Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.

Abstract: An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.

Abstract: A cooling system includes a plurality of fans and a fan bracket accommodating the fans. Each fan comprises a fan intake and a fan outlet. The fan bracket defines a plurality of air inlets and a plurality of air outlets therein. The fan bracket is provided with a fan guard in each air outlet and a plurality of noise-reducing holes in the fan guard. The air inlets of the fan bracket communicate with the fan intakes and the air outlets of the fan bracket communicate with the fan outlets, respectively. Airflow generated by the fans through the fan outlets comprises a portion exiting through the noise-reducing holes.

Abstract: An external heat dissipation device includes a housing, a circuit board placed in the housing, a fan electrically connected to the circuit board, and a wire electrically connected to the circuit board to power the fan. The housing includes an installation dock defining a receiving space for receiving the fan therein, and an insertion portion extending from the installation dock. A through hole is defined in the installation dock. An air passage is defined in the insertion portion. The fan includes a casing defining a first air hole communicating with the through hole and a second air hole communicating with the air passage.

Abstract: A system for controlling temperature of an antenna module including a heat generating module, and a radome and an underbody cover that enclose the heat generating module. The system includes: a heat collecting unit mounted on inner surface of the antenna module; a heat discharging unit mounted on outer surface of the antenna module; and a heat transfer unit for transferring heat from the heat collecting unit to the heat discharging unit.

Abstract: Provided is a driver module structure capable of ensuring high reliability. A PDP driver device 1 includes: a flexible substrate 2 having an interconnect pattern; a semiconductor device 3 placed on the flexible substrate 2; and a heat dissipating body 4 having a recess 41 configured to accommodate the semiconductor device 3. The heat dissipating body 4 is provided with four grooves 8 as airflow paths that connect a space in the recess 41 to the outside, and the grooves 8 have a substantially V-shaped cross section.

Abstract: A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.

Abstract: An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.

Abstract: An external heat dissipation device includes a housing, a circuit board placed in the housing, a fan electrically connected to the circuit board, and a wire electrically connected to the circuit board to power the fan. The housing includes an installation dock defining a receiving space for receiving the fan therein, and an insertion portion extending from the installation dock. A through hole is defined in the installation dock. An air passage is defined in the insertion portion. The fan includes a casing defining a first air hole communicating with the through hole and a second air hole communicating with the air passage.

Abstract: An electronic device with a heat dissipation mechanism includes a main body, at least one supporting member, at least one driving device, a temperature sensor, and a controller. The main body defines a plurality of heat dissipation holes and at least one through hole. The heat dissipation holes are configured for dissipating heat of the electronic device. The supporting member passes through the through hole, and one end of the supporting member protrudes from the bottom of the main body. The driving device is configured for driving the supporting member to move along its axis, causing the electronic device to be kept in a flat state or in an inclined state. The temperature sensor is for sensing the temperature of the electronic device. The controller is for driving the driving device, causing the supporting member to move a predetermined distance along its axis, according to the sensed temperature.

Abstract: An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed.

Abstract: A projector includes a casing, a light source, and a heat dissipation device. The light source and the heat dissipation device are installed inside the casing. Two openings are formed at two sides of the casing opposing to the light source. A light shield is positioned on one of the two openings. The light shield has a fixing plate, and a plurality of first parallel light-shielding plates and a plurality of second parallel light-shielding plates for blocking light leaking from the openings.

Abstract: A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity.

Abstract: A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.

Abstract: A circuit board case including: a cover that includes a cover front wall and a rise wall connected to the cover front wall, the cover being attachable to an attaching object at a position on the rise wall opposite the cover front wall; and a case that houses a circuit board and includes a case front wall and a first wall surface oriented toward a direction opposite the case front wall, the case being housed in the cover such that the case front wall opposes the cover front wall. A fitting that engages the first wall surface is formed in the rise wall of the cover so as to urge the case toward the cover front wall and thus hold the case within the cover.

