Abstract: Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones.

Abstract: A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a bottom structure to achieve double-sided cooling. Meanwhile, the top structure is configured to shield EMI noises as well. The proposed structure further comprises a first set of connecting structures for connecting devices of the mini-modules with the top structure and a second set of connecting structure for connecting the top structure with the bottom structure. The connecting structures are capable of carrying current.

Abstract: A free standing film includes: i. a matrix layer having opposing surfaces, and ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average distance of at least 1 micrometer through one or both surfaces of the matrix layer. A method for preparing the free standing film includes (a) providing an array of nanorods on a substrate, optionally (b) infiltrating the array with a sacrificial layer, (c) infiltrating the array with a matrix layer, thereby producing an infiltrated array, optionally (d) removing the sacrificial layer without removing the matrix layer, when step (b) is present, and (e) removing the infiltrated array from the substrate to form the free standing film. The free standing film is useful as an optical filter, ACF, or TIM, depending on the type and density of nanorods selected.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink; and a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink. In the cooling device, a plurality of cooling fins is disposed to extend along the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side in the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction. Accordingly, it is possible to have improved cooling efficiency of a heat sink with cooling fins.

Abstract: An electronic device having a piezoelectric pump. The electronic device includes: an audio input section; an audio recording section recording input sound from the audio input section; a piezoelectric pump cooling air by a piezoelectric element; a drive circuit driving the piezoelectric element; and a control circuit monitoring and controlling operation of the audio input section, the audio recording section, and the drive circuit, wherein when an operation mode being monitored is an audio recording mode, in which the input sound is used for recording by the audio recording section, the control circuit controls the drive circuit to decrease the amount of air flow exhausted outside from the piezoelectric pump, and when the operation mode being monitored is another mode without audio recording, the control circuit maintains the amount of the air flow.

Abstract: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: In a memory device and its heat sink, the memory device includes a memory, a heat sink mounted onto the memory and a clamping element, and the heat sink includes an isothermal vapor chamber plate and a heat dissipating body, and the isothermal vapor chamber plate is attached onto an external side of the memory and includes an insert portion, and the heat dissipating body includes a base plate, a plurality of heat dissipating fins extended from the base plate, and a pawl arm extended from the base plate and in an opposite direction of the fins, and the heat dissipating body is coupled to the insert portion in a replaceable manner by the pawl arm, and the clamping element is provided for clamping the base plate and the isothermal vapor chamber plate, such that the heat dissipating body can be replaced on the isothermal vapor chamber plate easily.

Abstract: A server assembly includes a first server and a first airflow guiding pipe. The first server comprises a front wall. An input hole is defined in the front wall. A first input opening and a first output opening are defined in the first airflow duct. The first output opening corresponds to the input hole so as to guide airflow into the inner of the first server to dissipate heat generated by the first server. The first airflow guiding pipe is connected to the first input opening of the first airflow duct, the first airflow guiding pipe is configured to receive and guide airflow into the first airflow duct.

Abstract: In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.

Abstract: Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet.

Abstract: For dynamically cooling an input/output (I/O) controller, the presence of the I/O controller is automatically detected. The I/O controller includes an electronic component capable of generating heat that is greater than a predefined amount when the electronic component is operating in a predefined state. The I/O controller provides a control output in response to a demand indicative of operating the electronic component in the predefined state. The control output is provided to a baseboard management controller (BMC) that is capable of providing additional cooling to the I/O controller in response to the control signal.

Abstract: A thermal management system (101), comprising (a) a synthetic jet actuator (103), and (b) a processor (107) in communication with the synthetic jet actuator, the processor being adapted to receive programming instructions, and being further adapted to modify the operation of the synthetic jet actuator in response to the programming instructions.

Abstract: A hinge assembly having a hollow clutch is arranged to pivotally couple a portable computer base portion to a portable computer lid portion. The hinge assembly includes at least a hollow cylindrical portion that includes an annular outer region and a central bore region, the central bore region suitably arranged to provide support for electrical conductors between the base and lid portions. The hinge assembly also includes a plurality of fastening components that couple the hollow clutch to the base portion and the lid portion of the portable computer, with at least one of the fastening regions being integrally formed with the hollow cylindrical portion such that space, size and part count are minimized. The integrally formed fastening region(s) can be flat with holes dispersed therethrough for screws, bolts or the like. The central bore can also support a heat transfer element and can also serve as a lubricant reservoir.

