Abstract: A cooling host module is operable for providing cooling gas flow in a substantially isolated closed loop for a computing device. The computing device comprises a substantially vertical first face having an inlet portion comprising no more than about a lower third of a height of the first face for inlet gas flow and a substantially vertical second face opposite the first face for outlet gas flow. The cooling host module comprises: a heat exchanger adjacent to the second face of the computing device for cooling outlet gas flow; a gas flow path directing air exiting the heat exchanger beneath the computing unit; a gas moving device for moving gas in the gas flow path; and a vent towards distal end of the gas flow path for providing gas flow to the inlet portion of the first face of the computing device.

Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.

Abstract: A semiconductor recording medium recording and/or reproducing apparatus includes: a medium holder that has a medium housing unit in which a semiconductor recording medium is detachably housed; an exterior case that has a medium entrance through which the semiconductor recording medium is inserted and ejected, and in which the medium holder is housed in a state where the medium housing unit is opposed to the medium entrance; an openable and closeable cover that opens and closes the medium entrance; a heat sink that is contactable with the semiconductor recording medium housed in the medium housing unit; and a heat sink moving unit that moves the heat sink in cooperation with an opening and closing operation of the openable and closeable cover.

Abstract: A air channeling sub-system may include a mechanical cooling section and a direct evaporative cooling section. The direct evaporative cooling section may be downstream from the mechanical cooling section. Cooling air is channeled through the air channeling sub-system and into the room. If a first set of control conditions is met, the air channeling sub-systems is operated in an adiabatic mode. The adiabatic mode includes channeling cooling air through the direct evaporative cooling section to evaporate water into the cooling air. If a second set of control conditions is met, the air channeling sub-system is operated in a hybrid mode. The hybrid mode includes channeling cooling air through the mechanical cooling section to remove heat from the cooling air and channeling the cooling air through the direct evaporative cooling section to evaporate water into the cooling air.

Abstract: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: A tiltable notebook-computer cooling pad with a tablet-computer bracket is disclosed. The notebook-computer cooling pad has its bottom its bottom detachable assembled with a tablet-computer bracket that can provide tiltable and rotatable support. The tablet-computer bracket can work with the notebook-computer cooling pad to allow adjustment of a tilting angle of the notebook-computer cooling pad, or it can work independently as a stand-alone tablet-computer bracket that provides tiltable and rotatable support to a tablet computer. Thereby, the disclosed device can serve to not only maintain an operating notebook computer cool, but also support a tablet computer.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: A heat dissipation device for a notebook computer is disclosed. The heat dissipation device includes a base, a connection device and a bracket. The connection device includes a first connecting member and a second connecting member which can be detachably connected with the first connecting member. The bracket is pivotally connected with the base through the connection device. The first connecting member is provided on the base, and the second connecting member is fixed on the bracket. The bracket is regulated by controlling engagement and separation of the first connecting member and the second connecting member, achieving stepless adjustment of the tilt angle of the heat dissipation device for a notebook computer, and the adjustment will be more convenient. Furthermore, the bracket is locked by the engagement of the first connecting member and the second connecting member, and it is of better stability.

Abstract: An AC photovoltaic module includes a DC photovoltaic module for converting solar energy to DC electrical power, and an inverter for converting DC electrical power to AC electrical power, the inverter being adapted for connection to a frame portion of the module and being sized and configured, and provided with arrangements of electrical components thereof, to dispense heat from the inverter, whereby to prolong operational life and reliability of the inverter.

Abstract: A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.

Abstract: An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink.

Abstract: A method for cooling a data center having a plurality of racks and an adjustable cooling system includes the following steps. A minimum and maximum temperature is set for each of the racks. A temperature of each of the racks is determined based on i) a rate R(t) at which the chilled air at a temperature Tc is introduced to each of the racks and ii) a rate R at which warm air from each of the racks at a temperature T is returned to the cooling system. The cooling system is adjusted to add cooling or to reduce cooling to the data center. The determining and adjusting steps are repeated at a predetermined time interval to achieve and maintain the temperature of each of the racks to be greater than or equal to the minimum temperature and less than or equal to the maximum temperature.

