Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s).

Abstract: An electrical junction box to be attached to a vehicle includes a heat dissipation member having a base plate portion that has a plate shape having a first surface and a second surface, a plurality of fins that protrude from the second surface, and a pedestal that is provided protruding from the second surface and that has a smaller protruding height from the second surface than the fins as well as a bracket having a pedestal attachment portion that is attached to the pedestal and a vehicle body attachment portion that is continuous with that attachment portion, extends in a direction away from the heat dissipation member, and is attachable to a vehicle body of the vehicle.

Abstract: A power unit includes a power distribution member and an interchangeable adapter configured to be deployed in an equipment rack of a distributed computing system. The power distribution member includes multiple power outlets to provide electrical power to a plurality of devices disposed in the equipment rack at a first current rating and phase type configuration, and a first connector having a plurality of first electrical contacts that are electrically coupled to the power outlets. The interchangeable adapter includes a second connector to be coupled to the first connector in which the second connector has multiple second contacts that are arranged to mate with certain ones of the first electrical contacts such that one of a plurality of different electrical power sources having a second current rating and phase type configuration is provided to the power outlets at the first current rating and phase type configuration.

Abstract: The exemplary embodiments herein provide an electronic display assembly having an electronic display surrounded by a front panel and a housing. An ingestion gap may be placed near a portion of the perimeter of the front panel while an exhaustion gap may be placed near an opposing portion of the perimeter of the front panel. A buffer zone may be defined between the ingestion gap and the exhaustion gap. A fan may be positioned to draw open loop fluid into the ingestion gap, through a channel behind the electronic display, and out of the exhaustion gap. This fan may also draw open loop fluid through an optional heat exchanger. A circulating fan may force circulating air through an optional heat exchanger.

Abstract: A display device includes a chassis, an electronic module, and a waterproof breathable member. The chassis has a front frame and a rear cover installed on the front frame. The rear cover has a plurality of heat-dissipating holes and an intake port, and the chassis is configured to allow a heat-dissipating airflow to pass through the accommodating space via the heat-dissipating holes and the intake port. The electronic module arranged in the chassis has a circuit board, and the heat-dissipating holes are arranged above the circuit board. The waterproof breathable member is disposed on an inner surface of the rear cover and entirely shields the heat-dissipating holes, so the heat-dissipating airflow only passes through the waterproof breathable member when the heat-dissipating airflow flows out of the chassis via the heat-dissipating holes. The waterproof breathable member is configured to avoid any liquid flowing into the chassis via the heat-dissipating holes.

Abstract: A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold.

Abstract: A method, an apparatus, and a computer program product are provided. The apparatus may be a UE. The UE has a processor including a plurality of cores. The plurality of cores includes a first core and remaining cores. The UE determines a temperature of the first core of the plurality of cores. The first core processes a load. The UE determines that the temperature of the first core is greater than a first threshold. The UE determines that the temperature of the first core is not greater than a second threshold. The second threshold is greater than the first threshold. The UE transfers at least a portion of the load of the first core to a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold.

Abstract: A method for providing for conditioning of a computer data center includes supplying a working fluid from a common fluid plane to a plurality of power/cooling units distributed across a data center facility in proximity to electronic equipment that is distributed across the data center facility; converting the working fluid into electric power and cooling capacity at each of the plurality of power/cooling units; and supplying the electric power to a common electric power plane serving a plurality of racks of the electronic equipment in the data center facility and being served by a plurality of the power/cooling units in the data center facility, wherein the common fluid plane serves at least 10 percent of the power/cooling units in the data center facility and the common electric power plane serves at most 5 percent of the electronic equipment in the data center facility.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: An adapter device includes a cover that covers an inserted recording medium, a cover urging portion that urges the cover in a direction of the recording medium and causes the cover to be in press contact with the recording medium, and a connector conversion section that connects a terminal portion of the recording medium to a connector on an apparatus side having a different physical specification.

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.

Abstract: A cooling device for electric equipment includes a cooling unit for cooling inverter elements. Cooling unit includes a heat mass which has a surface provided with the inverter elements and a back surface arranged on a back side of surface to form a heat mass inner tank arranged between the surface and the back surface and transfers heat generated at the inverter elements, a fin portion which is provided on the back surface and radiates heat transferred through the heat mass, air-conditioner coolant pipelines which are provided on the surface and form a coolant passage through which a coolant for vehicle cabin air-conditioning flows, and a water pump which supplies and discharges coolant water to and from the heat mass inner tank. With such a configuration, a cooling device for electric equipment which is excellent in cooling efficiency is provided.

Abstract: An industrial control panel is provided that comprises a zone enclosure unit and an equipment segregation unit. The zone enclosure unit has a back panel, a plurality of side panels, a top panel, a bottom panel, and a door to access the interior of the zone enclosure unit. The zone enclosure unit is adapted to contain a first set of electrical equipment. The equipment segregation unit may be mounted to the zone enclosure unit. The equipment segregation unit has a back panel, a plurality of side panels, a bottom panel, and a door to access the interior of the equipment segregation unit. The equipment segregation unit is adapted to contain a second set of electrical equipment. The first set of electrical equipment is capable of being electrically connected to the second set of electrical equipment.

Abstract: An equipment-rack power distribution system is described which includes a PDU housing, a power input penetrating the housing, a plurality of power outlets disposed on a surface of the housing, circuitry enclosed in the housing interconnecting the power input and the power outlets, one or more air inlets associated with the housing, one or more air outlets associated with the housing, and an air flow device in fluid communication with one or more of the air inlets and the air outlets. An environmental sensor may activate the air flow device upon detection of predetermined environmental conditions, such as a temperature that is above a defined limit.

Abstract: Example embodiments disclosed herein relate to a case having a base unit and a display unit. The base unit includes an emitting surface. The display unit includes a dissipating member. A hinge connects the base unit and the display unit, the hinge connected below at least part of the heat emitting surface or first vent and the heat dissipating member or second vent. The emitting surface and the dissipating member are to overlap or align when the display unit is in a closed position.

Abstract: A data center includes a wind collecting structure that directs prevailing winds external to the data center into an interior of the wind collecting structure. The wind collecting structure includes vents around its perimeter configured to selectively open on a side of the wind collecting structure receiving prevailing wind, pressurizing the intake air. The pressurized air flows from the wind collecting structure through a compartment of the data center including computing assets. The air is directed across the computing assets to extract heat from the computing assets during operation.

Abstract: An IT chassis, configured to house IT componentry, includes a forward portion having a forward portion width and a rearward portion having a rearward portion width that is narrower than the forward portion width. A first side of the rearward portion is configured to engage a first slide assembly having a first slide width. A second side of the rearward portion is configured to engage a second slide assembly having a second slide width. The sum of the rearward portion width, the first slide width and the second slide width is substantially equal to the forward portion width.

Abstract: A server includes a chassis, processing units and an airflow generating device. The processing units are disposed inside the chassis for heat dissipation of the processing units. Each processing unit includes a motherboard, an electric heat source, a heat dissipation fin set and a stopping air bag. The electric heat source is disposed on the motherboard, the heat dissipation fin set is attached to the electric heat source and the stopping air bag including an air inlet opening is located at space between the heat dissipation fin set and one of the processing units which is adjacent to the stopping air bag. When the airflow generating devices are operated, air is blown into the stopping air bag through the air inlet opening so that the stopping air bag is inflated to occupy the space to stop an airflow from flowing through the space.

Abstract: A heat dissipation system includes a number of condensers, an air distribution apparatus, a number of guiding pipes, and a controller. The air distribution apparatus includes a distribution box and a number of adjusting members. The distribution box defines an air inlet and a number of air outlets arranged along a lengthwise direction of the distribution box. The adjusting members are rotatably installed in the air outlets of the distribution box. The guiding pipe is connected between the condensers and the air inlet of the air distribution apparatus. The controller controls the adjusting members to rotate to change opening sizes of the air outlets.

Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.

Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.

Abstract: In accordance with some implementations of this invention, an electronic assembly is formed with a thermal channel that controls an air flow for the purpose of dissipating heat generated in the electronic assembly. The electronic assembly includes a top board, a bottom board and a subassembly that further includes a rail, an airflow tab and an interconnect. The subassembly couples the top and bottom boards together. The rail has an opening through which air passes. The interconnect faces the airflow tab, carries electrical signals between the top board and the bottom board, and is configured to channel air directed through the opening of the rail.

Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: A cooling method is provided which includes providing a cooling apparatus that includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

Abstract: A system for cooling items of equipment likely to give off energy, comprises: an enclosure comprising a membrane that is porous to water vapor and sealed to liquid water, said membrane separating the cavity into a first portion designed to contain a fluid consisting of water and vapor, a second portion designed to contain the vapor resulting from the vaporization of the water, a temperature sensor for measuring the temperature of the liquid-vapor fluid contained in the cavity, a device to discharge the vapor from the cavity into the environment creating a vacuum in this cavity and breaking the natural liquid/vapor balance of the cavity containing the liquid, thus causing a vaporization of a portion of the liquid, a means for controlling the flow rate of the vapor discharged to outside of the cavity, said control means being regulated on the signal delivered by the temperature sensor.

Abstract: According to one embodiment, a server rack includes a server, a housing which includes a ventilation opening part, and surrounds the server, a water sensor which is provided outside the housing and senses water, a closing member which is movable between a first position in which the closing member is dislocated from the opening part and a second position in which the closing member covers the opening part, a moving mechanism which moves the closing member from the first position to the second position, an adhering mechanism which brings the closing member that has moved to the second position into close contact with the housing, and a controller which operates the moving mechanism and the adhering mechanism, when the water sensor senses water.

Abstract: Enclosures and systems that can control airflow and signal connectivity in a blade enclosure are provided. Some examples include a front section including a number of blade server modules, a rear section including a number of switch modules; and a middle section having a number of openings and a number of connectors, wherein the middle section controls airflow between the front section and the rear section in the blade enclosure with the number of openings and the middle section controls signal connectivity between a number of blades in the number of blade server modules and a number of switches in the number of switch modules with the number of connectors.

Abstract: Disclosed is a heat removal apparatus to be used in conjunction with a case of a computer processing unit. The apparatus comprises an air permeable cover disposed over a top opening of the case, the air permeable cover for enabling the hot air in the case to egress therethrough and a cap secured over the air permeable cover for preventing dust and liquids from entering the case therethrough while allowing the passage of hot air therethrough by virtue of the stack effect.

Abstract: A computing device having a housing; a temperature monitor to monitor a temperature within the housing; a cooling fluid drawing mechanism to draw cooling fluid into the housing; a cooling fluid drawing controller, when the computing device is installed within an enclosure as one of plural computing devices, to obtain a value representing the temperature, and if the value is within a predetermined range, to select an operating state for the mechanism from among a first state in which the mechanism draws fluid into the housing at a first rate, and a second state in which the mechanism draws cooling fluid into the housing at a second rate lower than the first rate, and to run the mechanism in the selected state; where the selection of the state is based on demand for cooling from other computing devices from among the plurality of computing devices.

Abstract: An apparatus includes an enclosure defining an interior space and at least one server-rack port configured to engage one or more of racks such that one or more servers installed in each rack are contiguous to the interior space. The enclosure is inside of a room and includes at least one stability control unit at the bottom of the enclosure. Each server includes a fan that draws air from the interior space into the server and expels the air outside of the enclosure into the room. The apparatus also includes a mixing chamber that is contiguous to the enclosure. The mixing chamber includes a first set of one or more dampers that are contiguous to natural air outside of the room and a second set of one or more dampers that are contiguous with air in the room.

Abstract: An electronic-device housing stores an electronic circuit and a cooling fan. The electronic-device housing includes a first surface having at least one opening to release heat outside. At least one projected portion projects toward an outside of the electronic-device housing, and when the electronic-device housing is installed on an installation surface so that the first surface is opposed to the installation surface and the projected portion comes into contact with the installation surface, a rotation moment acting on a gravity center of the electronic-device housing acts in a direction where the rotation moment causes the first surface to move away from the installation surface.

Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

Abstract: Embodiments are provided for cooling one or more components of a playback device using speaker vibrations that result from inaudible audio. Movement of air molecules arising from the speaker vibrations may disperse heat away from the one or more components of a playback device. The playback device may include a thermal sensor to determine the temperature on or around one or more components. If the playback device is no longer playing audible audio and temperature on or around one or more components rises above a first predetermined threshold, the playback device may play inaudible audio. Playback of inaudible audio may result in movement of air molecules and the dispersion of heat away from the one or more components. Playback of the inaudible audio may stop if the playback device begins playing audible audio or if the temperature on or around one or more components drops below a second predetermined threshold.

Abstract: A server system and a heat dissipation control method thereof are provided. A main power supply and a standby power supply respectively supplying a main voltage and a standby voltage of the server system are provided. An extension card module including at least one extension card slot allowing at least one extension card to insert into, is provided. A fan module including at least one fan used for dissipating heat from the extension card module is provided. When the main voltage is applied to the server system, the main voltage is applied to the fan to drive the fan. When the standby voltage is applied to the server system, the extension card module is determined whether to be inserted in any extension card. If yes, the standby voltage is applied to the fan to drive the fan; otherwise, the standby voltage is interrupted to stop the fan.