Abstract: According to an embodiment of the present invention, there is provided a system for cooling. The system comprises an equipment rack installable in a facility and for accommodating a plurality of electronic equipment. The system further comprises an exhaust duct into which the electronic equipment, when installed in the rack, exhausts gas drawn from a first section of a facility. The system further comprises a gas flow meter for measuring gas flow in the exhaust duct, and a controller for generating control signals to control, based on the measured gas flow, the output of a cooling unit arranged to provide cooled gas to the first section of the facility.

Abstract: A method and system are provided for thermal management of a portable computing apparatus. Accelerometers are provided to detect changes in attitude, and temperature sensors are provided to detect changes in temperature. A fan is used to cool the internal temperature of the electronic components of the computer. In response to lift of the computer from a stationary surface, the computer may transition to an alternative state of operation. The transition may include the change of the speed of the fan and/or adjustment of the processor clock.

Abstract: The invention discloses an electronic apparatus comprising a motherboard, a connector, a card member and a first holder. The connector is disposed on the motherboard and the card member is disposed on the connector. The motherboard comprises a first fixing portion and the card member comprises a second fixing portion. The first holder comprises a third fixing portion fixed to the first fixing portion of the motherboard and a fourth fixing portion fixed to the second fixing portion of the card member. Accordingly, once the motherboard or the card member is hit or pulled by an external force, since two ends of the first holder respectively fix the card member and the motherboard, the card member will not be detached from the connector, such that the card member can be connected to the connector well.

Abstract: A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.

Abstract: A cooling plate for a notebook comprises a base, a deck, a support jig, and a mouse piece, wherein the base is axially connected with the deck and includes an air hole formed thereon, the air hole includes a fin and a fixing panel connected therewith, the base also includes a recessed opening adjacent to the air hole, the deck includes a chamber formed on a middle portion thereof and having a number of positioning tabs attached on two sides of the chamber individually, and includes two covers disposed on two sides thereof respectively, each cover includes a cut mounted on an inner side thereof and a plurality of engaging protrusions adjacent to an inner side of a bottom surface thereof, the support jig is pivotally disposed in the opening of the base, and the support jig includes two retaining foots arranged on two sides of the rear end thereof.

Abstract: An image display apparatus of the present invention includes: a display device for displaying an image; a heat-receiving tube that is disposed so as to be in thermal communication with the display device and is filled with a cooling liquid; a heat-radiating tube that is provided to be continuous with the heat-receiving tube and is filled with the cooling liquid; and a transporting pump allowing the cooling liquid to circulate through the heat-receiving tube and the heat-radiating tube. When viewed from a display surface side of the display device, at least a part of the heat-radiating tube is located outside a peripheral edge of the display device and is disposed along the peripheral edge.

Abstract: A housing, which may contain a hard disk drive, is configured to removably mount to a recessed surface of a console. The housing includes a lip and a biased latch arm so that the lip can be inserted into a corresponding feature in the recessed surface and the housing can be rotatably mounted to the recessed surface. The biased latch arm is retained by a latch arm retainer so that the housing is held in place. A cable connector extends from the bottom of the housing and is configured to connect to a receptor on the console when the housing is installed. When desired, a latch on the housing can be translated where the translation cause the biased latch arm to translate so as to clear the latch arm retainer. Thus the housing can be readily removed from the console. Preferably a portion of the housing extends beyond a wall of the recessed surface so that when installed, the housing alters the profile of the console.

