Abstract: An apparatus is provided to remove heat from a heat-generating component of a computer, such as a processor. The apparatus comprises a first heat sink having a plurality of leader fins, wherein the first heat sink is thermo-conductively coupled to a heat-generating component that is coupled to a first portion of a chassis; and a second heat sink having a plurality of follower fins, wherein the second heat sink is thermo-conductively coupled to a second portion of the chassis, and wherein the plurality of follower fins are disposed in an interlaced configuration with the plurality of follower fins to promote radiative heat transfer from the leader fins to the follower fins. Optionally, one or more alignment structures may be used to facilitate the relative movement of the first and second chassis portions into an operative position in which the leader and follower fins are in the interlaced configuration.

Abstract: A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, a left side plate and a right side plate connecting with the top and bottom plates respectively, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate is different from a total area of the through holes in a lower half portion of the front side plate. The front side plate is rotatable in a plane defined by the front side plate.

Abstract: A cooling system for rack mount electrical or electronic equipment comprises a hollow, box-shaped exhaust shelf having a vent on at least one end face thereof. The exhaust shelf may be configured for rack mounting. A side duct, open on its inner side, is mounted between the exhaust shelf and a top rail adapted to be mounted between a front post and an opposing rear post in a four-post rack mount enclosure. A plenum in the side duct is in fluid communication with the interior chamber of the exhaust shelf. A chassis having a side-facing exhaust for cooling air may be mounted on or over the exhaust shelf such that warm air exiting the chassis is collected in the plenum of the side duct and channeled into the exhaust shelf and out through the vent. In this way, the desired front-to-back cooling air flow within a rack mount enclosure may be maintained even if one or more individual chassis mounted in the enclosure have side cooling air exhausts.

Abstract: A system for cooling an electronic image assembly using ambient gas. The system contains a plurality of channels place behind the electronic image assembly and preferably in conductive thermal communication with the image assembly. Ambient gas is ingested into the display housing and directed to a first manifold which distributes the ambient gas to the plurality of channels. A second manifold preferably collects the ambient gas from the channels after absorbing heat from the electronic image assembly and/or channels. The second manifold then preferably directs the ambient gas towards an exit aperture and out of the display housing. Circulating gas may also be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing.

Abstract: A power supply device in which a plurality of power supplying bodies are stacked is provided with a plurality of holes that extend from one end side to the other end side in the stacking direction of the power supply device and through which coolant flows. The power supply device is also provided with a guide portion that leads coolant that has passed through a first hole which is provided in a first region of the power supply device into a second hole which is provided in a second region of the power supply device which radiates heat better than the first region does.

Abstract: The subject invention is directed to an improved modular multilevel raised floor electro-mechanical distribution system for installation in building structures including, but not limited to, data centers and similar rooms having high heat loads requiring usually dedicated cooling systems and usually having extensive data cabling and wiring. In addition to a walking and equipment support surface, the invention provides dedicated levels, isolated from one another and positioned under the walking surface, for distribution of electrical services, including data, on the one hand, and conditioned air, on the other.

Abstract: A housing includes a first chamber having an exhaust aperture to provide fluid communication with an outside environment, a wall disposed in the first chamber and containing an electrical component, wherein a thermal energy generated by the electrical component is transferred from the first chamber to the outside environment through the exhaust aperture, a second chamber formed adjacent the first chamber and including a control means for the electrical component, and a means for selectively providing access to the first chamber and the second chamber.

Abstract: An electric device includes: first opening 7 provided on rear panel 4 to exhaust internal air out of casing 1; first partition 12 covering second opening 8 provided on left side panel 2 and having fourth opening 10; second partition 13 covering third opening 9 provided on right side panel 3 and having fifth opening 11; and radiator 14 disposed so as for opening 14C at one end to faceopening 7. The configuration can prevent weld spatters or the like from coming into casing 1 directly.

Abstract: A power converting apparatus includes a housing base, a main body, an air duct, a pair of upright air duct walls, first and second heat generators, and a protrusion. The housing base has first and second surfaces. The main body is on the first surface. The air duct is for cooling air to flow through the air duct and is on the second surface. The upright air duct walls are on the second surface and extend from an upwind side to a downwind side. The first and second heat generators are disposed in series from the upwind side to the downwind side in the air duct. The protrusion is between the first and second heat generators to protrude from at least one of the pair of air duct walls toward a center portion of an air-flowing space for the cooling air.

