Abstract: An inspection system (9) includes an idler wheel (61) that is coupled to a fabrication system (8) and is in contact with a backing layer (65) of an applied material (64), A rotation sensor (63) monitors the idler wheel (61) and generates a rotational signal. A controller (24) is coupled to the rotation sensor (63) and determines a characteristic of one or more flaws and FOD (19) on a composite structure (12) in response to the rotation signal.

Abstract: An optical equipment for inspecting and addressing a specimen is disclosed. The optical equipment comprises an optical device and a processing module. The optical device comprises a light source, a sample inspecting device and an address detecting device. The sample inspecting device comprises a first objective lens and a first detector. A beam is focused on a sample placed in an inspected site of a specimen by the first objective lens. The address detecting device comprises a second objective lens and a second detector. A beam is focused on the address coding site by the second objective lens. The processing module controls the beam to be focused on the sampling points of the inspected site to generate first optical signals, and simultaneously controls the beam of the light source to be focused on the corresponding address codes of the address coding site to generate second optical signals.

Abstract: An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.

Abstract: A surface inspection method for inspecting a surface H of an inspection subject having a specular surface H, including: a step in which the surface H of the inspection subject is irradiated with light L from an oblique direction; a step in which measurement is conducted of the intensity of diffracted light D that is diffracted by adhering foreign matter K among light that is regularly reflected by the surface H of the inspection subject; a step in which measurement is conducted of the intensity of scattered light S that is irregularly reflected by the adhering foreign matter K; and a step in which an adhering condition of foreign matter K on the surface H of the inspection subject is determined based on measurement results for the intensity of the diffracted light D that is regularly reflected, and the intensity of the scattered light S that is irregularly reflected.

Abstract: A surface inspection apparatus includes an irradiating unit that has a plurality of light sources that respectively emit a plurality of illumination light beams having different wavelength ranges, and irradiates an inspection surface as a surface of a body to be inspected with the illumination light beams, in a condition where the light sources are located adjacent to each other and arranged in a given order along the inspection surface, an imaging unit that images reflected light when the illumination light beams are reflected by the inspection surface, so as to obtain a plurality of items of image data corresponding to the respective wavelength ranges, and a control unit that detects a detection object on the inspection surface, based on the items of image data corresponding to the respective wavelength ranges which are obtained by the imaging unit.

Abstract: A system for performing alignment of two wafers is disclosed. The system comprises an optical coherence tomography system and a wafer alignment system. The wafer alignment system is configured and disposed to control the relative position of a first wafer and a second wafer. The optical coherence tomography system is configured and disposed to compute coordinate data for a plurality of alignment marks on the first wafer and second wafer, and send that coordinate data to the wafer alignment system.

Abstract: An edge exposure unit includes a projector, a projector holding unit, a substrate rotating unit, an outer edge detecting unit and a surface inspection processing unit. Each component of the projector holding unit operates to move the projector in an X direction and a Y direction. The projector irradiates a peripheral portion of a substrate with light transmitted from a light source for exposure through a light guide. Edge sampling processing is performed based on distribution of an amount of light received in a CCD line sensor of the outer edge detecting unit. Surface inspection processing is performed based on distribution of an amount of light received in a CCD line sensor of the surface inspection processing unit.

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

Abstract: A new architecture for machine vision system that uses area sensor (or line sensor), with telecentric imaging optics compound with telecentric illumination module is described. The illumination module may include a bright field illumination source and/or a dark field illumination source. The telecentric imaging optics includes an upper imaging module having an aperture stop and a lower imaging module positioned between the upper imaging module and object, such that the light source and the aperture stop are located in the back focal plane of the lower imaging module. The lower imaging module images the illumination source into a plane of an aperture stop of the upper imaging module. The optical axis of the upper imaging module is offset with respect to the lower imaging module. The optical axis of the telecentric illumination module is offset with respect to the axis of the lower imaging module in the opposite direction.

Abstract: A method and apparatus for detecting defects are provided for detecting defects or foreign matter on an object to be inspected. The apparatus includes a movable stage for mounting a specimen, an illumination system for irradiating a circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. A spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip.