Abstract: An electronics housing system (S) adapted for electronic devices (D) includes a main chassis unit (M) and at least one removable module (10) mountable with the base unit (M) for supporting electronic circuitry components electro-optically coupled with the base unit (M). The removable module assembly (10) has a main body (12) that includes two opposing mounting edges (14, 16) and a connection edge (18). At least one of the mounting edges (14, 16) of the removable mounting assembly (10) has an opening (20) to receive a cooling air flow (F) into an interior cavity (22) of the main body (12) of the removable module (10). The main chassis (M) has a pair of opposing module mounting assemblies (24, 26) to receive a removable module (10) between the opposing module mounting assemblies (24, 26). The electronics rack wall (24, 26) includes a removable seal plate (32) to provide an air seal.

Abstract: A tray-type structure device includes a side plate, a front plate attached to a forward end of the side plate, having the functions of opening and closing, and positioned on the front side of a housing, a top plate attached to an upper end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, a bottom plate attached to a lower end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, and a back plate attached to a rearward end of the side plate, having the functions of opening and closing, and positioned on a side of the housing toward a backboard. The device has a tray structure having a tray-like shape formed by the front plate, top plate, bottom plate, side plate and back plate.

Abstract: A system having: a midplane having air flow channels therein; a disk drive mounted to a first side of the midplane; and a temperature sensors mounted to the midplane. The system includes a pair of electrical chassis connected to a second side of the midplane. A first one of the chassis has therein: a fan; and a fan controller for controlling speed of the fan in response to a temperature control signal. A second one of the chassis has therein: a microprocessor for: detecting temperature signals produced by the temperature sensors; comparing differences between the detected temperature signals; and selecting one of the detected temperature control signal from the compared differences as the temperature control signal. A faulty one of the temperature sensors is detected by: selecting one of the detected temperature control signal as the faulty one of the plurality of temperature sensors from the compared differences.

Abstract: Air flow ducts for improving the air flow within data processing units are described herein. In some embodiments, a duct includes an inlet portion and an outlet portion. An interior surface of the outlet portion of the duct defines, at least in part, a portion of a flow path. The duct is configured to be coupled to a printed circuit board within a data processing unit such that a first portion of a cooling fluid can flow within the flow path between the inlet portion of the duct and an electronic device coupled to the printed circuit board. An exterior surface of the outlet portion of the duct is configured to redirect a second portion of the cooling fluid to a volume within the data processing unit apart from the electronic device.

Abstract: A cooling system including several air jet elements, a heat exchange assembly and a frame is provided. The cooling system is applied to a rack server configured to receive a plurality of electronic assemblies. The air jet elements receive a high-pressure air and convert the high-pressure air into a low-temperature air. The heat exchange assembly is disposed in the frame and is connected to the air jet elements so as to perform a heat exchange between the low-temperature air and a high-temperature air generated by the rack server so as to lower the temperature of the high-temperature air. The frame is applied to accommodate the heat exchange assembly.

Abstract: An acoustically absorptive apparatus is provided which includes an acoustically absorptive panel and an attachment mechanism. The acoustically absorptive panel is configured to reside along a side of an electronics rack, and includes a multilayer structure to attenuate noise. The attachment mechanism slidably mounts the acoustically absorptive panel to the electronics rack and facilitates sliding of the panel relative to the rack between retracted and extended positions. In the refracted position, the panel is disposed along the side of the rack, and in the extended position, the panel extends beyond a front or back edge of the electronics rack to facilitate attenuating noise emanating from the rack or an aisle alongside a row of multiple racks. In addition, the acoustically absorptive panel hingedly couples along a vertical edge to the attachment mechanism such that the panel is also rotatable outward away from the side of the electronics rack.

Abstract: Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid.

Abstract: Power electronic devices of an electronic control module are mounted in a power module disposed between the control module circuit board and an interior face of the control module case, with a prescribed separation distance between the circuit board and a housing of the power module. The power electronic devices are mounted on an inboard face of a power module substrate, and a heatsink thermally coupled to the opposite face of the substrate is fastened to an interior surface of the control module case. The substrate and heatsink are mounted in the power module housing, and the power electronic devices are electrically coupled to the circuit board by a set of compliant terminals that protrude from the inboard face of the power module housing. The terminals extend into plated holes in the circuit board, and have shoulders that limit their depth of insertion to establish the prescribed separation distance between the circuit board and the power module housing.

