic wave component and odd-number harmonic waves of noises that are generated from the PLL circuit 11 and propagate (the arrow Y1 of FIG. 2) in the power source wiring 4 are reflected (arrow Y2 of FIG. 2) by the open stub OS1 so as to return to the PLL circuit 11, and do not reach the filter circuit 12.

Abstract: An impedance adapter with body and cap portions coupled together encloses a cavity with a printed circuit board (PCB). The PCB is provided with a trace on a first side and a ground plane on a second side. The trace is coupled to a first contact at a first end of the PCB and a second contact at a second end of the PCB. The trace has a sinuous path between the first contact and the second contact, the path longer than a longitudinal axis length of the PCB. The first and second contacts are supported coaxial within the inner conductor bore of the respective cap portion and body portion by first and second end insulators. The ground plane coupled to the body portion and the cap portion. A method of manufacture for the adapter includes steps of pre-assembling the PCB, contacts and insulators before insertion into the cavity.

Abstract: Systems and methods for combining RF signals are disclosed. An input signal can be divided into equal parts going around a ring clockwise and counterclockwise. In one embodiment, the RF amplifiers are arranged on the inside of a ring structure, and output is combined approximately at the center of the ring.

Abstract: An RF impedance-matching transformer for matching the output impedance of an RF amplifier to the discharge of a gas-discharge laser includes upper and lower dielectric plates arranged face-to-face and bonded together. A primary U-shaped strip winding is embedded in the bonded surface of one of the dielectric plates. A secondary strip-winding is formed on an exposed surface of the upper dielectric plates. A ground-plane electrode formed on an exposed surface of the lower dielectric plate. An electrical connector connects one end of the secondary strip-winding to the ground-plane electrode via a via-hole extending through the dielectric plates. The other end of the secondary strip-winding can be connected to the laser.

Abstract: This invention effectively prevents potential fluctuation in the power supply terminal of a semiconductor device, that is, noise from flowing out to a main power supply wiring. A multilayer print circuit board includes a first power supply via hole which connects to the power supply terminal of a semiconductor integrated circuit on a first surface layer and extends from the first surface layer to a second surface layer, a ground via hole which connects to a ground conductive layer, extends from the ground conductive layer to the second surface layer, and connects to the first power supply via hole on the second surface layer through a bypass capacitor, a first clearance hole which is formed in a power supply conductive layer, and a second clearance hole which is formed in the ground conductive layer. The first clearance hole is larger than the second clearance hole.

Abstract: A bipolar pulse generator circuit generates bipolar pulses and provides an impedance transformation. The circuit is amenable for implementation in a variety of configurations depending on the size and pulse width requirements for the design. It also maximizes energy transfer and may be implemented in a straight forward, easy manner. The generator may be implemented with one or two switches in a three, five or more transmission line implementation and may include inductive stub, which is inherent element of transmission line transformers. The generator may also be implemented in a multi-layer folded configuration, with or without the addition of a ground potential conductor. The generator may also be implemented in stacked or/and balanced configurations.

Abstract: An object of the present invention is to provide a resonator capable of constituting a variable filter which has a small size, high mass productivity, low loss and high reproducibility of frequency. According to the present invention, a resonator having a line structure formed on a dielectric substrate 2, is reduced in size by providing a counter electrode 6 in the direction perpendicular to a surface of a resonant line 4 for forming a capacitive reactance which is added to the resonance circuit. The resonator can be further reduced in size by providing widened parts 7a, 7b on the resonant line with the use of the skin effect of an electric signal propagating in the resonant line, so as to enable a large capacitive reactance to be obtained, and by providing the widened parts and the counter electrodes for a part on the resonant line where a magnitude of voltage standing wave is high.

Abstract: A broadband transmission line impedance transformer performs impedance transformation with improved frequency response and efficiency across a wide operational bandwidth. In particular, the bandwidth of a transmission line 2:1 impedance transformer may be significantly increased by adding an additional compensating capacitor as an internal component between interconnected transmission lines. This capacitor effectively improves low frequency response for a given length of transmission lines and decreases mismatch in an entire frequency range. The overall bandwidth ratio increases at least twice and mismatch decreases.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: A circuit board construction which reduces unwanted electrical effects and lower signal quality resulting from the use of vias in relatively thick circuit boards or in circuit boards carrying signals of relatively high frequency. The circuit board includes a through-hole in the circuit board substrate for carrying a conductive via stub, the stub having an inherent stub characteristic; and a compensation element, such as a surface mount capacitor, positioned on the substrate such that when the stub is carried by the through-hole the inherent stub characteristic is adjusted to define a compensated stub characteristic.