Abstract: A motor control apparatus is configured to control driving of a motor. The motor control apparatus includes a housing base, a main portion, an air duct, a heat dissipating component, and a heat sink. The housing base has one surface and another surface. The main portion is on the one surface of the housing base and includes a substrate. Through the air duct, cooling air passes. The air duct is on the other surface of the housing base. The heat dissipating component is on the one surface of the housing base and is coupled to the substrate. The heat sink includes a base portion and at least one fin. The heat sink is on the other surface of the housing base at a position corresponding to the heat dissipating component with the housing base disposed between the base portion and the heat dissipating component.

Abstract: The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.

Abstract: This storage unit includes a storage portion that stores power, a converter that converts power, a first temperature detection portion arranged in the vicinity of the converter, and a housing that houses at least the converter, the first temperature detection portion, and the storage portion.

Abstract: To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Abstract: A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.

Abstract: An electronic device includes a housing defining at least one outlet, a number of electronic components accommodated in the housing, at least one fan comprising an intake side and an opposite exhaust side, and a pipe defining a center hole and a number of small holes in the peripheral wall. The pipe includes a number of segments each being mounted adjacent to one of the electronic components. The exhaust side of the fan faces the outlet, and the intake side is coupled to the pipe for communicating with the center hole. When the fan is actuated, heat generated by the electronic components and dust retained within the housing is drawn into the pipe through the small holes and the center hole, and are finally exhausted out of the housing through the at least one outlet.

Abstract: An apparatus includes a first electronic display, a second electronic display generally parallel to and facing away from the first electronic display, and a bracket. The first electronic display is mounted to a first side of the bracket and the second electronic display is mounted to a second side of the bracket. The bracket is dimensioned to extend across a width of a top arm of a basketball hoop stanchion such that the first electronic display at least partially covers a first side of the top arm and the second electronic display at least partially covers a second side of the top arm.

Abstract: A storage module for computer systems includes a housing defining an opening, a power supply unit and an air cooling unit, a storage unit detachably received in the housing through the opening, a bracket for mounting the storage unit, and a magnetic member. The bracket includes a tray plate defining a plurality of heat dissipation holes, a first side plate, an opposite second side plate, a stop plate including a first end detachably coupled to the second side plate and a second end pivotally connected to the first side plate, and a resilient member resiliently biasing the stop plate away from the first side plate. The storage unit is moveably and insertably positioned between the first and the second side plates. The magnetic member is positioned in one of the second side plate and the stop plate such that the second side plate and the stop plate are magnetically attracted.

Abstract: A data center includes a housing, a number of heat units arranged in the housing, and a fan mounted in the housing. When the data center runs, cool air comes into the housing through the front wall, the back wall, and the bottom wall of the housing, for cooling the heat units. The heated air is vented out of the housing through the top wall by the fan.

Abstract: An exemplary heat dissipation device includes a heat sink defining air passages therein, a fan holder fixedly mounted on the heat sink, a fan mounted on the fan holder, and an adjustable wind-guiding module located in and pivoted to the fan holder. The fan is positioned for generating an airflow flowing through the adjustable wind-guiding module generally toward the air passages of the heat sink. The adjustable wind-guiding module is selectably pivotable with respect to the fan holder such that a direction of the airflow generally toward the air passages of the heat sink is changed accordingly.

Abstract: A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, and a fan mounted in the housing near the cooling units. When the data center is operating, heated air is driven to the cooling units by fans, and then the cooled air is driven to enter the server modules.

Abstract: A storage apparatus S comprises a disk controller 1 for controlling data I/O processing between a host H and a disk unit 2. The disk controller 1 includes a plurality of circuit board modules each having a circuit board 210 and a module case 200 storing the same, and a chassis 100 shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module 20 is configured to introduce cooling air from a cooling fan 10F through an opening provided on at least one side surface toward a circuit component mounted on the circuit board 210. A MP module 30 is configured to introduce cooling air by a cooling fan 10R through an opening provide on a front surface of the module case 200.

Abstract: A display apparatus has a display panel, a circuit unit which controls the display panel, a first chamber which accommodates the display panel, a second chamber which arranged behind the first chamber, the second chamber accommodates the circuit unit, a cooling device which cools the display panel, and a ventilating part which ventilates between the first and the second chamber. The air emitted from the cooling device is led to the back side of the display panel via the front side thereof, and then ventilates the ventilating part.

Abstract: A container data center includes a movable container, two server systems having a cold aisle and two hot aisles, two fan apparatuses, an exchanger, and an air intake apparatus. The air intake apparatus includes a number of air intake elements each defining an air channel. The fan apparatuses are operable to transfer hot airflow in the hot aisles into the heat exchanger, and then the heat exchanger transforms the hot airflow into cold airflow and transfers the cold airflow into the cold aisle through the air intake apparatus. The air intake elements are connected together and cover the cold aisle. The air intake elements of the air intake apparatus are arranged in a “V” shape along an orientation toward the airflow of the cold aisle.

