Abstract: A printing apparatus comprises a paper path adjacent a media supply. The paper path moves printing media from the media supply through the printing apparatus. Also, a marking engine is positioned adjacent the paper path, and the paper path supplies the printing media to said marking engine. The marking engine prints marking material on the printing media in a printing process, and the printing process generates vapors and ultrafine particles. The printing apparatus includes ducting adjacent the paper path and the marking engine. A fan is positioned within the ducting. The fan moves the vapors and ultrafine particles from around the paper path and the marking engine into the ducting. Further, at least one condensation unit is located within the ducting. The condensation unit is maintained at a temperature sufficient to condense and collect the vapors and ultrafine particles.

Abstract: Shielding liquid from electronic components may be accomplished by a variety of systems, devices, and techniques. A shielding may include a substantially vertical channel mounted to a fuel dispenser component; an airflow inlet; a plurality of arrays of angled protrusions; and a plurality of substantially vertical protrusions. The channel is adapted to guide an airflow. The plurality of arrays of angled protrusions are, disposed within the channel and are substantially parallel in arrangement within each array. The angled protrusions within each array are angularly offset in arrangement relative to the angled protrusions within adjacent arrays. The arrays of angled protrusions are adapted to form a tortuous path for the airflow through the channel. The plurality of substantially vertical protrusions are disposed within the channel and are located between the airflow inlet and the plurality of arrays. The vertical protrusions are adapted to substantially straighten the airflow within the channel.

Abstract: A heat-dissipating type of power converter comprises a support unit, at least one power module, at least one pair of rails and at least one main air duct module corresponding to the at least one power module. The pair of rails are fixed to the support unit and parallel to each other. The power module comprises a mounting plate module, a power unit and a radiator. wherein the power unit is fixed to the radiator, and the mounting plate module and the radiator are fixedly connected to each other. the main air duct module is fixed to the support unit and provided between the pair of rails, a second opening is defined in a side of the main air duct module toward the power module. The power module is assembled with or disassembled from the main air duct module by sliding along the pair of rails.

Abstract: A heat-dissipating system for high-power cabinet is provided, which comprises: a cabinet; at least one main air duct, which is formed in the cabinet with a first opening and a second opening, and a first heat-generating assembly, a second heat-generating assembly and at least one first fan, which are mounted in the at least one main air duct, wherein the first fan is mounted between the first heat-generating assembly and the second heat-generating assembly; and the outlet of the first fan faces the first heat-generating assembly, airflow enters the main air duct from the first opening of the main air duct, flows through the second heat-generating assembly, an inlet of the first fan, an outlet of the first fan, and the first heat-generating assembly in sequence, and finally is discharged out of the cabinet from the second opening of the main air duct cabinet.

Abstract: An improved electronic communications system and process 100 with front to back cooling can be provided in which the flow of influent cooling air can be directed horizontally through an intake cooling plenum chamber 145-146 positioned above or below line cards 127-129 and then passed downwardly through an inlet side cooling plenum 139-141. The cooling air can thereafter be propelled sideways, laterally and horizontally across passageways 138 between the line cards to remove heat generated by the line cards. The effluent heated air can be passed upwardly through an outlet side cooling plenum 142-144 and can be discharged through an exhaust cooling plenum to chamber 147-148 which can be diagonally separated from the intake cooling plenum chamber 145-146 by a fluid-impermeable plate 149-151.

Abstract: A server rack includes a rack body and fan modules. The rack body has front and back surfaces. Server units are disposed in the rack body. The fan modules are arranged on the back side along a vertical direction. Each fan module corresponds to several server units and includes a fan case and fan units. The fan case assembled to the back side is independently electrically connected to the rack body and suitable for being independently detached from the rack body. The fan units are detachably assembled to the fan case and arranged on the fan case along a horizontal direction. Each fan unit is independently electrically connected to the fan case and suitable for being independently detached from the fan case along a first direction perpendicular to the back surface or independently assembled to the fan case along a second direction opposite to the first direction.

Abstract: An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.

Abstract: According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat pipe. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. At least a portion of the heat pipe is buried in the wall from the first region to the second region.

Abstract: An electronic device includes a sidewall and a fan module. The fan module includes a first support bracket mounted on an inner surface of the sidewall, a second support bracket mounted on the inner surface of the sidewall and spaced from the first support bracket, and a number of fans sandwiched between the first support bracket and the second support bracket. The sidewall, the first support bracket, the second support bracket, and the fans cooperatively bound a receiving slot for receiving cables of the electronic device. The first and second support bracket each defines a cutout adjacent to the sidewall and communicating with the receiving slot for allowing some of the cables to extend out of the receiving slot.