Abstract: An electronic equipment enclosure system with an airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a magnetic filler panel.

Abstract: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case housing the circuit board, the circuit board oriented in a substantially vertical direction, a vertical inner wall surface of the case formed opposite the non-mounting surface of said circuit board, the vertical inner wall and the non-mounting surface of said circuit board defining a substantially vertical air ventilation path, a suction port positioned in the case and in communication with the ventilation path, an exhaust port positioned in the case above said suction port and in communication with the ventilation path, and a heat generating component in communication with the ventilation path.

Abstract: An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.

Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.

Abstract: Data center capsules providing modular and scalable capacity with integrated power and thermal transmission capabilities. Modular integrated central power system (“ICPS”) to fulfill the power and thermal needs of data center environments or other mission critical environments. Computer-based systems and methods for controlling the energy- and thermal-envelope of any single data center environment or other mission critical environment, or an ecosystem of multiple data center environments or multiple other mission critical environments.

Abstract: In an electronic unit accommodated in a containing device so as to be adjacent to another electronic unit accommodated in the containing device, the electronic unit includes: a housing that is formed into a tub shape, that is provided with a plate comprising an air blowing hole, and that is closed by said another electronic unit when the electronic unit and the other electronic unit are accommodated in the containing device; and an interrupting portion that interrupts power supply to the electronic unit when said another electronic unit is detached from the containing device and the housing of the electronic unit is opened.

Abstract: In one embodiment an electronic device comprises a housing having a first section comprising a display and a second section comprising a keyboard coupled to the first section by a hinge assembly and an automatic hinge opening assembly for the housing. The automat hinge opening assembly comprises a hinge pin assembly mountable to the first section of the housing of the electronic device a pin rotatable about an axis between a first position and a second position and a hinge plate coupled to the pin and connectable to a hinge which connects the first section of the housing to a second section of the housing, and at least one torsion member coupled to the pin to apply a torque to the pin, wherein the torsion member is to store potential energy when the first section of the housing and the second section of the housing are in a closed position. Other embodiments may be described.

Abstract: A cooling box for electric or electronic components, consisting of a material, wherein the cooling box is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity that is enclosed by the material, wherein cavity being closed or provided with at least one opening.

Abstract: Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.

Abstract: A portable electronic device includes a housing, a radiating assembly, a display, a battery, and a heat sink assembly. The housing includes a front portion and a back portion opposite to the front portion. Both the radiating assembly, the display, the battery, and heat sink assembly are received in the housing. The heat sink assembly is a semiconductor cooling plate, and dissipates heat from the radiating assembly out of the housing.

Abstract: An exemplary embodiment of an electronic device includes a cover including a first hole, and a heat dissipating assembly. The heat dissipating assembly includes a movable board including a second hole and slidably connected to the cover, and a heat magnifying device received inside the cover and adjacent to a heat element. The heat magnifying device includes a moving end secured with the movable board. When the heat element is maintained room temperature, the first hole and the second hole are staggered from each other to seal the cover. When heat generated by the heat element heats the heat magnifying device and causes the moving end of the heat magnifying device to move under thermal expansion and drive the movable board to slide relatively to the cover, and the first hole of the cover and the second hole of the movable board are communicated with each other.

Abstract: A refrigerated server rack that may be used in a server room to cool computing equipment. The refrigerated server rack may contain a cooling unit or include a cooling inlet to receive chilled air to cool the computing equipment within the server rack. The self contained server rack has a modular design such that it may be easily integrated into mounting point within a data center. As the requirements of the data center change, server racks may be added or removed to provide scalability. As the racks are added or removed, a monitoring application discovers the server racks and equipment contained therein. The server rack and equipment may then be configured to operate within the data center computing infrastructure. Because only the interior of the self-contained server rack is cooled to maintain a proper operating environment for the computing equipment, there is no need to cool entirety of the data center.

