Abstract: An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.

Abstract: In the electronic device, an inlet 10 is provided on a front face 1c of a first housing 1. Thus, it is possible to reduce the possibility of the inlet 10 being blocked by objects. That is, when a user uses a notebook computer in a normal position, his body opposes the front face 1c in many cases. Thus, when the inlet is provided on the front face 1c, the inlet is less likely to be blocked than when it is provided on any other face of the first housing 1. For this reason, the cooling efficiency within the first housing 1 does not drop.

Abstract: A notebook computer 1 is provided with: a casing in which a CPU is accommodated; a heat-dissipating component 37 having a plurality of fins; and a fan 31, and operates such that heat transferred from the CPU to the heat-dissipating component 37 is heat-exchanged with air supplied from the fan 31, and released to the exterior of the casing. The heat-dissipating component 37 is disposed at an air outlet 32b of the fan 31. An opening 35 is formed, between the air outlet 32b and a fan main unit 33, in a fan case 32. First shutter means 39 is provided on a discharge outlet surface of the heat-dissipating component 37. With this structure, increase in cost and weight can be restrained, and dust on the heat-dissipating component can be removed with a simplified structure.

Abstract: The exemplary embodiments herein provide a figure eight closed loop of circulating gas pathways wrapping around an electronic display. One or more open loop ambient air pathways may pass through the figure eight but do not allow the circulating gas and the ambient air to mix. In some embodiments, the open loop ambient air pathway travels along a rear surface of the electronic display. In some embodiments, the circulating gas pathways contain a front channel placed in front of the electronic display, a rear channel placed behind the electronic display, and a center channel placed between the front and rear channels. Pass-through apertures may be placed within the path of the circulating gas and/or the ambient air to allow the paths of the two gaseous matters to cross without allowing them to mix with one another.

Abstract: A digital sign and a method of driving a digital sign are provided. The digital sign may include a case, a display panel provided in the case, and a circuit unit to drive the display panel. An inner space of the case may include a first space and a second space, with a first end of the first space connected to a first end of the second space. A suction port may be formed in the case to guide external air into the inner space, and a discharge port may be formed in the case to discharge the air from the case. A circulation fan may be provided in the inner space to induce flow of air in the inner space, and a circulation damper may be disposed between second ends of the first space and the second space to open and close the second ends thereof. The air introduced through the suction port passes through the inner space of the case and is discharged through the discharge port when the circulation damper is closed, and the air circulates in the first space and the second space when the circulation damper is opened.

Abstract: A heat-dissipation structure includes a first carbon nanotube layer and a metal mesh layer. The first carbon nanotube layer and the metal mesh layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper. An electronic device applying the heat-dissipation structure is also disclosed.

Abstract: An expansion apparatus suitable for an electronic apparatus is provided. The expansion apparatus includes a base, a supporter and an airflow guiding structure. The base has a first fan disposed therein. The supporter is pivoted to the base along a rotating axis and has a cooling channel. The cooling channel has a first port and a second port opposite to the first port. When the electronic apparatus is assembled to the supporter, the second port of the cooling channel faces to the electronic apparatus. The airflow guiding structure is disposed between the supporter and the base movably. When the supporter is pivoted relative to the base to an expanded state, an active airflow generated by the first fan is guided by the airflow guiding structure to pass through the base and the electronic apparatus. An electronic equipment including the expansion apparatus is also provided.

Abstract: A chassis for a network storage system contains a first thermal chamber that houses conventional electronic components and a second thermal chamber that houses non-volatile solid state memory such as flash memory. A cooling system keeps the electronics in first thermal chamber below their maximum junction temperature. Meanwhile, a temperature regulating system maintains the solid state memory in the second thermal chamber within a range of a preferred operating temperature selected to extend the lifetime and/or improve the reliability of the solid state memory. Thus, the chassis provides dual zone temperature control to improve performance of the network storage system.

Abstract: An electric apparatus is disclosed having at least two cooling elements and a first fan arrangement for cooling the at least two cooling elements with a first air flow. A second fan arrangement can cool the at least two cooling elements with a second air flow. The second fan arrangement passes a second air flow in a different flow direction as compared to the first air flow, and the first and second air flows are arranged to cool different parts of the at least two cooling elements.

Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.

