Abstract: Disclosed are methods and apparatus for performing inspection or metrology of a semiconductor device. The apparatus includes a plurality of laser diode arrays that are configurable to provide an incident beam having different wavelength ranges. The apparatus also includes optics for directing the incident beam towards the sample, a detector for generating an output signal or image based on an output beam emanating from the sample in response to the incident beam, and optics for directing the output beam towards the detector. The apparatus further includes a controller for configuring the laser diode arrays to provide the incident beam at the different wavelength ranges and detecting defects or characterizing a feature of the sample based on the output signal or image.

Abstract: Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.

Abstract: A beam deflection device including an aluminum disc containing a plurality of lasers, each laser projecting a laser beam substantially along one of the ‘X’, ‘Y’, and ‘Z’ axes of a structural beam to which the device is attached. Wiring is attached to each of the plurality of lasers to provide power and transmit data. Passageways are provided in the solid disc to route the wiring to the exterior. A suction cup on a surface of the device allows it to be attached to the beam by pressing the device against a flat surface area of the beam.

Abstract: A computer-based method for inspecting a wafer, including: storing, in a memory element for at least one computer, computer readable instructions; detecting a first light beam rotating in a first spiral about a first central axis; and executing, using a processor for the at least one computer, the computer readable instructions to generate, using the detected first light beam, an image including at least one shape, determine an orientation of the at least one shape or a size of the at least one shape, and calculate a depth of a defect in the wafer according to the orientation or the size.

Abstract: A method and apparatus for inspecting a composite workpiece. A response to electromagnetic radiation directed to a surface of the composite workpiece is separated into a number of wavelengths for each of a number of locations on the surface of the composite workpiece. A set of contaminants on the surface of the composite workpiece is identified from the number of wavelengths for the each of the number of locations. A two-dimensional image of the surface of the composite workpiece is generated with a set of graphical indicators indicating the set of contaminants identified from the number of wavelengths for the each of the number of locations on the surface of the composite workpiece.

Abstract: An optical inspection apparatus inspecting the optical system of the optical scanning apparatus by measuring the light quantity of scanning light emitted from the optical scanning apparatus includes: a slit plate that includes a plurality of slits for allowing a part of scanning light to pass provided so as to include a scanning effective portion; a diffuser that diffuses the scanning light having passed through slit; a light guide that guides the scanning light diffused by the diffuser; an optical sensor that measures the light quantity of the scanning light guided by the light guide; and an inspection device that inspects the state of the optical system by comparing a measurement result acquired by the optical sensor with a preset reference value, in which the slits are arranged at intervals in a direction where scanning is performed on the slit plate with the scanning light.

Abstract: In an aspect, an inspection method for detecting the presence or absence of a defect on an object, the object comprising a recess having a physical depth, is disclosed. The method includes directing radiation at the object, the radiation having a wavelength that is substantially equal to twice an optical depth of the recess, detecting radiation that is re-directed by the object or a defect on the object, and determining the presence or absence of a defect from the re-directed radiation.

Abstract: A method of assessing a model of a substrate is presented. A scatterometry measurement is taken using radiation at a first wavelength. The wavelength of the radiation is then changed and a further scatterometry measurement taken. If the scatterometry measurements are consistent across a range of wavelengths then the model is sufficiently accurate. However, if the scatterometry measurements change as the wavelength changes then the model of the substrate is not sufficiently accurate.

Abstract: Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members.

Abstract: Described are computer-based methods and apparatuses, including computer program products, for wafer identification fault recovery. A digital image is received that includes a data symbol comprising a message encoded in a set of data cells. The digital image is processed to form a set of classified data cells, wherein one or more classified data cells from the set of classified data cells comprises an error. User interface data is transmitted comprising the digital image and interactive graphics, the interactive graphics including at least one data cell control. Interaction data is received from the interactive graphics that modifies a data cell location, a data cell state, or both, of at least one classified data cell from the set of classified data cells to form a modified set of classified data cells. An error free decoded message string is generated based on the modified set of classified data cells.

Abstract: Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.

