Abstract: Provided is a microstrip transmission line for reducing far-end crosstalk. In a conventional microstrip transmission line on a printed circuit board, a capacitive coupling between adjacent signal lines is smaller than an inductive coupling therebetween, so that far-end crosstalk occurs. According to the present invention, the capacitive coupling between the adjacent signal lines is increased to reduce the far-end crosstalk. A vertical-stub type microstrip transmission line is provided.

Abstract: Methods and apparatus are disclosed, such as those involving an interconnection layout for an integrated circuit (IC). One such layout includes a plurality of differential pairs of lines. Each differential pair has two lines including one or more parallel portions extending substantially parallel to each other. Each pair also includes a shield line. Each of the shield lines includes one or more parallel portions interposed between the parallel portions of one of the pairs of differential lines. One or more of the shield lines are electrically connected to a voltage reference, such as ground. This layout is believed to reduce or eliminate intra-pair coupling as well as inter-pair coupling.

Abstract: In a microwave transition from a coaxial line (1) to a coplanar line system (3), in a longitudinal hole (5) of an outer conductor housing (6), the round inner conductor (4) of the coaxial line (1) continues in a planar inner conductor in the form of a narrow piece of foil (9), of an elastically flexible insulating material and metalized on at least one side. The end of this planar inner conductor (9, 10) then narrows in a transition section (16) to the width of a coplanar middle conductor (13; 20), with coplanar earthing areas (14, 15; 21, 22) on both sides.

Abstract: Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via.

Abstract: A tuning circuit for a pivotal antenna comprises a feeder transmission cable, a microwave medium, an impedance-matching tuning circuit, a grounding plane, a pivotal shaft, a radiation conductor, and a carrier member. The feeder transmission cable has a central wire and an outer conductor. The microwave medium has a first plane and a second plane. The impedance-matching tuning circuit is arranged on the first plane and connected with the central wire. The grounding plane is arranged on the second plane and connected with the outer conductor. The pivotal shaft has a first end connected with the impedance-matching tuning circuit and a second end connected with the radiation conductor. The carrier member accommodates the microwave medium thereinside. The tuning circuit for a pivotal antenna of the present invention can provide superior impedance and bandwidth for a radiation conductor of an antenna.

Abstract: A design structure, structure, and method for providing an on-chip variable delay transmission line with a fixed characteristic impedance. A method of manufacturing a transmission line structure includes forming a signal line of the transmission line structure, forming a first ground return structure that causes a first delay and a first characteristic impedance in the transmission line structure, and forming a second ground return structure that causes a second delay and a second characteristic impedance in the transmission line structure. The first delay is different from the second delay, and the first characteristic impedance is substantially the same as the second characteristic impedance.

Abstract: There are provided a waveguide plate that is made of metallic plates through which through holes are formed and a pair of resin made substrates (first and second substrates) on which a grounding pattern is formed to cover the through holes. Both the waveguide plate and the substrates are laminated with each other using a conductive adhesive such that the waveguide plate is sandwiched by the substrates, whereby a rectangular waveguide is provided. The first substrate has high frequency circuits such as an oscillator that generates high frequency signals. The high frequency signals generated by the oscillator are supplied to an antenna section that is formed on the second substrate via the rectangular waveguide.

Abstract: A coaxial transition includes a first conductor aligned along a first axis. The transition also includes a ground shield surrounding the first conductor such that a first gap exists between the first conductor and the ground shield. An electric field radiates between the first conductor and the ground shield through the first gap. The transition further includes a second conductor aligned along a second axis and coupled to the first conductor. The second conductor forms a second gap between the second conductor and a portion of the ground shield. A first portion of the electric field radiates between the second conductor and the ground shield through the second gap. The transition also includes a top ground plane aligned substantially parallel to the second conductor. A third gap exists between the top ground plane and the second conductor. The second gap and the third gap are substantially parallel with the second conductor therebetween.

Abstract: A signal selecting device according to the present invention has two input/output ports, a plurality of resonating parts, a plurality of impedance transforming parts, and a controlling part. The resonating parts have a ring conductor having a length equal to one wavelength at a resonant frequency or an integral multiple thereof and a plurality of switches each of which is connected to a different part of the ring conductor at one end and to a ground conductor at the other end. The controlling part controls the state of the switches. The resonating parts are disposed in series between the two input/output ports. The impedance transforming parts are disposed between the input/output ports in such a manner that the impedance transforming parts at the both ends are disposed between the input/output port and the resonating part and the remaining impedance transforming parts are disposed between the resonating parts.