Abstract: An interior cooling structure according to the present invention includes a frame in which a plurality of circuit board modules are stacked, with electronic components mounted on the plurality of circuit board modules by being classified by function; an external housing which covers the frame together with the plurality of circuit board modules; a plurality of cooling devices which reduce temperature rises in the external housing caused by heat produced by the plurality of circuit board modules; and a heat generating region a partitioned in such away as to enclose a circuit board module which has the highest total power consumption out of the plurality of circuit board modules, wherein the plurality of cooling devices are arranged in such away as to reduce temperature rises in the heat generating region by displaying capacity higher than capacity of each of the cooling devices.

Abstract: A docking plenum for a rack is disclosed. The docking plenum includes a pair of sides that are coupled to first and second panels at the top of the docking plenum. The panels at the top of the docking plenum are separated from one another by an aperture. The docking plenum includes a front opening and a rear opening between the two sides. Each of the front opening and the rear opening are sized to receive a rack. The placement of a first rack in the front opening and a second rack in the rear opening creates a heated air cavity that is formed by the racks, the floor of the docking plenum, and the panels at the top of the docking plenum. When the racks are placed in the opening, and when one or more fans in the computer systems are activated, the fans draw air from outside the plenum across the interior of the computer systems. Heated air exits the computer systems and enters the heated air cavity. The heated air exits the heated air cavity through the aperture in the top of the docking plenum.

Abstract: Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.

Abstract: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.

Abstract: An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.

Abstract: An electronic assembly includes a casing structure defining an interior space for receiving at least one electronic component, an exterior space isolated from the interior space and a heat dissipating path along which heat generated by the electronic component is expelled from the interior space to the exterior space. The casing structure includes a first casing part and a would-be coupling unit. The first casing part includes an engagement unit having a bottom seat extending into the interior space and defining at least one flow passage along the heat dissipating path and a first coupling member projecting from the bottom seat. The would-be coupling unit includes a second coupling member coupled to the first coupling member within the interior space.

Abstract: In a flat panel display (FPD), a conductive heat proof plate is inserted between the back surface of a display panel, on which printed circuit boards (PCBs) and signal lines are formed, and signal lines. A back frame positioned on the back surface of the display panel is provided to cover the printed circuit boards and the signal lines. A shield can is formed in the internal surface region of the back frame corresponding to the printed circuit board on which a timing controller is mounted. The shield can is electrically coupled to the heat proof plate to improve resistance against the electromagnetic compatibility of a large flat panel display and to improve a thermal characteristic.

Abstract: An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the first zone may receive cool air directly from a cool air source and the second zone may receive cool air from a duct in fluid communication with the cool air source. In another example, both the first and second zones may receive cool air from the cool air source through a duct. In yet other examples, the cabinet may include a baffle between the cool air source and one of the first zones and the second zones to selectively control a quantity of cool air provided to the one of the first and second zones.

Abstract: Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.

Abstract: Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.

Abstract: A clothes dryer has horizontally extending louvres located in its rear cabinet wall that permit ambient air to enter the dryer cabinet during normal dryer operation. U-shaped cover brackets are positioned to horizontally extend and cover the louvres where the brackets each define a horizontally extending airflow channel having opposing open ends. Air entering the dryer flows through the louvres along the airflow channels and out through the open ends. The cover bracket helps to contain a fire within the dryer cabinet should one occur by restricting flow of ignited particles and other debris as a result of a fire from exiting through the louvre.

Abstract: In one embodiment, a tag includes a substantially flat portion having two faces and a length and a height, wherein the length is between about 1 inch and about 2½ inches. The height is between about ? inch and about 1 inch. The tag also includes at least one first member coupled to the flat portion and extending away therefrom at an angle of between about 45° and about 135° to a plane normal to a plane of the flat portion, the at least one first member being adapted for mounting in an opening of a surface of an electronics system thereby creating a removable coupling between the at least one first member and the surface of an electronics system when mounted.

Abstract: In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

Abstract: A cooling system includes a system air intake, a system air outlet, a fan, and a noise-reducing outlet. The fan includes a fan intake, and a fan outlet. The fan drives airflow, from the system air intake through the fan intake, the fan outlet, and the system air outlet. The noise-reducing outlet is located adjacent to the fan outlet. When the airflow exits through the fan outlet, a portion of the airflow exits through the noise-reducing outlet.

Abstract: An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.

