Abstract: An airflow restrictor door is pivotably supported by and extends from a support towards a card receiving bay.

Abstract: Improved approaches to providing thermal and power management for a computing device are disclosed. These approaches facilitate intelligent control of a processor's clock frequency and/or a fan's speed so as to provide thermal and/or power management for the computing device.

Abstract: A light-emitting diode (LED) heat dissipation aluminum bar and electricity conduction device includes a heat dissipation aluminum bar having a structure formed of multiple sections each having multiple heat dissipation fins. The heat dissipation aluminum bar forms a LED circuit board receiving slot and power channels and each power channel receives therein an insulation that encloses an electrically conductive bars. When an LED circuit board is received and secured in the LED circuit board receiving slot by fasteners, the fasteners, which are made electrically conductive, penetrate the insulations to contact the electrically conductive bars so as to supply electricity to the LED circuit board at the same time of fixing the LED circuit board. The LED circuit board has a structure formed of multiple sections interconnected to each other to allow for adjustment of the overall length thereof.

Abstract: A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

Abstract: A system and method for throttling a slave component of a computer system to reduce an overall temperature of the computing system upon receiving a first signal is disclosed. The first signal may be from a master component indicating that a temperature for the master component has exceeded its threshold temperature. The slave component or the master component may be a central processing unit, a graphics memory and controller hub, or a central processing unit memory controller hub. The slave component may send a second signal to indicate that a temperature for the slave component has exceeded its temperature. The master component would then initiate throttling of the master component to reduce the overall temperature of the computing system. The master component may be throttled to a degree less than the slave component. A first component may be designated the master component and the second component may be designated the slave component based on a selection policy.

Abstract: A cooling system for an outdoor electronic enclosure, with separate compartments for electronics and batteries, includes separate cooling devices for each compartment so that optimal temperatures are provided to each compartment. The batteries are cooled by a thermo-electric type air-conditioner, while the electronics are cooled by direct air cooling device or a heat exchanger.

Abstract: This document invention relates to a display apparatus, and more particularly, to a plasma display apparatus. The plasma display apparatus according to an embodiment of the present invention comprises a plasma display panel in which upper and lower substrates are combined, a vibration damping sheet formed on a rear surface of the plasma display panel, and a plurality of driving circuit substrates formed on a rear surface of the vibration damping sheet, for driving the plasma display panel. According to an embodiment of the present invention, noise occurring in a discharge of a plasma display panel and driving circuit elements is precluded. Therefore, a high level of noise reduction can guaranteed and the manufacturing cost of a plasma display apparatus can be saved.

Abstract: An electronic device with a heat dissipation mechanism includes a main body, at least one supporting member, at least one driving device, a temperature sensor, and a controller. The main body defines a plurality of heat dissipation holes and at least one through hole. The heat dissipation holes are configured for dissipating heat of the electronic device. The supporting member passes through the through hole, and one end of the supporting member protrudes from the bottom of the main body. The driving device is configured for driving the supporting member to move along its axis, causing the electronic device to be kept in a flat state or in an inclined state. The temperature sensor is for sensing the temperature of the electronic device. The controller is for driving the driving device, causing the supporting member to move a predetermined distance along its axis, according to the sensed temperature.

Abstract: An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed.

Abstract: A computer includes an enclosure, a motherboard, at least one expansion card, a supporting bracket, and at least one first baffle plate and at least one second baffle plate. The at least one expansion card is inserted into the corresponding expansion slot. The bracket is located above and spaced from the motherboard by a spacing. The at least one first baffle plate and at least one second baffle plate are arranged along an extension direction of the supporting bracket and extending between the bracket and the motherboard. The at least one first baffle plate covers a part of the spacing between the bracket and the motherboard. The at least one second baffle plate covers another part of the spacing between the bracket and the motherboard. The at least one first baffle plate and the at least one second baffle plate define a plurality of through holes therein.

Abstract: A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.