Abstract: A multiband matching circuit of the present invention includes an inductive element having one end connected to an input terminal, a first switch having one end connected to the other end of the inductive element and the other end grounded, a capacitive element having one end connected to the input terminal, a second switch having one end connected to the other end of the capacitive element and the other end grounded, a first-band matching circuit that is connected between the other end of the inductive element and a first output terminal and performs impedance matching in a first frequency band, and a second-band matching circuit that is connected between the other end of the capacitive element and a second output terminal and performs impedance matching in a second frequency band higher than the first frequency band.

Abstract: A circuit board includes a signal line plane and a reference plane. The signal line plane has at least a first transmission line and a second transmission line formed thereon. The reference plane has a conductive region and at least a non-conductive region. The first transmission line and the second transmission line overlap the conductive region in a thickness direction of the circuit board. The non-conductive region includes at least a first part and a second part connected to the first part, where the second part is positioned between the projection of the first transmission line on the reference plane and the projection of the second transmission line on the reference plane, and has no intersection with at least one of the projection of the first transmission line and the projection of the second transmission line.

Abstract: A flexible matching circuit topology defined by rules maximizes transfer efficiency for an amplified input signal over a wide band of operation. The circuit includes an impedance matching circuit suitable for transforming an electromagnetic signal transmission path of a first impedance into an electromagnetic signal transmission path having a second impedance. A first transmission line element is connected to at least one intermediate transmission line element. At least one pair of perpendicularly juxtaposed transmission line stub elements are connected across said intermediate transmission line element. At least one last transmission line element is connected to the intermediate transmission line element. An optional number of single-sided stub elements may be connected perpendicularly to the first transmission line element, the intermediate transmission line elements or the last transmission line element.

Abstract: A layout of a circuit board includes a first signal layer, a second signal layer, and a third signal layer. The first signal layer has a transmission line. The second signal layer is stacked below the first signal layer, and has an opening. The third signal layer is stacked below the first and second signal layers with the second signal layer sandwiched between the first and third signal layers. The third signal layer is electrically connected to the second signal layer, and both of the second and third signal layers are ground layers or power layers. An orthogonal projection of a segment of the transmission line on the third signal layer is overlapped with that of the opening on the third signal layer. Therefore, an equivalent impedance of the segment of the transmission line with respect to the second and third signal layers can be increased or decreased.

Abstract: Methods and systems for matching networks embedded in an integrated circuit package are disclosed and may include controlling impedance within an integrated circuit via one or more impedance matching networks. The impedance matching networks may be embedded within a multi-layer package bonded to the integrated circuit. The impedance of one or more devices within the integrated circuit may be configured utilizing the impedance matching networks. The multi-layer package may include one or more impedance matching networks. The impedance matching networks may provide impedance matching between devices internal to the integrated circuit and external devices. The impedance matching networks may be embedded within the multi-layer package, and may include transmission lines, inductors, capacitors, transformers and/or surface mount devices. The impedance matching networks may be deposited on top of and/or on bottom of the multi-layer package. The integrated circuit may be flip-chip bonded to the multi-layer package.

Abstract: In one example embodiment, a coplanar waveguide signal transition element transitions high-speed signals between vertically stacked coplanar waveguide transmission lines. The signal transition element comprises one or more dielectric layers and a plurality of electrically conductive vias extending through at least a portion of the one or more dielectric layers. The vias include one or more signal vias and one or more ground vias that are configured to transition signals between the vertically stacked coplanar waveguide transmission lines. The signal transition element also comprises a ground plane disposed within the one or more dielectric layers and electrically coupled to the one or more ground vias. The ground plane has one or more openings through which the one or more signal vias respectively pass.

Abstract: This invention discloses a complementary-conducting-strip transmission line (CCS TL) structure. The CCS TL structure includes a substrate, at least one first mesh ground plane, m second mesh ground planes having m first inter-media-dielectric (IMD) layers interlaced with and stacked among each other and the first mesh ground plane to form a stack structure on the substrate, a second IMD layer being on the stack structure, and a signal transmission line being on the second IMD layer. Wherein, each first IMD layer has a plurality of vias to correspondingly connect the first and the m second mesh ground planes, therein, m?2 and m is a natural number, and the m second mesh ground planes under the signal transmission line have at least one slit structure.