Abstract: A surface inspection apparatus and a surface inspection method aim to securely deal with finer repetition pitch without shortening the wavelength of illumination light. To this end, the apparatus includes a unit illuminating repetitive pattern(s) formed on the substrate surface to be inspected with linearly polarized light, a unit setting to an oblique angle an angle between the direction of an intersecting line of a vibration plane of the linearly polarized light on the substrate surface and the repetition direction of repetitive pattern(s), a unit extracting a polarized light component perpendicular to the vibration plane of the linearly polarized light, from light having been emitted from the repetitive pattern(s) in a specular direction, and a unit detecting a defect of the repetitive pattern(s) according to the light intensity of the polarized light component.

Abstract: One of the broader forms of the present disclosure involves a method of enhanced defect inspection. The method includes providing a substrate having defect particles and providing a fluid over the substrate and the defect particles, the fluid having a refractive index greater than air. The method further includes exposing the substrate and the defect particles to incident radiation through the fluid, and detecting, through the fluid, radiation reflected or scattered by the defect particles.

Abstract: In one embodiment, a system includes an optical monitoring system configured to optically communicate with an interior of a rotary machine. The optical monitoring system is configured to redirect a field of view toward different regions of a component within the interior of the rotary machine while the rotary machine is in operation, and to capture an image of each region.

Abstract: A pattern inspection apparatus is provided to compare images of regions, corresponding to each other, of patterns that are formed so as to be identical and judge that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

Abstract: To provide a defect inspection apparatus for inspecting defects of a specimen without lowering resolution of a lens, without depending on a polarization characteristic of a defect scattered light, and with high detection sensitivity that is realized by the following. A detection optical path is branched by at least one of spectral splitting and polarization splitting, a spatial filter in the form of a two-dimensional array is disposed after the branch, and only diffracted light is shielded by the spatial filter in the form of a two-dimensional array.

Abstract: An inspection region is specified using the design information to perform region division for measurement through a scatterometry method. The obtained detection data is classified by pattern into a periodic region and a non-periodic region. A spectroscopic characteristic is detected by an optical sensor to extract features. The extracted features are compared with features stored in a feature map database for each region to evaluate a state of a patterned medium.

Abstract: A detector detects radiation from a mask to form an image, but the focal plane of the image is in front of the mask. Any particles arranged on the mask will be in focus. However, the pattern on the mask will be out of focus. It is therefore possible to detect the existence and location of particles on a mask having an arbitrary pattern. The depth of field of the detector is small and the focal plane is no further from the surface of the patterning device than two times the depth of field.

Abstract: An enclosure for an optical inspection apparatus for scanning the profile of at least one surface of an article moving along a travel path axis, which apparatus having a frame for mounting a profile sensor unit using a laser source, includes a peripheral portion connected to the frame and forming spaced apart peripheral edges defining a space in which the frame and the profile sensor unit are contained, and front end and rear end portions each having an opening aligned with the travel path axis to allow the movement of the article through the apparatus.

Abstract: Selection with alignment marks of an optimal template, its identification and similarity judgment are conducted by a calculation function of a correlation value provided to a foreign matter inspection apparatus. In other words, the foreign matter inspection apparatus includes unit for registering feature points of alignment marks formed on a surface of an inspected object, unit for collecting image data of the alignment marks formed on the surface of the inspected object and a data processor for extracting a feature point from the image data and calculating a correlation value of both feature points, and registers the image data of the alignment mark on the basis of a threshold value of the correlation value.

Abstract: A laser surveillance system includes a housing positioned generally at or below a water line and a laser and detector mechanism positioned within the housing. The mechanism includes a laser source and a sensor. The laser source is configured to project a laser beam towards a vessel being inspected. The sensor is configured to receive a reflection of the laser beam.

Abstract: A method of conditioning a liquid crystal polymer (LCP) substrate for enhanced surface adhesion accomplished by exposing an LCP substrate to oxygen plasma. The plasma will chemically alter and modify the LCP substrate surface to promote increased adhesion of metal and subsequent LCP layers during lamination. Lamination is accomplished while dwelling under the melt temperature of the LCP substrate itself. A further method is disclosed of detecting impurities modified or deposited onto the LCP surface during plasma treatment.

Abstract: A method is provided for detecting not fully set coatings and liquid or smearing impurities on a surface, in which in a first step a film is pressed onto a surface of a coating using a predefined press-on pressure, the film having a relative motion with respect to the surface of the coating, thereafter the film is pulled off the surface of the coating and finally it is determined whether impurities are adhering to the film. A device is also provided for performing the method, including at least one film, which may be pressed against a surface to be tested, at least one press-on roller having a surface by which the film is pressed against the coating, and at least one device for determining whether there are impurities adhering to the film.

