Abstract: A resonant element that causes a signal input from an input terminal to resonate at a predetermined resonance frequency and outputs it to an output terminal is provided. The element has a transmission line series including a plurality of transmission lines connected in series with each other and intersecting with a hotline connecting the input terminal and the output terminal and a plurality of switches. At least one of one end and the other end of the transmission line series is a grounded end. The resonant element having first and second end side, each end side having a first transmission line and a second transmission line connected to a switch having a grounded end. The resonance frequency is switched by turning on/off the switch to change the sum of the lengths of the transmission lines through which the signal passes.

Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.

Abstract: A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.

Abstract: The invention relates, in particular, to a system for transmitting at least one electric pulse for an apparatus for determining a distribution of charges contained in the thickness of an item (2) made of a dielectric material, said transmission system including a transmitter electrode (1) for transmitting at least one pulse and a generator (3) of said pulse. The system is notable in that said electrode is formed by a transmission line (1) which is substantially level in relation to the item (2) to be analyzed and which includes impedance matching means to keep said impedance substantially constant along said transmission line in the passband of said pulse.

Abstract: A structure made of in certain frequency bands invisible material includes a transmission line network. The structure has a matching layer at the boundary of the material, supporting structures inside the transmission line network and that the transmission line network has been matched with the surrounding space.

Abstract: The invention concerns a coaxial automatic impedance adaptor characterized in that it comprises two slugs and has only a lateral translational movement along an axis Ox. The double slug tuner principle is based on the movement of two line segments of different characteristics of 50 O inside a closed cylinder on either side of standard connectors.

Abstract: A termination block for connecting a first signal device and a second signal device. The termination block includes a housing, first and second connectors, and an electrical circuit having passive elements that connect the first and second connectors and provide impedance matching.

Abstract: An example of a transmission-line transformer may include a transmission-line assembly and a balun assembly. The transmission-line assembly may include first and second conductors forming at least first and second transmission-line sections. The transmission-line assembly may provide a signal path through the first conductor and second conductor in series to a circuit ground. Balanced lines of the balun assembly may be connected to respective intermediate points on the first and second conductors between the first and second transmission-line sections. The transmission-line transformer may provide a signal path between a first end of the first conductor of the transmission-line assembly and the unbalanced line of the balun assembly.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: A transit structure of a standard waveguide and a dielectric waveguide is related to connecting the dielectric dielectric waveguide to the standard waveguide. The transit structure includes: a cavity to match the dielectric waveguide and the standard waveguide, wherein the dielectric waveguide and the standard waveguide are orthogonal to each other to connect. The transit structure drastically reduces a design time by simply implementing a transit structure by using only a dielectric waveguide, a cavity and a standard waveguide on a dielectric substrate and remarkably reduces a size thereof in comparison with a conventional transit structure since all designs are finished in the size of a metal waveguide.

Abstract: A method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications. A method includes: forming a plurality of openings in a ground plane associated with a signal line; forming a plurality of capacitance plates in the plurality of openings; and connecting the plurality of capacitance plates to the signal line with a plurality of posts extending between the signal line and the plurality of capacitance plates.

Abstract: The application discloses a method and apparatus for adjusting internal load impedances, by section, at feed points present on a distributed amplifier's output transmission line. The method includes determining a summing-point load impedance (Zx) at an off-chip output transmission line of the distributed amplifier. The method further includes determining a driving-point load impedance (Zd) at an output of an on-chip power transistor. The driving-point load impedance diverges and disperses over frequency from that summing-point load impedance due to reactance of at least one on-chip component coupled to the output of the on-chip power transistor. The method then includes determining and providing an offset to summing-point load impedance (Zx) based on the driving-point load impedance (Zd) such that the driving-point load impedance (Zd) converges to the summing-point load impedance (Zx) of that distributed amplifier section.

Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.

Abstract: An array antenna is provided that operates at high-band and low-band, comprising a first array of high-band radiators and a second array of low-band radiators, each respective low-band radiator disposed so as to be interleaved between the high-band radiators so as to share an aperture with the high-band radiators. Each low-band radiator comprises a coaxial section, a dielectric section, a waveguide, and a planar section. The dielectric section is formed of a continuous piece of dielectric material and includes a hollow opening formed perpendicular to the coaxial section, and a plurality of step transitions, wherein at least one of the step transitions is disposed within and partially fills the waveguide operably coupled to the planar section. The planar section is oriented to the portion of high-band radiators such that the output of the respective low-band radiator is disposed between and within the spacing between adjacent high-band-radiators.