Abstract: It is an object of the present invention to provide a key sheet and the like which can suppress local elevation of temperature, and effectively diffuse heat loss from electronic circuits. The key sheet includes: a viscoelastic sheet 16b having a viscoelastic property, and having a first surface and a second surface; a button section 16a located on the side of the first surface of the viscoelastic sheet 16b; a thermally-conductive sheet 14 located along the first surface or the second surface of the viscoelastic sheet 16b, the thermally-conductive sheet 14 having a thermal conductivity equal to a specific value; and a contact section 16d projected from the second surface of the viscoelastic sheet 16b, the contact section occupies a position corresponding to the button section 16a.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A cooling system cools an electrically rechargeable portable device accommodated in a docking station. The cooling system includes a docking station having a non-forced air active cooling unit and a housing. The cooling unit maintains a first heatsink surface at a temperature below an ambient temperature and a second heatsink surface at a temperature exceeding said first heatsink surface temperature. The housing accommodates an electrically re-chargeable portable device. The housing re-charges said portable device and seats said portable device in a position providing thermal contact between said docking station first heatsink surface and a heat spreader of said portable device while re-charging of said portable device.

Abstract: A computer system that has an outer shape that is round in outer cross-section. The computer housing can be formed of first and second housing parts that are each round in outer cross-section where one unscrews relative to another like taking the lid off a jar. The inside of the housing can store various kinds of nonvolatile memory and a processor. The user's entire processing environment may be stored within the memory and processor, and part of that environment may include stylesheet that represents specific styles of the user.

Abstract: A server structure with a replaceable heat-dissipating module comprises at least one heat-dissipating module receiving slot and at least one heat-dissipating module. The heat-dissipating module receiving slot is provided in a case and has two lateral walls each provided with a sliding groove. The heat-dissipating module further comprises a heat-dissipating element and two side boards. The two side boards are located at two sides of the heat-dissipating element for engaging with the sliding grooves, respectively, so that the heat-dissipating module receiving slot replaceably receives the heat-dissipating module therein.

Abstract: A flow tube apparatus may include a flow tube having a first opening and a second opening, a corona electrode provided in the flow tube, a collecting electrode provided in the flow tube, and at least one focusing electrode provided in the flow tube to guide ions and thereby provide an ionic wind. In at least one embodiment, the flow tube apparatus may be provided in an electronic apparatus to provide an air flow.

Abstract: A portable computer having a partially sealed cooling system is disclosed. The portable computer contains heat transfer materials that function to remove heat from a sealed area of the portable computer to an unsealed area where the heat may be more effectively dissipated. A portable computer having a power source shield is also disclosed. The shield may be formed to partially surround a portion of the power source, and may be formed by partially enclosing a power source in a conductive material; forming an opening in the conductive material on one side of the power source; installing the power source near an edge of the electronic device; and orienting the power source so that the opening faces the edge of the electronic device.

Abstract: A multi-specification fixing module used at a motherboard and a cooler. The multi-specification fixing module includes a plurality of the fixing sheet and a specification adjusting base plate. Each of the fixing sheets has a fixing hole. The specification adjusting base plate includes a plurality of adjusting portions at a periphery of the specification adjusting base plate. Each of the adjusting portions has an adjusting guiding rail group and an adjusting portion hole. The positions of the fixing sheets are adjusted according to the size of the cooler body to install the fixing sheets in the adjusting guiding rail groups, and the installing fixing accessories are connectedly fixed at the motherboard holes via the fixing holes and the adjusting portion holes to fix and install the cooler body above the socket.

Abstract: A bracket, computer component and method for connecting to connection points associated with a socket on a computer circuit board are provided. The bracket and computer component have a mounting device including a fastener connectable to one of the connection points and positioned on a mounting flange. The mounting device is adjustable relative to the mounting flange from a first position on the mounting flange to a second position to allow the bracket and computer component to be used in conjunction with a number of different types of sockets.