Abstract: The invention relates to a method and a device for evaluating fluorescence partial images representing the same object region, independently of stray light. Two partial images of the objects are produced in the red and in the green by a camera (10). A quotient image is produced in pixels from said two partial images, and the frequency of the occurrence of the image points having a pre-defined red/green ratio is determined for said quotient image. The mean values and the width are determined for the distribution curve obtained in this way. The two end variables of the distribution curve are used to calculate a threshold value. The quotient image is modified using said threshold value such that its contrast in relation to interesting details is increased.

Abstract: A mode-locked laser system operable at low temperature can include an annealed, frequency-conversion crystal and a housing to maintain an annealed condition of the crystal during standard operation at the low temperature. In one embodiment, the crystal can have an increased length. First beam shaping optics can be configured to focus a beam from a light source to an elliptical cross section at a beam waist located in or proximate to the crystal. A harmonic separation block can divide an output from the crystal into beams of different frequencies separated in space. In one embodiment, the mode-locked laser system can further include second beam shaping optics configured to convert an elliptical cross section of the desired frequency beam into a beam with a desired aspect ratio, such as a circular cross section.

Abstract: A defect inspection apparatus emits light to a test object, detects reflected of scattered light from the test object and detects a defect in the test object The apparatus comprises a temperature-controlled part accommodating section that accommodates parts having a need for controlling a temperature, which is out of a plurality of parts in the defect inspection apparatus. A first temperature measuring instrument measures a temperature in the temperature-controlled part accommodating section; and a temperature control unit controls a temperature of the interior of the temperature-controlled part accommodating section at a prescribed temperature according to the temperature measured by the first temperature measuring instrument. Accordingly, a defect inspection apparatus can efficiently perform temperature control without involving an enlarged size can be achieved.

Abstract: A device for detecting soiling, having a light source, which emits a light beam, and a layer having a first boundary surface and a second boundary surface, whereby the light beam emitted by the light source first impinges on the first boundary surface, and part of a light beam fraction, which is scattered at the second boundary surface, impinges on a receiver and forms a measuring signal, and hereby the first boundary surface is set up to scatter part of the incident light beam, and the part impinging on the receiver of the light beam, scattered at the first boundary surface, forms a reference signal, and the device is set up further to determine a measure for the soiling of the second boundary surface from the comparison of the reference signal and measuring signal.

Abstract: A foreign substance inspection apparatus includes a light projecting unit, a detector which detects the intensity of scattered light of light projected onto the surface of an object to be detected by the light projecting unit, in association with the two-dimensional coordinate position on the surface, and a processing unit. The relationship between the intensity of the scattered light detected by the detector and the particle size of the foreign substance differs depending on the two-dimensional coordinate position on the surface. The processing unit determines, a conversion curve to convert the intensity of the scattered light detected by the detector into the particle size of the foreign substance, in accordance with the two-dimensional coordinate position of the foreign substance detected by the detector, and converts the intensity of the scattered light detected by the detector into the particle size of the foreign substance using the determined conversion curve.

Abstract: A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.

Abstract: The disclosed device, which, using an electron microscope or the like, minutely observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, can reliably insert a defect to be observed into the field of an electron microscope or the like, and can be a device of a smaller scale. The electron microscope (5), which observes defects detected by an optical appearance-inspecting device or by an optical defect-inspecting device, has a configuration wherein an optimal microscope (14) that re-detects defects is incorporated, and a spatial filter and a distribution polarization element are inserted at the pupil plane when making dark-field observations using this optical microscope (14).

Abstract: The present invention is to lessen work burden on a user, to eliminate determination error, to prevent a substrate from being damaged, and to prevent prolonged working time by automatically determining whether or not a particle to be removed is present. A particle inspection and removal apparatus of the present invention includes a particle information acquisition section acquiring particle information on a particle adhering onto a substrate surface, a particle removal section removing the particle adhering onto the substrate surface, a comparison section comparing a threshold set for each of regions of the substrate surface with the particle information on each of the region obtained by the particle information acquisition section, and a particle removal control section controlling the particle removal section to remove the particle on the substrate surface based on a comparison result of the comparison section.

Abstract: A surface defect inspection apparatus includes a light source that emits light to a first position on a surface of a target at an angle inclined with respect to the surface of the target, a first photodetector that detects first reflected light of the light from the light source, the first reflected light being reflected at the first position, a second photodetector that detects second reflected light of the light from the light source, the second reflected light being reflected at a second position, the second position being closer to the light source than the first position and being separated from the surface of the target by a given distance, and a determining unit that determines whether or not foreign matter is present on the surface of the target on a basis of detection results obtained from the first photodetector and the second photodetector.

