Abstract: A computer includes various features that improve its functionality and/or ease of use. A modular electronics cartridge that includes a piston seal and opposed-direction latches removably engages a cartridge bay of the computer. A high intensity touch-screen display and a high power processor are disposed in a sealed compartment of the computer, and a remote heat exchanger is used to cool the sealed compartment. An interface converter/adapter converts a standard mini-PCI Express slot into a specialized mini-PCI Express slot with voice capabilities. SIM and microSD card slots mount to a pivoting door on the computer such that opening the door provides easier access to the card slots.

Abstract: A notebook auxiliary device includes a first rigid body, a second rigid body and a folding portion. The first rigid body is disposed on a top surface of a screen body of a notebook. The second rigid body is disposed on a bottom surface of a mainframe body of the notebook. A folding portion is disposed between the first rigid body and the second rigid body, and the folding portion is driven by the first rigid body such that the folding portion is bent under the mainframe body to produce a protrusion so as to form a preset support angle to support the mainframe body. Thus, one side of the notebook can lift to a preset support angle when the notebook is at open state, so as to increase the heat dissipation effect of the notebook and to reduce the fatigue which is introduced by prolonged use of notebook.

Abstract: Housing for at least one electric or electronic device, the housing surrounding a housing interior comprising a storage space, the electric or electronic device being arrangeable in the storage space, the housing comprising a housing upper part, which delimits the housing interior, the housing comprising at least one intermediate ceiling portion, which is arranged in the housing interior below the housing upper part and, together with the housing upper part, encloses at least one intermediate space, the intermediate ceiling portion having at least one cooling air passage, through which cooling air can flow from the storage space into the intermediate space, the housing upper part having at least one cooling air outlet, through which the cooling air can escape outwardly from the intermediate space, wherein the intermediate ceiling portion forms a catching arrangement for dripping water, which infiltrates the intermediate space through the cooling air outlet.

Abstract: Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel.

Abstract: A multi-floor data center, comprising in one implementation, a plurality of floors; a first set of server racks disposed about a first vertical center axis on each floor, the first set of server racks formed in a substantially closed shape, with a substantially vertical open center comprising a first airflow plenum at least for air flow; a first opening in each of the floors, with the first opening aligned with the substantially vertical first airflow plenum on it respective floor, wherein the substantially vertical first airflow plenums on the floors are aligned for communication through the first openings in the floors; outer wall; a roof with a roof opening therein.

Abstract: A chassis for a network storage system contains a first thermal chamber that houses conventional electronic components and a second thermal chamber that houses non-volatile solid state memory such as flash memory. A cooling system keeps the electronics in first thermal chamber below their maximum junction temperature. Meanwhile, a temperature regulating system maintains the solid state memory in the second thermal chamber within a range of a preferred operating temperature selected to extend the lifetime and/or improve the reliability of the solid state memory. Thus, the chassis provides dual zone temperature control to improve performance of the network storage system.

Abstract: Embodiments of an apparatus, system, method and techniques are described for an improved volumetric resistance blower and rotor. An apparatus may comprise, for example a motor, a casing having one or more inlets and one or more outlets, and a cylindrical rotor to create a volumetric resistance inside the casing, at least a portion of the rotor comprising a porous material. Other embodiments are described.

Abstract: Thermally actuated vents for electronic devices. An embodiment of an apparatus includes a vent having a first position and a second position, wherein the first position is an open position and the second position is a closed position; a muscle wire, a first end of the muscle wire being coupled with a connection to the vent and a second end of the muscle wire being coupled with an anchor point; and a tension element, a first end of the tension element being coupled with the vent at a connection point. The muscle wire is to apply a force to the vent to move the vent to the open position upon the muscle wire entering a contracted state, and the tension element pulling the vent to the closed position upon the muscle wire entering a relaxed state.

Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.

Abstract: A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

Abstract: An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.

Abstract: An apparatus for preventing deformation of a communication card includes a card holder configured to install a communication card; a temperature control component that is located on one side of the card holder and connected to a power supply configured to perform cooling or heating; a temperature sensor configured to collect temperature of the card holder; and the power supply configured to generate a supply current according to the temperature collected by the temperature sensor to supply power to the temperature control component, so that the temperature control component performs cooling or heating to maintain the temperature of the card holder within a preset temperature range, and the communication card is not deformed when the communication card is in the card holder and within the preset temperature range.