Abstract: A pattern inspection apparatus in accordance with one aspect of the present invention includes a laser light source configured to emit a laser light, an integrator lens configured to input the laser light, and form a light source group by dividing the laser light inputted, a scattering plate, arranged at a front side of an incident surface of the integrator lens, configured to scatter the laser light which is to enter the integrator lens, and an inspection unit configured to inspect a defect of a pattern on an inspection target object where a plurality of figure patterns are formed, by using the laser light having passed through the integrator lens as an illumination light.

Abstract: An apparatus for detecting defects of elements to be subjected to examination, particularly metallic lids, with means for lighting an element to be subjected to examination, an image acquisition unit, and a unit for processing images acquired by said image acquisition unit is described.

Abstract: First test beams (464a-d), after passing through an optical system on optical paths that differ in pairs, impinge on a first measurement region (461) at angles that differ in pairs with respect to the measurement plane. Second test beams (465a-d), after passing through the optical system on optical paths that differ in pairs, impinge on a second measurement region (462) at angles that differ in pairs, wherein the second region differs from the first. A value of a first measurement variable of the test beam at the first region is detected for each of the first test beams, and comparably for a second measurement variable at the second region for the second test beams. Impingement regions (467a-d) on reference surface(s) (466, 471) of the optical system are determined and a spatial diagnosis distribution of a property of the reference surface(s) for each test beam is calculated.

Abstract: Systems, apparatuses, methods, and computer program products for inspection of objects or items in a conveyance system. Presence (or absence) of an object/item or objects/items is detected sensed and also one or more characteristics of the object/item can be determined based image detection of characteristics of one or more laser lines projected on a conveyance surface of the conveyance system.

Abstract: An inspection system (9) includes an idler wheel (61) that is coupled to a fabrication system (8) and is in contact with a backing layer (65) of an applied material (64), A rotation sensor (63) monitors the idler wheel (61) and generates a rotational signal. A controller (24) is coupled to the rotation sensor (63) and determines a characteristic of one or more flaws and FOD (19) on a composite structure (12) in response to the rotation signal.

Abstract: An apparatus, system, and method for increasing measurement accuracy in imaging cytometry. The system may include a light detector configured to measure light emitted by a particle in response to a first light source, and processor coupled to the light detector. The processor may be configured create a first image by taking a first measurement of light and create a second image by interpolating the first image, where the second image has higher resolution than the first image. The processor may be configured to determine a difference between pixels of the second image and an expected distribution and discard the first measurement of light if the difference is above a predetermined threshold.

Abstract: In one embodiment, a method for detecting design defects is provided. The method includes receiving design data of an integrated circuit (IC) on a wafer, measuring wafer topography across the wafer to obtain topography data, calculating a scanner moving average from the topography data and the design data to provide a scanner defocus map across the wafer, and determining a hotspot design defect from the scanner defocus map. A computer readable storage medium, and a system for detecting design defects are also provided.

Abstract: The three dimensional (3-D) locations of splices in pre-preg tows placed by an automatic fiber placement machine to form a laminated composite structure are mapped to allow visualization of alignment patterns in the splices.

Abstract: A pattern inspection apparatus is provided to compare images of regions, corresponding to each other, of patterns that are formed so as to be identical and judge that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

Abstract: Light that is scattered by a defect on a wafer is very weak, and a PMT and an MPPC are used as detection methods for measuring the weak light with high speed and sensitivity. The methods have a function of photoelectronically converting the weak light and multiplying an electron, but have a problem in that a signal light is lost and an S/N ratio is reduced because the quantum efficiency of the photoelectron conversion is as low as 50% or less. Direct light is amplified prior to the photoelectron conversion. The optical amplification is an amplification method in which the signal light and light of pump light are introduced into a rare-earth doped fiber, a stimulated emission is caused, and the signal light is amplified. In the present invention, the optical amplification is used. The amplification factor is changed according to various conditions.

Abstract: Various embodiments for substrate inspection are provided.

Abstract: A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.