Abstract: In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a coaxial structure such as a coaxial cable that directly connects the monolithic microwave integrated circuit to the waveguide to transmit energy such as microwave energy with minimal loss.

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract: A circuit topology for multiple loads is provided. In an embodiment, the circuit topology includes a driving terminal (50), a first node (A), a first receiving terminal (10), and a second receiving terminal (20). The driving terminal is coupled to the first node via a main transmission line (11), the first node is respectively coupled to the first and second receiving terminals via a first branch transmission line (13) and a second branch transmission line (12). A first resistor (R2) is mounted on the second branch transmission line, a distance the signal travels from the driving terminal to the second receiving terminal via the main transmission line and the second branch transmission line is greater than a distance the signal travels from the driving terminal to the first receiving terminal via the main transmission and the first branch transmission line.

Abstract: A broadband transmission line impedance transformer performs impedance transformation with improved frequency response and efficiency across a wide operational bandwidth. In particular, the bandwidth of a transmission line 2:1 impedance transformer may be significantly increased by adding an additional compensating capacitor as an internal component between interconnected transmission lines. This capacitor effectively improves low frequency response for a given length of transmission lines and decreases mismatch in an entire frequency range. The overall bandwidth ratio increases at least twice and mismatch decreases.

Abstract: Signal modules and methods for electrically interfacing with an electronic device are provided. The signal module includes a dielectric and a conductor extending through a surface of the dielectric. The surface of the dielectric is located away from perpendicular relative to an axis of the conductor and is located based on an electromagnetic field produced as a result of a signal flowing through the conductor.

Abstract: High-speed communication links are improved by having differential pairs of traces in a connector pinfield on layers of a multilayer printed circuit board (PCB) to straddle respective rows of reference (ground) pins rather than the respective rows of signal vias. Thus, a desirable increase in the size of each an anti-pad to surrounding each signal via pad can be incorporated without forcing tracing of adjacent differential pairs closer to one another, and thus increased cross talk is avoided. Thereby, 50 ohm or close to 50 ohm impedance for each signal via is achieved. Spacing and routing between traces of each differential pair are advantageously adjusted for skew compensation and impedance optimization utilizing three dimensional computational electromagnetic tools.

Abstract: Methods and apparatus are disclosed, such as those involving an interconnection layout for an integrated circuit (IC). One such layout includes a plurality of differential pairs of lines. Each differential pair has two lines including one or more parallel portions extending substantially parallel to each other. Each pair also includes a shield line. Each of the shield lines includes one or more parallel portions interposed between the parallel portions of one of the pairs of differential lines. One or more of the shield lines are electrically connected to a voltage reference, such as ground. This layout is believed to reduce or eliminate intra-pair coupling as well as inter-pair coupling.

Abstract: A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer.

Abstract: A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.

Abstract: A variable impedance adapter that has a value of characteristic impedance that is responsive to changes in the configuration of the adapter. In one embodiment, the variable impedance adapter includes an elongated section and a telescoping section that surround a center conductor that transmits an electrical signal across the adapter. A pair of tuning elements is disposed on a portion of the center conductor, one or more of the elements being shaped and configured to move along the center conductor amongst a plurality of positions in response to relative movement between the elongated section and the telescoping section. The first position and the second position correspond to different values of characteristic impedance of the variable impedance adapter.

Abstract: A junction for connecting two waveguides having substantially a 90-degree angular offset between longitudinal symmetry axes of their cross-sections. The junction has a first interface and a second interface for connecting the waveguides, and at least a first transformer section and a second transformer section, both having cross-sections of substantially rectangular shape, and both having the 90-degree angular offset between longitudinal symmetry axes of their cross-sections. The first and second transformer sections are connected such that a T-shape connection is formed and the first transformer section has a first protruded ridge on its broad wall and the second transformer section has a second protruded ridge on its broad wall. The broad wall with the second ridge is connected to the top narrow wall of the first transformer section and the ridges are located such that they overlap.

Abstract: A method and an arrangement for matching the antenna of a radio device in transmitting condition. The antenna impedance in the output of the power amplifier of a transmitter is adjusted by means of a ?-shaped reactive matching circuit, the component values of which can be selected from a relatively wide array of the alternatives. The component values are selected by means of the multiple-way switches, which only are located in the transverse branches of the matching circuit. The switches are set (706) by the control unit, input variables of which being the SWR value provided by the directional coupler, the operating band used each time and a value of the transmitting power. The matching is based on an adjusting process to be executed at regular intervals, in which process the control unit tries different combinations of the switch states and finally selects (710) the combination, which brings the lowest SWR value.