Abstract: A computer system includes a chassis and an airflow blocking plate. The chassis comprising a first chassis sidewall, a second chassis sidewall, and a drive bracket which is used to mount a disk drive. The drive bracket is secured in the chassis and abuts the first chassis sidewall, and the first chassis sidewall defines a first ventilation hole. The air flows into the chassis via the first ventilation hole. The airflow blocking plate secured in the chassis and located between the first chassis sidewall and the second chassis sidewall. The airflow blocking plate prevents the air from flowing back to the drive bracket.

Abstract: An information processing apparatus having improved cooling efficiency is disclosed. The information processing apparatus includes a first chassis and a second chassis separated from each other at a prescribed distance, the first chassis accommodating a substrate on which high heat generating parts such as a CPU and a chipset are mounted, and the second chassis accommodating low heat generating and low heat resistance parts. Because of this structure, the first chassis and the second chassis are thermally isolated, and the surface area of the apparatus is increased, thereby improving the cooling efficiency of the apparatus.

Abstract: An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described.

Abstract: A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed along the plurality of memory circuits. Finally, the system may include a heat pipe, a vapor chamber, or a combination thereof, extending along the heat spreader. In another embodiment, a system may include a heat spreader configured to mount to an in-line memory module, and an evaporative cooling system at least substantially contained within dimensions of the heat spreader.

Abstract: To avoid the need to operate in-chassis fans to cool rack-mounted servers in a data center, the data center is arranged into a hot aisle and a cold aisle. The cold aisle is adjacent to a first side of the rack mounted servers and receives cold air from a cold air supply unit. The hot aisle is adjacent to a second side of the rack-mounted servers and has a lower pressure than the cold aisle. Because of the pressure difference between the cold aisle and the hot aisle, cold air flows through the rack-mounted servers, cooling electronic equipment therein, into the hot aisle. Control systems are used to obtain sufficient cooling.

Abstract: A server blade chassis having at least one mechanically actuated variable air flow damper is presented. One or more variable air flow dampers are aligned with server blades in the server blade chassis. When a server blade is pressed into a slot in the server blade chassis, one or more of the variable air flow dampers are mechanically opened, to variable degrees of movement, by the server blade pressing against the variable air flow dampers.

Abstract: According to one embodiment, an information processing apparatus includes a cooling module configured to cool an electronic component, a thermoelectric element configured to absorb heat generated from the electronic component, and to generate first electricity by performing a thermoelectric conversion by use of the heat, a determination module configured to determine whether the supply source is a battery, and a switcher configured to switch between a first mode and a second mode, the thermoelectric element performing the thermoelectric conversion and the cooling module is driven by the first driving electricity generated from the first electricity in the first mode, and the thermoelectric element absorbing the heat and the cooling module is driven by the second driving electricity generated by use of second electricity from a supply source includes a battery in the second mode.

Abstract: Disclosed is both a method and apparatus for delivering cooling air to an electronics rack in a data room in an energy efficient manner. The present apparatus provides directionally delivered cooling air to an electronics rack with usage rates up to 90%. The tiles utilize angled directional vanes for delivering the cooling air. The tiles both conserve energy and increase the overall possible power usage for each cabinet. The tiles greatly increase the cooling efficiencies in the data room and conserve energy.

Abstract: In at least some embodiments, an apparatus includes a pressurized air source and a tube coupled to the pressurized air source. The apparatus also includes an electronic component that is spot-cooled by moving air between the pressurized air source and the electronic component via the tube.

Abstract: A computer chassis comprises a plurality of chambers. Each of the chambers comprises a hardware group, an aft inlet exposed to air external to the chassis and dedicated to the chamber, and an air outlet exposed to air external to the chassis and dedicated to the chamber. Airflow between the air net and the air outlet cools the hardware group.

Abstract: An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.

Abstract: This cooling device (28) of a computer rack (12) equipped with a back panel (16) comprising an evacuation zone (18), toward the exterior of the rack, of air having circulated over electric power components (201, . . . , 20i, . . . , 20n) arranged within this computer rack (12), comprises a rear door (32) in the thickness of which air cooling means (38, 40) is arranged. It further comprises a supporting frame (30) on which the rear door (32) is mounted, molded to surround the air evacuation zone (18) of the computer rack (12), and removable positioning means (36) of the supporting frame (30) against the back panel (16) of the computer rack (12).