Abstract: The present disclosure is directed to a method for inspecting a wafer, the wafer including a film deposited on a surface of the wafer. The film may have a thickness that varies over the surface of the wafer. The method includes the step of measuring the thickness, refractive index, and extinction coefficient of the film across the surface of the wafer. With this data a film curve is created in real time. The method also includes the step of determining a size of a defect on the surface based on at least the film curve.

Abstract: An appearance inspection apparatus analyzes a difference in detection characteristics of detection signals obtained by detectors to flexibly meet various inspection purposes without changing a circuit or software. The apparatus includes a signal synthesizing section that synthesizes detection signals from the detectors in accordance with a set condition. An input operating section sets a synthesizing condition of the detection signal by the signal synthesizing section, and an information display section displays a synthesizing map structured based on a synthesized signal which is synthesized by the signal synthesizing section in accordance with a condition set by the input operating section.

Abstract: The three dimensional (3-D) locations of splices in pre-preg tows placed by an automatic fiber placement machine to form a laminated composite structure are mapped to allow visualization of alignment patterns in the splices.

Abstract: Systems and methods for inspection are provided utilizing a wide angle optical system. The optical system includes a wide angle input lens group and an output lens group. The wide angle input lens group is configured to receive wide-angle radiation, e.g., having an angular spread of 60 degrees or more, from an object surface, and produce imageable radiation. The wide angle input lens group is arranged such that no intermediate focused image is formed within or after the wide angle input lens group. The output lens group is configured to receive the imageable radiation from the wide angle input lens group and focus the imageable radiation onto an image plane to image at least part of the object surface. A detector receives the image of the at least part of the object surface and, based on the received image, detects, for example, contamination on the object surface.

Abstract: A defect inspecting method is provided which comprises a pre-scan defect inspecting process including a pre-scan irradiating step for casting irradiation light onto the surface of a sample, a pre-scan detecting step for detecting the scattered lights, and a pre-scan defect information collecting step for obtaining information on preselected defects present on the sample surface on the basis of the scattered lights; a near-field defect inspecting process including a near-field irradiating step in which the distance between the sample surface and a near-field head is adjusted so that the sample surface is irradiated, a near-field detecting step for detecting near-field light response, and a near-field defect information collecting step for obtaining information on the preselected defects on the basis of the near-field light response; and a merging process for inspecting defects present on the sample surface by merging the pieces of information on the preselected defects.

Abstract: A dew condensation detection device includes: a light emitting unit for emitting a light flux that travels along a dew condensation detection surface of a member having the dew condensation detection surface; a changing unit for changing a diameter of the light flux; and an optical detector for receiving the light flux that has passed along the dew condensation detection surface.

Abstract: Provided are a surface inspection apparatus and method capable of detecting foreign materials on the surface of a substrate, and a slit coater having the surface inspection apparatus. In the surface inspection apparatus, a slit lighting unit irradiates slit-shaped light. An optical system splits the slit-shaped light into two beams traveling along two different paths, is incident upon a subject, and extracts an interference image caused by combination of the two beams reflected from the subject. An imaging device captures the interference image to output an image signal. An analysis unit acquires a luminance value of the image signal, analyzes the luminance value in real time, and determines whether or not foreign materials are present.

Abstract: A system for inspecting a depth relative to a layer using a sensor with a fixed focal plane. A focus sensor senses the surface of the substrate and outputs focus data. In setup mode the controller scans a first portion of the substrate, receives the focus data and XY data, and stores correlated XYZ data for the substrate. In inspection mode the controller scans a second portion of the substrate, receives the focus data and XY data, and subtracts the stored Z data from the focus data to produce virtual data. The controller feeds the virtual data plus an offset to the motor for moving the substrate up and down during the inspection, thereby holding the focal plane at a desired Z distance.

Abstract: In the inspection of a defect in a fine concave-convex pattern, a spectral waveform of a detection area of an inspection object is detected, area determination as to which area section determined by a pattern type of the inspection object the detection area belongs to is performed, a feature calculation equation and a determination index value which correspond to a determined area section and vary according to defect type is selected, feature calculation on the spectral waveform data in accordance with the selected feature calculation equation is performed, and a calculated feature value and the selected determination index value are compared to perform determination processing according to defect type.