Abstract: A modular datacenter having multiple levels. The levels are stackable, and the number of levels can be selected based upon a desired installation. The datacenter includes walls or other structures that define ducts that extend through all the levels. The ducts can be used as hot and cold aisles for servers and networking equipment. The ducts can be formed by concentric cylinders.

Abstract: Methods, apparatuses, and computer program products for modifying the spatial orientation of a thermal acoustic panel of a computing enclosure rack are provided. Embodiments include receiving, by a configuration controller, a configuration preference from a user; identifying, by the configuration controller, a spatial orientation configuration corresponding to the configuration preference received from the user; and coordinating, by the configuration controller, movement of the thermal acoustic panel relative to a body of the computing enclosure rack in accordance with the identified spatial orientation configuration.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract: Various computing devices and methods of thermally managing the same are disclosed. In one aspect, an apparatus is provided that includes a case and a first sensor in the case. a case and a first sensor in the case. The first sensor is operable to generate an output in response to sensing contact with a body part of a user. The computing device manages thermal behavior of the computing device responsive to the output.

Abstract: A method and system of cooling a server rack unit is described herein. A server rack for housing certain devices may be configured to receive a first air flow at a server rack front. Each device may form a wall at the back of the device creating a channel between the wall and the server rack back. The camber may collect warm air created by the first air flow as it extends over the at least one server. A first surface of the server may define at least one server rack opening allowing the warm air in the channel to exit the server rack.

Abstract: Improving the operating efficiency of a rear door heat exchanger, including: determining, by a ventilation management module, a temperature differential between two temperature sensors in the rear door heat exchanger, the temperature differential indicative of cooling efficiency in the rear door heat exchanger; determining, by the ventilation management module, whether the temperature differential is greater than a predetermined threshold; and responsive to determining that the temperature differential is greater than the predetermined threshold, taking corrective action by the ventilation management module.

Abstract: A low noise amplifier device for receiving a radio frequency signal from a satellite contains an amplifier kept in a sealed chamber in a cryostat, and a cryogenic cooler mounted on the outside of the cryostat. The amplifier is: maintained in the sealed chamber attached to a cold finger of the cryogenic cooler, made of a material with good heat conductivity and without direct contact with the wall of the cryostat; connected to the input and output coupler, each traversing the wall of the cryostat; functional at room temperature and at least one cryogenic temperature well below room temperature; and the sealed chamber of the cryostat contains a gas at a pressure between a pressure close to the pressure outside the cryostat and 0.1 millibar.

Abstract: A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat sink surface facing the thermal interface member and a step extending from the heat sink surface with a module engagement surface. The ribs ride along the step during insertion into and removal from the receptacle of the transceiver module. When the ribs are longitudinally aligned with and engage the step, the module engagement surface is in an elevated position. When the ribs are longitudinally offset from the step, the module engagement surface is in a recessed position and in direct thermal engagement with the thermal interface member.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting arrangement accommodating thermal cooling of active equipment having internal side-to-side air cooling arrangements.

Abstract: In one implementation, an environmental controller operates a cooling system in an electronic device. The environmental controller includes a closed loop control system for operating a cooling fan at a target speed. The environmental controller may select the target speed based on one or more temperature sensors. The environmental controller may select the target speed based on the speeds of additional fans or the fans may be controlled in unison. The closed loop control system includes a proportional weight. When a measured cooling fan speed deviates from the target speed by more than a threshold error value, the proportional weight is constant. As the measured cooling fan speed approaches the target speed, and the threshold error value is crossed, the proportional weight is variable. The variance may be a function of time such as a periodic stair step function.

Abstract: A datacenter or server farm having servers mounted to blow air at an angle in a hot aisle. The angled air flow can provide a cyclonal effect in the hot aisle, enhancing heat convention in the hot aisle.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: An air shield is mounted to a cabinet to replace a server unit. The air shield includes a supporting shell detachably mounted in an opening defined the cabinet through which the server unit can enter the receiving space, and an adjusting apparatus slidably installed to the supporting shell. The supporting shell defines a number of vents communicating with the receiving space of the cabinet. The adjusting apparatus includes a number of spaced shield pieces. The adjusting apparatus is operated, to move the shield pieces to cover, partially cover, or uncover the vents of the supporting shell.

