Abstract: A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door.

Abstract: Controlling an airflow passing into an electronic component cabinet includes passing an airflow into the electronic component cabinet through a first passage having a first filter, sensing a parameter of the airflow passing through the first passage, detecting a change in the parameter of the first airflow associated with a flow restriction at the first filter, and shifting a first flap from a first position allowing the airflow to pass unrestricted through the first passage, to a second position, wherein the first flap creates a flow restriction for the airflow passing though the first passage, and triggers an actuation mechanism based on the change in parameter of the first airflow. Controlling the airflow further includes opening a second flap that exposes a second passage having a second filter based on the triggering of the switch, and passing an airflow into the electronic component cabinet through the second passage.

Abstract: A heatsink structure and method for the cooling of closely spaced packaged heat-producing devices, such as dual-in-line memory modules (DIMMs). A folded sheet metal heatsink structure is provided which is constituted of a coined metallic material and which has a large plurality of waffle-shaped ridges extending therefrom constituting additional surface areas which are adapted to enable heat generated by hub chips to pass upwardly and then outwardly through waffle-like ridges and, thus, dissipated to the exterior, thereby imparting an improved degree of cooling to heat-producing components or devices.

Abstract: Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.

Abstract: An entrainment heatsink system and method using distributed micro jets. Such a system and/or method utilize a pressurized primary flow through arrays of micro nozzles to entrain a much larger secondary flow to carry heat away from the heatsink. The bleed air from an aircraft engine represents an ideal pressurized air source for the primary flow with respect to such a heatsink. As such, the needed high-pressure primary flow is very small and can be delivered via thin air hoses, which has the flexibility to reach constraint spaces. In addition to the entrainment effect, the distributed micro jets also induce a high level of turbulence in the heatsink, significantly enhancing heat transfer and cooling performance.

Abstract: Embodiments of the present invention are directed to a cable management system. In one embodiment, the cable management system includes a housing, a plurality of baffles extending from the housing, wherein the plurality of baffles are configured to resist movement of a connector relative to a port in a connection direction and receive the connector in an access direction generally traverse to the connection direction, and an access panel configured to enable access to the port and the connector.

Abstract: A card fixing structure includes a card holder for disposing at least one card. The card holder has an air deflector clamped on its one side. The air deflector catches the card to securely fix the card in the card holder, thereby reducing the number of fixing members and the manufacturing cost. Also, the card, the air deflector, and the card holder are easy to be assembled or disassembled.

Abstract: A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.

Abstract: A display unit and a vending machine having the same. The display unit includes a display panel to display an image, a circuit board to control the display panel, a board bracket installed at a rear of the display panel and formed with a receiving section to receive the circuit board, and a plurality of inlet holes and a plurality of outlet holes formed in opposite surfaces of the board bracket to allow external air to flow through the receiving section. The air travels through the inlet and outlet holes and passes through the receiving section in one direction to cool the display panel and the circuit board. Thus, the display unit is prevented from malfunctioning and the display panel is prevented from being degraded by heat even if tempered glass is installed at a front of the display panel.

Abstract: A cooling distribution configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least one electronics board. The electronics board may comprise a communication board having a plurality of ports. Cooling air spaces are defined above and below the board, permitting cooling air to be drawn over both sides of the board. Notches extend inwardly from an edge of the board, the notches serving as air flow paths between the cooling air spaces and serving to distribute cooling air flowing into the housing from one or more intakes to the cooling air spaces.

Abstract: An outdoor apparatus that incorporates a heat sink and has a box-shaped casing, having a plurality of aligned ventilation holes formed on an upper plate and a lower plate so as to oppose the heat sink, and wherein inter-hole portions that are portions of the upper plate between adjacent ventilation holes are recessed downward with respect to other portions of the upper plate.

Abstract: A notebook computer with a tilting keyboard, which opens a vent when tilted, solves multiple problems and may further materially contribute to countering terrorism. A tilted position of the keyboard allows the vent to open when the notebook lid is open, thereby providing extra cooling capacity during periods of computer use when there is a lessened need for compactness. The vent is it least partially closed when the keyboard is in the stowed position and the lid is closed, thereby reducing the possibility of debris ingestion when air flow needs are reduced and the need for compactness is increased. A security inspection position of the keyboard enables inspection of the inside of the computer, for example as part of a security checkpoint procedure. A negative tilt can reduce wrist strain and repetitive motion injuries for some users. Some embodiments tilt the keyboard automatically in response to the lid opening, and stow the keyboard automatically in response to the lid being closed.

