Abstract: Detection and identification of minute quantities of condensed or solid state materials with significantly improved performance over the present state-of-the-art, comprises illuminating a small target particle with an appropriate laser radiation at a wavelength that is strongly absorbed by the target. The resulting temperature rise is observed by monitoring the increased blackbody radiation from the sample. An unambiguous determination of the target compound or the target material composition can be achieved through the use of a tunable laser that generates an absorption fingerprint of the target.

Abstract: The invention relates to a sorting device and a method for sorting products (1) that are moved in a flow of products (2) through an inspection zone (3), wherein a light beam (6) is moved over the flow of products such that substantially all products (1) are hit by the light beam (6) in said inspection zone (3), whereby the light of this light beam (6) is, on the one hand, directly reflected as of the point of impact of the light beam on the products, and is, on the other hand, reflected in a scattered manner as of a zone round the point of impact following the diffusion of the light beam's light in the products, whereby the directly reflected light as well as the light which is reflected in a scattered manner is at least partly directed to a sensor element (19) of a detector (15), whereby this sensor element (19) has at least two detection areas, wherein for each detection area a detection signal is generated corresponding to the intensity of the reflected light (14) that impinges upon this detection area.

Abstract: In the present invention, to make corrective matching thereof, it is designed as follows; position effect of defects coordinates, which are output from an inspection apparatus, is allowed, coordinates of inspected data are mutually corrected, and a state of coincidence or non-coincidence among a plurality sets of inspected data is output or displayed. Inspection data is designed to include kinds, kinds difference and dimension of defects. A state of coincidence or non-coincidence between inspected data is designed to be output or displayed appropriately, by kinds or dimensions, or by a grouping thereof, of a defects object. The same sample is inspected by every time of passing a production step, and a state of data increase or decrease, or coincidence or non-coincidence between the inspected data is designed to be output or displayed.

Abstract: A method and apparatus for detecting small particulate matter and contaminants on hard surfaces.

Abstract: A surface inspection method and a surface inspection apparatus in which a plurality of photodetectors are arranged in a plurality of directions so that light scattered, diffracted or reflected on a surface of an object to be inspected or in the vicinity of the surface is detected and a plurality of signals obtained by this are subjected to weighted addition processing or weighted averaging processing by linear combination.

Abstract: An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.

Abstract: In a method for preparing focus-adjustment data for a focusing lens system of an optical defect-inspection apparatus, a wafer having a plurality of defects is positioned in place with respect to a focal plane defined by the focusing lens system at a positioning step, and the detects on the wafer are optically and electronically detected at a detecting step. Then, defects having a predetermined size are extracted among the detected defects at extracting step, and a number of the extracted defects is counted as defect-number data. The positioning, detecting, extracting and counting steps are repeated whenever the focus-adjustment wafer is relatively shifted from the focal plane by a predetermined distance, and a defect-number distribution is produced based on the defect-number data thus obtained.

Abstract: A device for measuring positions of structures (3) on a substrate (2) is disclosed, wherein the device is enclosed by a climatic chamber (30). An illumination and imaging means (6, 14) is also arranged in the climatic chamber (30). At least one loading station (32) for substrates is formed on an outer wall (30a) of the climatic chamber (30), wherein at least one transport means (34, 40) for transporting the substrates is provided within the climatic chamber (30). A means (36) for orienting the substrates (2) with respect to a coordinate system of the coordinate measuring machine (1) is provided, wherein the transport means (34, 40) deposits the substrates (2) on the means (36) for orienting.

Abstract: An appearance inspection apparatus analyzes a difference in detection characteristics of detection signals obtained by detectors to flexibly meet various inspection purposes without changing a circuit or software. The apparatus includes a signal synthesizing section that synthesizes detection signals from the detectors in accordance with a set condition. An input operating section sets a synthesizing condition of the detection signal by the signal synthesizing section, and an information display section displays a synthesizing map structured based on a synthesized signal which is synthesized by the signal synthesizing section in accordance with a condition set by the input operating section.

Abstract: A wafer having improved inspection sensitivity to foreign matter on a top-most surface of the wafer, as detected with a surface scanning optical inspection system that uses an inspection wavelength. The wafer includes a substantially homogenous first layer at the top-most surface of the wafer, the first layer having a first thickness. The first layer is at least partially transparent to the inspection wavelength. A substantially homogenous second layer immediately underlies the first layer, the second layer having a second thickness. The second layer is at least partially transparent to the inspection wavelength. A substrate immediately underlies the second layer. The first thickness and the second thickness are set in a combination that produces a local minimum of an electric field at the top-most surface and a local maximum of an electric field within one hundred nanometers above the top-most surface.