Abstract: A memory protection device and a computer including the memory protection device are disclosed. The memory protection device includes insulating heat-conducting bars which are provided on an upper end of slot arms at two sides of a memory connection base and cover up heat emitting holes of the slot arms.

Abstract: An assembly may include at least one duct and at least one distribution box, wherein the distribution box is mounted on the duct in fluid-tight engagement therewith for enclosing a distribution chamber therewith. Also, a method of mounting a distribution box to a duct, at a distribution point that is spaced-apart from duct ends, may include positioning a distribution point duct section in the distribution box, and hermetically sealing a distribution chamber, defined within the distribution box, from an environment of the distribution box.

Abstract: A device may include multiple power supplies that are cooled by a system fan. The power supplies may be cross-connected to supply power to one another and the device may monitor temperatures of the power supplies. Based on the temperatures of the power supplies, the device may determine whether any of the power supplies are likely to be on fire. The device may shut off the fan when a power supply is determined to be likely to be on fire.

Abstract: A system including a chassis (102), a vent (130,132) in the chassis to exchange air from outside the chassis with air inside the chassis, a temperature sensor (114) inside the chassis, a power supply (106) to supply power to the system, and a controller (120) coupled to the temperature sensor to perform an airflow block response action (121) if the controller determines the temperature from the temperature sensor is higher than a threshold temperature for a level of power being drawn by the system from the power supply.

Abstract: A server rack heat dissipation system for a server including an electronic component comprises a first and a second heat dissipation assembly. The first heat dissipation assembly includes a first heat exchanger and a first pipeline. The first heat exchanger is inside the server rack and in thermal contact with the electronic component. The first pipeline is in thermal contact with the first heat exchanger and has a first coolant. The second heat dissipation assembly includes a second heat exchanger. The second heat exchanger is inside the server rack and in thermal contact with the first pipeline. The second heat exchanger can remove the heat of the electronic component in the first coolant in advance. Accordingly, the time of the first coolant being maintained in a vapor phase can be shortened, so that a power the fluid driving device used for driving the first coolant is reduced.

Abstract: An apparatus on which a fan can be mounted, including a casing; a plurality of cooling fan units arranged in line on a lower portion of the casing and capable of being inserted into and removed from the casing on an individual basis; and a plurality of plate members disposed above the line in which the cooling fan units are arranged and above a gap between the cooling fan units, the plate members extending in a direction to which an upper surface of each of the cooling fan units is substantially perpendicular and in which the cooling fan unit is inserted into and removed from the casing, wherein each of the plate members is supported so as to be able to pivot about its lower end portion toward both directions.

Abstract: A data center inside a shipping container having a lower plenum and an upper plenum in its interior, individual computing devices, and a humidity. Humidity inside the container is controlled by a humidity sensing device that reports the humidity level to a central controller. The central controller is connected to a humidity control device and the individual computing devices. Based on the humidity level, the central controller will adjust the output of the humidity control device to maintain the humidity internal to the container at a pre-determined level. The central controller energizes and de-energizes individual computing devices depending on the humidity level inside the container and other factors associated with the operation of computing devices. The central controller is also connected to, and communicates with, an external communication network.

Abstract: A synthetic jet ejector (501) is provided which includes a diaphragm (503) and a chassis (505). The chassis has first and second major surfaces which are equipped with a set of interlocking features (509) such that a first instance of the synthetic jet ejector releasably attaches to a second instance of the synthetic jet ejector by way of the interlocking features.

