Abstract: A heat dissipating apparatus comprises a base, an air duct, and a cooling fan. The base comprises a first cooling portion and a second cooling portion. The air duct covers the first cooling portion, and defines an air inlet and an air outlet. The cooling fan is secured to the first cooling portion, and located below the air inlet. A blocking board is secured between the first cooling portion and the second cooling portion to prevent air flowing from the first cooling portion to the second cooling portion.

Abstract: A computer system includes a computer case and an air guiding duct. The motherboard is attached to the computer case, and a heat sink is attached to the motherboard. The air guiding duct includes a top panel. A mounting member is slidably attached to the top panel and is clipped to the heat sink. A limiting device is located on the top panel and engaged with the mounting member to prevent the mounting member from sliding relative the top panel.

Abstract: Various integrated circuit voltage regulation apparatus and methods of assembling the same are provided. In one aspect, an apparatus is provided that has a stack that includes a heat sink and a semiconductor chip. The semiconductor chip has a conductive heat transfer pathway to the heat sink. A voltage regulator member is electrically coupled to the semiconductor chip and coupled to the heat sink, but is not positioned in the stack.

Abstract: A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: An exemplary heat dissipation device includes a fan having fixing cylinders, a heat sink having a supporting board, and fasteners fixing the fan to the heat sink. Each fastener includes a screwing pole, a first elastic member and a second elastic member encircling the screwing pole, and a fastening cylinder engaging with the screwing pole. Each screwing pole includes a head, a shaft extending coaxially downwardly from the head, and a post extending coaxially downwardly from the shaft. For each fastener, the screwing pole extends through a corresponding fixing cylinder of the fan, the first elastic member is compressed between the head and the corresponding fixing cylinder, the second elastic member is compressed between the corresponding fixing cylinder and the fastening cylinder, and the post protrudes from the fastening cylinder and is engaged with the supporting board.

Abstract: A system for cooling an electronic display where an isolating structure may be used to allow ambient air to cool power modules. The isolating structure substantially prohibits contaminants which may be present within the ambient air from contacting sensitive electrical components on the power modules or otherwise. A gasket may be used to seal the interface between the power modules and the isolating structure. Heat sinks may be placed in thermal communication with the power supplies and fans may draw air through a narrow channel in which the heat sinks are located. In some embodiments the narrow channel may have the opposing surface of the channel defined by the rear portion of an LED assembly. Exemplary embodiments may use the ambient air to cool both the power modules and a closed loop of isolated gas within the electronic display.

Abstract: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.

Abstract: An LCD apparatus comprising an LCD screen, backlight arrangements for providing back illumination to the LCD screen, video processing circuitry and air moving devices, characterized in that the air moving devices are arranged to move air to condition the image displaying surface of the LCD screen. An LCD image displaying apparatus according to the present invention could operate at a brightness level of above 1000 nits, and even 3000 nits, which provides an astounding visual effect in the outdoor environment.

Abstract: A dust-free and anti-vibration industrial computer. The industrial computer has a case sealed from the outside, a heat diffusion fin assembly mounted on the outer surface of the case, and a circulation pipe for allowing a heat generating component and at least a heat diffusion fin to be communicated with each other, or a heat pipe for transferring heat between the heat generating component and the heat diffusion fin. The heat generating component can be cooled in a state in which dust is prevented from being produced within the case.

Abstract: An assembly includes an article, and a computer housing including left and right sidewalls cooperatively defining an accommodating space and an opening for communicating the accommodating space with an external environment, and a positioning member provided on one of the sidewalls. Each sidewall includes a slide rail. A package is mounted removably in the accommodating space via the opening, is connected slidably to the slide rails of the sidewalls, and is positioned within the accommodating space through the positioning member. The package includes two interconnected cover parts cooperatively defining a receiving space for receiving the article and a communicating hole for communicating the receiving space with the external environment, and a handgrip to mount removably the package in the accommodating space. Each cover part includes a stop member abutting against the article to prevent escape of the article from the receiving space via the communicating hole.

Abstract: An electronic device includes a bottom plate, a cover plate, a dust collection box, and a dust cleaning apparatus. A heat sink is mounted in the bottom plate. The cover plate covers on the bottom plate. The cover plate defines a cutout. The dust collection box is placed on the bottom plate via the cutout. The dust cleaning apparatus is slidably mounted on the bottom plate. The dust cleaning apparatus moves relative to the heat sink to sweep dust of the heat sink into the dust collection box.

Abstract: A heat dissipation device for a memory card includes a memory slot mounted on a circuit board, a frame, and two fans. The memory slot includes a main body and two fixing portions pivotably mounted to opposite ends of the main body. The frame includes a connection bar abutted against a side surface of the main body, and two plates perpendicularly extending from opposite ends of the connection bar and positioned at opposite ends of the main body. Two hooks protrude from the connection bar respectively adjacent to the two plates to abut against opposite side surfaces of the main body. The fans are respectively fixed to the plates.