Abstract: A welding power supply includes a housing and a one-piece chassis. The one-piece chassis is coupled to the housing and configured to be enclosed within the housing. Moreover, the one-piece chassis is configured to be selectively removable from the housing and the one-piece chassis is configured to have multiple components coupled thereto. The components include one or more transformers, a fan blade, one or more rectifiers, one or more inductors, and control circuitry.

Abstract: A modular datacenter having multiple levels. The levels are stackable, and the number of levels can be selected based upon a desired installation. The datacenter includes walls or other structures that define ducts that extend through all the levels. The ducts can be used as hot and cold aisles for servers and networking equipment. The ducts can be formed by concentric cylinders.

Abstract: Articles for supporting computers on users' laps and for isolating the users from heat from the computers. Embodiments may include a body, a top surface for contacting the computer, a bottom surface for contacting the user's lap, and back and front walls or surfaces. In various embodiments, the body defines a hollow area and a side opening, the back is taller than the front, the top surface is at an acute angle to the bottom surface, the bottom surface has a greater horizontal dimension from front to back than the top surface, the bottom surface has a greater horizontal dimension from left to right than the top surface; the article has a cross section that is a trapezoid (e.g., isosceles), the article comprises a foam portion (e.g., tubular) and fabric covering the foam portion, or a combination thereof. In some embodiments, each surface comprises the foam covered with fabric.

Abstract: A fan plate system can include a fan plate and may or may not include the fan. The fan plate can include one or more surfaces. The fan plate can also include a grill configured to allow air to flow into or from a fan through the grill. The one or more surfaces can be configured to connect to a first end of an outer housing of the fan. The one or more surfaces can also provide a gap between the first end of the fan outer housing and the grill when the fan outer housing is connected to the fan plate. In some embodiments, an electronic device can include a fan plate system.

Abstract: A server includes a rack, at least one server unit, at least one communication exchange unit, at least one rack control unit and an electric power transmission unit. The rack has a plurality of shelving spaces. The server unit, the communication exchange unit, and the rack control unit are moved into or moved out of a corresponding shelving space along a horizontal axis, respectively. The server unit is communicatively connected to the communication exchange unit, and communicates with the rack control unit through the communication exchange unit. The electric power transmission unit is disposed in the rack and runs adjacent to the shelving spaces along a vertical axis. After the server unit, the communication exchange unit and the rack control unit are moved into corresponding shelving spaces, the server unit, the communication exchange unit and the rack control unit are electrically connected to the electric power transmission unit.

Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.

Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.

Abstract: Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are laterally oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.

Abstract: A fan control system. The fan control system has a programmable microcontroller to receive an input signal and a rotation speed signal corresponding to the actual rotation speed of the fan motor, determining an output signal according to the input signal and the rotation speed signal, and outputting the output signal; and a fan-driving unit to receive the output signal and adjusting the rotation speed for driving the fan motor according to the output signal. The rotation speed is in a relation of a multi-stage function to the input signal.

Abstract: A method and system of cooling a server rack unit is described herein. A server rack for housing certain devices may be configured to receive a first air flow at a server rack front. Each device may form a wall at the back of the device creating a channel between the wall and the server rack back. The camber may collect warm air created by the first air flow as it extends over the at least one server. A first surface of the server may define at least one server rack opening allowing the warm air in the channel to exit the server rack.

Abstract: There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.

Abstract: At the time of a fan failure of a plurality of fans for cooling redundant controllers, data loss can be avoided even if a power source of each controller is controlled. A storage system includes: a first controller for controlling a first power source; a plurality of first fans for cooling the first controller; a second controller for controlling a second power source; a plurality of second fans for cooling the second controller; and a storage device including a plurality of storage units; wherein if a fan failure of the first fans occurs, the first controller controls the first power source in a standby state on condition that the second controller is in a normal state; and if the second power source is in the standby state, the first controller executes destaging processing and then controls the first power source in the standby state.

Abstract: A notebook computer is provided with: a casing in which electronic components including a CPU are accommodated; and a heat-dissipating unit including a heat-dissipating component 37 having plural fins, and a fan 31 for supplying air to the heat-dissipating component 37. A communicating path 35 is formed between an air outlet 32b of the fan 31 and a surface 37b of the heat-dissipating component 37 on a side thereof that opposes the fan 31, so as to communicate them. An opening 32c is formed in a fan case 32 between the air outlet 32b and a main unit 33 of the fan. A duct 36 is provided so as to communicate the opening 32c with the heat-dissipating component 37. With this structure, an electronic device can be provided which has a built-in heat-dissipating unit that can restrain increase in cost and weight, and remove dust on the heat-dissipating component.

Abstract: A parallel redundant fan system includes at least first and second fans located adjacent each other. Each fan includes: (i) a fan housing defining a fan chamber in which an impeller is supported for rotation about an axis of rotation; (ii) a first chamber outlet in communication with the fan chamber and defined by an opening in a first wall of the fan housing; (iii) a second chamber outlet in communication with the fan chamber and defined by an opening in a second wall of the fan housing; and, (iii) first and second backflow prevention dampers respectively associated with the first and second chamber outlets. The first and second dampers respectively include first and second damper plates that selectively pivot from their closed positions toward their opened positions against the closing force of respective first and second counterweights in response to exhaust air flow pressure exerted thereon.

Abstract: A display device including a case having a transparent window that forms one side of a first air flow path, a display unit including a display surface that faces the transparent window to form the other side of the first air flow path, a ventilator to supply air to the first air flow path, and a diffuser disposed at an exit of the first air flow path and having a cross-sectional area that is gradually increased.

Abstract: A connection arm couples to a cooling fan main body to enclose wires extending from the main body to an end of the connection arm that holds a plug of the wires in a position aligned with a circuit board cooling fan socket. Wires enclosed in the connection arm slip through a slot along the side of the connection arm and are protected from view by a cable cover disposed along the top surface of the cooling fan and connection arm.

Abstract: An electronic apparatus includes: a casing with an air inlet and an air outlet; a plurality of walls that each extend in a direction in which the air inlet is opened, the plurality of walls forming a serpentine ventilation path inside the casing; and an air blower that forms a flow of cooling air, the cooling air flowing from the air inlet to the air outlet through the ventilation path.

Abstract: A drive system for a grid blower of a vehicle is provided. The system includes: an electrical bus, a grid of resistive elements connected to the electrical bus, the grid of resistive elements configured to thermally dissipate electrical power generated from braking of the vehicle, the electrical power being transmitted on the electrical bus to the grid of resistive elements, an electrical power modulation device configured to modify electrical power received from at least one of the electrical bus and the grid of resistive elements, and a grid blower motor coupled to an output of the electrical power modulation device, wherein a speed of the grid blower motor varies based on the electrical power that has been modified by the electrical power modulation device.

Abstract: A fan speed control system includes a BMC, a CPLD, and a temperature sensor. The BMC includes an operation signal sending pin. The CPLD includes an operation signal receiving pin connected to the operation signal sending pin. The temperature sensor is configured for detecting temperatures of electronic components. When the BMC fails to operate normally, the operation signal sending pin sends a BMC_fail signal to the operation signal receiving pin, the temperature sensor sends the detected temperatures to the CPLD. The CPLD compares the detected temperatures with the corresponding preset standard temperatures and adjusts the speed of the fan module according to a comparing result.

Abstract: An improved electronic communications system and process 100 with front to back cooling can be provided in which the flow of influent cooling air can be directed horizontally through an intake cooling plenum chamber 145-146 positioned above or below line cards 127-129 and then passed downwardly through an inlet side cooling plenum 139-141. The cooling air can thereafter be propelled sideways, laterally and horizontally across passageways 138 between the line cards to remove heat generated by the line cards. The effluent heated air can be passed upwardly through an outlet side cooling plenum 142-144 and can be discharged through an exhaust cooling plenum to chamber 147-148 which can be diagonally separated from the intake cooling plenum chamber 145-146 by a fluid-impermeable plate 149-151.

Abstract: A storage apparatus S comprises a disk controller for controlling data I/O processing between a host H and a disk unit. The disk controller includes a plurality of circuit board modules each having a circuit board and a module case storing the same, and a chassis shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module is configured to introduce cooling air from a cooling fan through an opening provided on at least one side surface toward a circuit component mounted on the circuit board. A MP module is configured to introduce cooling air by a cooling fan through an opening provide on a front surface of the module case.

Abstract: A method and apparatus of cooling electronic components when replacing a cooling device in an information technology system are disclosed. The apparatus may include first and second cooling device trays that may be slidably mounted within an information technology system. The cooling device trays may include one or more cooling devices that are movably mounted to the cooling device trays. The apparatus may pivot one or more of the cooling devices when a pivot member contacts a fixed member with the chassis.