Abstract: In a millimeter waveband transceiver using an antenna and a waveguide for a connection line, it is necessary to perform transmission mode line conversion between TEM waves of a microstrip line and VTE01 mode waves of the waveguide. There is a limit to reducing the conversion loss using only a matching box for connecting the microstrip line with the waveguide. In a transmission mode line transducer for converting between the TEM waves of the microstrip line and the VTE01 mode waves of the waveguide, if the cross-sections are substantially the same size, in the case of a 50? microstrip line when the characteristic impedance of the waveguide is about 80%, i.e., 40?, the line conversion loss can be optimized. Therefore, the microstrip line is connected with the waveguide using a ?/4 matching box via a ridged waveguide having a low impedance and a length of ?/16 or less.

Abstract: Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.

Abstract: According to one embodiment, a wiring board includes a transmission line provided to perform communications between a first semiconductor chip and a second semiconductor chip, the transmission line is formed of a distributed constant wiring portion having a characteristic impedance matched to one of an output impedance of the first semiconductor chip and an output impedance of the second semiconductor chip, and a lumped constant wiring portion which is narrower than the distributed constant wiring portion and shorter than a length which can be regarded as a lumped constant circuit.

Abstract: An embodiment of the present invention provides a power amplifier, comprising tunable impedance matching circuit including a plurality of tunable dielectric varactors and a DC voltage source interface capable of providing voltage to said plurality of said tunable dielectric varactors.

Abstract: The invention relates to a compact automatic impedance adapter in a waveguide, characterised in that the impedance is controlled by plungers, filling the entire guide with a magic-tee coupler plane E/plane H modifying the electrical and magnetic field, one plunger modifying the electrical field (E) in the guide and the second modifying the magnetic field (H).

Abstract: A compact end launch transition for providing a connection between a housing having an electrical terminator and a waveguide component and associated method are described. The transition includes a having a rear side presenting a substantially flat surface to abut the housing and has a front side having an aperture. An antenna located within the body is configured to interact with the aperture to form an end launch transition. An electrical connector is in electrical communication with the antenna and exposed from the rear side of the body to connect directly to the electrical terminator. This avoids the need to use cable to connect the housing and waveguide component and provides a particularly compact device.

Abstract: A coaxial to transmission line connector has a connector and an attachment area with a windowed electrical attachment point that when soldered in place on a ground reference of an electrical device, creates an electrical and mechanical connection between an outer conductor of the coaxial to transmission line connector. The attachment area has at least one mechanical alignment point and a corresponding reference pivot point located substantially co-planar at the termination of the coaxial dielectric region at an edge of a PCB and a port of the coaxial to transmission line connector. The at least one mechanical alignment point and the corresponding reference pivot plane serve to automatically align the coaxial to transmission line connector to the electrical device. Opposite the attachment area is a dielectric area following termination of the outer conductor in the transition area of the microstrip transmission line.

Abstract: A printed circuit board (PCB) including an impedance-matched strip transmission line includes a strip transmission line including a main line and at least one pair of branch lines branching off from the main line. An upper ground layer is disposed over the strip transmission line and has upper opening parts corresponding in position to the branch lines. A lower ground layer is disposed under the strip transmission line and has lower opening parts corresponding in position to the branch lines. The upper and lower opening parts are symmetric about the branch lines of the strip transmission line.

Abstract: A transmission line transition for coupling electromagnetic energy between different transmission lines includes first and second dielectric substrates laminated to each other and a waveguide tube attached to the first dielectric substrate. The laminated dielectric substrate provides a dielectric waveguide having a first end short-circuited and a second end communicating with a hollow interior of the waveguide tube. An antenna connected to a planar line is disposed in the dielectric waveguide and spaced from the short-circuited end of the dielectric waveguide by a predetermined distance in a longitudinal direction of the waveguide tube to excite and to be excited by the waveguide tube. The dielectric waveguide has a cross-sectional area smaller than that of the interior of the waveguide tube and coincides with the interior of the waveguide tube in the longitudinal direction.