Abstract: A computer host includes a casing, a number of fans, at least two temperature sensors, and a controller. The casing includes a top portion and a bottom portion. The bottom portion includes a first sidewall, a second sidewall, a third sidewall, and a forth sidewall. The at least two temperature sensors are positioned on the first sidewall and one or more of the other sidewalls and the top portion to sense the local temperature. The controller stores a threshold value, and when the temperature difference between the first sidewall on the one hand and the temperature of any one of the other sidewalls or the top portion is less than the threshold value, the controller turns off at least one fan.

Abstract: A server rack includes a rack, a first electronic device, a second electronic device, and an air block plate. The first electronic device is mounted in the front of the rack and arranged close to a left side of the rack. An opening is defined between the first electronic device and a right side of the rack. The second electronic device is mounted in the rear of the rack and arranged on a same level with the first electronic device. The air block plate is slantingly connected between the first electronic device and the second electronic device. A first end of the air block plate is connected to a right end of the first electronic device, and a second end of the air block plate opposite to the first end is connected to a left end of the second electronic device.

Abstract: A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.

Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.

Abstract: A unified scalable hardware system architecture contains subsystems which can be made available to a user depending on demand, a status of user's subscription or on a level of acquired licenses. This allows achieving manufacturing economies of scale with flexible monetization policies depending on the subscribed service level. An electric circuit such as a microprocessor system or a semiconductor control device includes a set of channels coupled to a source of a cooling medium and to an external heat exchanger. This cooling medium may be composed of a single or multi-phase liquid, gas, or mixture of any of the said media with solid particles flowing within an integrated circuit (IC) enclosure tangent to the said IC or across the integrated circuit structure through a set of microchannels. A scalable microprocessor system adjusts the number of active cores to the capability of a docking station to dissipate waste heat.

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.

Abstract: A heat dissipation system includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a baseboard with a motherboard and a mass storage device attached to the baseboard, a first cooling fan mounted on a top surface of the motherboard, and an air guiding panel attached on the baseboard surrounding the mass storage device. The air guiding panel guides cool air to the mass storage device along a first direction and out of the mainframe module by the first cooling fan in a second direction perpendicular to the first direction.

Abstract: A modulized heat-dissipation control method for a datacenter is provided. In this method, a temperature sensor is used to sense inner temperatures of multiple servers and CPU temperatures in the multiple servers. If any one of the CPU temperatures is abnormal, a flow of a first coolant is adjusted. If any one of the inner temperatures is abnormal, a rotating speed of a fan module is adjusted. If the rotating speed of the fan module has reached its maximum, a flow of a second coolant is adjusted.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: A projector includes: an external housing; and an exhaust fan configured to suck an air within the external housing and discharges the sucked air to the outside, the external housing has a top and bottom surface crossing a vertical axis, an air discharge port through that the air discharged from the exhaust fan is discharged to the outside, and a side surface that connects the top surface and the bottom surface, the exhaust fan constituted by a turbo fan that has an impeller rotatable around a predetermined rotation axis, and the rotation axis extends along the vertical axis.

Abstract: Systems and methods for mounting a modular processing unit that is configured to be selectively used alone or with other processing units in an enterprise. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units (including base modules and/or peripheral modules) in an enterprise. The one or more processing units are dynamically mounted based upon the particular enterprise needed and corresponding environment. In at least some implementations, shock mounting is included to provide for needed shock and vibe requirements. In some implementations, the mounting system includes a fixed mounting system for environments that need to be fixably secured. In other implementations, a selectively releasable connector is provided to allow for ease in mounting and removing the dynamically modular processing unit.

Abstract: A high density server including a plurality of portable devices is disclosed. The portable devices may be arranged in drawers, which may be assembled into shelves for mounting within the high density server. The server rack of the high density server has a substantially open bottom and open top to permit passive airflow in and around the portable devices housed therein. Because of the configuration of the portable devices within the server, the computing power density is increased over a traditional server. Also, the design of the portable devices and their placement within the high density server minimizes the need for active cooling and in some embodiments removes the need for active cooling mechanisms altogether. The portable devices are encased in a protective coating that facilitates heat dissipation away from the portable device. The portable devices include components found in traditional servers.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: This relates to the manner in which computers are configured in a given area in order to conserve space and to deal with cooling issues associated with the close housing of a large number of computers. Efficient arrangements for efficiently increasing the density of computer configurations are shown, particularly when used in a network server or host environment.