Abstract: A multilayer complementary-conducting-strip transmission line (CCS TL) structure is disclosed herein. The multilayer CCS TL structure includes a substrate, and n signal transmission lines being parallel and interlacing with n-1 mesh ground plane(s), therein a plurality of inter-media-dielectric (IMD) layers are correspondingly stacked with among the n signal transmission lines and the n-1 mesh ground plane(s) to form a stack structure on the substrate, therein n?2 and n is a natural number. Whereby, a multilayer CCS TL with independent of each layer and complete effect on signal shield is formed to provide more flexible for circuit design, reduce the circuit area and also diminish the transmission loss.

Abstract: A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission.

Abstract: Since the loss of the conventional microwave device is large, when this device is applied to the microwave component, there are problems; for example, a low-noise amplifier, the noise figure is degraded, and when applied to a high-output amplifier, output and efficiency may be decreased. In particular, in the high-output amplifier of over 100 W class, heat generation at a capacitor which forms the microwave device increases, which causes a problem that the reliability of the microwave device may be decreased. A structure is formed to include a capacitor loaded between two high impedance lines the length of which has ¼ wavelength in the desired frequency band and the characteristic impedance is higher than 50?.

Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; the length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

Abstract: Described herein are an apparatus, system, and method having a compact symmetrical transition structure for RF applications. The apparatus comprises: first and second ground planes each of which having respective truncated edges, the first and second ground planes being parallel to one another and separated by a multi-layer substrate; a strip line positioned between the first and second ground planes; and a symmetrical transition structure, coupled to the strip line and the first and second ground planes near their respective truncated edges, and further coupled to a broadside coupled line (BCL).

Abstract: In a CO2 gas discharge laser energized by a radio frequency (RF) power source a transformer having selectively variable output impedance is used to match output impedance of the power source to the impedance of discharge electrodes of the laser. A similar transformer can be used to impose a selective variable phase-shift on the RF power from the source. The variable impedance transformer can also be used for impedance matching between amplifier stages in the power source.

Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Abstract: A printed wiring board having at least one connector includes a dielectric substrate that has, on a first face, a first ground plane, and on a second face, at least two transmission lines between which the connector and a footprint are mounted. The footprint includes a first element positioned between the two transmission lines under the connector. The first element forming with the first ground plane, a capacitive element and, at each extremity of the first element, second elements forming with the first element, a self-inductive and capacitive element. The second elements each extending by a second ground plane, the second ground planes which are connected to the first ground plane.

Abstract: A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.

Abstract: A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.

Abstract: An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines.

Abstract: Provided is a waveguide-microstrip line converter, including: a waveguide; a dielectric substrate that is connected to cover one end of the waveguide; a strip conductor that is disposed on a front surface of the dielectric substrate; a conductor plate that is disposed the front surface of the dielectric substrate, and connected to the strip conductor; a ground conductor that is disposed on a rear surface of the dielectric substrate; and a plurality of connection conductors that connect a periphery of the conductor plate and the ground conductor, in which: the ground conductor has an opening formed therein in a connection region; the strip conductor and the ground conductor forma microstrip line; and the plurality of connection conductors are arranged so that a distance between two lines of the plurality of connection conductors that are aligned in a longitudinal direction of the microstrip line, and disposed on both opposing sides of the conductor plate in a vicinity of a connection portion is narrower than a

Abstract: Disclosed herein is a wideband transmission line—waveguide transition apparatus. The wideband transmission line—waveguide transition apparatus includes: a waveguide constituted by a single dielectric substrate; a transmission line applying a signal to the waveguide; and a cavity matching unit in which a cavity of which an inner surface is formed by a metallic surface is formed at a portion of the waveguide to contact with the transmission line and impedance is adjusted through a change of the dielectric constant in the cavity caused by changing the size and shape of the cavity to perform impedance matching between the waveguide and the transmission line, and the position of the cavity is changed to perform phase matching between the waveguide and the transmission line.