Abstract: A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.

Abstract: A cooling system is used for cooling an electronic apparatus in an electronic device. The electronic device includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The electronic apparatus is supported on a middle of the bottom plate. The cooling system includes an evaporator, a fan, a condenser, a heat sink attached to the condenser, and a refrigerant pipe connected between the condenser and the evaporator. The heat sink and the condenser are set on an inner surface of the first sidewall. The fan is set on the first sidewall and aligns with the heat sink. The condenser operates to cool refrigerant and transfers the cooled refrigerant to the evaporator. A first airflow cooled by and coming from the evaporator flows through the electronic apparatus and the condenser to cool the electronic apparatus and the condenser, and is then vented through the fan.

Abstract: A computer data center system includes stacks of computers, each of the stacks computer motherboard assemblies arranged vertically with respect to one another, a first row of stacks, the row defined by stacks arranged adjacent to each other in a horizontal line of stacks, and a cool air supply plenum adjacent to the first row of stacks. The cool air supply plenum supplies cool air to a first side of the first row of stacks for cooling computers placed in the stacks, and has a longitudinal axis substantially parallel with an average air flow of cooling air in the plenum. Computer assemblies in the first row of stacks include portions that are closer to the longitudinal axis of the cool air supply plenum than other portions of the same assemblies, or portions of adjacent computer assemblies that are closest to the longitudinal axis for the adjacent assemblies.

Abstract: A heat dissipation fan and a power device are provided. The heat dissipation fan includes a frame, a fan circuit board, a fan motor, multiple fan blades and a thermistor. The frame has an air inlet side and an air outlet side, and forms a base hoard on the middle of the middle of the air outlet side. The fan circuit board is mounted on the base board. The fan motor is mounted on the base board and electrically connected to the fan circuit board. The thermistor is disposed on the fan circuit board or the frame to provide a temperature-sensing function for the heat dissipation fan. The heat dissipation fan is applied to the power device to save the internal space of the power device, and can provide reliable temperature information for the power device to improve the working quality of the power device.

Abstract: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case housing the circuit board, the circuit board oriented in a substantially vertical direction, a vertical inner wall surface of the case formed opposite the non-mounting surface of said circuit board, the vertical inner wall and the non-mounting surface of said circuit board defining a substantially vertical air ventilation path, a suction port positioned in the case and in communication with the ventilation path, an exhaust port positioned in the case above said suction port and in communication with the ventilation path, and a heat generating component in communication with the ventilation path.

Abstract: A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

Abstract: An electronic device includes a housing unit, a first electronic component, a heat-dissipating module, and an air-guide passage. The first electronic component, the heat-dissipating module, and the air-guide passage are disposed in the housing unit. The heat-dissipating module includes a fan unit and a heat-dissipating sink. The fan unit has a first air outlet zone and a second air outlet zone. The heat-dissipating sink is for dissipating heat generated by the first electronic component. The heat-dissipating sink is substantially aligned with the first air outlet zone. The air-guide passage is in spatial communication with the second air outlet zone and is formed with a passage air outlet. Air through the first air outlet zone flows in a first direction. Air through the passage air outlet is directed into the housing unit and flows in a second direction different from the first direction.

Abstract: A portable electronic system includes a portable device and a mobile device. The portable device includes a base, a bearing seat, and a connecting element. The base includes a fan and at least one first opening. The bearing seat includes at least one second opening. The connecting element connects the base and the bearing seat and includes a passage. The mobile device is detachably disposed at the bearing seat and includes at least one third opening. The base and the mobile device have corresponding passage and openings to bring heat airflow from inside of the mobile device to outside of the mobile device.

Abstract: A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit.

Abstract: A centrifugal fan assembly has a fan with a number of vanes at a peripheral edge of a rotor, a motor, arranged coaxially to the inside of the rotor, that rotates the fan, and a casing that houses the fan and the motor. The casing has an air inlet in the direction of a rotating shaft of the fan, and an air outlet in a radial direction. A first part of the casing near the air inlet is arranged relatively towards a center of the casing as compared to the other part of the casing. The motor is mounted on the first part.

Abstract: In accordance with at least some embodiments, a computer system includes an enclosure (202) configured to hold at least one resource unit (204). The computer system also comprises a plurality of mixed-flow ducted fans units (400) selectively attached to the enclosure (202). Each mixed-flow ducted fan unit (400) comprises a duct (102) having an intake diameter, a bellmouth diameter, and an exhaust diameter. The bellmouth diameter is less than the intake diameter and the exhaust diameter.

Abstract: A display apparatus includes a display section, a control section, and a cooling section including a first ceiling section, a second ceiling section, a first connecting section and an air stream generating section. The first ceiling section is formed such that a distance of the first ceiling section from a non-display surface of the display section is shorter than that of the second ceiling section, and a ventilating area of a first ventilating passage is smaller than that of a second ventilating passage. The air stream generating section is configured such that an air stream is generated from the second ventilating passage toward the first ventilating passage so as to take the air out of the first ventilating passage and the second ventilating passage, and replenish the taken air with the ambient air. The control section is provided on a control section mounting surface of the first ceiling section.

Abstract: A fixing assembly for a fan module is combined in a housing and includes at least one fixing base and at least one bottom pad. The fixing base has an accommodating space and a plurality of positioning portions in the accommodating space. The positioning portions are provided in pairs and symmetrical to each other. The locations of the positioning portions are designed for positioning various sizes of heat-dissipating fans. The bottom pad is configured to support the bottom of the fixing base. By this structure, various sizes of fan modules can be positioned in the housing.

Abstract: An apparatus and article is disclosed for separating intake air from exhaust air. The apparatus discloses an intake port, coupled to conduct intake air; an exhaust port, coupled to conduct exhaust air; and an air-curtain port, coupled to conduct air-curtain air to separate at least a portion of the intake air conducted by the intake port from the exhaust air conducted by the exhaust port. The article discloses a ductwork shell article, having an intake vent, an intake chamber, an exhaust vent, an exhaust chamber, an air-curtain vent, and an air-curtain chamber; wherein: the air-curtain vent is in part located between the exhaust vent and the intake vent.

Abstract: A graphic card with multiple fans and a controlling method thereof are provided. In the controlling method, the temperature of a first component and a second component of the graphic card is detected. A rotating speed of a first fan of the graphic card is adjusted according to the temperature of the first component. The rotating speed of the second fan of the graphic card is adjusted according to the temperature of the second component or the temperature of the first component and the second component.

Abstract: An outdoor stackable telecommunications equipment cabinet family and a method of deploying an outdoor telecommunications equipment cabinet. In one embodiment, the family includes: (1) a plurality of selectable cabinet modules and (2) a plurality of selectable plinth modules, at least one of the plurality of selectable cabinet modules and one of the plurality of selectable plinth modules configured to be selected and stacked to form an outdoor telecommunications equipment cabinet that includes an air filter and at least one fan.

Abstract: An approach is provided in which a cooling manager detects a failed fan included in an electronic enclosure. The electronic enclosure includes multiple fans that each cool different component areas in the electronic enclosure. The cooling manager selects an airflow compensator that corresponds to a functioning fan included in the electronic enclosure, which includes a fixed perforated member and a movable perforated member. In turn, the cooling manager adjusts the selected airflow compensator to redirect a portion of airflow generated by the functioning fan to the component area corresponding to the failed fan.

Abstract: In an electronic device, a substrate mounting unit is provided at a front side inside a housing, and contains a plurality of electronic substrates under a state where faces of any two mutually adjacent ones of the plurality of electronic substrates are opposite to each other. A power supply unit is provided at a position which is located at a rear side inside the housing and is located behind the substrate mounting unit, and supplies the plurality of electronic substrates with electric power. A power-supply fan unit, which is provided at a rear side of the power supply unit, takes in air outside the housing from the power-supply air intake opening, and discharges the taken-in air to an outside of a rear side of the housing via the substrate mounting unit and the power supply unit.

Abstract: A heat dissipation device is disposed in an electronic device. The electronic device has an opening and an upper wall and a lower wall at the position where the opening is formed. The heat dissipation device includes an air passage and a pair of air deflectors disposed on two opposite sides of the air passage. A distance between the pair of air deflectors is smaller than a distance between the upper wall and the lower wall. The pair of air deflectors is located between the upper wall and the lower wall. The hot air inside the electronic device after passing through the air passage will not be obstructed by a barrier but is directly discharged outside the electronic device through the opening.

Abstract: An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.