Abstract: An enclosure is provided. A housing (120) can have one or more walls (130). At least one of the one or more walls (130) can include a thermally conductive, carbonaceous member (100). The thermally conductive, carbonaceous member (100) can be partially or completely encapsulated within one or more electrically non-conductive materials.

Abstract: One aspect of this disclosure is directed to a sub-rack module for supporting a personal computer chassis therein. The sub-rack module is configured to be received within a multi-position support rack. Due to the unique combination of the sub-rack and the multi-position support rack, the sub-rack modules can be positioned such that the back ends of the personal computer chassis form an air passageway in the center of the multi-position support rack, which allows for the air flow to be directed through the passageway and out through the front end of the personal computer chassis. This configuration allows for the high density storage of an array of personal computer chassis while providing adequate cooling for multiple units. A method for manufacturing this system is also provided.

Abstract: A carrier for installation in a receiving space of a chassis includes a carrier body having a bottom wall and two sidewalls that cooperatively define a carrying space. The bottom wall has two opposite short sides respectively defining front and rear sides of the carrier body. A front shell is connected to the front side of the carrier body, and includes a front cover plate and two connecting walls extending into the carrying space and respectively and adjustably connected to the sidewalls in an overlapping manner to adjust a distance between the front cover plate and the rear side of the carrier body, so that the length of the carrier corresponds to the depth of the receiving space of the chassis.

Abstract: A device for protecting a computer of an aircraft turbine engine, the device comprising a box containing the computer and a cover covering the box, the box being supported by tabs forming integral portions of the box and maintaining a flow of air between the bottom of the box and a portion of the casing of the engine on which they are to come into secure contact via resilient studs, the box being made of a composite material.

Abstract: A computer system is provided. The computer system includes a housing, a mainboard, a first heat source, a second heat source and a flow field modulator. An inlet and an outlet are formed on the housing. The mainboard is disposed in the housing. The first heat source is located on a first location of the mainboard. The second heat source is located on a second location of the mainboard. The flow field modulator is disposed on the mainboard including a control unit, a piezoelectric element and a guiding sheet. The control unit is electrically connected to the mainboard. The piezoelectric element is electrically connected to the control unit. The guiding sheet is connected to the piezoelectric element.

Abstract: The invention relates to a power semiconductor device (100) cooling assembly for cooling a power semiconductor device (100), wherein the assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is adapted for adjusting the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction comprised in the power semiconductor device (100).

Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: A plenum provides cooled air to an inlet of an enclosure. An electronics assembly within the enclosure includes temperature sensors. Each of a plurality of position variable flow restrictors is positioned to control flow of the cooled air to a portion of the electronics assembly. A controller individually positions each flow restrictor based on temperature measurements provided by the temperature sensors associated with the portion of the electronics assembly for which cooled air is provided via the flow restrictor.

Abstract: A computer apparatus comprising a computer chassis, a baseboard component disposed within the computer chassis and a computer module electronically coupled to the baseboard component is disclosed. A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, wherein the heat sink assembly forms part of an integral exterior structure of the computer chassis. The chassis may comprise a compartment disposed through an exterior surface of the chassis for receiving the computer module heat sink assembly in mated fashion. The computer module heat sink assembly forms a water and air tight seal with the internal compartment of the chassis in mated fashion.

Abstract: A data center includes an air-conditioner and an information processing system that includes a plurality of information processing devices that is cooled with air flowing from an outlet port from the air-conditioner. The information processing device executes a program and acquires first air volume information measured by an air volume meter that measures an air volume from an outlet port corresponding to the subject device. The information processing device acquires a second air volume information measured by an air volume meter that measures an air volume from an outlet port corresponding to each of other information processing devices. The information processing device specifies other information processing devices that are cooled with a larger air volume than the air volume that cools the subject device based on the first and the second air volume information. The information processing device migrates the executed program to the specified information processing device.

Abstract: Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet.