Abstract: In the electronic device, an inlet 10 is provided on a front face 1c of a first housing 1. Thus, it is possible to reduce the possibility of the inlet 10 being blocked by objects. That is, when a user uses a notebook computer in a normal position, his body opposes the front face 1c in many cases. Thus, when the inlet is provided on the front face 1c, the inlet is less likely to be blocked than when it is provided on any other face of the first housing 1. For this reason, the cooling efficiency within the first housing 1 does not drop.

Abstract: A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to the outside of the housings by the airflow. Air introduction plates inclined to change the direction of the airflow are arranged at the suction opening (4), and a large number of projections are formed on the surfaces of the air introduction plates. The device for air-cooling an electronic apparatus has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.

Abstract: The present invention is a compact, highly efficient method for convectively cooling substrates, where the substrates contain light emitting diodes (LEDs) or other highly dissipative electronic components. The methodology exhibits very low acoustic noise, extended operating life of moving parts and minimum susceptibility to dust. Also, the improved cooling methodology for high brightness light emitting diodes employs one or more high-density, high-surface-area, single or multiple-element metallic structures having superior heat-transfer properties in the presence of low-speed, minimally turbulent air flow, and enhanced electronic-power-management.

Abstract: An electronic device includes an enclosure. The enclosure includes a main body and a cover attached to the main body. A first air intake and a second air outlet are defined in the cover. A first heat device and a circuit board are attached to the main body. The first heat device includes a plurality of first fins. A second heat device is located on the circuit board and configured to dissipate heat from a CPU located on the circuit board. A heat pipe is located between the first heat device and the second heat device. A distance between adjacent first fins is in a range of 5.3-5.7 mm, and the second heat device, the first heat device and the first air outlet cooperatively define an airflow passage configured for directing air to flow through to the electronic device.

Abstract: An electronic device module includes an electronic device, a rack accommodating the electronic device, and a shield adjusting assembly. The rack defines a number of ventilation holes, and the shield adjusting assembly defines a number of through holes. The electronic device is placed in the rack to drive the shield adjusting assembly to a first position in which the through holes align with the ventilation holes. When the electronic device is detached from the rack, the shield adjusting assembly is restored by a resilient element to a second position in which the through holes offset the ventilation holes such that the ventilation holes are shielded.

Abstract: A housing of an electronic device includes a sidewall and a heat dissipating zone on the sidewall. The heat dissipating zone includes a reinforcement portion on the sidewall. The reinforcement portion defines heat dissipating holes. The reinforcement portion can extend inwardly from the sidewall of the housing or outwardly from the sidewall of the housing. Each heat dissipating hole has a width equal to or less than 3.5 millimeters.

Abstract: A power converter design is disclosed with a novel approach to thermal management which enhances the performance and significantly reduces the cost of the converter compared to prior art power converters. The invention minimizes the heating of one power component by another within the power converter and therefore enables the power converter to work at higher power levels. Essentially, the power converter uses a heatsink having a high length to width ratio, a linear array of power components thermally coupled to the heatsink parallel to the long axis of the heatsink and a heat removal system which produces the highest cross sectional thermal flux perpendicular to said long axis. In addition, a number of ancillary thermal management techniques are used to significantly enhance the value of this basic approach. A specific circuit design for the power converter is not disclosed or discussed as the invention can be applied to any number of power converter electrical topologies.

Abstract: The present invention relates generally to efficiently cooling converter and inverter components of a drive system in accordance with present embodiments. More specifically, present techniques relate to a motor drive duct system that facilitates efficient cooling and access to motor drive components. The motor drive duct system includes duct channel paths that are parallel and adjacent to one another. These channels are formed by various duct segments coupled together or integrated to form the duct system. In particular, the duct system includes a converter section that houses a converter heat sink, an inverter section that houses an inverter heat sink, an exhaust section, and an air inlet section. The air inlet section may include a blower for blowing cooling air through the duct channel paths of the converter and inverter sections. The converter section and the inverter section are configured to be attached and detached from each other at end sections that are angled to receive one another.

Abstract: With respect to a housing device having a plurality of slots in which plug-in units are mountable, division plates corresponding to the positions of the openings of the slots are put in the inside of a baffle section for changing the direction of the flow of cooling air released from the slots, and the division plates are used to divide the inside space of the baffle section into a plurality of regions corresponding to the slots, thereby reducing mutual interference of the cooling air from the slots in the baffle section and preventing a further increase in differences in the amount of passing air among the slots. Thereby, even if any difference occurs in the amount of passing air among the slots due to a structural factor, it is possible to reduce the deterioration of the cooling capacity of a slot through which relatively less amount of air passes.

Abstract: A mobile measurement device, particularly for temporary use in or on vehicles, on stationary engines, or on test benches, consists of individual components (2) that might have different working temperatures, disposed in a common housing (1). Furthermore, at least one fan (6) is provided. In order to allow a very broad range of use with regard to the outside temperature range, at the smallest and lightest possible construction, in order to guarantee simple transport and great mobility, and reliable measurements within this range, the housing (1) is structured essentially in gastight manner.

Abstract: According to one embodiment, a display apparatus is provided. The display apparatus includes: a display panel; a case including a cover portion provided with an air outlet and a first air inlet; a mask portion provided with an opening which is connected to the cover portion via the display panel and through which the display panel is exposed, a slant portion which extends to the cover portion, and a second air inlet located at the slant portion. The apparatus further includes: a support stand which supports the case; a circuit board housed in the case and mounted with a heat generation body; a heat sink housed in the case and configured to face the air outlet; a heat pipe which thermally connects the heat generation body and the heat sink; and a fan including an air discharge outlet which is directed to the heat sink.

Abstract: A gas ejector capable of effectively dissipating heat generated from a heater while inhibiting noise generation as little as possible, an electronic device equipped with the gas ejector, and a gas-ejecting method are offered. A gas ejector (1) according to the present invention includes a vibrator (25) and ejects gas in a form of a pulsating flow such that vibration of the vibrator allows sound waves respectively generated upon ejection of the gas ejected from nozzles (23) and (24) to deaden out each other. Also, a control section (20) optimizes the frequency of the vibrator (25), hence, by increasing the gas ejection quantity as much as possible while inhibiting noise generation, heat of a heater is effectively dissipated.

Abstract: A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.

Abstract: A cooling system includes a system air intake, a system air outlet, a fan, and a noise-reducing outlet. The fan includes a fan intake, and a fan outlet. The fan drives airflow, from the system air intake through the fan intake, the fan outlet, and the system air outlet. The noise-reducing outlet is located adjacent to the fan outlet. When the airflow exits through the fan outlet, a portion of the airflow exits through the noise-reducing outlet.

Abstract: An electronic device includes a base, a motherboard having an electronic component, a fan unit, and an airflow guiding cover. The airflow cover includes a top panel and two side panels. An air channel is bounded by the top panel and the side panels. The electronic component is received in the air channel. The air channel includes opposite open ends. The fan unit aligns with one of the open ends of the air channel, to draw airflow in the air channel out. The top panel defines a plurality of through holes adjacent to the fan unit, to discharge a part of the airflow in the air channel out of the airflow guiding cover, for reducing change of the pressure gradient of the airflow, thereby reducing aerodynamic noise.

Abstract: A housing for protectively enclosing a printed circuit board, including a base, and a pair of parallel spaced vertical housing side walls extending upwardly from the base to define a chamber that receives the central portion of the printed circuit board, whereby the vertical edge portions of the board extend outwardly beyond the corresponding vertical edges of the housing side walls, respectively. Vertical side members having generally U-shaped horizontal cross-sectional configurations are mounted on the outwardly extending edge portions of the printed circuit board, respectively, with the leg portions of each side member extending between the housing side walls and the printed circuit board, respectively, whereby portions of housing side walls overlap the side member leg portions. The upper end of the chamber is closed by a lid member that is fastened between the upper ends of the side members.

Abstract: An exemplary fan assembly includes a fan and a muffler. The fan includes an air outlet. The muffler is disposed at the air outlet of the fan. The muffler includes a base plate. The base plate defines vents therein and blades thereon corresponding to the air outlet of the fan. The blades extend from the base plate toward the fan. An electronic device incorporating the fan assembly is also provided.

Abstract: To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Abstract: A network device includes an airflow baffle. The baffle redirects cooling air toward a transceiver cage to increase a rate of heat transfer from electronic devices on the transceiver. The baffle is bi-directional, so that cooling air is redirected regardless of whether it flows in a front-to-back or back-to-front direction.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a cooling fan in the housing including an intake and a discharge hole, and a wind shielding portion between the intake of the cooling fan and the discharge hole of the cooling fan. The wind shielding portion partitions at least partially an inner space of the housing.

Abstract: This document describes various techniques for powering a computer data center using a wind-powered generator. The computer data center may include network connected servers that are electrically connected to, and powered by, the wind-powered generator.

Abstract: An electronic device includes a printed circuit board and a heat dissipation module. The printed circuit board has a first heat-generating electronic component and a number of second heat-generating electronic components. The heat dissipation module includes a heat sink thermally engaging on the first heat-generating electronic component and an enclosure enclosing the printed circuit board. The heat sink includes a number of fins. The enclosure extends an inner casing to envelop the fins of the heat sink. The enclosure defines a number of slots letting the casing communicate with an exterior of the enclosure. The casing separates the fins from the second heat-generating electronic component.

Abstract: Solid state switching device having a heatsink, a solid state switching element in heat conductive relationship with the heatsink, and an enclosure having ventilation openings adjacent to the heatsink through which air can flow to remove heat from the heatsink. In some disclosed embodiments, the heatsink has fins and ducts aligned with ventilation openings in the enclosure for removing heat by radiation and convection. In others, the heatsink is a generally planar baseplate, with ventilation openings in a side wall of the enclosure next to the baseplate for removing heat from the device. Spacers project laterally from the devices and permit a plurality of the devices to mounted side-by-side with space between the devices through which air can flow.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: Articles for supporting computers on users' laps and for isolating the users from heat from the computers. Embodiments may include a body, a top surface for contacting the computer, a bottom surface for contacting the user's lap, and back and front walls or surfaces. In various embodiments, the body defines a hollow area and a side opening, the back is taller than the front, the top surface is at an acute angle to the bottom surface, the bottom surface has a greater horizontal dimension from front to back than the top surface, the bottom surface has a greater horizontal dimension from left to right than the top surface; the article has a cross section that is a trapezoid (e.g., isosceles), the article comprises a foam portion (e.g., tubular) and fabric covering the foam portion, or a combination thereof. In some embodiments, each surface comprises the foam covered with fabric.

Abstract: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.

Abstract: An arrangement of a mother circuit board and daughter circuit boards in a power instrument improves current and voltage capabilities. A mother board is mounted to a base panel of an enclosure, and a number of daughter boards are attached to and extend from the mother board. Each daughter board has substantially identical circuitry and produces substantially the same amount of current. The daughter boards together provide a total output current equal to a sum of each individually generated current. The amount of power generated by the instrument can be increased by attaching additional daughter boards to the mother board. The total current produced by the daughter boards is provided to and output from the mother board via a low inductance output path. The low inductance output path ensures that a sudden increase in current does not result in a large voltage spike that adversely affects instrument operation.

Abstract: A portable electronic device includes a housing formed with a first receiving space, and a second receiving space communicating spatially with the first receiving space. A keyboard is disposed within the second receiving space. A pop-up mechanism is disposed within the first receiving space, and includes a hollow post body disposed within the first receiving space, and an ejecting member disposed movably within the hollow post body and abutting against a bottom side of the keyboard. The ejecting member is movable between first and second height positions when the keyboard is pressed downwardly. When the ejecting member is in the first height position, the keyboard is in a horizontal position within the second receiving space. When the ejecting member is in the second height position, the keyboard is in a tilted position tilting outwardly from the second receiving space.

