Abstract: A variable impedance adapter that has a value of characteristic impedance that is responsive to changes in the configuration of the adapter. In one embodiment, the variable impedance adapter includes an elongated section and a telescoping section that surround a center conductor that transmits an electrical signal across the adapter. A pair of tuning elements is disposed on a portion of the center conductor, one or more of the elements being shaped and configured to move along the center conductor amongst a plurality of positions in response to relative movement between the elongated section and the telescoping section. The first position and the second position correspond to different values of characteristic impedance of the variable impedance adapter.

Abstract: An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices.

Abstract: A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate through the inner conductor, an impedance between the inner conductor and an outer conductor serving as a grounding line being adjusted to a predetermined impedance; and causing a component of the radio frequency signal to propagate through a capacitor provided in a middle of the inner conductor, an impedance at a portion of the capacitor installed being adjusted to match the predetermined impedance by a dielectric material provided around the capacitor.

Abstract: An output terminal 6 is provided at the connecting point 5 between the collector terminal of a transistor 1 and an open-ended stub 4 by connecting the open-ended stub 4 to the collector terminal of the transistor 1, the open-ended stub 4 having a line length equal to a quarter of the wavelength of a signal of frequency 2N·F0 or 2N times the oscillation frequency F0. In addition, an output terminal 9 is provided at a connecting point 8 located at a distance equal to a quarter of the wavelength of a signal of oscillation frequency F0 from the end of an open-ended stub 7 by connecting the open-ended stub 7 to the base terminal of the transistor 1, the open-ended stub 7 having a line length longer than a quarter of the wavelength of the signal of oscillation frequency F0.

Abstract: A controller 90 of an automatic matching unit includes a first and a second matching control unit 100, 102 for respectively variably controlling the electrostatic capacitances of a first and a second variable capacitors 80, 82 through a first and a second stepping motor 86, 88 such that a measured absolute value ZMm and a measured phase Z?m of a load impedance obtained by an impedance measuring unit 84 become close to a predetermined reference absolute value ZMs and a predetermined reference phase Z?s, respectively; and a gain control unit 112. The gain control unit 112 variably controls a proportional gain of at lease one of the first and the second matching unit based on current electrostatic capacitances NC1 and NC2 of the first and the second variable capacitors 80, 82 obtained by a first and a second electrostatic capacitance monitoring unit 108, 110, respectively.

Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

Abstract: A junction (300) for connecting two waveguides having an angular offset between longitudinal symmetry axes of their cross-sections and a first linear offset of the center axes of the waveguides. The junction (300) comprises at least a first and a second transformer sections (202, 206) both having said first angular offset between longitudinal symmetry axes of their cross-sections and said first linear offset of their center axes, wherein each of said transformer sections (202, 206) has one protruded ridge (204, 208) on broad walls, wherein the first ridge (204) is mainly situated outside the cross section of the second transformer section 206 and the second ridge (208) is mainly situated outside the cross section of the first transformer section (202).

Abstract: An apparatus and method for reducing stray magnetic fields include a decoupling circuit includes a balun that comprises a transmission line. The transmission line includes a first spiral positioned substantially parallel to a first plane, the first spiral emanating from a inner portion of the first spiral in a first spiral direction. The transmission line also includes a second spiral positioned substantially parallel to the first plane, the second spiral emanating from a inner portion of the second spiral in the first spiral direction, wherein the inner portion of the first spiral is electrically coupled to the inner portion of the second spiral, and wherein the transmission line comprises a signal line and a ground line. The balun further comprises a first capacitor electrically coupled to the transmission line.

Abstract: An embodiment of the present invention provides an apparatus, comprising a power amplifier with a tunable impedance matching circuit including a plurality of tunable dielectric varactors and a DC voltage source interface capable of providing voltage to said plurality of saud tunable dielectric varactors.

Abstract: A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

Abstract: A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate through the inner conductor, an impedance between the inner conductor and an outer conductor serving as a grounding line being adjusted to a predetermined impedance; and causing a component of the radio frequency signal to propagate through a capacitor provided in a middle of the inner conductor, an impedance at a portion of the capacitor installed being adjusted to match the predetermined impedance by a dielectric material provided around the capacitor.

Abstract: A junction (100) for connecting two waveguides (102, 104) having a first angular offset (?) between longitudinal symmetry axes of their cross-sections, said junction (100) comprising a first interface and a second interlace for connecting said waveguides (102, 104). The junction further comprises at least a first transformer section (106) and a second transformer section (108), both having cross-sections of substantially rectangular shape, and both having said first angular offset (?) between longitudinal symmetry axes of their cross-sections. Each of said transformer sections (106, 108) has two protruded ridges (202, 204, 206, 208) on its opposite walls.