Abstract: A display device of the present invention is a display device including a body unit; a display unit; and a supporting unit, arranged upright from the body unit, for supporting the display unit; the display device including a circuit substrate arranged inside the body unit and mounted with an electronic component; a radiator plate arranged facing the circuit substrate and directly or indirectly contacting a plurality of electronic components; a heat pipe arranged on the radiator plate; and a cooling fan attached to the radiator plate and connected with a terminating end of the heat pipe.

Abstract: An electronic device includes a body portion such as, for example, a laptop chassis, and a deployable support coupled to the bottom surface of the body portion. The deployable support can be moved between a stowed position relative the bottom surface of the body portion and a deployed position in which support is positioned in spaced relationship to the bottom to create an airflow path beneath the body portion.

Abstract: An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.

Abstract: A server cabinet includes a rack and an air baffle plate. The rack defines an interior space configured for accommodating a plurality of servers therein. The rack includes a top wall, an opposite bottom wall and two sidewalls respectively connected between left sides of the top and the bottom walls and right sides of the top and the bottom walls. The servers are arranged along a bottom-to-top direction. Each of the servers is fixed between the two sidewalls. A space is defined between a topmost server and the top wall. The air baffle plate is positioned in the space for blocking an airflow on a rear side of the servers from flowing back to a front side of the servers via the space.

Abstract: A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.

Abstract: An air volume control module for use with a vehicular air conditioning apparatus includes a circuit board including a control circuit for controlling the rotational speed of the blower of the vehicular air conditioning apparatus, a heat sink connected to the circuit board and including a fin for radiating heat generated by the circuit board, and a base housing surrounding the circuit board, the heat sink being inserted in the base housing with the fin projecting from the base housing. The base housing is mounted on the heat sink only by a locking finger. Either one of the base housing and the fin of the heat sink has a protective projection having a heightwise dimension greater than that of the locking finger.

Abstract: In accordance with at least some embodiments, a computer system include a chassis and a main airflow channel within the chassis. The computer system also includes multiple processors and multiple memory banks positioned in the main airflow channel. The computer system also includes a removable airflow guide assembly installed in the main airflow channel, wherein the removable airflow guide assembly divides the main airflow channel into a processor-side airflow channel and a memory-side airflow channel.

Abstract: A cooling system may include a fan which may be placed near the center of the system board. The fan may include bottom inlet and may draw air through an opening in the bottom skin of the computer system and may generate a positive pressure within the computer system. Exhaust vents may be positioned at the periphery.

Abstract: Airflow management apparatuses for computer cabinets and associated methods are disclosed herein. The computer cabinets include a plurality of computer modules positioned between an air inlet and an air outlet and an air mover configured to move a flow of cooling air from the air inlet, past the plurality of computer modules, and out the computer cabinet via the air outlet. The computer cabinets carry an airflow restrictor positioned proximate to the air outlet. The airflow restrictor is configured to restrict the flow of cooling air through a portion of the computer cabinet to achieve a desired temperature profile in the computer cabinet.

Abstract: A portable electronic device includes a screen module, a main body module and an input/output module. The screen module is pivotally connected with the body module. The input/output module is electrically connected with the main body module. An actuating element is disposed at a bottom of the screen module. When the screen module is opened respectively to the body module to be opened, the actuating element is driven to swing to push a front end of the input/output module to be lifted to drive the input/output module to be out of a state that the keyboard abuts against the main body module. Therefore, the portable electronic device is easy to be operated. Moreover, the heat dissipation is improved to keep the internal temperature low and reduce energy consumption.

Abstract: A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components.

Abstract: Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container, and a manifold structure associated with the container. The manifold structure includes a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port, and one or more jet orifices in fluid communication with the coolant jet plenum. The jet orifices are positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon when the electronic system is operatively positioned within the container for immersion-cooling thereof.