Abstract: A server provides for improved cooling using one or more baffles. The baffles allow for increased cooling efficiencies by directing heat in such a manner as to reduce heat exposure for temperature sensitive hardware and data center employees. The baffle may be disposed within a server and direct hot air through the server away from temperature sensitive devices. The baffle may include an inlet that receives hot air and an outlet through which hot air may exit. One or more fans may be used to direct air through the baffle. For example, the baffle may direct heat from the baffle inlet to the baffle outlet, directing heat away from temperature sensitive devices within the server.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Abstract: A system for managing air flow computing devices in a rack includes a stall and filler elements. The stall includes a stall top panel and two side panels spaced apart from one another. The stall accommodates a rack computing system. The filler elements fill gaps between the computing devices of the rack computing systems and the panels of the stalls. An air moving system moves air from the cold aisle through cold-aisle facing air inlets of the computing devices. The filler elements inhibit air moving toward the cold aisle-facing inlets from leaking through gaps between the computing devices of the rack computing systems and the stall panels such that the filler elements inhibit air moving toward inlets in the computing devices from leaking through the gaps between the computing devices in the rack and the stall panels.

Abstract: A server including a chassis, an electronic module, a fan module and a handle is provided. The chassis has a first wedging portion. The electronic module is disposed in the chassis. The fan module is disposed in the chassis and is adjacent to the electronic module. The handle is pivotally connected to the fan module and has a second wedging portion, and the first wedging portion is used for wedging the second wedging portion. When the handle is rotated, the fan module is moved relatively to the first wedging portion for entering or exiting the chassis.

Abstract: The present invention relates to a battery management system for a battery module comprising a plurality of cells connected to one another which each have a positive and a negative terminal. The invention is in particular concerned with a battery management system which is used with accumulators especially lithium ion cells for forming a traction battery or a traction battery module for vehicles with an electrical drive drain. Such battery modules can for example be used in electrical vehicles, hybrid vehicles with combustion engines or hybrid vehicles with fuel cells, can however also be used for other purposes, for example for stationary applications or for small traction applications, such as for example in a wheelchair.

Abstract: Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Abstract: A system selectively cools a set of at least one rack-mounted server in a chassis. The system comprises: a chassis; a chassis manager; a set of at least one thermal sensor coupled to each rack-mounted server in the chassis; a cold air source; a cold air conduit coupled to the cold air source; a plurality of cold air valves coupled to the cold air conduit; and an expandable tube of flexible memory material coupled to each of the plurality of cold air valves, where the expandable tube inflates with cold air from the cold air source to expose directional holes, and thus cold air, across a specific predetermined sub-area of a particular overheating rack-mounted server in response to the chassis manager detecting that the particular overheating rack-mounted server is exceeding a predetermined temperature.

Abstract: An example includes an apparatus to pump a fluid. The apparatus includes a housing extending along a length defining an elongate interior, an actuator in the housing, conforming to the elongate interior, the actuator including a plurality of lumens, each having a length extending substantially parallel to the elongate interior, each from around 10 to 200 micrometers across and an actuator configured to oscillate the actuator in the actuator housing along the length of the elongate interior with a rate differential between movement in a first direction versus movement in a second direction opposite the first direction to pump the fluid.

Abstract: In a server cooling device having a cold zone and a hot zone, a flow of cold air is determined depending on an air conditioner disposed in the hot zone and a size of a casing. A server cooling system is provided in which a chamber is substantially divided into two parts with a cold aisle formed in one part and a hot aisle formed in the other part, and a server rack is disposed on a boundary between the cold aisle and the hot aisle. The server cooling system includes: an air conditioner provided on the hot aisle side; a circulation path disposed so as to extend from the air conditioner to the cold aisle; and a shield provided on the boundary excluding the server rack. The shield is provided with a gallery capable of venting from the cold aisle to the hot aisle.

Abstract: An air duct includes a top wall and a blocking plate. The top wall includes a limiting block, a resilient arm, and a pair of hooks. A latching slot is defined between the pair of hooks. The blocking plate is rotatably secured to the top panel and includes a body and a shaft connected to the body. The shaft is rotatably engaged in the latching slot. The limiting block and the resilient arm abut two opposite surfaces of the body and block the body preventing the blocking plate from rotating relative to the top wall. The blocking plate is adapted to abut an electronic component and guide airflow towards the electronic component.

Abstract: A panel type display device for minimizing temperature increase in the interior of a case and a display panel. The display device includes a case, a display panel mounted in an interior of the case, at least one circuit board for controlling the display panel, a first cooling fluid path for cooling the display panel, and a second cooling fluid path for cooling the circuit board. In the display device, the first and second cooling fluid paths are separated from each other.