Abstract: A defect inspection tool includes an illumination optical system for irradiating light to a surface of an object, and a detection optical system for detecting light scattered from the surface of the object which is irradiated. The detection optical system include an analyzer, a photoelectric converting device for receiving the scattering light passed through the analyzer, a member for saving a database prepared through an actual measurement or a calculation in correspondence with a condition of the illumination optical system, that of the detection optical system, a kind of an object to be inspected, and a rotation angle of the analyzer, and a member for adjusting an angle of the analyzer by selecting an angle of the analyzer from a database saved in the member for saving on a basis of an inspection recipe after receiving the inspection recipe to the defect inspection tool.

Abstract: An optical apparatus for defect inspection having an illuminating optical system for irradiating illumination light beams on the surface of a specimen to form a beam spot and a detection optical system for detecting a reflection light ray originating from the beam spot comprises a storage unit in which the position and size of a standard particle of known size on a specimen for correction are stored in advance, a correction processing section which, when the correction specimen is used as an inspection target, correlates a detected scattering light quantity from the standard particle with the known size of standard particle stored at a corresponding position in the storage unit to prepare a correlation between the scattering light quantity and a true value, and a signal processing section which, when an inspection wafer is used as an inspection target, converts a detected scattering light quantity into a defect dimension.

Abstract: An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.

Abstract: An inspected object (e.g., a reticle) is stored in an immersion cassette filled with a liquid having a specific refraction factor. An inspection beam is irradiated toward the inspected object, which is subjected to precise positioning, via an objective lens while being refracted by the liquid, thus producing a reflected inspection beam reflected by the inspected object and a transmitted inspection beam transmitted through the inspected object. Image processing is performed based on at least one of the reflected inspection beam and the transmitted inspection beam, thus producing an inspected image of the inspected object. The inspected image is compared with a prescribed circuit pattern so as to inspect the existence and nonexistence of foreign matter or structural defects on the exterior of the inspected object. Thus, it is possible to secure an adequate focal depth of the objective lens while achieving a high resolution in imaging the inspected object.

Abstract: A belt inspecting apparatus applies illuminating light beams (R, G, B) through light guides to a flat inner portion, a flat outer portion, flat side portions, and curved portions of a metal belt. The illuminating light beams, which are reflected by the metal belt, are guided through the light guides to color cameras, which detect the illuminating light beams as image information. A surface state decision unit compares the detected image information with normal image information in order to determine whether the metal belt contains flaws therein or not.

Abstract: An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.

Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.

Abstract: A surface inspection method and a surface inspection apparatus in which a plurality of photodetectors are arranged in a plurality of directions so that light scattered, diffracted or reflected on a surface of an object to be inspected or in the vicinity of the surface is detected and a plurality of signals obtained by this are subjected to weighted addition processing or weighted averaging processing by linear combination.

Abstract: A particle inspection apparatus includes an irradiation unit configured to apply a light beam onto front and back surfaces of an object to be inspected, first and second detection units configured to detect scattering light from the surfaces, a calculation unit configured to conduct a particle inspection on the surfaces on the basis of outputs from the detection units, and a control unit configured to control the irradiation unit, the detection units, and the calculation unit. The irradiation unit can selectively apply the beam onto the front or back surface. The control unit causes the calculation unit to conduct the particle inspection on the inspection surface on which the light beam is selectively applied, on the basis of outputs made by the detection unit corresponding to simultaneous application and selective application of the light beam.

Abstract: In the conventional contaminant particle/defect inspection method, if the illuminance of the illumination beam is held at not more than a predetermined upper limit value not to give thermal damage to the sample, the detection sensitivity and the inspection speed being in the tradeoff relation with each other, it is very difficult to improve one of the detection sensitivity and the inspection speed without sacrificing the other or improve both at the same time. The invention provides an improved optical inspection method and an improved optical inspection apparatus, in which a pulse laser is used as a light source, and a laser beam flux is split into a plurality of laser beam fluxes which are given different time delay to form a plurality of illumination spots. The scattered light signal from each illumination spot is isolated and detected by using a light emission start timing signal for each illumination spot.

Abstract: A method and apparatus for detecting defects are provided for detecting harmful defects or foreign matter with high sensitivity on an object to be inspected with a transparent film, such as an oxide film, by reducing noise due to a circuit pattern. The apparatus for detecting defects includes a stage part on which a substrate specimen is put and which is arbitrarily movable in each of the X-Y-Z-? directions, an illumination system for irradiating the circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. Furthermore, a spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern.