Abstract: A signal transmission device 10 is constructed in such a way that transmitting equipment 11 and receiving equipment 12 are connected to each other via a transmission path which consists of at least hot and cold signal lines, and a signal output stage of the transmitting equipment 11 is comprised of a current output circuit 112 and a load impedance Z (113) for converting a current I0 created by the current output circuit 112 into a voltage, the load impedance Z (113) has an end connected to the hot signal line (H) of the transmission path 13 and another end connected to the cold signal line (C) of the transmission path, and the cold signal line (C) of the transmission path is connected to a ground terminal (GNDB) of the receiving equipment 12.

Abstract: A circuit board includes a signal line plane and a reference plane. The signal line plane has at least a first transmission line and a second transmission line formed thereon. The reference plane has a conductive region and at least a non-conductive region. The first transmission line and the second transmission line overlap the conductive region in a thickness direction of the circuit board. The non-conductive region includes at least a first part and a second part connected to the first part, where the second part is positioned between the projection of the first transmission line on the reference plane and the projection of the second transmission line on the reference plane, and has no intersection with at least one of the projection of the first transmission line and the projection of the second transmission line.

Abstract: A strip conductor is provided on a dielectric board, and a ground conductor facing the strip conductor in a thickness direction of the dielectric board is provided on a surface of the dielectric board. The ground conductor is provided with a plurality of holes penetrating therethrough along the thickness direction of the dielectric board. This structure accomplishes a microstrip line that can obtain consistent passing frequency characteristics.

Abstract: A coaxial connector includes a first inner conductor and a second inner conductor. A capacitor connects between the first inner conductor and the second inner conductor. An outer conductor extends along and surrounds the first and second inner conductors and the capacitor. A first dielectric material is filled in a gap between the outer conductor and the first and second inner conductors. A support member supports the first and second inner conductors with respect to the outer conductor. A second dielectric material for impedance matching is provided between the capacitor and the outer conductor.

Abstract: Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.

Abstract: A resonant element that causes a signal input from an input terminal to resonate at a predetermined resonance frequency and outputs it to an output terminal is provided. The element has a transmission line series including a plurality of transmission lines connected in series with each other and intersecting with a hotline connecting the input terminal and the output terminal and a plurality of switches. At least one of one end and the other end of the transmission line series is a grounded end. The resonant element having first and second end side, each end side having a first transmission line and a second transmission line connected to a switch having a grounded end. The resonance frequency is switched by turning on/off the switch to change the sum of the lengths of the transmission lines through which the signal passes.

Abstract: A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.

Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.

Abstract: A structure made of in certain frequency bands invisible material includes a transmission line network. The structure has a matching layer at the boundary of the material, supporting structures inside the transmission line network and that the transmission line network has been matched with the surrounding space.

Abstract: The invention relates, in particular, to a system for transmitting at least one electric pulse for an apparatus for determining a distribution of charges contained in the thickness of an item (2) made of a dielectric material, said transmission system including a transmitter electrode (1) for transmitting at least one pulse and a generator (3) of said pulse. The system is notable in that said electrode is formed by a transmission line (1) which is substantially level in relation to the item (2) to be analyzed and which includes impedance matching means to keep said impedance substantially constant along said transmission line in the passband of said pulse.

Abstract: The invention concerns a coaxial automatic impedance adaptor characterized in that it comprises two slugs and has only a lateral translational movement along an axis Ox. The double slug tuner principle is based on the movement of two line segments of different characteristics of 50 O inside a closed cylinder on either side of standard connectors.

Abstract: A termination block for connecting a first signal device and a second signal device. The termination block includes a housing, first and second connectors, and an electrical circuit having passive elements that connect the first and second connectors and provide impedance matching.

Abstract: An example of a transmission-line transformer may include a transmission-line assembly and a balun assembly. The transmission-line assembly may include first and second conductors forming at least first and second transmission-line sections. The transmission-line assembly may provide a signal path through the first conductor and second conductor in series to a circuit ground. Balanced lines of the balun assembly may be connected to respective intermediate points on the first and second conductors between the first and second transmission-line sections. The transmission-line transformer may provide a signal path between a first end of the first conductor of the transmission-line assembly and the unbalanced line of the balun assembly.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: A transit structure of a standard waveguide and a dielectric waveguide is related to connecting the dielectric dielectric waveguide to the standard waveguide. The transit structure includes: a cavity to match the dielectric waveguide and the standard waveguide, wherein the dielectric waveguide and the standard waveguide are orthogonal to each other to connect. The transit structure drastically reduces a design time by simply implementing a transit structure by using only a dielectric waveguide, a cavity and a standard waveguide on a dielectric substrate and remarkably reduces a size thereof in comparison with a conventional transit structure since all designs are finished in the size of a metal waveguide.