Abstract: Provided is a printed circuit board having air vents and a semiconductor package that uses the printed circuit board having the air vents. The printed circuit board includes a substrate layer having a circuit pattern and a protection layer formed on the substrate layer, a molding region on which at least one semiconductor chip is mounted and for which a molding for the semiconductor chip is performed, and a plurality of air vents extending towards edges of the printed circuit board from the molding region.

Abstract: An electronic apparatus has a case having a bottom wall in which a first vent is formed and a circumferential wall connected to a perimeter of the bottom wall; a printed circuit board housed in the case; an electronic component which is mounted on the printed circuit board and generates heat when powered; a fan which has an air outlet and sends out a wind through the air outlet in such a direction that the wind goes away from a rotation axis of a rotor; a heat radiation member opposed to the first vent and the air outlet of the fan; and a heat pipe which is disposed between an associated part of the circumferential wall and the heat radiation member and transmits heat generated by the electronic component from the electronic component to the heat radiation member.

Abstract: The heat sink is provided perpendicularly to a bottom of a case of an on-board information device as the electronic device and adjacent to a right side plate of the case having windows (104) and (105). The heat sink includes grooves each vertically extending from the first to the third heat generating elements at a lower portion upward, and the through holes formed at positions corresponding to the windows of the right side plate of the case and at the upper portion of the heat sink along the grooves.

Abstract: A system for managing air flow through a body of an information handling system is disclosed. The disclosure provides a blank including a blank base plate and a blank ridge extending from the blank base plate. The blank base plate may be configured to match an architecture of both a processor socket and a bank of memory chip sockets. The blank may be configured to provide an impedance to air flow substantially similar to a total impedance provided by a processor and associated heat sink disposed in the processor socket and a bank of memory chips disposed in the bank of memory chip sockets.

Abstract: An electric equipment includes: first opening 7 provided on rear panel 4 to exhaust internal air out of casing 1; first partition 12 covering second opening 8 provided on left side panel 2 and having fourth opening 10; second partition 13 covering third opening 9 provided on right side panel 3 and having fifth opening 11; and radiator 14 disposed so as for opening 14C at one end to face opening 7. The configuration can prevent weld spatters or the like from coming into casing 1 directly.

Abstract: Information equipment includes an open/close mechanism that opens or closes exhaust ports, a cooling fan that dissipates heat in the information equipment into the air through the exhaust ports, a user state detecting part that detects a contact state in which the hand of a user is in contact with the information equipment or a closeness state in which the hand of the user is close to the information equipment, and a heat dissipation control part that controls an open/closed state of the open/close mechanism so that heat exhausted from the exhaust ports is not directed to the hand of the user that is contact with or close to the information equipment, in accordance with the contact state or the closeness state detected by the user state detecting part.

Abstract: An enclosure for electronic assemblies is provided, with a first deck surface and a first side wall with a short side and a long side and a second deck surface, disposed such that it faces the first deck surface, and a second side wall, disposed such that it faces the first side wall, with a short side and a long side, as well as with a first venting element, which extends in the direction of the long side along one of both side walls, and a plurality of plug-in slots for electronic assemblies that are arranged in parallel to one another, whereby the electronic assemblies are disposed, in the plugged-in state, vertically to both long sides of both side walls, and the first deck surface includes, along the end oriented toward the first side wall, a first opening and the first venting element, on the enclosure's outer side of the first deck surface, is disposed at least partially above the first opening, and the first and/or the second deck surface includes a second opening, along the end that faces the second

Abstract: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.

Abstract: A mount for a bezel/air filter assembly for use in mounting the bezel/air filter assembly directly to the rack or cabinet in which electrical equipment is mounted or contained. The mount is affixed to the rack or cabinet rather than to the electrical equipment mounted or contained in the rack or cabinet, making use of the normally unused frontal area along the rail forming the front of the rack or cabinet, maximizing air flow to the equipment mounted in the rack or contained in the cabinet and allowing greater packaging density. Also, by using the rack or cabinet (rather than the equipment) as a support element, the mount is substantially stronger than if the mount was affixed to the chassis.

