Abstract: An electronic device includes: a first housing that includes an inlet and an outlet on one end; a second housing; and a linkage section that links the second housing to the first housing such that the second housing can be opened and closed. The device is configured such that the second housing divides at least a part of a space between the inlet and the outlet while the second housing is in the open position relative to the first housing. While the second housing is opened relative to the first housing, the second housing divides the space between the inlet and the outlet, thereby preventing the exhausted warm air from being drawn into the electronic device.

Abstract: A server cabinet includes a rack and an air baffle plate. The rack defines an interior space configured for accommodating a plurality of servers therein. The rack includes a top wall, an opposite bottom wall and two sidewalls respectively connected between left sides of the top and the bottom walls and right sides of the top and the bottom walls. The servers are arranged along a bottom-to-top direction. Each of the servers is fixed between the two sidewalls. A space is defined between a topmost server and the top wall. The air baffle plate is positioned in the space for blocking an airflow on a rear side of the servers from flowing back to a front side of the servers via the space.

Abstract: In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost.

Abstract: A computing device and method have a thermal module (60, 161, 460) in a bay (54, 354) for a component so as to occupy space otherwise occupied by the component.

Abstract: A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.

Abstract: A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate adjacent to the top plate is different from a total area of the through holes in a lower half portion of the front side plate adjacent to the bottom plate.

Abstract: A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.

Abstract: A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portion of a motor vehicle transmission having electrical and electronic components such as valves, solenoids, motors and sensors. Spaced from the inside surface of the cover where it is subjected on both sides to flow of transmission fluid is a plate or heat sink. An electronic controller is disposed on the outside of the cover and attached by heat transferring mechanical fasteners such as studs or bolts to the plate inside the cover. Preferably, the housing of the controller also includes a heat sink.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.

Abstract: One embodiment provides a method of controlling memory in a computer system. Airflow is generated through an enclosure at a variable airflow rate to cool a plurality of memory banks at different locations within the enclosure. The airflow rate is controlled as a function of the temperature of one or more of the memory banks. Memory workload is selectively allocated to the memory banks according to expected differences in airflow, such as differences in airflow temperature, at each of the different locations.

Abstract: An apparatus and article is disclosed for separating intake air from exhaust air. The apparatus discloses an intake port, coupled to conduct intake air; an exhaust port, coupled to conduct exhaust air; and an air-curtain port, coupled to conduct air-curtain air to separate at least a portion of the intake air conducted by the intake port from the exhaust air conducted by the exhaust port. The article discloses a ductwork shell article, having an intake vent, an intake chamber, an exhaust vent, an exhaust chamber, an air-curtain vent, and an air-curtain chamber; wherein: the air-curtain vent is in part located between the exhaust vent and the intake vent.

Abstract: Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components.

Abstract: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.

Abstract: An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets. This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment.

Abstract: A method for providing control signals to a fan in a computer system is described. During the method, an electronic device receives temperature measurements and a fan-speed measurement performed in the computer system. Using a pattern-recognition model, the electronic device validates the measurements, and excludes any inaccurate measurements, such as those associated with drifting or failed sensors. Next, the electronic device determines control signals for a fan in the computer system using a model of coolant flow in the computer system and/or a slope of a phase-frequency curve of a cross power spectral density function corresponding to a pair of temperature profiles measured, as a function of time, by a pair of thermal sensors. Then, the determined control signals are provided to the fan.

Abstract: To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board.

Abstract: The invention relates to a method for controlling an air conditioning system for a data processing facility that comprises at least one row of server switch cabinets, wherein the row of server switch cabinets bounds a cold aisle that is sealed off from a hot aisle facing away from the cold aisle side, wherein hot air is drawn in, cooled, and blown into the cold aisle by at least one air conditioner, and wherein cold air is drawn out of the cold aisle and fed into the hot aisle or into the surrounding space by at least one of the server switch cabinets. The invention further relates to a corresponding device for performing the method. According to the invention, the control of the air supply rate of the air conditioner is performed by means of a pressure controller, wherein a measured pressure difference between a pressure sensor in the cold aisle or in the hot aisle and a pressure sensor in the surrounding space outside the cold aisle or the hot aisle is used as an input variable of the pressure controller.

Abstract: A disaster resistant server enclosure is provided. A fire resistant outer enclosure is provided, and may be made of gypsum. A water resistant, thermally conductive container is mounted within the outer enclosure. A server is mounted within the water resistant container. A cold thermal storage device, such as a block of ice, is also mounted within an insulating cover inside said outer enclosure. When a fire is sensed outside the outer enclosure, an actuator thermally connects the cold thermal storage device to the water resistant container to cool the server during the fire.

Abstract: The present invention is a robust LED display module for use in an electronic sign which display module includes a metallic housing, a heat conductive interface panel, an LED circuit board and LEDs, and a metallic mask arranged in intimate contact and association therewith, and which components operate synergistically in concert with each other in order to evenly distribute, reduce and dissipate heat along, about and within the structure of the present invention. Display uniformity is provided by the use of major metallic structures in order to prevent warpage and to protect the geometric integrity of the LED display module.

Abstract: A cooling fan housing assembly for assembling to a heat sink includes a boosting portion and a connecting portion extended from the boosting portion. The connecting portion includes a first part and a second part for covering on and fixing to the heat sink. The second part of the connecting portion is provided with at least one hooking section for firmly hooking to the heat sink, so that a cooling fan supported on the cooling fan housing assembly can be quickly assembled to the heat sink without the risk of producing vibration during the operation of the cooling fan. Therefore, the cooling fan housing assembly not only reduces assembling labor and time and manufacturing cost, but also enables stable operation of the cooling fan.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: An electronic module includes an enclosure having a front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.

Abstract: A portable computer includes a shell, a printed circuit board in the shell, a heat generating element, a heat conducting sheet, a primary heat dissipation unit, a subsidiary heat dissipation unit, and a heat-transfer unit. The heat generating element is electronically connected on the printed circuit board. The heat conducting sheet is positioned on the heat generating element. The heat-transfer unit includes a heat-transfer member and a drive unit. The heat-transfer member connects to the heat conducting sheet. The drive unit moves the heat-transfer member to connect with the primary heat dissipation unit or the subsidiary heat dissipation unit.

Abstract: A computer system includes a chassis, one or more hard disk drives coupled to the chassis, and one or more air passages under at least one of the hard disk drives. The air passages include one or more air inlets and one or more air outlets. The inlets direct at least a portion of the air downwardly into the passages. The passages allow air to move from the air inlets to the air outlets.

Abstract: One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.

Abstract: A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.

Abstract: An exemplary server system includes a server cabinet, two rows of racks arranged in the server cabinet, a number of servers mounted in the racks and a heat dissipating device. The server cabinet includes two side plates parallel to each other. The servers of each row are evenly distributed between the side plates. A channel is defined between the two rows of racks. The heat dissipating device includes an air conditioner arranged over the racks for generating cooling air and an air guiding mechanism. The air conditioner defines a number of apertures facing the passage. The guiding mechanism includes a number of tubes received in the passage and respectively coupled to the apertures of the air conditioner. Each of the tubes defines a number of air outlets for exhausting the cooling air towards the servers.

Abstract: Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

Abstract: The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally distributed across the opposing surfaces of the devices and associated components. The semiconductor devices and components are located between opposing jaws that are joined together by at least two tie rods, which compressively load the opposing jaws to apply the desired compression force to the semiconductor devices and components. The desired compression force is first achieved in even distribution between independent clamp pressure set point assemblies and the first jaw, where each of the independent clamp pressure set point assemblies is associated with one of the tie rods.

Abstract: A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N1?1 of first positioning elements and the heat sink a number N2?1 of second positioning elements. Each of the first positioning elements corresponds to one of the second positioning elements and forms a pair therewith. The power semiconductor module and the heat sink are alignable relative to one another so that the two positioning elements of each of the pairs are interfitted when the power semiconductor module is mounted on the heat sink.

Abstract: The invention relates to a cooling body of at least one electrical component. According to the invention, a first cooling body section is designed as a spring and a contact surface is provided on the first cooling body section, between the cooling body and the at least one component.

Abstract: An air duct installed in a chassis is configured to have a heat dissipating device mounted thereon during shipping. The heat dissipating device defining a number of mounting holes corresponding to a number of fixing members extending from a surface of the air duct to accomplish the mounting. Thereby, the heat dissipating device may be conveniently and securely packaged and transported with the air duct and chassis.

Abstract: The present invention includes several hard disk drive (HDD) enclosures that use pre-stressed polymer compression members to provide integral vibration shock and acoustic noise dampening and isolation. The vibration dampening system has springs of polymeric material located between outer surfaces and existing HDD FRU mounting walls. The suspension system secures the hard drive in a slot in the structure within the polymer springs, isolating the hard drive from the side panels and dampening the vibration internal and external. The minimal structure allows for significant air flow to provide the cooling Beams are designed to consider temperature effects, creep and long term fatigue of the plastics. Multiple beams will be recruited to support the drives and each other to ensure that no individual beam sustains a substantial portion of the load.

Abstract: A system for providing computing capacity includes a base module and two or more fin modules coupled to the base module. At least one of the fin modules includes one or more fins and two or more computer systems coupled to the fins. The fins form an enclosure for the computer systems to protect the at least one computer system from environmental conditions. The system can operate in an outdoor environment.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: Disclosed is an embodiment of a rack system including a universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane area on a second side of the rack system opposite to the first side, a power bus, a plurality of partitions, a plurality of module bays, and two or more service unit backplanes. The power bus may be configured to provide power to the modules coupled to the universal backplane area.

Abstract: A storage module for computer systems includes a housing defining an opening, a power supply unit and an air cooling unit, a storage unit detachably received in the housing through the opening, a bracket for mounting the storage unit, and a magnetic member. The bracket includes a tray plate defining a plurality of heat dissipation holes, a first side plate, an opposite second side plate, a stop plate including a first end detachably coupled to the second side plate and a second end pivotally connected to the first side plate, and a resilient member resiliently biasing the stop plate away from the first side plate. The storage unit is moveably and insertably positioned between the first and the second side plates. The magnetic member is positioned in one of the second side plate and the stop plate such that the second side plate and the stop plate are magnetically attracted.

Abstract: A notebook computer housing structure is described. The notebook computer housing structure includes a body, which is made of one of plastic, aluminum, and an aluminum magnesium alloy. A circuit board installed with electronic elements such as a CPU and an interface card is placed inside the body. The improvement lies in that a plurality of holes is disposed on the body to form a convection effect inside the body after cold air enters the body through the holes.

Abstract: A data center includes a rack mounted with two first slide rails, a server module arranged in the rack. Two second slide rails are mounted on the top and bottom sidewalls of the server module, to mate with the first slide rails, thereby slidably attaching the server module to the rack.

Abstract: A cooling system comprising a plurality of coolant channels comprising a fluid-impervious surface comprising a base surface, at least one distinct region of the base surface covered by a mixed monolayer, the mixed monolayer comprising a species having a functional group M1 and a species having a functional group M2 where M1 and M2 have different surface energies, the mixed monolayer forming a surface energy gradient within the region and wherein any portions of the surface that border the at least one distinct region have substantially equal surface energies.

Abstract: A stand for a portable device includes two supporting members with two supporting surfaces for loading the portable device, and a heat dissipation device detachably attached between the two supporting members. The heat dissipation device comprises at least one fan and defines a plurality of holes.

Abstract: A liquid submersion-cooled computer that is configured to reduce physical structures passing through walls of the computer liquid-tight computer case, which eliminates the amount of sealing needed around those physical structures and reduces the number of possible fluid leakage paths from the interior of the computer that contains a cooling liquid submerging at least some of the computer components. The computer includes a mechanism to pass input/output signals into and from the computer without any physical structure extending through any of the plurality of walls. The computer also has a mechanism for wirelessly transferring power into the interior space of the computer case, and a switch that controls power in the computer without having any physical structure extending through any of the plurality of walls.

Abstract: A cellular cooling part includes a number at least one movable part, that can be the removable flap or movable cover for a fan. The fan, for example, can be moved or opened to expose it. A flap can also be opened. In addition, different covering structures can be used.

Abstract: A flat display apparatus includes a display unit; a housing configured to accommodate the display unit; a support member configured to support the housing; and a cooling device configured to radiate heat of a heating element which is mounted in the housing, wherein the cooling device includes a first far infrared ray transfer member which is thermally connected to the heating element in the housing and a second far infrared ray transfer member which is thermally connected to an external portion of the housing at a rear surface side, wherein a radiating surface of the first far infrared ray transfer member and an absorbing surface of the second far infrared ray transfer member are disposed to oppose each other with the housing interposed therebetween, and wherein heat radiated from the first far infrared ray transfer member is radiated at both plane surface of the second far infrared ray transfer member.

Abstract: A storage device suitable to be installed on a rack includes a case, a plurality of storage units, a power module, a management module and an adapting board, wherein the case includes a bottom board, a first side wall, a second side wall and a partition board. The partition board is located over the bottom board to divide the case into an upper and a lower accommodation spaces. The storage units are disposed in the upper accommodation space and the power module is disposed in the lower accommodation space. The power module includes a power backboard and power suppliers plugged at the power backboard. The management module disposed in the lower accommodation space has an expanding interface. The adapting board is disposed in the lower accommodation space and electrically connected to the power backboard, the management module and the storage units.

Abstract: An electrical installation has a container which encloses high-voltage components. The electrical installation can be fitted inexpensively and quickly, and at the same time provide sufficient cooling of the high-voltage components. A control room with control elements and/or display elements of the electrical installation and a cool room with a cooling device for at least one of the high-voltage components are disposed in the interior of the container.

Abstract: An exemplary computer server system includes a cabinet and a server mounted in the cabinet. The servers includes a casing, an electronic component mounted in the casing, a heat dissipation device for dissipating heat generated by the electronic component, and a fan module. The heat dissipation device includes a heat absorption portion and a heat dissipation portion. The heat absorption portion is arranged in the enclosure to absorb the heat generated by the electronic component. The heat dissipation portion is arranged between the enclosure and the fan module to dissipate the heat transferred to an outside of the enclosure.

Abstract: Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one aperture (48, 50) aligned with the component (30,32) or a respective one of the components, and the electronic circuitry is configured to provide, in use, a path for coolant fluid to flow through the or each aperture (48, 50) and past the at least one component (30,32).

Abstract: A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet and a fluid discharge, can be disposed proximate the second aperture. Fluid from the chamber can provide an inflow to the fluid inlet and an outflow from the fluid discharge can be directed to the exterior of the electronic enclosure.