Abstract: A defect inspection device, which inspects defects such as foreign materials existing on a specimen on which a circuit pattern of wiring or the like is formed, is provided with an illumination optical system which illuminates a plurality of different areas the specimen with a plurality of linear shaped beams and an image forming optical system that forms images of the plurality of the illuminated areas on a plurality of detectors, and the detectors are configured to receive a plurality of polarization components substantially at the same time and individually, wherein the polarization components are different from each other and are contained in each of the plurality of the optical images formed by the image forming optical system, thereby detecting a plurality of signals corresponding to the polarization components and carrying out the inspection at high speed under a plurality of optical conditions.

Abstract: Systems and methods are provided for inspecting an object surface. An illumination source illuminates the object surface. An optic intercepts scattered light from the illuminated object surface and projects a real image of an area of the object surface. A sensor receives the projected real image. A computer system, coupled to the sensor, stores and analyzes the real image. The real image is processed to detect particles located on the object surface. This arrangement is particularly useful for detecting contaminants or defects on a reticle of a lithography device.

Abstract: A method of forming a standard mask for an inspection system is provided, the method comprising providing a substrate within a chamber, and providing a tetraethylorthosilicate (TEOS) precursor within the chamber. The method further includes reacting the TEOS precursor with an electron beam to form silicon oxide particles of controlled size at one or more controlled locations on the substrate, the silicon oxide particles disposed as simulated contamination defects.

Abstract: Disclosed are systems and methods for time differential reticle inspection. Contamination is detected by, for example, determining a difference between a first signature of at least a portion of a reticle and a second signature, produced subsequent to the first signature, of the portion of the reticle.

Abstract: A system and method of calibrating optical measuring equipment includes optically measuring discrete objects of a first known predictable pattern from a calibration apparatus, wherein the first known predictable pattern is a bit pattern. A recording surface optical reader is calibrated based on the optically measuring. Using the first known predictable pattern, contamination is filtered from the results of the optically measuring.

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes combining first image data and second image data, generated using different output generated using different values for focus of an inspection system, corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer and detecting defects on the wafer using the additional image data.

Abstract: One of the broader forms of the present disclosure involves a method of enhanced defect inspection. The method includes providing a substrate having defect particles and providing a fluid over the substrate and the defect particles, the fluid having a refractive index greater than air. The method further includes exposing the substrate and the defect particles to incident radiation through the fluid, and detecting, through the fluid, radiation reflected or scattered by the defect particles.

Abstract: An apparatus for optically inspecting an at least partially reflecting surface of an object includes first and second transverse carriers (12, 14) defining respective substantially circular segment-shaped cutouts (32). The transverse carriers (12, 14) are disposed at a longitudinal distance (D) from one another and the longitudinal distance (D) defines a longitudinal direction (17). A plurality of longitudinal members are configured to hold the first and second transverse carriers at the longitudinal distance (D). The longitudinal members are arranged at a defined radial distance to the circular segment-shaped cutouts. A translucent diffusing screen is held in the circular segment-shaped cutouts by the transverse carriers to form a tunnel-shaped inspection space. A multiplicity of light sources are arranged outside of the tunnel-shaped inspection space behind the diffusing screen.

Abstract: A system and method for processing mail and other documents. A method includes scanning a document to produce a document image and analyzing the document image. The method includes determining that there is a condition of the data processing system that requires maintenance based on the analysis. The method includes notifying at least one user of the condition that requires maintenance based on the determination.

Abstract: The defect inspecting apparatus is capable of easily performing adjustment with a change of an elevation angle of illumination to a substrate to be inspected, while being low in cost. A plane parallel plate and a cylindrical lens supported by a lens holder are symmetrically disposed at the same tilt angle ? with respect to a horizontal plane. A shift in optical axis at a focal position of light (101) with the rotation of the cylindrical lens can be prevented from occurring. The light can be rotated with a motor and a belt by a rotating mechanism, while allowing the optical axes of the light to match each other at the same focal position. The lens holder and the rotating mechanism are connected to a vertically moving mechanism and moved along a guide of the vertically moving mechanism to thereby adjust the focal position of the cylindrical lens.