Abstract: Provided is an electronic apparatus capable of preventing an unnecessary space from being made inside the housing, and of improving ventilation efficiency of the air flowing along the power circuit. An electronic apparatus includes: a power circuit; a power circuit case (4) housing the power circuit; and a housing (2) for housing the electronic apparatus and the power circuit case (4). The power circuit case (4) includes a rear wall portion (43) having an air outlet (43a) formed therein, and the housing (2) having an opening (2a) formed therein, a shape of the opening corresponding to the rear wall portion (43) of the power circuit case (4). The power circuit case (4) is arranged such that the rear wall portion (43) is exposed through the opening (2a).

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.

Abstract: An outdoor unit of air conditioner for efficiently cooling a board having a heater element and a heat generating component in an electrical component box, thereby enhansing heat release efficiency. Air flowing from a machinery chamber 11 into an electrical component box 60 is divided into: a flow Fa flowing from open space defined by an arm 64 and a support post 65 through a periphery of a box base plate 62; a flow Fb flowing through a first ventilation hole 62b; a flow Fc flowing through a second ventilation hole 62c; and a flow Fd flowing through a third ventilation hole 62d. The board and the heat generating component can be effectively cooled by the flows Fb, Fc, and Fd directly touching the board and the heat generating component, and by the flow Fa cooling overall the inside of the electrical component box 60.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An enclosure of an electronic device includes a front panel including a plurality of first air guiding boards and a plurality of second air guiding boards. The plurality of first air guiding boards arrange a first air guiding layer, and the plurality of second air guiding boards arrange a second air guiding layer. A first gap is defined between adjacent two of the plurality of first air guiding boards, a second gap is defined between adjacent two of the plurality of second air guiding boards, and a third gap is defined between the first air guiding layer and the second air guiding layer. Each second air guiding board is located opposite to the first gap. An absorbing layer is placed on a side surface of each second air guiding board towards the first gap. The first gap communicates with the second gap and the third gap.

Abstract: A high-voltage apparatus includes a battery device, a high-voltage control device, a housing, and a cooling structure. The cooling structure includes a first cooling channel to cool the battery device, a second cooling channel to cool the high-voltage control device, a connection channel connecting the first cooling channel to the second cooling channel, and a ventilator. The connection channel has a first opening portion connected to the first cooling channel, a second opening portion connected to the second cooling channel, and an inner flow path to communicate the first opening portion to the second opening portion. A sectional area of the first opening portion and a sectional area of the second opening portion are each set to be smaller than a sectional area of the inner flow path.

Abstract: A method for cooling an electronic device having first and second flow paths for transmitting a coolant. The method includes assessing a merit of impelling the coolant along the first flow path relative to impelling the coolant along the second flow path. When the relative merit is above a threshold, coolant is impelled along the first flow path. When the relative merit is below the threshold, coolant is impelled along the second flow path.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber.

Abstract: A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

Abstract: An exemplary embodiment of the present invention provides a silencer. The silencer includes an enclosure with a first airflow path configured to allow air to pass through the enclosure and attenuate noise entering the enclosure. The enclosure also includes an opening configured to provide a second airflow path if the first airflow path is obstructed.

Abstract: Disclosed is a data center and its configuration arrangements and configuration units of electronic device assemblies and air conditioners, in which the configuration arrangements of electronic device assemblies and air conditioners includes an air conditioner and a plurality of electron device assemblies. The air conditioner includes an intake and a corresponding opposite outtake and the electronic device assemblies are mounted around to form a block. Each electronic device assembly includes an air inlet and a corresponding air outlet. The air conditioner is mounted in the block and partitions the block into a first sector and a second which are both shaped as a polygon. The intake and the outtake of the air conditioner respectively face the first sector and the second sector, and the electronic device assembly adjacent to the first sector faces the first sector with its air outlet and the electronic device assembly adjacent to the second sector faces the second sector with its air inlet.

Abstract: An inverter stack includes an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space, a heat sink having a switching element, disposed within an upper region of the internal space, and a plurality of DC-link capacitors disposed within the internal space and below the heat sink. Through this, heat generated in high heat dissipation components is immediately moved upward by convection, thereby suppressing the damage of components due to high temperature.