Abstract: A fan module includes a housing and at least one impeller. The housing includes first and second air channels. The housing further includes an axial air inlet in communication with the first air channel and a radial air inlet in communication with the second air channel. The housing further includes at least one radial air outlet in communication with the first and second air channels. The at least one impeller draws external air into the housing via the axial air inlet or the radial air inlet and expels air out of the housing via the at last one radial air outlet. By such an arrangement, external air can be guided into the fan module via different directions, providing an enhanced cooling effect.

Abstract: An electronic device with a housing or enclosure. At least one heat-generating electronic component is contained within the housing. The electronic device further comprises a fan module configured to direct cooling air over the at least one heat-generating electronic component. The fan module is pivotably secured to the housing and capable of pivoting through at least 180°, such that the cooling air can be directed in a front-to-back flow path or a back-to-front flow path. Either of a manufacturer and a customer can reconfigure the direction of airflow.

Abstract: There is disclosed a digital signage including a display panel, a housing having the display panel arranged in a front surface, the housing comprising an inlet formed in a lower portion of a lateral surface and an outlet formed in an upper portion of a back surface or a top surface, a fan configured to suck air into the housing via the inlet and to blow the air exhausting via the outlet after penetrating a back surface of the display, a pre-filter mounted adjacent to the inlet, the pre-filter comprising a plurality of mesh holes, and a membrane filter configured to penetrate the air having penetrated the pre-filter there through and to filter moisture and foreign substances, such that may have a slim design and exhaust the heat generated from a display panel and a driving circuit board effectively.

Abstract: The exemplary embodiments disclosed herein provide a heat exchanger assembly for cooling power module bricks, having a plurality of heat exchanger layers where a top layer is in conductive thermal communication with the power module brick. A series of metallic plates are preferably positioned within each heat exchanger layer and are preferably aligned with the power module brick. A circulating fan may be positioned to force circulating gas across the power module brick and through the heat exchanger. An external air fan may be positioned to force external air through the heat exchanger. Pass through junctions may be positioned near edges of the heat exchanger to permit the circulating gas to cross paths with the external air without allowing the two gas flows to mix with one another.

Abstract: An electronic device includes a main body and a number of fan modules. The main body defines a number of vents in a top of the main body. The fan modules are mounted to the top of the main body. Each fan module includes a housing and a fan. The housing includes a side plate defining an opening aligned with the vents. A stop plate is pivotably connected to a first end of the opening, and is operable to cover the opening. The fan is mounted in the housing, and is near a second end of the opening opposite to the first end.

Abstract: A notebook computer 1 is provided with: a casing 20a in which electronic components including a CPU are accommodated; and a heat-dissipating unit 30 that includes a heat-dissipating component 37 having a plurality of fins 37a to which heat is transferred from the CPU, and a fan 31 for supplying air to the heat-dissipating component 37, and, in the heat dissipating unit 30, heat exchange between heat transferred from the CPU to the heat-dissipating component 37, and air supplied from the fan 31, is performed to release heated air to the exterior of the casing 20a. A communicating path 36 is formed, between an air outlet 32b of the fan 31, and an inflow surface 37b of the heat-dissipating component 37, for communicating therebetween, and a dust removal path 38 is formed in the communicating path 36 so as to communicate with the exterior of the casing 20a.

Abstract: A rack-mounted server system includes a rack, a number of server units mounted in the rack adjacent to a front end of the rack, a fan module, and a number of power units located beside the server units. The rack includes a back wall defining an air outlet aligned with the server units. The fan module is fixed to the back wall and fitted in the air outlet. The power units are arranged in front of the fan module. An air-guide plate is mounted in the rack between the fan module and the power units to guide a part of the airflow generated by the fan module to flow through the power units.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: A computer includes a backplane, an enclosure, a motherboard, a shielding cover, a guiding plate, and a fan. The enclosure covers on the backplane. The motherboard is located on the backplane. The motherboard includes a plurality of heat generating elements. A shielding cover covers the motherboard and located in the enclosure. The shielding space is defined in the shielding cover. The guiding plate is located on the backplane adjacent to the shielding cover. A heat dissipating space is defined between the shielding cover and the guiding plate. The heat dissipating space communicates with the shielding space. The fan is located in the heat dissipating space. The fan is adapted to generate airflow from the shielding space and is adapted to dissipate the airflow through the heat dissipating space.