Abstract: An apparatus, system, and method for increasing measurement accuracy in imaging cytometry. The system may include a light detector configured to measure light emitted by a first particle and light emitted by a second particle, where the measured light from the second particle at least partially overlaps the measured light from the first particle in an overlap region. Additionally, the system may include a processor coupled to the light detector, where the processor is configured to determine a contribution of light from the first particle in the overlap region and determine a contribution of light from the second particle in the overlap region. The processor may also be configured to subtract the contribution of light from the second particle from the contribution of light from the first particle and determine the intensity of light emitted by the first particle.

Abstract: The present invention is directed to a method for obtaining appearance characteristics of a target coating containing effect pigments. The present invention is also directed to a method for comparing appearances of two or more coatings by comparing the appearance characteristics. The present invention is further directed to a system for obtaining appearance characteristics of one or more coatings and comparing said coating appearances.

Abstract: A surface inspection method and a surface inspection apparatus in which a plurality of photodetectors are arranged in a plurality of directions so that light scattered, diffracted or reflected on a surface of an object to be inspected or in the vicinity of the surface is detected and a plurality of signals obtained by this are subjected to weighted addition processing or weighted averaging processing by linear combination.

Abstract: An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.

Abstract: A defect inspection apparatus includes an illumination optical system, a detection optical system which includes a reflecting objective lens, and wavelength separation optics for conducting wavelength separation, and after the wavelength separation, branching the scattered light into at least a first detection optical path and a second detection optical path. The detection optical system further includes, on the first detection optical path, a first sensor, and on the second detection optical path, a second sensor. A signal processor is provided which, in accordance with at least one of a first signal obtained from the first sensor and a second signal obtained from the second sensor, discriminates defects or defect candidates present on a surface of a sample.

Abstract: An article such as an EUV lithography reticle is inspected to detect contaminant particles. The method comprises applying a fluorescent dye material to the article, illuminating the article with radiation at wavelengths suitable for exciting the fluorescent dye, monitoring the article for emission of second radiation by the fluorescent dye at a wavelength different from the first radiation, and generating a signal representing contamination in the event of detecting the second radiation. In one example, measures such as low-affinity coatings may be applied to the reticle to reduce affinity for the dye molecules, while the dye molecules will bind by physical or chemical adsorption to the contaminant particles. Dyes may be selected to have fluorescence behavior enhanced by hydrophobicity or hydrophilicity, and contaminant surfaces treated by buffer coatings accordingly.

Abstract: A patterning method according to an embodiment of the present invention comprises: acquiring information about a surface state of an underlying film formed on a substrate; determining, based on the surface state, whether irregularity/foreign matter is present in each shot region in which a pattern is to be formed; and solidifying a resist agent while a first template, when it is determined that no irregularity/foreign matter is present in the shot region, or a second template that is different from the first template, when it is determined that irregularity/foreign matter is present in the shot region, is brought close to the underlying film on the shot region at a certain distance with the resist agent therebetween.

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

Abstract: A defect inspection apparatus and method includes utilizing an irradiation optical system that focuses a beam flux emitted from a laser light source and formed into a slit-shaped beam so as to irradiate the beam onto the surface of the substrate to be inspected, utilizing a detection optical system that detects light from the substrate that has been irradiated with the slit-shaped beam, and utilizing a signal processor that processes a signal output from the detection optical system. The irradiation optical system includes a cylindrical lens for focusing the beam that has been emitted from the laser light source onto the substrate to be inspected, as the slit-shaped beam, wherein the cylindrical lens is disposed so as to obtain a distance between an incidence surface or emitting surface thereof and the slit-shaped beam upon the substrate to be inspected to be equal to a focal distance of the cylindrical lens.

Abstract: Disclosed are systems and methods for time differential reticle inspection. Contamination is detected by, for example, determining a difference between a first signature of at least a portion of a reticle and a second signature, produced subsequent to the first signature, of the portion of the reticle.

Abstract: A foreign matter detecting method of detecting foreign matter attached to a peripheral edge of a substrate, which makes it possible to accurately detect foreign matter attached to the peripheral edge of the substrate even if the foreign matter is of a minute size below the detection limit of an existing measuring instrument, and which is highly versatile and suitable for mass production of substrates. The substrate is cooled to condense moisture around the foreign matter attached to the peripheral edge of the substrate, and then the condensed moisture is iced to grow an ice crystal. Then, the foreign matter attached to the peripheral edge of the substrate, which is emphasized by the ice crystal, is detected.