Abstract: In a method for determining a structure parameter of a target pattern, a first series of calibration spectra are determined from at least one reference pattern, each spectra being determined using a different known value of at least one structure parameter of the respective reference pattern. The first series of calibration spectra does not take into account parameters of an apparatus used to produce the reference pattern. A representation of each of the first series calibration spectra is stored in a central library. A second series of calibration spectra corresponding to at least one of the stored spectra for a target spectrum is determined using the parameters of the apparatus for measuring the target spectrum. A measured target spectrum is produced by directing a beam of radiation onto the target pattern. The measured target spectrum and the second series of calibration spectra are compared, where this comparison is used to derive a value for the structure parameter of the target pattern.

Abstract: A defect inspecting apparatus of the invention solves a problem that in a defect inspecting apparatus, because of improving detection sensitivity of a microscopic defect by reducing a detection pixel size, a focal depth becomes shallow, a height of imaging is varied due to environmental change and the detection sensitivity of a defect becomes unstable. This apparatus comprises an XY stage, which carries a substrate to be inspected and scans in a predetermined direction, and a mechanism having a system of irradiating a defect on the inspected substrate at a slant and detecting the defect by a detection optical system disposed on the upper side, which corrects a height of imaging in real time for change in temperature and barometric pressure in order to keep the imaging in a best condition.

Abstract: An optical inspection tool used to detect surface defects of a substrate include a chuck for holding a substrate and a lens unit disposed over the chuck. The lens unit includes at least a pair of oblique beam paths therein, wherein light penetrating the beam paths travels without angular deflection. The beam paths take the form of spaces formed through the lens unit, or flat portions formed on a lens within the lens unit. A camera is installed on the lens unit, and the camera converts light passing through the lens unit into an image. Methods of detecting surface defects of the substrate using the inspection tool are also provided.

Abstract: Specially designed for the fully automated detection of residual oxide stains (residual scale) and classification thereof in metal sheet production lines, with no to stop the line, the invention consists of a framework or box (4) equipped with means for movement (8) over the surface of the metal sheet (2) to be examined, containing a high-resolution CCD camera (1), a high-power lighting unit (6-7) and a diffuse light generator; the video signal of the camera is sent to a PC (3) equipped with software for processing the images obtained, so that the residual oxide stains may be detected and classified. The movement of said box or framework (4) is controlled by a programmable automaton (14), also connected to said PC (3).

Abstract: The invention relates to a device production process for forming a circuit pattern on a substrate such as semiconductor device. To enable a stable inspection of a minute foreign particle and a pattern defect occurring in manufacture of a device at a high speed and with a high sensitivity, an object to be inspected on which a transparent film is formed, is irradiated with a beam which is emitted from an illuminator whose illumination direction and illumination angle are selected from a plurality of choices to be optimum, so that scattered reflected light from a minute foreign particle defect on the object or the transparent film is effectively detected by eliminating a noise from the pattern formed on the object, and a detection optical system is optimized by evaluating and adjusting, with an image forming performance checker, an image forming performance of the detection optical system included in an inspecting apparatus.

Abstract: Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation.

Abstract: The invention provides a macro inspection apparatus including: a stage on which an inspection object is placed; a light source that irradiates light on an upper surface of the inspection object from an angular direction arbitrarily selected relative to the upper surface of the inspection object; and a line sensor which is placed in an angular direction selected relative to the upper surface of the inspection object so that an optical axis thereof corresponds with an edge of the upper surface area irradiated by the light source and which receives reflected light from the edge of the upper surface area of the inspection object.

Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.

Abstract: A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.

Abstract: This invention is a defect inspection apparatus having a reflecting objective lens free from chromatic aberration, or an achromatic catadioptric lens, and a dioptric objective lens, and thus constructed to suppress changes in brightness due to multi-wavelength illumination (i.e., illumination with the irradiation light having a plurality of wavelength bands), to provide a clearer view of defects present on a sample, by means of selective wavelength detection in order to improve sensitivity, and to allow one spatial image on the sample to be acquired as different kinds of optical images.

Abstract: A lithographic apparatus has an illumination system that conditions a beam of radiation. A patterning support supports a patterning device, which serves to impart the beam of radiation with a pattern in its cross-section. A substrate support holds a substrate. A projection system projects the patterned beam of radiation onto a target portion of the substrate. A particle detection system detects a particle on a surface of an object. The particle detection system has a radiation source, which generates an illumination beam of radiation. The illumination beam of radiation is directed along a first optical path to a detection area at the surface of the object. A radiation detector receives a detection beam of radiation from the detection area along a second optical path. The length of the first optical path is made substantially equal to the length of the second optical path.