Abstract: A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Abstract: Coaxial-to-microstrip transitions may include a microstrip line and coaxial-line assembly. The microstrip line includes a first dielectric having an aperture, a conductive strip disposed on one primary face of the first dielectric, and a ground plane disposed on the opposite primary face of the first dielectric. The coaxial-line assembly includes an outer conductor and an inner conductor. In some examples, the ground plane extends between the outer conductor and the inner conductor on a first side of the coaxial-line assembly proximate the conductive strip and an aperture cross section extends beyond the outer conductor on a second side of the coaxial-line assembly distal the conductive strip. In some examples, the ground plane has a non-circular aperture. In some examples, the outer conductor encloses an area that is less than an area of the aperture. In some examples, the enclosed area has a width that is less than a corresponding width of the first aperture.

Abstract: A circuit topology for multiple loads includes a driving terminal, a first node coupled to the driving terminal and a second node via a first branch transmission line, a first receiving terminal which is a test point configured to detect errors of the circuit topology coupled to the first node via a second branch transmission line, a second and a third receiving terminal respectively coupled to the second node via a third branch transmission line and a fourth branch transmission line, wherein the difference between the length of the second branch transmitting line and that of the third branch transmitting line, and the difference between the length of the third branch transmitting line and that of the fourth branch transmitting line are greater than the product of a transmission speed and a rise time of the signal, and a first resistor is connected in the third branch transmission line.

Abstract: The present invention relates to an element of transition between a waveguide and a transition line on a substrate. The element of transition comprises a securing flange on the substrate, the flange being dimensioned so that at least, in the direction microstrip line, the width d of the flange is selected in such a manner as to shift the resonant modes away from the useful band. The invention is used particularly for circuits using SMD techniques at millimeter frequencies.

Abstract: An embodiment of the present invention provides an apparatus, comprising a filter; and a matching network coupled to the filter, the matching network including a plurality of voltage tunable dielectric varactors.

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract: An apparatus providing a low impedance transition from a pulse generator to one or more helical antennae. Conventional transition from coaxial-to-antenna causes energy loss. The present invention decreases that loss.

Abstract: The invention relates to a coaxial connecting part which is used to connect a coaxial plug socket to a circuit carrier in an internal conductor. An elastically flexible bellows made of a conductive material is incorporated therein in order to keep axial and radial forces, occurring at the beginning of the socket, away from the substrate.

Abstract: An embodiment of the present invention provides an apparatus, comprising a delay line and a matching network coupled to the delay line, the matching network including a plurality of voltage tunable dielectric varactors.

Abstract: There is provided a matching circuit, in which a main-matching block and a sub-matching block are connected in series. The sub-matching block includes: a series matching block of which one end is connected to the main-matching block; and a parallel matching network connected to the other end of the series matching block. At a first frequency f1, the connection point of the series matching block and a first parallel matching block is caused to be in an open state for a radio-frequency signal, and the connection point of the first parallel matching block and the second parallel matching block is caused to be in a short state for the radio-frequency signal. Impedance matching is performed by the main-matching block and the series matching block at the first frequency f1, and is performed by the main-matching block and the sub-matching block at the second frequency f2.

Abstract: A power amplifier includes a transistor, a transmission line transformer, and a capacitor. The transistor is operable to receive a signal and to generate an amplified signal. The transistor has a source, a drain, and a gate. The gate has a first impedance and is operable to receive the signal to be amplified. The transmission line transformer has a first, second, third, and fourth port, the first port being coupled to the gate of the transistor and the third port, and the fourth port being coupled to a source device having a second impedance. The capacitor has a first end and a second end. The first end of the capacitor is coupled to the second port of the transmission line transformer and the second end is coupled to a ground.

Abstract: A coaxial transition includes a first conductor aligned along a first axis. The transition also includes a ground shield surrounding the first conductor such that a first gap exists between the first conductor and the ground shield. An electric field radiates between the first conductor and the ground shield through the first gap. The transition further includes a second conductor aligned along a second axis and coupled to the first conductor. The second conductor forms a second gap between the second conductor and a portion of the ground shield. A first portion of the electric field radiates between the second conductor and the ground shield through the second gap. The transition also includes a top ground plane aligned substantially parallel to the second conductor. A third gap exists between the top ground plane and the second conductor. The second gap and the third gap are substantially parallel with the second conductor therebetween.

Abstract: In a millimeter wave circuit having first and second adjacent circuit boards, each circuit board having a microstrip and a ground plane, a low loss electrical connection between the microstrips on adjacent planes. Each microstrip ends in a connection pad and a first wire bond is attached to the connection pads on the adjacent circuit boards. A second wire bond also extends between the connection pads in parallel with the first wire bond and, optionally, one or more capacitors are provided on either the first, second or both circuit boards to match the impedance between the circuit boards. These capacitors may be selectively trimmed.

Abstract: A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed.