Abstract: A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, and top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the top and bottom surfaces and being disposed on opposite sides of the circuit board from each other.

Abstract: A combined power and cooling apparatus is provided facilitating powering and cooling one or more electronics racks, which are distinct from the power and cooling apparatus. The power and cooling apparatus includes a frame, one or more bulk power assemblies associated with the frame, and one or more heat exchange assemblies associated with the frame. The one or more bulk power assemblies are configured to provide power to the one or more electronics racks, and the one or more heat exchange assemblies are configured to cool system coolant provided to the one or more electronics racks. Heat is transferred by the one or more heat exchange assemblies from the system coolant to a facility coolant. In operation, the power and cooling apparatus is coupled to provide both power and cooling to the one or more electronics racks.

Abstract: A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.

Abstract: A power converter including a switching element, a switching power module containing a driving circuit for driving the switching element, a smoothing capacitor module for smoothing an input to the switching power module, and a heat sink for cooling the switching power module, wherein the switching power module is mounted on the heat sink, and the smoothing capacitor module is provided on a side surface of the heat sink.

Abstract: The present invention relates to a cooling system. More particularly, the present invention relates to a cooling system for removing dust from air being drawn for cooling heat generation components of an electronic product, for improving convenience in maintenance or repair of the electronic product.

Abstract: An exemplary electronic device includes a cover, a motherboard and a driving module both disposed at an inner side of the cover, an electronic component fixed on the motherboard, and a fan duct mounted on the motherboard and covering the electronic component. The driving module has a rotating shaft for supportively driving an optical disk rotating. The fan duct guides hot air therein toward the driving module.

Abstract: An exhaust device applied to an electronic device is described. Memory deformable elements of the exhaust device are heated to shrink, and meanwhile, guide vanes located on an air outlet are driven to rotate and swing back and forth between a left outlet position and a right outlet position, such that the exhaust device reciprocatively changes an outlet position without requiring any external power.

Abstract: According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board.

Abstract: A system and method for cooling the underside surface of a portable computer device having a casing and at least one connector for releasable engagement with a portable computer device. The casing has an upper surface, a lower surface and space therebetween whereby so that the lower surface of the portable computer device is adjacent to the upper surface of the system casing. The system may also include a fan.

Abstract: A method of cooling a data centre having at least one hot aisle (145) and at least one cold aisle (144), including the steps of producing cooling air having controlled to have temperature and relative humidity within certain pre-defined limits; supplying the cooling air to a plurality of items of IT equipment (143) located in the data centre between the cold aisle and the hot aisle; measuring the velocity of air flowing from the hot aisle to the cold aisle through an opening (150) between the hot aisle and the cold aisle; and controlling the rate of supply of cooling air to the items of IT equipment in dependence on the velocity of air so measured.

Abstract: A server rack system including a rack is provided. The rack has a front end, a rear end, and a receiving portion. The bottom of the front end has an air inlet. The rear end has an air outlet. The receiving portion is disposed in the rack and is located between the front end and the rear end, so as to receive a plurality of server units. An air flow flows into the rack from the air inlet, vertically upward parallel to the front end, horizontally through the server units, and out the rear end in sequence.

Abstract: A computer includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a base board defining a motherboard, a plurality of drive devices, a heat sink device and a fan thereon. The heat sink device includes a heat sink having a plurality of fins and a heat pipe. The base board is divided into a first part and a second part. The motherboard is located in the first part, and the drive devices are located in the second part. The fan is located between the first and second parts. The heat pipe transmits heat from a heat source on the motherboard to the plurality of fins. The fan blows air to the plurality of fins to cool the heat source on the motherboard.

Abstract: A presence detectable baffle for electrical components in a computing system, including: a passive chassis having a form factor is consistent with an electrical component of the computing system; and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component.

Abstract: A power electronics module includes a frame, a jet impingement cooler assembly, and a power electronics assembly. The frame includes a first surface, a second surface, a power electronics cavity within the first surface of the frame, a fluid inlet reservoir, and a fluid outlet reservoir. The fluid inlet and outlet reservoirs extend between the first surface of the frame and the second surface of the frame. The fluid inlet reservoir and the fluid outlet reservoir are configured to be fluidly coupled to one or more additional modular power electronics devices. The jet impingement assembly is sealed within the frame and fluidly coupled to the fluid inlet reservoir and the fluid outlet reservoir. The power electronics assembly includes at least one power electronics component, is positioned within the power electronics cavity, and is thermally coupled to the jet impingement cooler assembly. Power electronic module assemblies are also disclosed.

Abstract: In order to increase the flexibility of the positioning of a stacked computer system within a data center, a removable fan unit is positioned within the computer system. The removable fan unit includes a fan housing that supports a fan electrically connected to a connector extending from a side of the fan housing. The connector of the removable fan unit may be electrically connected to a computer system-side connector in a first orientation to move air through the computer system in a first direction. The connector or another connector of the removable fan unit may be electrically connected to another or the same computer system-side connector in a second orientation to move air through the computer system in a second direction.

Abstract: A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.

Abstract: A portable electronic device comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing. The heat-conduction structure is disposed in the housing and contacts the circuit board. The heat-dissipation structure is disposed outside the housing and connected to the heat-conduction structure, wherein heat is transmitted from the circuit board, passing the heat-conduction structure and the heat-dissipation structure to be dissipated out of the housing.

Abstract: Gimbal system, including apparatus and methods, with forced flow of external air through a channel to remove heat. The system may comprise a support portion including at least one electronic component and defining a channel, a gimbal assembly pivotably connected to and supported by the support portion, and a payload pivotably orientable with respect to the support portion by the gimbal assembly. The support portion alone or collectively with the gimbal assembly may define a chamber in which the electronic component is disposed. The support portion may include a forced-air device configured to drive flow of external air through the channel, thereby removing heat transferred to the channel from the electronic component.

Abstract: An electronic apparatus includes the following: a heat dissipation chamber that is formed by liquid tightly separating the inside of a main unit case with a partition, has an inlet air vent and an outlet air vent in the partition, and includes a heat dissipation portion; a cooling fan that is located in the heat dissipation chamber; an inlet that is provided in the main unit case to introduce outside air into the heat dissipation chamber through the inlet air vent; and an outlet that is provided in the main unit case to exhaust an air flow sent from the cooling fan to the outside through the outlet air vent. An air channel that extends from the inlet air vent through a side wall of the main unit case to communicate the heat dissipation chamber with the inlet is liquid tightly sealed from the internal space of the main unit case with a sealing wall.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: Systems and methods for increasing the power efficiency of cooling fans are disclosed. A method for providing power-efficient operation of a plurality of cooling fans may include testing a plurality of cooling fans over an operating range of delivered airflow to determine, in each of one or more regions of the operating range, a number of cooling fans to be enabled to provide the lowest power amount required to deliver the delivered airflow for such region.

Abstract: An electronic device includes a main body and a rotating base. The rotating base has a first vent and is pivoted at the main body and adapted to rotate between an operating position and a retracted position relatively to the main body. When the rotating base is located at the operating position, the first vent is exposed out of the main body, and when the rotating base is located at the retracted position, the first vent is retracted into the main body.

Abstract: Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.

Abstract: A power switch and connector that are conventionally included in a body are formed in spaces created at the outer ends of the shafts of hinges other than the body and a display, whereby the body is thinned. Electronic device comprises a body, a display, and a hinge that joins the body and display so that they can be freely opened or closed. A power switch is formed at an end of the shaft of the hinge. Furthermore, the electronic device comprises the body, the display, and another hinge that joins the body and display so that they can be freely opened or closed. A port of a connector opens at an end of the shaft of the hinge.

Abstract: An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: A motherboard includes a fan and a fan control circuit. The fan control circuit includes a switch module and a voltage control circuit. A first terminal of the switch module is connected to a standby power terminal of the motherboard. A second terminal of the switch module is connected to a first power terminal of the motherboard and connected to a power terminal of the fan. An input terminal of the voltage control circuit is connected to a power state signal terminal of the motherboard. An output terminal of the voltage control circuit is connected to a control terminal of the switch module. When the motherboard is turned off, the voltage control circuit turns on the switch module for a predetermined time, to make the standby power terminal supply a working voltage for the fan to keep the fan rotating for the predetermined time.

Abstract: An energy efficient data center incorporating superconducting power transmission cables coupled with cryogenically cooled semiconductor inverters and converters, used to supply power to cryogenically operated or room-temperature computers and servers. Other options and features include a lighting system whose performance is enhanced by the cold temperatures, fiber optic connections operated at cryogenic temperatures, integrated renewable energy power sources, advanced energy storage technologies, cryogenically operated computers, and a number of other cryogenic hardware. The operating temperature of the cryogenic components can be anywhere in the range between 0 K and 200 K, with other components operating above 200 K.

Abstract: In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.

Abstract: Embodiments of an apparatus and system are described for a thermally radiating mobile computing device and case. An apparatus may comprise, for example, a thermally radiating case for a mobile computing device having a first portion arranged to receive the mobile computing device, a thermally conductive coupling arranged to removably couple the case to one or more internal heat generating components of the mobile computing device, and a second portion thermally coupled to the first portion and the thermally conductive coupling, the second portion comprising one or more thermally conductive materials arranged to radiate thermal energy away from the one or more heat generating components. Other embodiments are described and claimed.

Abstract: The invention provides modular air management devices for directing or diverting air flow within an equipment cabinet or enclosure to provide adequate cooling for non-“front to back” breathing electronic devices, and include a scoop assembly, a tray assembly, a vertical mount assembly, and a shroud assembly. The air management devices are designed to direct air flow to and from “side to side” breathing and “side inlet, rear exhaust” electronic equipment. The assemblies may be mounted inside or outside enclosure rails and may be augmented with fan assemblies.

Abstract: An exemplary computer case includes an external shell, a circuit board received in the external shell, and a dehumidification device. The circuit board includes a PCI socket providing an auxiliary power supply when the computer shuts down but the computer case retains electrical connection with an external AC power source. The dehumidification device includes a dehumidification card received in the PCI socket for obtaining the auxiliary power supply therefrom and a remote device. The dehumidification card includes a fan for generating airflow to remove moisture from the computer case and a sensor detecting a humidity inside the computer case. The remote device includes a display unit for displaying the result. When the humidity exceeds a predetermined value, the computer is not powered up until the fan evacuates the excess moisture from the computer case and the humidity falls below the predetermined value.

Abstract: An electronic apparatus includes a first unit having a first power switch for turning on/off a data processing part, a hard disk drive device, a power supply part and the electronic apparatus, a second unit that is separated from the first unit, is supplied with the power from the power supply part in the first unit, and has a drive device of a detachable recording media and a second power switch having the same function as that of the first power switch, and a cable for communicating data between the first unit and the second unit and supplying power from the power supply part of the first unit to the second unit.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a heat sink, and a fixing portion. The circuit board includes a heating component. The heat sink has a plate shape and faces the heating component. The fixing portion is attached to the heat sink and fixed to the circuit board at least at two points.

Abstract: An electro-optical device may include: an electro-optical panel, a holding member that includes a main body part arranged to surround the periphery of the electro-optical panel, and a holding part protruded from the main body part and holding the electro-optical panel, and a heat radiating member that is disposed opposing the electro-optical panel through an opening of the holding member from the opposite side of the light incident plane of the electro-optical panel.

Abstract: A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case.

Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.

Abstract: A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.

Abstract: A server assembly includes a first server and a first airflow guiding pipe. The first server comprises a front wall. An input hole is defined in the front wall. A first input opening and a first output opening are defined in the first airflow duct. The first output opening corresponds to the input hole so as to guide airflow into the inner of the first server to dissipate heat generated by the first server. The first airflow guiding pipe is connected to the first input opening of the first airflow duct, the first airflow guiding pipe is configured to receive and guide airflow into the first airflow duct.

Abstract: A computer system includes a computer case, a receiving tray, and a bracket. The computer case includes a front plate with a plurality of air intakes and a first side plate. The receiving tray includes a retaining wall. The bracket includes a first mounting plate and a second mounting plate. A plurality of first through hole is defined in the first mounting plate, and a plurality of second through hole is defined in the second mounting plate. The airflow guiding duct includes a first guiding plate and a second guiding plate. The first guiding plate is located between the front plate and the first mounting plate, the second guiding plate is located between the bracket and the first side plate; the plurality of air intakes, the airflow guiding duct, the plurality of first through hole second through hole together form a path for the air to flow.