Abstract: A thermally managed power source (201) is provided herein which comprises a first battery module (203), and a first synthetic jet ejector (215) disposed on a surface of said first battery module and being adapted to direct a plurality of synthetic jets along a surface (211) of said first battery module.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A fan detecting apparatus for detecting at least two fans includes a processing unit, at least two airflow switches, and at least two indicating units. The processing unit includes a first terminal configured to output a driving signal, a second terminal configured to receive the driving signal, and a third terminal, the processing unit alarming when the second terminal does not receive the driving signal from the first terminal. The at least two airflow switches are serially coupled between the first and second terminals, monitor airflow from at least two fans in a computer room, and turn on or off according to strength of airflow from the at least two fans. The indicating units are respectively coupled between corresponding airflow switches and the third terminal of the processing unit, and indicate status of corresponding fans according to on or off status of the airflow switches.

Abstract: An all-in-one computer includes a front enclosure and a rear enclosure fixed together. The front enclosure includes a rear piece opposite to the front enclosure, and two side pieces extending forwards from left and right ends, respectively. The rear piece defines an air outlet including a number of first holes each having a width or diameter between 1 mm and 2 mm. Each side piece defines an air intake including a number of vertically spaced elongated second holes. The front enclosure and the rear enclosure cooperatively bound an airtight space except communicating with outside via the air intakes and the air outlet. Each second hole is slanted lengthwise down towards the front enclosure with a first slanting angle of not less than 15 degrees. A bottom wall of each second hole is slanted down outwards with a second slanting angle of not less than 30 degrees.

Abstract: A disk array device comprises: a hard disk drive module including a disk for recording information thereon and having one side that has a length substantially equal to the diameter of the disk; a battery nodule; an operation module; a fan module having at least one cooling fan; a controller module having a controller; a power supply module provided for supplying power to the modules; a circuit board to which the above-mentioned modules are connected via electrical connectors; and a substantially box-shaped chassis in which the modules and the circuit board are housed. A front surface and a rear surface of the chassis are opened in a rectangular shape. A length of one side of the opened front surface of the chassis is substantially the same length as the one side of the hard disk drive module.

Abstract: According to the present invention, the amount of usage of a heat conductive member for fixing a self-luminous flat display panel to a metallic chassis member disposed at the back of the display panel is reduced in the thickness direction as well as in the surface direction. The invention further provides a technique for efficiently radiating heat from the display panel, suppressing cost increase. To this end, in the invention, the heat conductive member is a hot-melt adhesive having adhesion at room temperature and filled with a heat conduction imparting agent, and the display panel is fixed to the chassis member by a plurality of heat conducting sections of the heat conductive member formed discretely ranging from 0.3 to 0.8 mm in thickness.

Abstract: A computer includes a casing; the computer further comprises a motherboard, a hard disk drive mounting structure and a hard disk drive accommodated in the casing. The motherboard is mounted on a fixing plate of the casing. The hard disk drive mounting structure is located above the motherboard, and includes a heat dissipation apparatus including a heat sink, a mounting frame, and a supporting bracket connected between the mounting frame and a base of the heat sink. A bottom end of the supporting bracket is fixed to the base of the heat sink. A top end of the supporting bracket is fixed to one end of the mounting frame to support the mounting frame, which has another end fixed to a side plate of the casing. The hard disk drive is mounted on the mounting frame.

Abstract: A circuit for controlling heat dissipation means for multiple units on a circuit board may comprise a first logical OR operation unit connected to said multiple units. The first logical OR operation unit is for performing a logical OR operation on a first set of signals output from the multiple units that represents whether any one of the multiple units has reached an overheated status. A resultant signal is output from the first logical OR operation to control an overheat protection unit connected to the first logical OR operation unit. A second logical OR operation unit is for performing a logical OR operation on a set of signals from the multiple units representing a relationship between the workload and the core temperature of a unit, whether a unit has reached an alert status and whether any of the multiple units has reached an overheated status.

Abstract: A cooling device includes a chassis that partitions a first space, a second space, and a third space sandwiched between the first space and the second space, a printed circuit board accommodated in the chassis that extends from the first space to the second space while traversing the third space, a fan occupying the third space outside a predetermined space that produces an air flow from the first space toward the second space by rotation of a rotor blade, wherein the predetermined space is ensured between the printed circuit board and the fan in the third space and an air duct member that occupies the predetermined space to form a flow passage of the air flow from an intake port to an exhaust port on the printed circuit board, wherein the intake port is opened to the second space and the exhaust port is opened to the first space.