Abstract: An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.

Abstract: A system for use with a computing rack that prolongs operation of computing devices mounted within the rack by preventing or at least limiting the circulation of airflow (e.g., hot airflow) through empty receiving bays of the rack upon removal of computing devices from the receiving bays. In one arrangement, the system includes a plurality of airflow restriction devices (e.g., baffle plates) movably secured adjacent respective receiving bays of the cabinet. Each airflow restriction device is automatically movable between a deployed position to restrict airflow through respective receiving bay in the absence of a computing device in the receiving bay and a refracted position to allow for mounting of a computing device in the receiving bay (e.g., so that the computing device can exhaust hot air out of the rear portion of the receiving bay).

Abstract: An electronic device including a first body, a rotating base and a transmission module is provided. The rotating base has a first ventilation opening. The rotating base is pivoted on the first body and suitable for rotating between a using position and a retracted position in relative to the first body. When the rotating base is located at the retracted position, the first ventilation opening is exposed from the first body. When the rotating base is located at the using position, the first ventilation opening is retracted in the first body. The transmission module is connected to the rotating base for outputting a mechanical force to actuate the rotating base.

Abstract: Provided herein are a display device and a cooling apparatus, the cooling apparatus including an impeller which sucks a fluid in an axial direction, and which discharges the fluid in a radial direction; a pair of radiation blocks, which are respectively disposed at each side of the impeller, wherein each of the radiation blocks includes a plurality of radiation fins; and a plurality of scroll units which guide the fluid discharged from the impeller to the pair of radiation blocks, wherein each of the scroll units includes a first scroll part which guides the fluid based on a rotating direction of the impeller, and a second scroll part which guides the fluid so in a direction opposite to the rotating direction of the impeller.

Abstract: A handheld device (10), including a projector module (20) which includes a light source having a laser or at least one light emitting diode; a thermal management system which includes a heat collector (30) formed of a material having a thermo-mechanical design constant of at least 10 mm-W/m*K and having a non-planar shape, the heat collector in thermal contact with the light source; a heat spreader (40) having a surface area at least 1.5 times that of the surface area of the heat collector and a thermo-mechanical design constant of at least 10 mm-W/m*K, the heat spreader positioned in thermal contact with the heat collector, wherein thermo-mechanical design constant of a material is defined by thermal conductivity of the material multiplied by its average thickness.

Abstract: A fan mounting apparatus includes an operating platform, a mounting base, multiple mounting members, multiple pushing members, and multiple driving members. The mounting base is located on the operating platform and configured to mount a fan frame. The multiple mounting members are rotatably connected to the mounting base and configured to mount the multiple fan brackets. The multiple pushing members are configured to push the multiple mounting members. The multiple driving members are configured to push the multiple pushing members. In an original state, the multiple mounting members are substantially parallel to the mounting base. When the multiple pushing members are pushed out of the operating platform by the multiple driving members, the multiple mounting members rotate relative to the mounting base and resist against the fan frame, and the multiple fan brackets on the multiple mounting members are mounted to the fan frame.

Abstract: The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value.

Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.

Abstract: A magnetic lock system for releasably securing a heat exchanger with a component. The system includes: an electromagnet on one of the heat exchanger or the component and a magnetic region on the other of the heat exchanger or the component; the electromagnet being energizable to attract the magnetic region to secure the component and the heat exchanger in a thermally coupled position; and the electromagnet being de-energizable to release the component and the heat exchanger from the thermally coupled position.

Abstract: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels.

Abstract: A portable system that includes a portable housing having a section for reception of portable wireless computing devices such as tablets, and components to provide recharging capability and information to the portable wireless devices.

Abstract: A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and a adhesive layer. The transparent substrate defines at least one through hole. The adhesive layer is adhered to an inner wall of the at least one through hole.

Abstract: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels.

Abstract: A cover for an electronic device includes a transparent portion and a non-transparent portion beside the transparent portion. The transparent portion defines a display area of the electronic device. The non-transparent portion defines a non-display area of the electronic device beside the display area. The non-transparent portion includes a transparent substrate integrated with the transparent portion. A plurality of through holes are defined on the transparent substrate.

Abstract: A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.

Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.