Abstract: A module for a telecommunications subrack as well as a telecommunication subrack are disclosed. The module is a horizontal plug in unit including a power part that includes power filtering functions for securing power feed to a backplane of the subrack as well as to a number of fans also arranged on the module for cooling of the subrack. The module also includes connectors arranged in the rear of the module for connecting the module to the backplane as well as connectors arranged in the front of the module for accommodating power cables. The telecommunications subrack includes a cage configured to accommodate cards, an air intake with filter and two or more removably mounted modules. Each of these modules includes a power part that includes power filtering functions for securing power feed for the subrack, input connectors arranged in the front of the module for accommodating power cables, fans for cooling of the subrack, and output connectors for connecting the module to a backplane of the subrack.

Abstract: A heat dissipation structure includes a circuit board that is disposed inside an outer casing having a chassis formed with air inlet holes, and in which a first electronic component generating heat when driven and a second electronic component not generating heat when driven are mounted on one surface of a base plate, and a heat sink that releases the heat generated in the first electronic component. Here, in the heat sink, a heat dissipation unit positioned facing the base plate, an eaves portion protruding from the heat dissipation unit, and a pair of enclosing portions protruding from ends of the eaves portion in a direction perpendicular to a protruding direction from the heat dissipation unit, and at least one of the air inlet holes is formed in a position facing the eaves portion.

Abstract: The present disclosure relates to an adjustable air suction device, comprising a driving structure, an air suction structure, and a link structure. The driving structure and the air suction structure are disposed on a housing of an electronic device. The link structure is disposed inside the housing. Both ends of the link structure correspond to the driving structure and the air suction structure, respectively. The driving structure drives one end of the link structure to move towards a first direction, and drives the other end of the link structure to move towards a second direction. The other end of the link structure pushes the air suction structure, and projects from the housing. Besides, the air suction structure corresponds to a heat dissipating device of the electronic device and draws a great deal of fluids into the electronic device for dissipating the heat of the electronic components in the electronic device.

Abstract: Apparatus configured to provide a small form-factor module (SFP) that is plugged into a socket of an SFP cage with a functionality, the apparatus comprising: a connector configured to be inserted into the cage socket; functionality circuitry that is electrically connected to the connector and provides the functionality; and a socket electrically connected to the functionality circuitry configured to receive the connector of a conventional SFP module, and to electrically connect the conventional SFP to the functionality circuitry.

Abstract: A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit.

Abstract: An electronic device includes an air dam module. The air dam module includes a frame defining a vent, a first rotating member, a second rotating member, and two third rotating members. The first rotating member is rotatably connected to a surface bounding the vent, to vertically block a lower half of the vent by its gravity. The second rotating member is rotatably connected to the surface bounding the vent. The third rotating members are rotatably connected to opposite ends of the second rotating member. The second and third rotating members vertically block an upper half of the vent by their gravities.

Abstract: A system and method for chassis cooling is provided. A preferred embodiment comprises an orthogonal backplane along with a hybrid cooling air flow. One air flow is routed horizontally through aligned and suitable openings on the backplane, vertically over components to be cooled, and horizontally out of the chassis. A second air flow is routed horizontally over components and through aligned and suitable openings on the backplane before it is routed horizontally out of the chassis.

Abstract: The front case of the unit case contains a circuit section including a power semiconductor module, and the rear case contains a cooling fin assembly of the semiconductor module and a cooling fan. The cooling air ventilated through the wind channel by the cooling fan is discharged upward from the unit case. The water-proof cover is placed over the top of the unit case. The water-proof cover includes an exhausting structure formed with openings downward at the left and right sides of a front part of the water-proof cover to form an exhausting path; and a ventilation guide formed around an exhausting port inside a rear part of the water-proof cover. The cooling air discharged to the inside space of the water-proof cover by the cooling fan is ventilated through the ventilating path and exhausted outside through the exhausting path.

Abstract: Preferred embodiments provide a cooling system for an electronic display. A constricted convection channel is used to force cooling air against a posterior surface of the electronic display. Fans may be used to propel or pull air through the constricted convection channel in a substantially uniform manner. A refrigeration unit or thermoelectric module may be employed to cool or heat the air traveling through the constricted convection channel. Some embodiments include a closed loop which extracts heat (or adds heat) to the front display surface.