Abstract: A printed circuit board includes a heat sink and a circuit board. The heat sink defines two fixing blind holes respectively arranged on adjacent opposite ends of the heat sink. The circuit board includes a heat-generating component and two fixing elements corresponding to the fixing blind holes. Each fixing elements includes a fixing portion fixed on the circuit board, a locking portion, and an elastic portion extending from a first end of the locking portion to be connected to the fixing portion. A second end of the locking portion of each fixing element is inserted into a corresponding fixing blind hole, to fix the heat sink on the heat-generating component.

Abstract: A system contains a temperature sensitive device and a printed circuit board. The temperature sensitive device is coupled to the printed circuit board. An aperture is cut out of the printed circuit board between the temperature sensitive device and a heat generating device to act as an insulator for the temperature sensitive device.

Abstract: Heat sinks for distributing a thermal load are disclosed that include: a bottom plate; a front top plate; a back top plate; and a plurality of heat-dissipating fins connected to the bottom plate, the front top plate, and the back top plate, wherein the front top plate and the back top plate are separated by a predetermined distance.

Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.

Abstract: A reversible air flow fan system is described. A fan tray assembly is coupled with a chassis and a removable fan and bracket assembly that is oriented in a first direction. This removable fan and bracket assembly is configured to be removable from the fan tray assembly and being recoupled with the fan tray assembly in a second direction opposite the first direction. An air duct is coupled with and enables the exchange of air between the removable fan and bracket assembly and a first surface of the chassis. A sensor coupled with the fan tray assembly is configured for coupling with at least one bracket of the removable fan and bracket assembly when the removable fan and bracket assembly is oriented in the first direction.

Abstract: An embodiment of the present invention provides a heat-dissipating device of electronic equipment that comprises a housing, a heat source, a speaker, and a vibration film arranged inside the housing. The vibration film will vibrate when receiving the energy transmitted from the speaker, resulting in that the heat convection is accelerated and the heat generated by the heat source is removed.

Abstract: A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, a left side plate and a right side plate connecting with the top and bottom plates respectively, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate is different from a total area of the through holes in a lower half portion of the front side plate. The front side plate is rotatable in a plane defined by the front side plate.

Abstract: A cooling system for rack mount electrical or electronic equipment comprises a hollow, box-shaped exhaust shelf having a vent on at least one end face thereof. The exhaust shelf may be configured for rack mounting. A side duct, open on its inner side, is mounted between the exhaust shelf and a top rail adapted to be mounted between a front post and an opposing rear post in a four-post rack mount enclosure. A plenum in the side duct is in fluid communication with the interior chamber of the exhaust shelf. A chassis having a side-facing exhaust for cooling air may be mounted on or over the exhaust shelf such that warm air exiting the chassis is collected in the plenum of the side duct and channeled into the exhaust shelf and out through the vent. In this way, the desired front-to-back cooling air flow within a rack mount enclosure may be maintained even if one or more individual chassis mounted in the enclosure have side cooling air exhausts.

Abstract: An electronic display which can be serviced without having to remove the display from its mounted position. A front housing and a rear housing are hingedly attached so that the front housing can rotate and allow access to the interior of the display. An axial force mechanism can be used to aid in rotating the front housing to an open position. A locking collar, support member, or axial locking member may be used to ensure that the front housing remains open. A removable front glass assembly or removable glass panel may be used with an exemplary embodiment. The front glass assembly or glass panel can be easily replaced if it becomes damaged by minimally-trained personnel. Gutters may be used between the front and rear housing as well as the front housing and front glass assembly to ensure an adequate seal against contaminates.

Abstract: A computer power system includes a first power supply unit having a first output end, and a second power supply unit stacked on the first power supply unit and having a second output end adjacent to the first output end, a first power interface board electrically connected to the first output end and perpendicular to an end surface of the first output end, a second power interface board electrically connected to the second output end and perpendicular to an end surface of the second output end, and an electrical connection device. The electrical connection device connects the first power interface board and the second power interface board, such that the first power supply unit and the second power supply unit are electrically connected in parallel to the second power interface board.