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).

Abstract: A power supply apparatus includes an air path extending longitudinally, a fan that blows air into the air path in a direction intersecting a longitudinal direction of the air path, and a plurality of electronic components arranged in the longitudinal direction. Each of the electronic components is cooled by air passing through the air path. With this configuration, it is possible to efficiently cool the electronic components without compromising the flexibility of arrangement of the various electronic components. Also, a dust removal operation can be readily performed without the possibility of damaging the fan.

Abstract: A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

Abstract: An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.

Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

Abstract: A storage device testing system cooling circuit includes a plurality of test racks. Each of the test racks include a test slot compartment and a test electronics compartment. Each of the test slot compartments includes multiple test slots, and one or more cooling conduits configured to convey a cooling liquid toward the test slots. Each of the test electronics compartments includes test electronics configured to communicate with the test slots for executing a test algorithm, and a heat exchanger in fluid communication with the one or more cooling conduits. The heat exchanger is configured to cool an air flow directed toward the test electronics.

Abstract: An electronic apparatus includes a heat sink for mounting a heating element, a cooling fan for supplying an airstream to the heat sink, and a housing for storing the heat sink and the cooling fan. The housing and the heat sink are equipped with a projection engaged with a hole of a flange of the cooling fan, and the cooling fan is sandwiched by the housing and the heat sink.

Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The printed circuit board is secured on a casing of an electronic system. The heat dissipation device includes a heat sink disposed on the electronic component; and a plurality of fasteners extending through the heat sink, respectively, to assemble the heat sink to the printed circuit board. Each of the fasteners includes a supporting member fixed in the printed circuit board, an engaging member fixed in the board, and a screwing post engaging with the heat sink. A bottom portion of the screwing post extends through the printed circuit board via the supporting member, and is screwed into the engaging member.

Abstract: A method for constructing a thermal management system is provided herein. In accordance with the method, a fan (405) is provided which is adapted to provide a global flow of fluid through the device. A synthetic jet ejector (409) is also provided which is adapted to augment the global flow of fluid over the surfaces of a heat sink (403). The ratio of the flow per unit time of the synthetic jet ejector to the flow per unit time of the fan is selected so as to achieve a desired level of heat dissipation.

Abstract: A circuit board provided with a control circuit and an optical module placed at a close distance and configured to be capable of effectively cooling the control circuit and the optical module is provided. A circuit board placed inside the housing of electronic equipment and provided with an optical module and a control circuit, which are mutually connected, has: a fan-assisted heat sink mounted on the control circuit and configured to ventilate the control circuit and cool the control circuit; and a fresh air feeding duct placed on the circuit board and configured to distribute fresh air taken in from outside the housing through the intake of the fan-assisted heat sink. The optical module is placed in a predetermined position along a site in which the fresh air feeding duct is formed.

Abstract: A drive with heat dissipation and energy-saving function for supplying power to drive a motor. The drive includes a driving circuit having a rectification section. The rectification section serves to receive AC current generated when the motor abruptly accelerates/decelerates and convert the AC current into DC current and output the DC current. The drive further includes a cooling module electrically connected to an output end of the rectification section. The cooling module is drivable by the DC current output from the rectification section to conduct out and dissipate heat.

Abstract: According to one embodiment, an electronic apparatus includes a housing including an outlet, a cooling fan in the housing, a component in the housing configured to serve as a wall guiding air from the cooling fan to the outlet, and a wind shielding portion between the component and an inner surface of the housing.

Abstract: A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.

Abstract: A heat dissipation device is for dissipating heat generated from an electronic device, and includes a fan duct and a heat sink. The fan duct includes a top plate having a receiving hole penetrating therethrough. The heat sink is configured to dissipate heat from a heat-generating electronic component of the electronic device, and includes a base configured to be mounted on the heat-generating electronic component and a number of heat dissipating sheets positioned on the base. The heat dissipating sheets are long enough to extend towards the fan duct and into the receiving hole when the heat dissipation device is installed in the electronic device.

Abstract: A heat dissipation apparatus includes fins each including a body and blades extending radially outwardly from the body. The blades define cutouts therebetween. The fins are stacked together in such a manner that the cutouts of the fins cooperatively form airflow guiding channels each extending spirally from top to bottom.

Abstract: The present invention relates to a cooling system. More particularly, the present invention relates to a cooling system for removing dust from air being drawn for cooling heat generation components of an electronic product, for improving convenience in maintenance or repair of the electronic product.