Abstract: An electronic device includes a housing unit, a first electronic component, a heat-dissipating module, and an air-guide passage. The first electronic component, the heat-dissipating module, and the air-guide passage are disposed in the housing unit. The heat-dissipating module includes a fan unit and a heat-dissipating sink. The fan unit has a first air outlet zone and a second air outlet zone. The heat-dissipating sink is for dissipating heat generated by the first electronic component. The heat-dissipating sink is substantially aligned with the first air outlet zone. The air-guide passage is in spatial communication with the second air outlet zone and is formed with a passage air outlet. Air through the first air outlet zone flows in a first direction. Air through the passage air outlet is directed into the housing unit and flows in a second direction different from the first direction.

Abstract: According to one embodiment, a television attachment device includes a case, a fan unit, a fin unit and a heat pipe. The fan unit includes a case, a fan main body rotatably provided inside the case, and a motor fixed to the inner surface of a second wall and rotating the fan main body. The fin unit is arranged adjacent to a first side portion of the case. The heat pipe includes a first end portion connected to a circuit component, and a second end portion opposed to the first end portion, close to the second wall and connected to the fin unit.

Abstract: An apparatus for restricting the flow of RF energy when attached to a tester wherein test equipment is positioned within the apparatus, comprising: a lid; a base; hinges for attaching the lid to the base; EMI gasket material for sealing seams; latches for attaching the lid to the base and for applying forces between the lid and the base to provide compression of the EMI gasket material for proper sealing of the seams; a connection point for providing two axis alignment of the base to the tester; and a positioning plate for providing three axis alignment of the test equipment in relation to the tester.

Abstract: A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology.

Abstract: Embodiments of the present invention disclose a heat dissipation device, including: a closed shell and a temperature control device. The temperature control device includes: a cold storage medium module, a first group of thermosiphons, and a second group thermosiphons; wherein the cold storage medium module is disposed at the outside of the closed shell, the first group thermosiphons are provided with a first group of evaporation ends and a first group of condensation ends, and the second group of thermosiphons are provided with a second group of evaporation ends and a second group of condensation ends. Embodiments of the present invention also disclose a communication device and a heat dissipation method for a communication device. The above technical solutions save electric energy and improve the effects of energy saving and emission reduction of the system.

Abstract: In a heat radiation mechanism of an electronic apparatus, an opening allowing flow of air between a first duct side and a second duct side is formed on a portion mounted with a heating device of a circuit board in an air flow route constituted by a first duct and a second duct, and heat generated from the heating device is radiated from a first vent hole or a second vent hole through the air flow route.

Abstract: A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.

Abstract: An electronic device includes a case having a first surface facing a second surface and a side surface along peripheries of the first and second surfaces to form an internal space, an electronic component adjacent to a first side part of the side surface with a gap between the electronic component and the first side part, and a circuit board extending along the first surface and distant from the first surface such that the electronic component is sandwiched between the circuit board and the first surface. The case includes an air intake port introducing air into the case and an air outlet port discharging air flowed along the electronic component, and the circuit board includes a vent opening including a first end portion extending to a position closer to the first side part than a first end of the electronic component facing the first side part of the case.

Abstract: In the specification and drawing a flat panel display with a front cover, a rear cover, a printed circuit board and a display module is disclosed. The rear cover is fixed on the front cover, wherein the rear cover has a printed circuit board region and a panel region. The printed circuit board is locked on the rear cover and corresponding to the printed circuit board region. The display module is fixed on the front cover and corresponding to the panel region, wherein the display module comprise an liquid crystal panel facing the front cover and a back plate facing the rear cover. Moreover, a method for fabricating the flat panel display is also disclosed in the specification and drawing.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.

Abstract: An electrical equipment cabinet includes a main body and at least one waterproof module. The main body has a surface with an airflow outlet. The waterproof module is installed on the at least one surface of the main body, and includes a covering member, a first water-retaining structure and a second water-retaining structure. The covering member has a first opening. The first water-retaining structure has a second opening. The second opening is not aligned with the first opening. A periphery of the airflow outlet is enclosed by the second water-retaining structure. A heated airflow generated from an internal portion of the main body is exhausted out of the electrical equipment cabinet through the airflow outlet, the second opening and the first opening. If the electrical equipment cabinet is hit by rain, the rain is sequentially blocked by the covering member, the first water-retaining structure and the second water-retaining structure.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: An exemplary fan assembly includes a fan and a muffler. The fan includes an air outlet. The muffler is disposed at the air outlet of the fan. The muffler includes a base plate. The base plate defines vents therein and blades thereon corresponding to the air outlet of the fan. The blades extend from the base plate toward the fan. An electronic device incorporating the fan assembly is also provided.