Abstract: The invention relates to a sorting device and a method for sorting products (1) that are moved in a flow of products (2) through an inspection zone (3), wherein a light beam (6) is moved over the flow of products such that substantially all products (1) are hit by the light beam (6) in said inspection zone (3), whereby the light of this light beam (6) is, on the one hand, directly reflected as of the point of impact of the light beam on the products, and is, on the other hand, reflected in a scattered manner as of a zone round the point of impact following the diffusion of the light beam's light in the products, whereby the directly reflected light as well as the light which is reflected in a scattered manner is at least partly directed to a sensor element (19) of a detector (15), whereby this sensor element (19) has at least two detection areas, wherein for each detection area a detection signal is generated corresponding to the intensity of the reflected light (14) that impinges upon this detection area.

Abstract: Reflected light caused by the state of the surface of a wafer, a foreign material, or a defect is superimposed on a haze frequency component caused by the type and thickness of a film or a surface irregularity. In order to detect a haze frequency component caused by a haze present on the surface of an object to be inspected, light propagating from the object to be inspected is detected and converted into an electric signal. The electric signal is sampled at a predetermined sampling time interval and converted into digital data. A frequency component caused by a foreign material, a defect or the like is separated from the digital data to ensure that a haze frequency component is selected. The haze frequency component is caused by a stain attached to the surface of the wafer, hazy tarnish, a surface irregularity or the like.

Abstract: The present invention provides a method and apparatus for inspecting a surface of a substrate. The apparatus includes: a rotatable stage on which a substrate to be inspected is placed; an inspection optical system having an illumination light source for emitting light to a substrate placed on the stage and a detector for detecting light from the substrate which is irradiated with the light from the illumination light source; an A/D converter for amplifying and A/D converting signals output from the detector in the inspection optical system; and a defect detector for detecting defects in a surface of the substrate by processing signals output from the detector and converted by the A/D converter and classifying the defected defects. The defect detector extracts micro defects in the surface of the substrate by processing the signals output from the detector, and detects linear defects existing discretely in a linear region.

Abstract: A method for detecting a foreign particle trapped between substrates of a liquid crystal display panel, by which a potential short caused by the particle can be made into a short with reliability, and thus it is possible to make a display defect manifest itself that is caused by the particle. The method is for detecting the presence of a foreign particle trapped between flexible substrates (21, 26) of a liquid crystal display panel (20), between the substrates liquid crystals filled, and the method includes making the panel pass between supporting rollers (3) arranged to support one surface of the panel, and a pressing roller (4) disposed at a position opposed to a space between the supporting units and arranged to press the other surface of the panel, bending the panel, and displacing the substrates with respect to each other in their surface directions.

Abstract: A computer-implemented image pattern matching method for wafer alignment is provided, for determining an overall similarity value and an overall geometry relationship between a target wafer image and a model wafer image. The method includes: determining a plurality of model patterns in the model wafer image; searching the target wafer image to identify a plurality of target patterns, thereby generating a plurality of matches each including a respective target pattern and model pattern; selecting, using multiple threshold values, ones of the plurality of matches according to a plurality of similarity values; and determining, using a predetermined algorithm and the selected ones of the matches, the overall similarity value and the overall geometry relationship between the target wafer image and the model wafer image.

Abstract: Methods and systems for accurately determining dimensional accuracy of a complex three dimensional shape are disclosed. The invention in one respect includes determining at least a non-critical feature and at least a critical feature of the 3-D component, determining a first datum using at least the non-critical feature, aligning the first datum to at least a portion of a reference shape, determining a second datum corresponding to the critical feature subsequent to the aligning, and determining the dimensional accuracy of the 3-D component by comparing the second datum to another portion of the reference shape.

Abstract: A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.

Abstract: A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.