Abstract: A method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications. A method includes: forming a plurality of openings in a ground plane associated with a signal line; forming a plurality of capacitance plates in the plurality of openings; and connecting the plurality of capacitance plates to the signal line with a plurality of posts extending between the signal line and the plurality of capacitance plates.

Abstract: The application discloses a method and apparatus for adjusting internal load impedances, by section, at feed points present on a distributed amplifier's output transmission line. The method includes determining a summing-point load impedance (Zx) at an off-chip output transmission line of the distributed amplifier. The method further includes determining a driving-point load impedance (Zd) at an output of an on-chip power transistor. The driving-point load impedance diverges and disperses over frequency from that summing-point load impedance due to reactance of at least one on-chip component coupled to the output of the on-chip power transistor. The method then includes determining and providing an offset to summing-point load impedance (Zx) based on the driving-point load impedance (Zd) such that the driving-point load impedance (Zd) converges to the summing-point load impedance (Zx) of that distributed amplifier section.

Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.

Abstract: An array antenna is provided that operates at high-band and low-band, comprising a first array of high-band radiators and a second array of low-band radiators, each respective low-band radiator disposed so as to be interleaved between the high-band radiators so as to share an aperture with the high-band radiators. Each low-band radiator comprises a coaxial section, a dielectric section, a waveguide, and a planar section. The dielectric section is formed of a continuous piece of dielectric material and includes a hollow opening formed perpendicular to the coaxial section, and a plurality of step transitions, wherein at least one of the step transitions is disposed within and partially fills the waveguide operably coupled to the planar section. The planar section is oriented to the portion of high-band radiators such that the output of the respective low-band radiator is disposed between and within the spacing between adjacent high-band-radiators.

Abstract: In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a coaxial structure such as a coaxial cable that directly connects the monolithic microwave integrated circuit to the waveguide to transmit energy such as microwave energy with minimal loss.

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract: A circuit topology for multiple loads is provided. In an embodiment, the circuit topology includes a driving terminal (50), a first node (A), a first receiving terminal (10), and a second receiving terminal (20). The driving terminal is coupled to the first node via a main transmission line (11), the first node is respectively coupled to the first and second receiving terminals via a first branch transmission line (13) and a second branch transmission line (12). A first resistor (R2) is mounted on the second branch transmission line, a distance the signal travels from the driving terminal to the second receiving terminal via the main transmission line and the second branch transmission line is greater than a distance the signal travels from the driving terminal to the first receiving terminal via the main transmission and the first branch transmission line.

Abstract: A broadband transmission line impedance transformer performs impedance transformation with improved frequency response and efficiency across a wide operational bandwidth. In particular, the bandwidth of a transmission line 2:1 impedance transformer may be significantly increased by adding an additional compensating capacitor as an internal component between interconnected transmission lines. This capacitor effectively improves low frequency response for a given length of transmission lines and decreases mismatch in an entire frequency range. The overall bandwidth ratio increases at least twice and mismatch decreases.

Abstract: Signal modules and methods for electrically interfacing with an electronic device are provided. The signal module includes a dielectric and a conductor extending through a surface of the dielectric. The surface of the dielectric is located away from perpendicular relative to an axis of the conductor and is located based on an electromagnetic field produced as a result of a signal flowing through the conductor.

Abstract: High-speed communication links are improved by having differential pairs of traces in a connector pinfield on layers of a multilayer printed circuit board (PCB) to straddle respective rows of reference (ground) pins rather than the respective rows of signal vias. Thus, a desirable increase in the size of each an anti-pad to surrounding each signal via pad can be incorporated without forcing tracing of adjacent differential pairs closer to one another, and thus increased cross talk is avoided. Thereby, 50 ohm or close to 50 ohm impedance for each signal via is achieved. Spacing and routing between traces of each differential pair are advantageously adjusted for skew compensation and impedance optimization utilizing three dimensional computational electromagnetic tools.