Abstract: A semiconductor device according to the one embodiment of the present invention comprises a signal line; and a reference potential plane which is separated from the signal line and opposed to the signal line, the reference potential plane being provided with a discontinuous region in a portion intersecting with the signal line, as a delay element to be added to the signal line.

Abstract: Shielded circuit pad is provided where the parasitic capacitance is tuned out by the inclusion of a shunt transmission line stub which reduces the substrate induced loss in millimeter-wave applications. The circuit pad is located on the substrate, with a shield located beneath the circuit pad, and the shunt transmission line stub attached to the circuit pad. Accordingly, controlled impedance is obtained for millimeter-wave applications. The spacing between the circuit pad and the shield may then be minimized.

Abstract: While gradually increasing the widths of signal lines (104a, 104b, 105a, 105b) of first and second groups of differential signal lines (104, 105) to suppress attenuation in the lines, the opening widths of slits (104s, 105s) formed in a GND layer (102) below the differential signal lines are similarly changed. Thereby, impedance matching is realized. Further, by alternately disposing a large-width side and a small-width side of the two groups of differential signal lines (104, 105), the total wiring area widths are reduced.

Abstract: An electric apparatus capable of stably transmitting signals in a high frequency band (high speed signals) by preventing distortion of a signal waveform through impedance control is disclosed. The electric apparatus includes a case having a signal line which transmits signals between electronic parts, a dielectric deposited on the case and the signal line, and a ground portion disposed on the dielectric.

Abstract: A feedthrough for feeding a microwave signal through a wall of a casing comprises a signal waveguide having at least two portions having different cross-sections. The portion having the smaller cross-section is filled with plastically-deformable dielectric material which, under the action of pressure and heat, is bonded to the walls of the portion in which it is located. The dimensions of the portion are such as to provide an impedance match with the adjacent portions. An antenna couples electromagnetic energy between the waveguide and a strip transmission line. A metal cap seals the end of the waveguide and screens the antenna.

Abstract: A transmission line conversion apparatus connecting a parallel transmission line to a coplanar waveguide (CPW) is provided. To this end, the CPW including a transmission line composed of a signal line and a ground line which is formed on one surface of a dielectric substrate, and a parallel transmission line connected to the CPW, at a predetermined angle with respect to a substrate constituting the CPW, and composed of a signal line and a ground line, are proposed. In addition, the signal line of the CPW and the signal line of the parallel transmission line are connected to each other, and the ground line of the CPW and the ground line of the parallel transmission line are connected to each other. As such, by connecting the CPW to the parallel transmission line, a return loss can be minimized.

Abstract: A waveguide/strip line converter includes a waveguide and a multilayer substrate. A second end of the multilayer substrate is fixed to an opening of the waveguide. The multilayer substrate includes a plurality of dielectric layers to form a plurality of substrate faces. A top substrate face includes a strip line and a first short-circuiting metal pattern. First and second intermediate substrate faces include second and third short-circuiting metal patterns with openings, respectively. A matching element forming substrate face includes a matching element, which is electromagnetically coupled with the strip line. A waveguide passage extends through the openings between the strip line and the matching element. A cross sectional area of the opening is larger than that of the opening.

Abstract: Methods and systems for matching networks embedded in an integrated circuit package are disclosed and may include controlling impedance within an integrated circuit via one or more impedance matching networks. The impedance matching networks may be embedded within a multi-layer package bonded to the integrated circuit. The impedance of one or more devices within the integrated circuit may be configured utilizing the impedance matching networks. The multi-layer package may include one or more impedance matching networks. The impedance matching networks may provide impedance matching between devices internal to the integrated circuit and external devices. The impedance matching networks may be embedded within the multi-layer package, and may include transmission lines, inductors, capacitors, transformers and/or surface mount devices. The impedance matching networks may be deposited on top of and/or on bottom of the multi-layer package. The integrated circuit may be flip-chip bonded to the multi-layer package.

Abstract: A transmission line transformer is disclosed. The transformer improves efficiency and a dynamic range of a power amplifier. The transformer is formed to have a plurality of load impedances as the primary side of the transmission line transformer is separated to form a plurality of primary transmission lines with parasitic components which are different from each other. The transformer is used as an impedance matching circuit of the power amplifier requiring a plurality of load impedances.

Abstract: Provided is a microwave module having a converter for improving transmission characteristics in a millimeter-wave band. When a microstrip transmission line and a conductor-backed coplanar waveguide (CBCPW) transmission line are connected by wire bonding, a change in impedance caused by wire bonding and an abrupt change in electric field components between the two transmission lines are reduced by the converter. Therefore, insertion loss and return loss are reduced, and transmission characteristics in a millimeter-wave band are improved.

Abstract: The invention concerns a coaxial automatic impedance adaptor characterized in that it comprises two slugs and has only a lateral translational movement along an axis Ox. The double slug tuner principle is based on the movement of two line segments of different characteristics of 50 O inside a closed cylinder on either side of standard connectors.

Abstract: A mechanism for coupling a coaxial cable (108) to a planar circuit to provide galvanic isolation between the coaxial cable and the planar circuit while providing low transmission loss and reflections between the coaxial cable (108) and the circuit. The mechanism comprises a co-planar waveguide (211) coupled to the coaxial cable (108), a microstrip line (240) connected to the circuit, a galvanic isolation component (234) and a ground plane (222). The co-planar waveguide (211), the microstrip line (240) and the galvanic isolation component (234) are formed on one side (203) of a two-sided substrate (202). The ground plane (222) is formed on the other side (205) of the substrate (202) and underlies at least a portion of the co-planar waveguide (211) to form a grounded co-planar waveguide (221). The ground plane (222) includes a notch (224) underlying a portion of the co-planar waveguide (211) to provide a transition region (225) from the co-planar waveguide (211) to the grounded co-planar waveguide (221).

Abstract: A dual band balun filter that includes a first coupled-line section pair provided with a first terminal; a second coupled-line section pair configured to be connected to the first coupled-line section pair, a third coupled-line section pair, and a fourth coupled-line section pair, respectively, and the fourth coupled-line section pair is provided with a second terminal; the third coupled-line section pair is provided with a transmission line and is connected to a fifth coupled-line section pair that is provided with a third terminal; and each of the first to fifth coupled-line section pairs is formed with partial coupled stepped impedance resonators (SIRs).

Abstract: An electronic device includes a first transmission line, a second transmission line and a ground-coupling portion. The first transmission line is composed of a first signal line transmitting a given high frequency wave signal and a first ground. The second transmission line is composed of a second signal line transmitting the high frequency wave signal and a second ground. The ground-coupling portion couples the first ground and the second ground. A phase difference between the high frequency wave signals at both ends of the ground-coupling portion is substantially integral multiple of 180 degrees.

Abstract: Systems and methods for a structure for a package substrate for use in a semiconductor package are disclosed. Package substrates formed according to the systems and methods of the present invention may exhibit improved signal integrity and quality. In order to achieve this increase signal integrity, these systems and methods may endeavor to obtain equalization, or matching, of impedances in signal traces in or on the package substrate by removing material from one or more layers of a package substrate in a region of high signal density. Removing material from these layers may serve to increase the impedance of a signal trace within a region of high signal density such that the impedance of the signal trace with the region of high signal density is substantially matched to the impedance of the signal trace outside the region of high-signal density.

Abstract: Disclosed are a microstrip-type BALUN (BALance to UNbalance transformer), broadcast receiving apparatus using the same, and a method for forming the same. The BALUN includes a board and a microstrip line formed on the board for transforming an input unbalanced signal into a balanced signal. Since the microstrip-type BALUN is realized by a microstrip line which is a distributed constant line, the microstrip-type BALUN has an excellent performance even for high-frequency signals. Similarly, a broadcast receiving apparatus to which a microstrip-type BALUN is applied also has an excellent performance for high-frequency broadcasting signals.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a coaxial structure such as a coaxial cable that directly connects the monolithic microwave integrated circuit to the waveguide to transmit energy such as microwave energy with minimal loss.

Abstract: A printed circuit laminate is provided comprising at least one conductor trace for carrying forward electrical signals in a first direction of signal propagation. The printed circuit laminate also comprises a mesh reference plane, spaced from the at least one conductor trace, for carrying return electrical signals in a second direction. The mesh reference plane defines a plurality of cells. Each cell of the plurality of cells includes at least one axis of repetition. The plurality of cells are configured so that all of the axes of repetition of each cell are different from the first direction of signal propagation. Furthermore, the frequency of cell repetition along the first direction of signal propagation is chosen to reduce differences in transmission line impedance between any two conductors on the same laminate or any two conductors on different laminates.

Abstract: Electrical coupling apparatus providing transition between a high radio frequency waveguide and a perpendicularly oriented microstrip line without use of a shorting cap fixes an open end of the waveguide perpendicularly to a dielectric substrate. The microstrip line is carried on the substrate and couples through a hole in the waveguide wall to a microstrip patch on the substrate within the waveguide having a resonance with the waveguide encompassing a predetermined high radio frequency bandwidth of signals to be conducted by the apparatus. A plurality of parallel conducting members form a via fence aligned with the waveguide wall and extending through the substrate to electrically connect the waveguide to a planar ground conductor that covers the opposite side of the substrate, including the area under the open end of the waveguide.