Abstract: Various embodiments disclose a shielded or isolated heat dissipating system comprising a case, a heat sink base, and a circuit board comprising at least one electronic device for which heat dissipation is desired. The heat sink base is attached to the case and together with the shielding case defines an enclosed space within which electromagnetic interference is reduced. Both heat-dissipation function and electromagnetic shielding function may be achieved by the combination of the heatsink base and the case while maintain electrical isolation with one or more specially treated components. The space required for mounting the system may also be reduced without adversely affecting normal and stable operation of the electronic device.

Abstract: In one embodiment, an air guiding plate is attached to an enclosure with a plurality of vents defined therein. The air guiding plate includes a plurality of guiding holes defined therein. Each of the guiding holes is surrounded by a plurality of walls and includes an inlet with a large size, and an outlet with a small size. The outlets are in alignment with the vents of the enclosure. A size in cross section of each of the walls gradually decreases along a direction from the inlet to the outlet.

Abstract: A cooking appliance for cooking a foodstuff over a period of time including a shell having a heating cavity and a heating element to heat the heating cavity. A container is removably positionable within the heating cavity and includes a food cavity for receiving the foodstuff. A temperature probe is removably insertable into the foodstuff and a controller is mounted to the shell. The controller controls operation of the cooking appliance in a probe mode wherein the temperature probe is inserted into the foodstuff and transmits foodstuff temperatures to the controller for controlling the heating of the foodstuff, a program mode wherein the controller actuates the heating element to heat the container at a temperature for a selected amount of time and subsequently at a lower temperature and a manual mode wherein the controller actuates the heating element to heat the container at a selected temperature.

Abstract: An electronic device having a heat-dissipating mechanism includes a housing and a cooling device. The housing is provided with an intake hole and a plurality of exhausting holes. The interior of the housing is provided with a heat-dissipating fan. The cooling device includes a cooling chip, at least one cooler and at least one heater. The cooling chip has a cold end and a hot end opposite to each other. The cooler is connected to the cold end of the cooling chip. The cooler is arranged at one side of the heat-dissipating fan in the direction of airflow generated by the heat-dissipating fan. The heater is connected to the hot end of the cooling chip. The heater is located outside the housing and corresponds to the locations of the exhausting holes. Via this arrangement, the temperature within the housing of the electronic device can be reduced efficiently.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: A gas ejector capable of effectively dissipating heat generated from a heater while inhibiting noise generation as little as possible, an electronic device equipped with the gas ejector, and a gas-ejecting method are offered. A gas ejector (1) according to the present invention includes a vibrator (25) and ejects gas in a form of a pulsating flow such that vibration of the vibrator allows sound waves respectively generated upon ejection of the gas ejected from nozzles (23) and (24) to deaden out each other. Also, a control section (20) optimizes the frequency of the vibrator (25), hence, by increasing the gas ejection quantity as much as possible while inhibiting noise generation, heat of a heater is effectively dissipated.

Abstract: In a process for operating an air-cooled mains supply unit for industrial application, temperatures influenced by outer heat sources and by heat sources arranged in the mains supply unit are measured by thermo-elements and reported to a control system. Temperatures measured by at least two thermo-elements arranged at different measurement points are reported to the control system, and the measured temperatures are compared with temperature patterns. The comparison with known temperature patterns makes it possible to sense the totality of the thermal conditions continuously and to derive therefrom ratings for the control system.

Abstract: A heat dissipation system for digital electronic signboard includes a first heat dissipation subsystem disposed in a main circuit board area of a digital electronic signboard, and a second heat dissipation subsystem disposed in a computer mainboard area of the digital electronic signboard. The main circuit board area has a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the main circuit board area, while another heat dissipation fan is disposed at a side of a power supply and can be externally connected to an air guide pipe. The computer mainboard area can also have a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the computer mainboard, while another heat dissipation fan is disposed on the top of a microprocessor of the computer mainboard.

Abstract: An electrical enclosure assembly comprises an enclosure having walls defining an interior space for housing electrical components and having a front flange surrounding a front opening. A cover is hingedly mounted to the enclosure for selectively closing the front opening. The cover comprises a front wall larger than the front opening and a rearwardly extending peripheral rim. Cooling structure is integrally formed on an interior surface of the cover proximate the peripheral rim. The cooling structure comprises a plurality of spaced apart cooling ribs each having a shoulder engaging the enclosure front flange when the cover is in a closed position to provide an air flow path between the interior space and outside of the enclosure through spaces between the cooling ribs.