Abstract: An electronic flight bag computer (EFB) includes a housing defining first and second compartments that are fluidly isolated from and in thermal communication with one another. The first compartment contains electronic components connected to a user interface on an exterior portion of the housing for providing interactive flight related computation functions to a user. The second compartment contains a forced convection cooling component in thermal communication with the electronic components. The forced convection cooling component directs a flow of cooling fluid into the second compartment to convey heat produced by the electronic components out of the housing, such that the cooling fluid in the second compartment remains fluidly isolated from the electronic components in the first compartment of the housing.

Abstract: A disk array apparatus including a rack-shaped basic frame, and a plurality of disk boxes that can be inserted into and pulled out of the basic frame depth-wise. Each disk box has: disk drive connectors for connecting a plurality of disk drives arranged in a matrix on a platter substrate, which is the bottom face of the disk box, roughly parallel to the depth direction of the basic frame; and a cooling module for cooling the disk drives. The disk box is a hermetically sealed structure.

Abstract: An expandable server housing having one or more server chassis stacked upon each other and one intake plenum and one exhaust plenum disposed on opposite sides of the stacked server chassis is disclosed. Each server chassis may have two or more fans predominately controlling airflow rate through a zone of the server chassis. Also, a method and system determining fan failure regardless of blockage of air path.

Abstract: Data processing modules including a housing and optical interfaces associated with the exterior of the housing, and systems including the same.

Abstract: In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost.

Abstract: A heat dissipating system includes a chassis, a motherboard mounted in the chassis, a number of connectors mounted on the motherboard in parallel to form a passage between every two adjacent connectors, and a heat dissipating element mounted to the chassis and aligned with the passages. Each of the connectors includes a socket and an inserting portion. The socket defines a slot. The inserting portion includes a main body and a protrusion extending from the main body towards the slot. A cross-section of the protrusion is trapezoidal-shaped. A side surface of the protrusion is inclined to form an airflow guiding structure.

Abstract: An industrial computer includes a first casing, a second casing, a storage unit, a cover, and a heat dissipation unit. The second casing and the first casing form a closed casing, and the outside of the second casing has a containing area. The storage unit is disposed at the containing area. The cover is removably assembled at the second casing to cover the containing area and contact the storage unit. The heat dissipation unit is disposed at the cover.

Abstract: An industrial computer includes a first casing, a second casing, a storage unit, and a heat dissipation unit. The second casing and the first casing form a closed casing, and outside of the second casing has a containing area. The storage unit is disposed in the closed casing, contacts the second casing, and corresponds to the containing area. The heat dissipation unit is disposed at the containing area.

Abstract: A fixing device for fixing a hard disk includes a fixing bracket and a wire clip for fastening the hard disk to the fixing bracket. The fixing bracket includes a supporting body to which the hard disk is attached and two fixing arms respectively at two opposite sides of the supporting body for sandwiching the hard disk therebetween. The clip includes two pressing parts engaging with the fixing bracket and the hard disk, resting on a top surface of the hard disk and urging the hard disk towards the supporting body, and a locking part extending downwardly from two ends of the two pressing parts and spanning over an end of the fixing bracket to reach a bottom surface of the supporting body and engage with the fixing bracket, thereby fastening the hard disk to the fixing bracket firmly.

Abstract: Airflow bypass dampers made from a resilient material and systems including the resilient dampers. The dampers are secured in a chassis and extend into a deployed position to obstruct airflow through a component bay of a chassis in the absence of a component, such as a sever blade, within the selected bay. The airflow bypass damper bends into a retracted position in response to installing a component into the bay. It returns to its original shape and position when the component is removed. An air moving device moves air through a component installed in the chassis. A plurality of the resilient airflow bypass dampers may be secured in a plurality of bays of a chassis, each resilient damper moving independently of the others. The resilient material bends without permanent deformation. For example, the resilient material may include, without limitation, natural polymers, synthetic polymers and metals. A preferred damper has a curved cross-sectional shape.