Abstract: An inspection system (9) includes an idler wheel (61) that is coupled to a fabrication system (8) and is in contact with a backing layer (65) of an applied material (64), A rotation sensor (63) monitors the idler wheel (61) and generates a rotational signal. A controller (24) is coupled to the rotation sensor (63) and determines a characteristic of one or more flaws and FOD (19) on a composite structure (12) in response to the rotation signal.

Abstract: An inspection apparatus projects a laser beam on the surface of a SOI wafer and detects foreign matter on and defects in the surface of the SOI wafer by receiving scattered light reflected from the surface of the SOI wafer. The wavelength of the laser beam used by the inspection apparatus is determined so that a penetration depth of the laser beam in a Si thin film may be 10 nm or below to detect only foreign matter on and defects in the outermost surface and not to detect foreign matter and defects in a BOX layer. Only the foreign matter on and defects in the outermost surface layer can be detected without being influenced by thin-film interference by projecting the laser beam on the surface of the SOI wafer and receiving scattered light rays.

Abstract: A technique for providing high-contrast images of defects in solar cells and solar panels, by illuminating each cell under inspection with broadband infrared radiation, and then forming an image of radiation that is secularly reflected from the cell. Multi-junction solar cells have a metal backing layer that secularly reflects the illumination back into an appropriately positioned and aligned camera, selected to be sensitive to infrared wavelengths at which the solar cell materials are relatively transparent.

Abstract: A flaw and foreign object debris (FOD) detection system (11) for use during fabrication of a structure (12) includes an illumination device (13). The illumination device (13) is configured to be in proximity with a fabrication system (10) and illuminates a portion (18) of the structure (12). The illumination device (13) directs light rays (16) at acute angles relative to the portion (18). A detector (14) monitors the portion (18) and detects FOD in the portion (18) during fabrication of the structure (12) in response to the reflection of the light rays (16) off of the portion (18).

Abstract: Provided is a method for detecting a membrane module flaw, including: preparing fluorescent particles having a size of 0.5 to 1.5 ?m using silica; injecting the fluorescent particles in a concentration of greater than 0 mg/mL and less than 0.1 mg/mL or equal into a membrane module used in a sewage and wastewater treatment process; operating a pump to apply a pressure such that the fluorescent particles injected into the membrane module leak to the outside of the membrane module, in case that the membrane module has a flaw; acquiring a digital image of the membrane module; and discriminating a colored portion from a non-colored portion in the digital image.

Abstract: A apparatus and method for detecting defects in a honeycomb body. In operation, the particulates emerge at an outlet end face of the honeycomb body through defects, if any, in the honeycomb walls and/or plugs and passes though a permeable member, such as a screen, where they are illuminated. The permeable member is disposed adjacent to and preferably in contact with the outlet end. Use of the permeable member improves the signal-to-noise ratio (SNR) such that defects may be more readily detected. The permeable member preferably includes an anti-reflective surface.

Abstract: A hard disk inspection apparatus comprises a disk holding device which holds a hard disk; a light source which generates a light that illuminates an inspection region portion of a hard disk that is held by the disk holding device; a light guide which has a branched shape and guides a light from the light source to a plurality of light projecting parts; and an image pickup device which takes an image by receiving reflected light from the inspection region portion; wherein an illumination light is shone onto the inspection region from plural courses by shining the illumination light that is guided by the light guide onto the inspection region front the plurality of light projecting parts.

Abstract: A surface inspection apparatus capable of acquiring scattered light intensity distribution information for each scattering azimuth angle, and detecting foreign matters and defects with high sensitivity. A concave mirror for condensation and another concave mirror for image formation are used to cope with a broad cubic angle. Since mirrors for condensation and image formation are used, a support for clamping the periphery of a lens is unnecessary, and an effective aperture area does not decrease. A plurality of azimuth-wise detection optical systems is disposed and reflected light at all azimuths can be detected by burying the entire periphery without calling for specific lens polishing. A light signal unification unit sums digital data from a particular system corresponding to a scattering azimuth designated in advance in the systems for improving an S/N ratio.

Abstract: Systems and methods are provided for inspecting an object surface. An illumination source illuminates the object surface. An optic intercepts scattered light from the illuminated object surface and projects a real image of an area of the object surface. A sensor receives the projected real image. A computer system, coupled to the sensor, stores and analyzes the real image. The real image is processed to detect particles located on the object surface. This arrangement is particularly useful for detecting contaminants or defects on a reticle of a lithography device.

Abstract: The invention relates to an EUV lithography apparatus with at least one EUV-reflective optical surface and a cavity ringdown reflectometer adapted to determine the contamination status of the EUV-reflective optical surface for at least one contaminating substance by determining the reflectivity of the EUV-reflective optical surface for radiation at a measuring wavelength (?m). The invention further relates to a method for determining the contamination status of at least one EUV-reflective optical surface arranged in an EUV lithography apparatus for at least one contaminating substance comprising determining the reflectivity of the EUV-reflective optical surface for radiation at a measuring wavelength (?m) using a cavity ringdown reflectometer.

Abstract: A pattern inspection apparatus which compares images of regions, corresponding to each other, of patterns that are formed so as to be identical and judges that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

Abstract: A method of inspecting defect of a mask is provided. In this method, a database for storing a plurality of virtual simulation models is created. The virtual simulation models are determined by a plurality of factors including an optical effect and a chemical effect during the transferring the pattern of a mask to the photoresist layer on a wafer. A mask defect image is acquired. A simulation contour of the mask defect image is generated from at least one virtual simulation model in the database. Next, the acceptability of the mask is determined.

Abstract: A foreign matter detector and a foreign matter detecting method are provided, with which foreign matter detection performance can be improved. The foreign matter detector comprises: a means for irradiating first inspection light and second inspection light to an inspection area such that their incident planes are perpendicular to each other; a measuring means for measuring the spectrum of reflected light, the reflected light being a reflection of the inspection light at the inspection area; and a means for determining, by analyzing the spectrum of the reflected light, whether any foreign matter is intermingled or not.

Abstract: A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.

Abstract: An optical inspection apparatus irradiates a light beam onto the outer surface of an object to be inspected, in the form of an illumination spot having an illumination intensity which is higher in the outer peripheral part of the object to be inspected than in the inner peripheral part thereof while uniformly maintains a temperature rise caused by the irradiation of the light beam, over the outer surface of the object to be inspected, in order to prevent the effective entire signal value of a scattered light signal from lowering, without lowering the linear speed of a movable stage for the object to be inspected in the outer peripheral part of the object to be inspected, thereby it is possible to prevent lowering of the detectability for a foreign matter or a defect, for preventing lowering of inspection throughput.

Abstract: An optical metrology model for the structure is obtained. The optical metrology model comprising one or more profile parameters, one or more process parameters, and a dispersion. A dispersion function that relates the dispersion to at least one of the one or more process parameters is obtained. A simulated diffraction signal is generated using the optical metrology model and a value for the at least one of the process parameters and a value for the dispersion. The value for the dispersion is calculated using the value for the at least one of the process parameter and the dispersion function. A measured diffraction signal of the structure is obtained using an optical metrology tool. The measured diffraction signal is compared to the simulated diffraction signal to determine one or more profile parameters of the structure. The fabrication tool is controlled based on the determined one or more profile parameters of the structure.

Abstract: In order to provide a line light irradiation device that can improve efficiency of condensing light with a compact size and that is almost free from unevenness of lighting, the line light irradiation device of the present claimed invention comprises multiple light emitting parts 2 each of which is provided with a light irradiating part 21 where multiple optical fibers 4 are thickly arranged in a line with light leading out end portions 4a of the multiple optical fibers 4 forming a straight line and a columnar lens 22 arranged to extend along a direction of the line P in front of the light irradiating part 21 in pairs, and that irradiate line light LL that converges into a straight line, and a holding body 3 that is arranged to face to a work W as being an object on which the line light LL is to be irradiated, on which monitoring bores 3a, 3b are arranged to penetrate in order to monitor the work W, and that holds the light emitting parts 2 so that each optical axis face of the line light LL irradiated from ea

Abstract: An apparatus for detection of the existence of a film on a surface comprises a lens, a light emitter and a light sensor. The light emitter is preferably disposed in spaced relation to the lens and is configured to emit light toward the lens such that the light is incident thereupon. The light sensor is also preferably disposed in spaced relation to the lens and is mounted adjacent to the light emitter. The light sensor is configured to measure light reflected back from the lens. The presence or absence on the film on the surface is based upon the amount (i.e., intensity) of light that is reflected back from the lens. The apparatus may further comprise a temperature sensor or atmospheric sensor for measuring a temperature of the lens and atmospheric conditions in order to determine whether conditions are appropriate for the formation of ice, frost and other frozen contaminants.