Abstract: To provide a defect inspection apparatus for inspecting defects of a specimen without lowering resolution of a lens, without depending on a polarization characteristic of a defect scattered light, and with high detection sensitivity that is realized by the following. A detection optical path is branched by at least one of spectral splitting and polarization splitting, a spatial filter in the form of a two-dimensional array is disposed after the branch, and only diffracted light is shielded by the spatial filter in the form of a two-dimensional array.

Abstract: A defect inspection apparatus emits light to a test object, detects reflected of scattered light from the test object and detects a defect in the test object The apparatus comprises a temperature-controlled part accommodating section that accommodates parts having a need for controlling a temperature, which is out of a plurality of parts in the defect inspection apparatus. A first temperature measuring instrument measures a temperature in the temperature-controlled part accommodating section; and a temperature control unit controls a temperature of the interior of the temperature-controlled part accommodating section at a prescribed temperature according to the temperature measured by the first temperature measuring instrument. Accordingly, a defect inspection apparatus can efficiently perform temperature control without involving an enlarged size can be achieved.

Abstract: An apparatus for optically characterizing a surface structure of a board or sheet, includes a light source arranged at a first side of a said board and adapted to illuminate a first area of a surface of said board or sheet by emitting towards said surface a collimated light beam at a first, oblique angle of incidence relative to said surface of said board or sheet. A light receiver arranged at a second side of a said board or sheet, said second side being substantially opposite to said first side in respect of said board or sheet, is adapted to receive at least a part of said collimated light beam being reflected off said first area of said surface of said board or sheet, and includes a spatial detector adapted to receive by different parts of said detector light of said collimated light beam being reflected off respective, different parts of said first area.

Abstract: A system for calibrating a spectrometer includes wide field-of-view (WFOV) optics providing a first light path to a WFOV spectrometer, and narrow field-of-view (NFOV) optics providing a second light path to a NFOV spectrometer. A de-focusing optic is selectively positioned in the first or second light paths. A scan controller selectively controls the WFOV or NFOV optics to scan a celestial body. A processor is configured to calibrate the de-focusing optic, while the WFOV optics scan the celestial body. First, the WFOV optics scan the celestial body without the de-focusing optic positioned in the first light path. Second, the WFOV optics scan the celestial body with the de-focusing optic positioned in the first light path. Next, the processor calibrates the NFOV spectrometer, while the NFOV optics and the de-focusing optic scan the celestial body. After the NFOV spectrometer is calibrated, the NFOV spectrometer may be used to measure the albedo of the earth.

Abstract: Provided is a method for inspecting a defect on a surface of a sample, the method including the steps of comparing a haze signal distribution with a predetermined light intensity distribution to calculate pixel shift amounts of detection signals; and adding up shift corrected detection signals to detect a defect.

Abstract: An optical apparatus for defect inspection having an illuminating optical system for irradiating illumination light beams on the surface of a specimen to form a beam spot and a detection optical system for detecting a reflection light ray originating from the beam spot comprises a storage unit in which the position and size of a standard particle of known size on a specimen for correction are stored in advance, a correction processing section which, when the correction specimen is used as an inspection target, correlates a detected scattering light quantity from the standard particle with the known size of standard particle stored at a corresponding position in the storage unit to prepare a correlation between the scattering light quantity and a true value, and a signal processing section which, when an inspection wafer is used as an inspection target, converts a detected scattering light quantity into a defect dimension.

Abstract: If an inspection method for inspecting a patterned medium is intended for the nanoimprint process control, it is necessary to measure a correct shape of each pattern element. On the other hand, if the inspection method is intended for the quality control of products, it is necessary to inspect the products on a I00 percent basis. However, the conventional method which uses SEM or AFM could not satisfy these requirements. According to the present invention, IO0-percent inspection of products becomes possible by a method including the steps of: irradiating a surface of a hard disk medium, on which a magnetic material pattern is formed, with a light beam including a plurality of wavelengths; detecting the intensity of a reflected light beam from the hard disk medium on a wavelength basis; calculating a spectral reflectance from the detected intensity of the reflected light beam; and detecting a shape of each pattern element formed on the hard disk medium on the basis of the calculated spectral reflectance.