Abstract: An electronic component includes a housing having an inlet section, a mid-section, and an outlet section, mounting components for mounting the housing within an electronics cabinet, at least one movable louver positioned in at least one of the inlet section, the mid-section, and the outlet section, an actuator configured to manipulate the at least one movable louver to vary a volume flowrate of airflow through the housing, and a controller configured to operate the actuator to one of substantially maintain an environmental condition change from the inlet to the outlet within a predetermined range and substantially restrict airflow through the housing when the electronic component is in a relatively low operational state.

Abstract: A housing includes a main body defining a window and at least one glue injecting hole near the window. A screen guard covering the window, defines a slit between the main body and the screen guard. A glue layer located in the slit adheres the screen guard to the main body, wherein the at least one glue injecting hole communicates with the window. The glue layer is formed by injecting glue into the slit from at least one glue injecting hole.

Abstract: A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel.

Abstract: An electronic system enclosure including cooling units to regulate temperature of electrical components therein. In one embodiment, the electronic system enclosure includes field replaceable units which facilitate concurrent maintenance. In this embodiment, air pressure within the electronic system enclosure is maintained while a field replaceable unit is removed. Also in this embodiment, cooling of the remaining electrical components of the electronic system enclosure is continued during removal of a field replaceable unit.

Abstract: A high density switching platform arranges multiple circuit cards interconnected by a single backplane. A single backplane has three sets of circuit cards on one side. A shared ventilation chamber on the other side of the backplane draws ambient air through each of the three sets of circuit cards independently. The air flow also allows cooling of power modules that supply power to the circuit cards. The platform allows interconnection of its circuit cards with circuit cards in adjacent platforms.

Abstract: Settop box (STB) or other housing for use in protecting electronic components. The housing may include an interior portion for protecting the components. The housing may include feet on a bottom and side to facilitate stabilizing the STB in a vertical and horizontal position. The housing may include vents to facilitate air flow to the interior. The vents may be associated with blocking aspects to protect against blocking the vents.

Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Abstract: In a method of controlling vent tiles, the vent tiles are initially correlated with at least one rack. A vent tile family (VTF) of the at least one rack is determined, where the VTF includes vent tiles that have at least a predefined level of influence over the at least one rack as determined by the correlation between the vent tiles and the at least one rack. In addition, a vent control family (VCF) from the vent tiles in the VTF is identified, where the VCF includes vent tiles having an associated at least one rack whose inlet condition is outside of a predefined threshold. Moreover, the vent tiles in the VCF are controlled on a weighted basis determined by the correlation between the vent tiles and the at least one rack.

Abstract: A cooling duct for cooling heat generating elements inside a casing with outside air includes an intake vent through which outside air taken in from outside the casing is drawn, a guiding unit configured to guide the outside air drawn through the intake vent to a first target element being a heat generating element to be cooled, a discharge vent through which the outside air guided by the guiding unit is discharged to the first target element, and a branch pipe provided in the guiding unit and configured to guide part of the outside air flowing in the guiding unit to a second target element being another heat generating element to be cooled.

Abstract: A tray-type structure device includes a side plate, a front plate attached to a forward end of the side plate, having the functions of opening and closing, and positioned on the front side of a housing, a top plate attached to an upper end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, a bottom plate attached to a lower end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, and a back plate attached to a rearward end of the side plate, having the functions of opening and closing, and positioned on a side of the housing toward a backboard. The device has a tray structure having a tray-like shape formed by the front plate, top plate, bottom plate, side plate and back plate.

Abstract: A computer system includes a chassis with a fan installed therein, a cover plate adapted to be attached to the chassis, and a noise absorber attached to the cover plate. The fan is capable of generating an amount of air flow for cooling at least a component in the chassis. The noise absorber includes a plurality of protrusions facing the fan and capable of damping the air flow that impacts the cover plate and decreasing an acoustic noise level of the computer system.