Abstract: Methods and apparatus are disclosed, such as those involving an interconnection layout for an integrated circuit (IC). One such layout includes a plurality of differential pairs of lines. Each differential pair has two lines including one or more parallel portions extending substantially parallel to each other. Each pair also includes a shield line. Each of the shield lines includes one or more parallel portions interposed between the parallel portions of one of the pairs of differential lines. One or more of the shield lines are electrically connected to a voltage reference, such as ground. This layout is believed to reduce or eliminate intra-pair coupling as well as inter-pair coupling.

Abstract: A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer.

Abstract: A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.

Abstract: A variable impedance adapter that has a value of characteristic impedance that is responsive to changes in the configuration of the adapter. In one embodiment, the variable impedance adapter includes an elongated section and a telescoping section that surround a center conductor that transmits an electrical signal across the adapter. A pair of tuning elements is disposed on a portion of the center conductor, one or more of the elements being shaped and configured to move along the center conductor amongst a plurality of positions in response to relative movement between the elongated section and the telescoping section. The first position and the second position correspond to different values of characteristic impedance of the variable impedance adapter.

Abstract: A junction for connecting two waveguides having substantially a 90-degree angular offset between longitudinal symmetry axes of their cross-sections. The junction has a first interface and a second interface for connecting the waveguides, and at least a first transformer section and a second transformer section, both having cross-sections of substantially rectangular shape, and both having the 90-degree angular offset between longitudinal symmetry axes of their cross-sections. The first and second transformer sections are connected such that a T-shape connection is formed and the first transformer section has a first protruded ridge on its broad wall and the second transformer section has a second protruded ridge on its broad wall. The broad wall with the second ridge is connected to the top narrow wall of the first transformer section and the ridges are located such that they overlap.

Abstract: A method and an arrangement for matching the antenna of a radio device in transmitting condition. The antenna impedance in the output of the power amplifier of a transmitter is adjusted by means of a ?-shaped reactive matching circuit, the component values of which can be selected from a relatively wide array of the alternatives. The component values are selected by means of the multiple-way switches, which only are located in the transverse branches of the matching circuit. The switches are set (706) by the control unit, input variables of which being the SWR value provided by the directional coupler, the operating band used each time and a value of the transmitting power. The matching is based on an adjusting process to be executed at regular intervals, in which process the control unit tries different combinations of the switch states and finally selects (710) the combination, which brings the lowest SWR value.

Abstract: In a millimeter waveband transceiver using an antenna and a waveguide for a connection line, it is necessary to perform transmission mode line conversion between TEM waves of a microstrip line and VTE01 mode waves of the waveguide. There is a limit to reducing the conversion loss using only a matching box for connecting the microstrip line with the waveguide. In a transmission mode line transducer for converting between the TEM waves of the microstrip line and the VTE01 mode waves of the waveguide, if the cross-sections are substantially the same size, in the case of a 50? microstrip line when the characteristic impedance of the waveguide is about 80%, i.e., 40?, the line conversion loss can be optimized. Therefore, the microstrip line is connected with the waveguide using a ?/4 matching box via a ridged waveguide having a low impedance and a length of ?/16 or less.

Abstract: Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.

Abstract: According to one embodiment, a wiring board includes a transmission line provided to perform communications between a first semiconductor chip and a second semiconductor chip, the transmission line is formed of a distributed constant wiring portion having a characteristic impedance matched to one of an output impedance of the first semiconductor chip and an output impedance of the second semiconductor chip, and a lumped constant wiring portion which is narrower than the distributed constant wiring portion and shorter than a length which can be regarded as a lumped constant circuit.

Abstract: The invention relates to a compact automatic impedance adapter in a waveguide, characterised in that the impedance is controlled by plungers, filling the entire guide with a magic-tee coupler plane E/plane H modifying the electrical and magnetic field, one plunger modifying the electrical field (E) in the guide and the second modifying the magnetic field (H).

Abstract: An embodiment of the present invention provides a power amplifier, comprising tunable impedance matching circuit including a plurality of tunable dielectric varactors and a DC voltage source interface capable of providing voltage to said plurality of said tunable dielectric varactors.

Abstract: A compact end launch transition for providing a connection between a housing having an electrical terminator and a waveguide component and associated method are described. The transition includes a having a rear side presenting a substantially flat surface to abut the housing and has a front side having an aperture. An antenna located within the body is configured to interact with the aperture to form an end launch transition. An electrical connector is in electrical communication with the antenna and exposed from the rear side of the body to connect directly to the electrical terminator. This avoids the need to use cable to connect the housing and waveguide component and provides a particularly compact device.