Abstract: A method for manufacturing a vented board includes the steps of providing a metal plate, forming a mesh area in the plate, and punching a recessed portion on the plate to make at least one part of the mesh area extend to form a side wall of the recessed portion with a thickness of the mesh area substantially remaining constant. The mesh area includes a number of hole units. Each hole unit defines a hole and includes a plurality of borders bounding the hole. Every two adjacent hole units share a corresponding one of the plurality of borders. Before punching the recessed portion, a center line of each border is a curve line.

Abstract: A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power devices assembled juxtaposed to one another in a row, a fin style heatsink, an input bus bar and an output bus bar, and a circuit card assembly connected to the plurality of discrete power devices for managing power signals among the plurality of discrete power devices. The power panel includes a chassis, a mounting bracket with connector sockets formed in the mounting bracket, and a plurality of high power solid state power control modules modularly mounted in the connector sockets.

Abstract: A method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet.

Abstract: The invention relates to cooling techniques for portable devices such as, for example, mobile telephones. In one implementation, a portable device comprises one or more printed circuit boards (“PCBs”) supporting multiple heat-generating components, an airflow generator adapted to generate an airflow internally in the portable device, and a heat sink element thermally connected to the heat-generating components, wherein the heat sink element is adapted to receive heat from the heat-generating components for dissipation by the airflow.

Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.

Abstract: In one embodiment, an apparatus includes a card chamber, an air intake, an airway, an exhaust plenum, and at least one fan. At least one electronics card can be supported in the card chamber. Ambient air from outside the apparatus can flow into the card chamber via the air intake. The airway is located across the card chamber from the air intake. Air flows substantially linearly across the card chamber from the intake to the airway. The exhaust plenum is located adjacent the card chamber and the airway. The fan is operable to draw air from the airway into the exhaust plenum.

Abstract: An adjustable filler panel assembly, configured for use in an electronic equipment enclosure, includes a first panel and a second panel, each adapted to block airflow. The first panel has pairs of horizontally aligned adjustment openings formed therein, and the second panel has a pair of horizontally aligned attachment members disposed near one end. The first and second panels are connected to one another in an overlapping arrangement to form an air-blocking panel assembly with the attachment members of the second panel being aligned with and connected to a pair of adjustment openings of the first panel. In addition, the first panel and the second panel are telescopically adjustable relative to one another such that a length of the air-blocking panel assembly is selectively adjustable to fill at least a portion of an opening in the electronic equipment enclosure, thereby blocking air from flowing through the opening.

Abstract: An electronic device includes a fan including a frame, and an enclosure. The frame includes a plurality of mounting holes respectively positioned in a plurality of diagonal corners of the frame. The enclosure includes a plurality of sidewalls and a plurality of fixing members to fix the fan in the enclosure. Each of the plurality of fixing members projects from an inner surface of one of the plurality of sidewalls and is integrally formed with the sidewall. Each of the plurality of fixing members includes a clasping portion, and a cushioning portion between the clasping portion and the sidewall and having an angled shape. The plurality of cushioning portions are corresponding to the plurality of mounting holes and positioned between the fan and the sidewall.

Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Abstract: An electronic device enclosure includes a wall defining a slot therein, and a number of spaced bent plates formed on the wall bestriding the slot. Every two adjacent bent plates bound an opening in communication with the slot. The slot can allow more airflow to pass therethrough, and the number of bent plates can guide more airflow slantingly flowing towards the wall of the electronic device enclosure into or out the electronic device enclosure through the openings.

Abstract: A cooling unit to cool the display apparatus including a heat generating unit to generate heat and a casing to accommodate the heat generating unit, the cooling unit includes a cooling fan to generate air flow; a duct which is coupled with the casing and forms a cooling path to connect the cooling fan and the heat generating unit; an inlet portion which is provided to one side of the casing to communicate with the duct; an inlet grill which is provided in the inlet portion to guide air to be inhaled in a direction inclined to a rear surface of the casing; an outlet portion which is provided to an other side of the casing to communicate with the duct, being spaced from the inlet portion; and an outlet grill which is provided in the outlet portion to guide air to be exhaled in a direction inclined to a rear surface of the casing, wherein the exhaled direction provided by the outlet grill is different from the air-inhaling direction provided by the inlet grill.