Abstract: In a cooling device of an image forming apparatus, a space is formed between a flat surface of a sheet metal attached on a circuit board attached part and a power source circuit board. A duct is formed by a shielding member formed in a U shape surrounding the space, and on the lower part of the flat surface of the sheet metal, a tubular part as an air outlet is formed so as to be elongated to the side of a main body. On the upper part of the sheet metal arranged in a vertical direction, a fan motor is mounted, which sends cooled air into the power source circuit board and the duct. The cooled air cools the power source circuit board and also cools a power source unit in the main body via the tubular member.

Abstract: A partitioning device for holding slots of a host computer case, including: a host computer outer case provided with a horizontal upper panel; an upper cover; more than one rectangular partition; vertical connecting holes are defined in an upper side of each of the rectangular partitions, which provide for vertical penetration into the holding slot; bolts bolt into the through holes and into the vertically connecting holes, thereby fixing the partitions within the holding slot, thus partitioning the holding slot and forming at least more than two holding spaces, thereby achieving control of the number and size of the more than two holding spaces so as to accommodate he insertion of modular cases of various size specifications.

Abstract: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: An acoustically absorptive panel is provided configured to reside above multiple electronics racks disposed in a row within a data center. The acoustically absorptive panel is configured to extend a height above the multiple electronics racks sufficient to at least partially block hot air recirculation from one or more air outlet sides of the multiple electronics racks to one or more air inlet sides of the electronics racks. The acoustically absorptive panel includes an acoustically absorptive material selected to attenuate noise, and in one embodiment, includes printed material on at least one side thereof related to one or more of the multiple electronics racks.

Abstract: An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the first zone may receive cool air directly from a cool air source and the second zone may receive cool air from a duct in fluid communication with the cool air source. In another example, both the first and second zones may receive cool air from the cool air source through a duct. In yet other examples, the cabinet may include a baffle between the cool air source and one of the first zones and the second zones to selectively control a quantity of cool air provided to the one of the first and second zones.

Abstract: In one embodiment, an opaque enclosure for an electronics module includes an inner barrier having downward-facing louvers for allowing air flow and a cover having vent holes. The vent holes and downward-facing louvers are oriented so that the interior of the electronics module is not visible through the vent holes of the cover.

Abstract: A chassis panel for a computerized device includes ventilation elements that visually obscure electronic components disposed within an associated chassis and that minimize airflow resistance. Each ventilation element includes a first angled ventilation portion having openings that provides limited visual access to the electronic components disposed within the chassis. Each ventilation element also includes a second angled ventilation portion having openings that provide no visual access to the electronic components disposed within the chassis. As such, the ventilation elements visually obscure the electronic components disposed within the chassis without the need for additional materials such as screens, mesh, or foam. Also, the openings of the first and second ventilation portions provide the chassis panel with a relatively large free area ratio, such as between about 42% and 48% or greater depending on hole pitch values and opening sizes.

Abstract: The present invention is to provide a housing structure of an electronic device, which comprises a housing including a slot on a top surface; a plate member mounted in the slot and including a plurality of first ventilation holes formed along a periphery, the first ventilation holes being in communication with inside of the housing; and a cap mounted on the plate member and spaced from the top surface of the housing by a peripheral gap formed between the cap and the plate member; wherein the first ventilation holes are concealed by the cap. By utilizing the present invention, hot air inside the housing can be quickly removed via the first ventilation holes and the gap so as to achieve the purpose of heat dissipation, and the housing's appearance can be preserved since the first ventilation holes are concealed by the cap.

Abstract: Settop box (STB) or other housing for use in protecting electronic components. The housing may include an interior portion for protecting the components. The housing may include feet on a bottom and side to facilitate stabilizing the STB in a vertical and horizontal position. The housing may include vents to facilitate air flow to the interior. The vents may be associated with blocking aspects to protect against blocking the vents.

Abstract: An electronic equipment cabinet having a duct positioned in a side portion of the cabinet. The duct has a first opening formed in a bottom wall of the duct and a second opening formed in an inside wall of the duct. The first opening is configured to generally align with a cool air source and receive cool air from the cool air source with the first duct installed in the cabinet. The second opening is in fluid communication with a front internal portion of the cabinet and is configured to direct cool air from the duct to the front internal portion of the cabinet with the duct installed in the cabinet.

Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

Abstract: A detachable filter of the electronic apparatus can be positioned to the side of the housing of the electronic apparatus in a lateral way. With the help of fixing elements such as the supporters having arches or the magnetic elements adhering to the side of the detachable filter, the detachable filter can be positioned to the side of the housing laterally and fixed to the side of the housing tightly in an easy way. The detachable filter can be removed for cleaning by directly being drawn laterally along the side of the housing without the need to shutdown the electronic apparatus.

Abstract: Disclosed is an apparatus for improving server electromagnetic shielding at high and low frequencies, including a metallic plate in fixed association with a surface of a server casing, the metallic plate defining a plurality of openings, and a substantially plastic shield including conductive metal fibers and defining a plurality of bosses extending from a boss surface of the plastic shield, the bosses configured to be insertable within the plurality of openings to allow the boss surface to be disposed adjacent to the metallic plate, each of the plurality of bosses defining a boss cavity that extends entirely through the plurality of bosses and the plastic shield.

Abstract: Provided is a cooling apparatus for a flat display device. The cooling apparatus includes a flat display module, a cover for protecting the flat display module, an air inlet formed on a portion of the cover to allow external air to be introduced into the cover, an air outlet formed on one of four frame portions of the cover to allow the air introduced through the air inlet to be exhausted out of the cover, and a fan for directing the air in a direction extending from a screen surface of the flat display device.

Abstract: A system for cooling interior and external housing surfaces of an electronic apparatus. The apparatus includes at least one electronic component, a heat transfer mechanism for transferring to an external surface of the apparatus heat generated by the electronic component, and a cooling mechanism for cooling the external surface of the apparatus. The cooling mechanism also includes an airflow generation device and an opening that enables airflow to simultaneously flow over at least one electronic component within the apparatus and over the external surface to dissipate the heat generated by the at least one electronic component.

Abstract: A chassis and rack system is disclosed in which a chassis separated into two separate enclosures by a central partition. Each of the enclosures is sized to receive a computer system. The partition includes a pair of vertically oriented vents, with each of the vents in fluid communication with one of the enclosures and the computer system contained therein. Heated air is removed from each computer system through the vent in the partition that is associated with the computer system. Multiple chassis may be placed one atop another in a vertical configuration in which each chassis is either directly above or directly below another chassis. In this vertical configuration, the vents form a vertically oriented common plenum that can be used to evacuate air from multiple chassis arranged in a rack.

Abstract: A heatsink and a cooling apparatus for cooling a heating element wherein the heatsink includes a rolled metal plate having a central axis at a central portion thereof. The metal plate has a first end and a second end. The second end is arranged closer to the central axis than the first end. The metal plate has a height in a direction of the central axis that gradually increases from the first end toward the second end in a radial direction.

Abstract: An adjustable filler panel assembly, configured for use in an electronic equipment enclosure, includes a first panel and a second panel, each adapted to block airflow. The first panel has pairs of horizontally aligned adjustment openings formed therein, and the second panel has a pair of horizontally aligned attachment members disposed near one end. The first and second panels are connected to one another in an overlapping arrangement to form an air-blocking panel assembly with the attachment members of the second panel being aligned with and connected to a pair of adjustment openings of the first panel. In addition, the first panel and the second panel are telescopically adjustable relative to one another such that a length of the air-blocking panel assembly is selectively adjustable to fill at least a portion of an opening in the electronic equipment enclosure, thereby blocking air from flowing through the opening.

Abstract: There is provided a cooling apparatus for a flat display device. The cooling apparatus includes a flat display module, a cover for protecting an exterior of the flat display module, an air inlet formed on one side of the cover, for introducing external air, an air outlet formed in the other side of the cover, for discharging high temperature air contained inside the cover, and a shield for selectively closing the air outlet to prevent inflow of foreign substances.

Abstract: A circuit board assembly comprises a circuit board having a connector or contact pad, and a housing. The housing includes a casing having an open end, an end cover sealing the open end of the casing and having a conductor, a coolant inlet for introducing a coolant into the housing, a coolant outlet for discharging the coolant from the housing, an inside connector connected to an inside surface of the conductor of the end cover, and an outside connector connected to an outside surface of conductor. The conductor of the end cover extends from an inside surface of the end cover to an outside surface of the end cover.