Abstract: A method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet.

Abstract: A housing for electronic equipment comprises a heat exchanger for exchanging heat between a liquid-containing medium and a gas. This heat exchanger comprises a medium inlet and a medium outlet and a flat heat exchanger mat. The mat comprises a number of parallel, equidistant capillaries of heat-conducting material and wires of heat-conducting material which are attached in heat-conducting contact to the capillaries, extend in transverse direction relative thereto and have a mutual distance in the order of magnitude of the diameter of the wires, wherein air can flow along the wires for heat exchange between this air and the medium flowing through the capillaries. The heat exchanger is embodied such that the air flows along the mat and at least a substantial part of the air is prevented from flowing through the mat, and that it is ensured that the air flows along the wires in longitudinal direction of these wires.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack. The apparatus includes a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and second perforated planar surfaces covering first and second main sides, respectively, of the air-to-liquid heat exchanger. The heat exchanger is supported by the support frame and includes inlet and outlet plenums disposed adjacent to the edge of the outlet door cover hingedly mounted to the rack. Each plenum is in fluid communication with a respective connect coupling, and the heat exchanger further includes multiple horizontally-oriented heat exchange tube sections each having serpentine cooling channel with an inlet and an outlet coupled to the inlet plenum and outlet plenum, respectively. Fins extend from the heat exchange tube sections.

Abstract: Thermal control through a channel structure is disclosed. In one embodiment, an apparatus includes devices operable at an undesired temperature relative to a desired operating temperature, a vented cover of each of devices, and a channel structure formed along a side face of each of the devices, the channel structure having any number of ridges to transfer a gas between the vented cover and an external location to the apparatus. The gas may modify an operating state of the devices from the undesired temperature to the desired operating temperature. A heat structure coupled to the vented cover and the side face may absorb a portion of an energy dissipated by at least one of the devices. A printed circuit board may be formed along an opposite face relative to the vented cover to enable the gas to escape to the external location through a cavity of the apparatus.

Abstract: The invention relates to an access flap for shielding an opening defined in a server chassis. that the access flap includes a rotating plate, a sliding plate, and a resilient member. The rotating plate is pivotably mounted to a side of the opening of the server chassis. The rotating plate defines a plurality of first air holes therein. The sliding plate is slidably attached to the rotating plate. The sliding plate defines a plurality of second air holes therein. The resilient member includes two ends connected to the rotating plate and the sliding plate. The rotating plate can rotate and the sliding plate can slide when a functional module passes through the opening to enter into the server chassis. Thereby, he second air holes of the sliding plate are aligning with the first air holes of the rotating plate.

Abstract: A portable computer that is ergonomic and solvent resistant is disclosed. The computer may have an exterior surface that is made from a soft polymer, so that it will shield a user from exposure to heat while providing a positive tactile feel and shielding the computer from impact. The computer may comprise a number of input output devices with distinct controls arranged about the body of the computer so that a user may comfortably operate each the devices with one hand. The housing of the computer may be sealed, so that it will be resistant to liquid and particulate infiltration, and may be easily wiped clean and disinfected.

Abstract: A cooling device with a thermoelectric conversion element having a heat absorbing surface and a heat releasing surface includes: a heat-absorbing-side heat conductive member connected with the heat absorbing surface in a heat-conductive manner; a heat-releasing-side heat conductive member connected with the heat releasing surface in a heat-conductive manner; a plurality of heat-absorbing-side fin members that is disposed to the heat-absorbing-side heat conductive member, protrudes in an out-of-plane direction from an end surface remote from the heat absorbing surface and extends in a predetermined direction; and a plurality of heat-releasing-side fin members that is disposed to the heat-releasing-side heat conductive member, protrudes in an out-of-plane direction from an end surface remote from the heat releasing surface and extends in a predetermined direction intersecting with the plurality of heat-absorbing-side fin members in plan view.

Abstract: An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.