Abstract: According to one embodiment, an electronic apparatus includes a housing and a display unit. The housing includes a first end portion, a second end portion and a hinge portion. The display unit is connected to the housing via the hinge portion. The housing further includes a lower cover, an upper cover, a recessed surface and a plurality of projecting portions. The lower cover includes a bottom surface facing a placement surface on which the housing is placed, and an inclined surface provided from the bottom surface over to the first end portion and separating further from the placement surface towards the first end portion. The upper cover covers the lower cover. The recessed surface is recessed from the inclined surface, and includes a hole and a plurality of recessing portions arranged in a lattice manner together with the hole. The projecting portions project from the recessed surface.

Abstract: A data center includes one or more racks, one or more computing devices coupled to at least one of the racks, and one or more air moving devices. The computing devices include heat producing components. The computing devices may be inclined in the rack such that the lower ends of the computing devices are at a lower elevation than the higher ends of the computing devices. The air moving devices can move air from the lower end of the inclined computing devices to the higher end of the inclined computing devices such that heat is removed from heat producing components in the inclined computing devices.

Abstract: In an electronic unit accommodated in a containing device so as to be adjacent to another electronic unit accommodated in the containing device, the electronic unit includes: a housing that is formed into a tub shape, that is provided with a plate comprising an air blowing hole, and that is closed by said another electronic unit when the electronic unit and the other electronic unit are accommodated in the containing device; and an interrupting portion that interrupts power supply to the electronic unit when said another electronic unit is detached from the containing device and the housing of the electronic unit is opened.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: A mounting apparatus for a fan includes a bracket, two fixing members, two screws, and a shield plate. The bracket includes a fixing plate defining a vent and two first through holes adjacent to opposite ends of a top of the vent. The screws extend through the fixing members and the first through holes of the bracket, in that order, for engaging in an upper portion of the fan arranged behind the fixing plate, with the vent aligning with the fan. A top of the shield plate is rotatably connected between the fixing members. The shield plate hangs vertically by gravity to cover the vent upon a condition that the gravity of the shield plate is not overcome by airflow passing through the vent.

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: An information handling system (IHS) cooling system includes an IHS chassis defining an IHS chassis air inlet. A cooling chassis supports the IHS chassis on a support base. An air supply duct extends from the cooling chassis such that an air supply duct outlet on the air supply duct is immediately adjacent the IHS chassis air inlet. An air cooling subsystem is located in the cooling chassis and is operable to cool air that is drawn into the cooling chassis and supply the cooled air to the IHS chassis air inlet through the air supply duct. The IHS chassis may be a conventional IHS chassis that is designed for sub-35 degree Celsius ambient temperatures, and the cooling chassis may be provided for the conventional IHS chassis when used in extreme environments with high ambient temperatures above 35 degrees Celsius.

Abstract: A fan chassis includes: a wall panel; and an upper panel that is connected to an upper end of the wall panel, and a lower panel that is connected to a lower end of the wall panel. A cross sectional shape of the upper panel and the lower panel is substantially U-shape. The wall panel includes a plurality of projections to be inserted into mounting holes of a fan. At least either one of the upper panel and the lower panel includes a through hole into which an upper end part or a lower end part of the fan is to be fitted. An inner dimension between the upper panel and the lower panel is shorter than an outer dimension of the fan in a vertical direction. The upper panel and the lower panel deform elastically in a direction in which the upper panel and the lower panel move apart from each other.

Abstract: An electronic device has a board, a heat producing component mounted on the board, a connector mounted on the board and allowing a module component to be fitted thereto, a chassis housing the board, and an air blower configured to cause air to flow through the chassis. Additionally, an airflow adjustment member including a guide portion is placed upstream, in a flow direction of the air, of the heat producing component and the connector, the guide portion being configured to guide part of air flowing toward a region where the connector is placed to a region where the heat producing component is placed.

Abstract: A power supply device comprising: a plurality of battery units each having a protective unit, an output voltage from the plurality of battery units being configured to energize an electric power tool; and a drive-limiting unit provided in a current path of the battery unit of each row, wherein each protective unit stops energization from the battery unit of its row by the drive-limiting unit provided in the current path of the battery unit of its row, when the battery unit of its row has an error.

Abstract: There is provided an electronic device that includes a heatsink, a first dual IGBT coupled to the heatsink and configured to provide electrical power to a field exciter, a second dual IGBT coupled to the heatsink and configured to provide electrical power to a battery, a third dual IGBT coupled to the heatsink and common to the field exciter and the battery. The electronic device also includes a temperature sensor disposed in the heatsink, a cooling unit comprising a plenum and a variable source of air flow, and a controller. The controller is configured to receive a temperature reading from the temperature sensor and, based on the temperature reading, determine a desired level of cooling for at least one of the dual IGBTs, wherein an air flow rate provided by the cooling unit is determined based on the desired level of cooling.