Abstract: A support part serves is arranged in an instrument panel of a motor vehicle to hold a vehicle data display unit having an integrated navigation or radio unit. The support part has a single-piece frame composed of a magnesium pressure die cast material with a central holding frame for the unit and lateral holding frames for the air outlets. The support part is connected at one side to the instrument panel and another side to the cockpit cross member. Centering receptacles for the unit and further centering receptacles for the air outlets are arranged in the central holding frame and in the two lateral holding frames. Centering elements are arranged on the unit and on the air outlet correspondingly to the centering receptacles of the holding frames.

Abstract: Articles for supporting a computer on a user's lap, for cooling the computer, and for isolating the user from heat from the computer. Different embodiments may include a top surface for contacting the computer, a bottom surface for contacting the user's lap, a hollow area, a top aperture through the top surface to the hollow area, a fan, or a combination thereof. The top surface may be at an acute angle to the bottom surface, the fan may include an electric motor powered through a USB cable, or both, as examples. Various embodiments may include at least one side opening or rear opening to the hollow area to allow air to circulate, a foam portion, fabric covering the foam, a plastic portion which provides increased stiffness, or a combination thereof.

Abstract: An electronic apparatus comprising a casing forming a first inflow entrance and an outflow exit, the first inflow entrance allowing entry of a first airflow, the outflow exit allowing exit of a second airflow ; a light source module disposed in the casing; and a blower disposed in the casing, the blower having an outer wall, a blower flow inlet, a flow exit; a PCB disposed in the casing, the PCB having a heat-generation element, a first flow-conduit being formed between the outer wall and the PCB, and the a heat-generation element being located at the first flow-conduit; wherein, as heat ventilation is performed in the electronic apparatus, the first airflow is introduced into the blower flow inlet via the first flow-conduit, and an airflow exiting from the flow exit is directed to exit the casing from the outflow exit after taking heat from light source module.

Abstract: A cooling element for an electronic apparatus can include an inlet for receiving fluid, an outlet for forwarding fluid from the cooling element, and multiple pipes providing parallel fluid paths for passing the fluid from the inlet to the outlet. To obtain a simple and efficient cooling element, multiple base plates for receiving electronic components can be attached to the pipes for conducting heat generated by the electronic components to the fluid in the pipes.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: An electronic device housing includes a housing body, a movable foot pad mechanism disposed in housing body, a ventilation grille, a fan, and a fan switch connected electrically to the fan. The movable foot pad mechanism includes a foot pad pivoted to a bottom wall of the housing body. The foot pad is turnable pivotally to prop up the housing body so as to increase a space below a bottom of housing body. When the foot pad is being turned pivotally to prop up the housing body, the ventilation grille is moved simultaneously so as to make the space inside the housing body open to the ambient environment, and the fan is activated for heat dissipation, thereby increasing the heat dissipation efficiency of the electronic device housing.

Abstract: An outdoor equipment cabinet includes a housing with an equipment compartment therein. An intake air vent and an exit air vent are formed in the housing. A fan is mounted within the housing for pulling air into the intake air vent, moving an air stream through the equipment compartment, and pushing air out of the exit air vent. A membrane is disposed adjacent the intake air vent. The membrane allows air to pass therethrough, but resists the passage of water and contaminants therethrough. In some embodiments, a baffling plate is disposed to direct the air stream within the equipment compartment, and/or the fan speed is controlled by a temperature sensor, and/or a clogging of the membrane is monitored and reported, and/or the intake air vent is located in a first door and the exit air vent is located in a second door of the cabinet.

Abstract: According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation.

Abstract: A fan [36] and storage device [37] mounting assembly [1] for an electronic device comprises a base [2] having opposing front [4] and rear [5] walls. The rear wall [5] has a plurality of ventilation openings [11] provided therein. A support [16] has a fan [36] mount [32] arranged adjacent to the front wall [4] and substantially perpendicular thereto and a storage device [37] receiving opening [20] arranged between the fan mount [32] and the ventilation openings [11].