Abstract: There is provided a cooling apparatus for a flat display device. The cooling apparatus includes a flat display module, a front cover for protecting a front portion of the flat display module, a back cover for protecting a rear portion of the flat display module, an air inlet formed on a portion of the back cover to allow external air to be introduced into the back cover, an air outlet formed on another portion of the back cover and extending along a longitudinal length of the flat panel display module; a fan disposed inside the back cover and aligned with the air outlet formed on the back cover, and an air outlet channel formed in the back cover and aligned with the air outlet formed on the back cover, the air outlet having an effective exhaust area having a longitudinal length extending in a longitudinal direction of the flat display module.

Abstract: Systems and methods for detecting and analyzing elevated temperatures at a component rack to identify and characterize air recirculation anomalies. In one embodiment, temperatures are sensed in proximity to an air intake of the component rack. Temperature sensors communicate with a workstation having system management software including a thermal management component for analyzing air intake temperatures. Predefined temperature differentials (PTD) are established, corresponding to expected temperature differentials between the selected locations in the absence of any appreciable recirculation. The PTD provides a threshold for comparing with “actual” temperature differentials (ATD) to identify the presence and/or mode of recirculation. If an ATD exceeds a corresponding PTD for a predefined time interval, a signal is output. The mode of recirculation, such as left-side, right-side, or dual-surface recirculation, may be determined using as few as four temperature sensors positioned at a zone of interest (ZOI).

Abstract: A heat extraction system is provided for a laptop computer that comprises a system unit that includes a set of heat sources and a video display unit that is movably attached to the system unit. The laptop computer has air inlets and air outlets that allow air to flow into the system unit, over the heat sources forming heated air, and exhaust the heated air. The laptop computer has a set of tubes, which have an inlet and an outlet, located behind a video display in the video display unit and an air connection from the air outlets to each inlet in the tubes. The set of tubes are formed such that heated air passing through a constriction in the set of tubes changes in velocity and pressure in order to satisfy the conservation of flow rate. Thus, heat produced by the heat sources is extracted from the laptop computer.

Abstract: A cooling apparatus for a flat display device includes a flat display module, a front cover for protecting a front portion of the flat display module, a back cover for protecting a rear portion of the flat display module; an air inlet formed on a portion of the back cover to allow external air to be introduced into the back cover, an air outlet formed on another portion of the back cover to allow the air introduced into the back cover to be exhausted therethrough, a cross-flow fan disposed inside the back cover and aligned with the air outlet formed on the back cover, and an air outlet channel formed in the back cover and aligned with the air outlet formed on the back cover. A ratio of an inner diameter of the cross-flow fan to an outer diameter of the cross-flow fan is 0.69±0.03.

Abstract: A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting arrangement accommodating thermal cooling of active equipment having internal side-to-side air cooling arrangements.

Abstract: A method of providing an electronic equipment enclosure having a plurality of panels, including identifying at least one panel through which air is intended to flow, determining the design parameters of the identified panel, and providing an electronic equipment enclosure that includes the identified panel, constructed according to the determined design parameters. Determining the design parameters of the identified panel includes first establishing a maximum ratio of open area to closed area of between 60% and 70% and then determining one or more other parameters of the design of the identified panel in view of the established maximum ratio of open area to closed area. Other parameters include the material of which the identified panel is to be constructed, its thickness, and its rigidity. Specific enclosures benefiting from the design process are also described.

Abstract: A chassis venting apparatus includes a chassis wall base member comprising a first wall. A chassis vent structure is located on the chassis wall base member. A chassis venting passageway is defined between the chassis vent structure and the first wall of the chassis wall base member. The chassis venting apparatus may be, for example, removeably coupled to a chassis or fabricated as part of the chassis in order to provide obscured venting of the chassis and a handle for lifting the chassis.

Abstract: A heat-dissipating assembly of a computer housing with airways includes a casing. The casing is provided with a first partition and a second partition thereon. The first partition has a recessed space. The first partition is provided thereon with a plurality of penetrating troughs. The second partition is provided with a plurality of air-introducing ports thereon. The positions of the air-introducing ports and the positions of the penetrating troughs of the first partition are staggered respectively. Finally, the back and top of the casing are provided at least one fan respectively. Via this arrangement, after the external air enters the recessed space through the plurality of air-introducing ports, the external air is drawn into the casing by the fan on the first partition to perform an air-cooling effect and the heat dissipation. Finally, the air is drawn out of the casing by the fans provided on the top and back of the casing.