Abstract: The invention relates to a method and a device for pseudo-differential transmission in interconnections used for sending a plurality of electrical signals. The ends of an interconnection having 4 transmission conductors and a return conductor distinct from the reference conductor are each connected to a termination circuit. Three damping circuits are connected between the return conductor and the reference conductor. The transmitting circuits receive at their inputs the signals from the 4 channels of the two sources, and are connected to the conductors of the interconnection. A transmitting circuit in the activated state produces modal electrical variables, each modal electrical variable being allocated to one and only one channel.

Abstract: In a differential transmission line, a substrate has first and second surfaces parallel to each other, and a first grounding conductor is formed on the second surface of the substrate. A dielectric layer is formed on the first grounding conductor, and a second grounding conductor is formed on the dielectric layer. First and the second signal conductors are formed to be parallel to each other on the first surface of the substrate. The first signal conductor and the first and second grounding conductors constitute a first transmission line, and the second signal conductor and the first and second grounding conductors constitute a second transmission line. A slot is formed in the first grounding conductor to three-dimensionally intersect with the first and second signal conductors and to be orthogonal to a longitudinal direction thereof, and a connecting conductor is formed for connecting the first grounding conductor with the second grounding conductor.

Abstract: In some embodiments a differential communication channel compensates for electrostatic discharge capacitance of an electrostatic discharge component by increasing an impedance of the differential communication channel near the electrostatic discharge component. Other embodiments are described and claimed.

Abstract: A coaxial to transmission line connector has a connector and an attachment area with a windowed electrical attachment point that when soldered in place on a ground reference of an electrical device, creates an electrical and mechanical connection between an outer conductor of the coaxial to transmission line connector. The attachment area has at least one mechanical alignment point and a corresponding reference pivot point located substantially co-planar at the termination of the coaxial dielectric region at an edge of a PCB and a port of the coaxial to transmission line connector. The at least one mechanical alignment point and the corresponding reference pivot plane serve to automatically align the coaxial to transmission line connector to the electrical device. Opposite the attachment area is a dielectric area following termination of the outer conductor in the transition area of the microstrip transmission line.

Abstract: A variable impedance adapter that has a value of characteristic impedance that is responsive to changes in the configuration of the adapter. In one embodiment, the variable impedance adapter includes an elongated section and a telescoping section that surround a center conductor that transmits an electrical signal across the adapter. A pair of tuning elements is disposed on a portion of the center conductor, one or more of the elements being shaped and configured to move along the center conductor amongst a plurality of positions in response to relative movement between the elongated section and the telescoping section. The first position and the second position correspond to different values of characteristic impedance of the variable impedance adapter.

Abstract: An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices.

Abstract: A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate through the inner conductor, an impedance between the inner conductor and an outer conductor serving as a grounding line being adjusted to a predetermined impedance; and causing a component of the radio frequency signal to propagate through a capacitor provided in a middle of the inner conductor, an impedance at a portion of the capacitor installed being adjusted to match the predetermined impedance by a dielectric material provided around the capacitor.

Abstract: An output terminal 6 is provided at the connecting point 5 between the collector terminal of a transistor 1 and an open-ended stub 4 by connecting the open-ended stub 4 to the collector terminal of the transistor 1, the open-ended stub 4 having a line length equal to a quarter of the wavelength of a signal of frequency 2N·F0 or 2N times the oscillation frequency F0. In addition, an output terminal 9 is provided at a connecting point 8 located at a distance equal to a quarter of the wavelength of a signal of oscillation frequency F0 from the end of an open-ended stub 7 by connecting the open-ended stub 7 to the base terminal of the transistor 1, the open-ended stub 7 having a line length longer than a quarter of the wavelength of the signal of oscillation frequency F0.

Abstract: A controller 90 of an automatic matching unit includes a first and a second matching control unit 100, 102 for respectively variably controlling the electrostatic capacitances of a first and a second variable capacitors 80, 82 through a first and a second stepping motor 86, 88 such that a measured absolute value ZMm and a measured phase Z?m of a load impedance obtained by an impedance measuring unit 84 become close to a predetermined reference absolute value ZMs and a predetermined reference phase Z?s, respectively; and a gain control unit 112. The gain control unit 112 variably controls a proportional gain of at lease one of the first and the second matching unit based on current electrostatic capacitances NC1 and NC2 of the first and the second variable capacitors 80, 82 obtained by a first and a second electrostatic capacitance monitoring unit 108, 110, respectively.

Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

Abstract: A junction (300) for connecting two waveguides having an angular offset between longitudinal symmetry axes of their cross-sections and a first linear offset of the center axes of the waveguides. The junction (300) comprises at least a first and a second transformer sections (202, 206) both having said first angular offset between longitudinal symmetry axes of their cross-sections and said first linear offset of their center axes, wherein each of said transformer sections (202, 206) has one protruded ridge (204, 208) on broad walls, wherein the first ridge (204) is mainly situated outside the cross section of the second transformer section 206 and the second ridge (208) is mainly situated outside the cross section of the first transformer section (202).

Abstract: An apparatus and method for reducing stray magnetic fields include a decoupling circuit includes a balun that comprises a transmission line. The transmission line includes a first spiral positioned substantially parallel to a first plane, the first spiral emanating from a inner portion of the first spiral in a first spiral direction. The transmission line also includes a second spiral positioned substantially parallel to the first plane, the second spiral emanating from a inner portion of the second spiral in the first spiral direction, wherein the inner portion of the first spiral is electrically coupled to the inner portion of the second spiral, and wherein the transmission line comprises a signal line and a ground line. The balun further comprises a first capacitor electrically coupled to the transmission line.

Abstract: An embodiment of the present invention provides an apparatus, comprising a power amplifier with a tunable impedance matching circuit including a plurality of tunable dielectric varactors and a DC voltage source interface capable of providing voltage to said plurality of saud tunable dielectric varactors.

Abstract: A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate through the inner conductor, an impedance between the inner conductor and an outer conductor serving as a grounding line being adjusted to a predetermined impedance; and causing a component of the radio frequency signal to propagate through a capacitor provided in a middle of the inner conductor, an impedance at a portion of the capacitor installed being adjusted to match the predetermined impedance by a dielectric material provided around the capacitor.

Abstract: A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

Abstract: A junction (100) for connecting two waveguides (102, 104) having a first angular offset (?) between longitudinal symmetry axes of their cross-sections, said junction (100) comprising a first interface and a second interlace for connecting said waveguides (102, 104). The junction further comprises at least a first transformer section (106) and a second transformer section (108), both having cross-sections of substantially rectangular shape, and both having said first angular offset (?) between longitudinal symmetry axes of their cross-sections. Each of said transformer sections (106, 108) has two protruded ridges (202, 204, 206, 208) on its opposite walls.

Abstract: A circuit board includes a signal line plane and a reference plane. The signal line plane has at least a first transmission line and a second transmission line formed thereon. The reference plane has a conductive region and at least a non-conductive region. The first transmission line and the second transmission line overlap the conductive region in a thickness direction of the circuit board. The non-conductive region includes at least a first part and a second part connected to the first part, where the second part is positioned between the projection of the first transmission line on the reference plane and the projection of the second transmission line on the reference plane, and has no intersection with at least one of the projection of the first transmission line and the projection of the second transmission line.

Abstract: A signal transmission device 10 is constructed in such a way that transmitting equipment 11 and receiving equipment 12 are connected to each other via a transmission path which consists of at least hot and cold signal lines, and a signal output stage of the transmitting equipment 11 is comprised of a current output circuit 112 and a load impedance Z (113) for converting a current I0 created by the current output circuit 112 into a voltage, the load impedance Z (113) has an end connected to the hot signal line (H) of the transmission path 13 and another end connected to the cold signal line (C) of the transmission path, and the cold signal line (C) of the transmission path is connected to a ground terminal (GNDB) of the receiving equipment 12.

Abstract: A strip conductor is provided on a dielectric board, and a ground conductor facing the strip conductor in a thickness direction of the dielectric board is provided on a surface of the dielectric board. The ground conductor is provided with a plurality of holes penetrating therethrough along the thickness direction of the dielectric board. This structure accomplishes a microstrip line that can obtain consistent passing frequency characteristics.

Abstract: A coaxial connector includes a first inner conductor and a second inner conductor. A capacitor connects between the first inner conductor and the second inner conductor. An outer conductor extends along and surrounds the first and second inner conductors and the capacitor. A first dielectric material is filled in a gap between the outer conductor and the first and second inner conductors. A support member supports the first and second inner conductors with respect to the outer conductor. A second dielectric material for impedance matching is provided between the capacitor and the outer conductor.

Abstract: Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.