Abstract: An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.

Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, a first wall portion, and a second wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing and includes a circuit board having a first surface and a second surface, a first portion including the first surface, and a second portion including the second surface. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port to send cooling wind from the ejection port toward the first portion and the second portion. The first wall portion is located between the inner surface of the housing and the first portion, and constitutes a first ventilation path. The second wall portion is located between the inner surface of the housing and the second portion, and constitutes a second ventilation path.

Abstract: An electronic device includes an enclosure, and an airflow guiding duct. The enclosure includes a bottom panel. The airflow guiding duct is pivotably mounted to the enclosure. The airflow guiding duct includes a positioning portion. The bottom panel defines a sliding slot. A positioning opening is defined in the bottom panel communicating with the sliding slot. The positioning portion is used for being driven to slide along the sliding slot to move into the positioning opening when the airflow guiding duct is rotated.

Abstract: A cooling system includes a fixing device and a fan. The fixing device includes a fixing rack and a latching rack. The fixing rack includes a first latching arm and two opposite supporting arms protruding from two ends of the first latching arm. The latching rack includes a second latching arm and two opposite adjusting arms protruding from two ends of the second latching arm. The adjusting arms can be adjustably fixed to the supporting arms at different positions to adjust a distance between the first latching arms and the second latching arm to releasably fix the fan between the first latching arm and the second latching arm.

Abstract: A telecommunications system (10/100) is disclosed herein. The telecommunications system (10/100) includes a chassis (12/112) defining a top end (14/114), a bottom end (16/116), and a generally pyramidal shape, wherein a transverse cross-sectional footprint (28) of the chassis (12/112) changes in outer dimension as the transverse cross-sectional footprint (28) extends from the top end (14/114) to the bottom end (16/116), the telecommunications chassis (12/112) further defining at least one sidewall (30/130, 32/132, 34/134, 36/136), the at least one sidewall (30/130, 32/132, 34/134, 36/136) extending at an angle to both the top end (14/114) and the bottom end (16/116), the at least one sidewall (30/130, 32/132, 34/134, 36/136) defining ports (38) defining connection locations for receiving telecommunications equipment.

Abstract: According to one embodiment, a television receiver includes: a display device; a housing; a fan unit; a first wall; a second wall; and a supporting structure. The display device includes a display screen. The housing houses at least a portion of the display device. The fan unit is positioned in the housing and positioned opposite the display screen with respect to the display device, and includes a rotating portion including a fan. The first wall extends in a direction intersecting a rotation axis of the fan on a side opposite the display screen with respect to the fan. The second wall extends in the direction intersecting the rotation axis on a side opposite the first wall with respect to the fan. The supporting structure is positioned between the first wall and the second wall at apart at which rotation center of the rotating portion is positioned.

Abstract: An electronic device includes a chassis and a fan module received in the chassis. The chassis includes a bottom wall, a sidewall extending from a side of the bottom wall, and a cover fixed to the sidewall and spaced from the bottom wall. The fan module includes a bracket for receiving a number of fans, a number of parallel slide rails mounted on a top of the bracket, and a number of blocking plates each slidably received in two adjacent slide rails and covering the corresponding fan. To access the fans, the blocking plates are slid to be located under the cover, to expose the fans.

Abstract: Disclosed is a fan module used in electronic equipment and the like. The fan module of the present invention includes a dust-collecting part which has an air’-suction port and an air-discharge port, and which has a rotational region forming a passage linking the air-suction port to the air-discharge port and has a dust-collection box for collecting dust and detritus rotating in the rotational region; and a fan which is joined to one side of the dust-collecting part and makes air flow into the rotational region. The present invention can use centrifugal force to effectively remove various forms of dust and detritus contained in the air which flows into the casings of electronic equipment, household appliances and the like due to the action of a fan. Further, since a filter is not used, there is the advantage that the cooling efficiency is not reduced by the dust collection as the smooth flow of the air being sucked in is not disturbed.

Abstract: An electronic device includes a main body having an air inlet port and an air outlet port, an air channel having an air inlet port and an air outlet port and is arranged such that the air channel and the main body oppose each other, a boundary base disposed between the main body and the air channel, a heat sink mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter tightly mounted on an upper surface of a base of the heat sink so as to be positioned in the main body, cooling fans disposed near the air outlet port of the main body and the air outlet port of the air channel, and a first reactor disposed on a windward side of the heat sink in the air channel.