Abstract: A control unit is proposed which makes it possible to prevent connection problems between a package box and a backboard and prevent damage to the connector of the backboard. The control unit comprises a unit cover in which a first package box, which comprises a predetermined function and on the rear side of which a first connector is provided, is inserted into the corresponding spatial area so as to move over a shelf from an open end [of the unit cover]; and a backboard which is disposed inside the unit cover and on which a second connector is provided in a position where the first package box, inserted in the corresponding spatial area, mates with the first connector, wherein the shelf is provided with a protrusion which rotatably supports the first package box in a fan direction.

Abstract: A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming an indent, having a flange and an indent side, from a peripheral region of the active side; and forming a conformal interconnect, having an elevated segment, a slope segment, and a flange segment, over the indent.

Abstract: A cooling system includes a fan and an air conducting cover. The air conducting cover includes a first airflow channel and an opposite second airflow channel. The first airflow channel includes a first air inlet and an opposite first air outlet, the second airflow channel includes a second air inlet and an opposite second air outlet. The first air inlet and the second air inlet are both aligned with the fan.

Abstract: The present invention relates to a device for eliminating dust for a computer and a control method thereof. A control unit and a heat-radiating fan controlled by the control unit are provided in the main body. In addition, there is provided a cooling fin through which air stream formed by the heat-radiating fan passes. While the air stream formed by the heat-radiating fan passes through the cooling fan, heat is exchanged between the air stream and the cooling fin and the air stream is then exhausted to the outside of the main body. A vibration-generating element for generating vibration supplied with power is provided at one side of the cooling fin. The control unit controls the driving of the vibration-generating element. Vibration of the vibration-generating element is transmitted to the cooling fin to shake off dust accumulated on the cooling fin. Then, the air stream formed by the heat-radiating fan is exhausted to the outside of the main body together with the dust.

Abstract: According to one embodiment, a cooling unit includes a heat dissipating mechanism, a fan, and a movable cover. The heat dissipating mechanism is housed in a housing of an electronic device. The fan is housed in the housing, and generates an air flow that collides against the heat dissipating mechanism. The movable cover includes a sheet and a knob. The sheet serves as an openable and closable cover to cover an opening on a chamber formed between the fan and the heat dissipating mechanism from the outside. The knob is located on the sheet and protrudes outward.

Abstract: A communication apparatus and an air-cooling method for the same utilizes an air-cooling mode that can be easily changed to reduce the cost to increase the number of transceiver units and space for the housing. The communication apparatus includes transceiver units installed in a housing and attachable onto and detachable from the communication apparatus and fan units for forcibly air-cooling heat generated from the transceiver units. The fan units are installed in the housing and are attachable onto and detachable from the communication apparatus. Each transceiver unit includes a transceiver function section; a forced air-cooling radiator fixedly mounted in the transceiver function section for forcibly air-cooling heat generated from the transceiver function section; and a natural air-cooling radiator mounted in the transceiver function section for naturally air-cooling heat generated from the transceiver function section.

Abstract: According to one embodiment, a television includes: a display part; a tuner part; an electronic component; a casing including: a first wall provided with an opening part and configured to cover the electronic component; a second wall provided with a second opening part and configured to cover the electronic component; and a third wall provided with a third opening part over the first wall and the second wall; a stand part configured to support the casing; a fan accommodated within the casing; and a radiating member including regions facing the first opening part, the second opening part and the third opening part, and positioned between the fan and the third wall, wherein the second wall includes a recessed part and a projection projected toward the outside of the casing; and a part of the fan faces the recessed part from the inside of the casing.

Abstract: Various technologies for cooling a computer system are described. In accordance with one described embodiment, a fan assembly system for a computer comprises a fan operable for cooling the computer and a fan duct coupled with the fan. The fan duct comprises a number of attaching features. The fan is suspended at least one component of the computer. Moreover, the suspended fan enables air to flow between the fan and the component (e.g., a heatsink) to facilitate cooling of the component.

Abstract: A flow control device and a related cooled electronic system are provided. The electronic system comprises a first heat dissipation component and a second heat dissipation component. The flow control device controls an amount of an air flow to the first heat dissipation component and the second heat dissipation component. In one illustrative embodiment, the flow control device comprises: a memory metal component coupled to the first heat dissipation component and the second heat dissipation component and a movable component comprising a first end and a second end. The first end is coupled to a point between two ends of the memory metal component and the second end is movable with respect to the first end. In response to a temperature difference between the first heat dissipation component and the second heat dissipation component, the second end approaches the first heat dissipation component or the second heat dissipation component.

Abstract: A folded system-in-package (SiP) assembly is provided for minimizing the footprint of two corresponding circuit board modules in a handheld electronic device. The assembly includes top and bottom circuit board modules that are electrically interconnected through a flex circuit. Either a plate or wrapped heat spreader may be thermally coupled to the top circuit board module to conduct heat from the heat-generating components mounted to the top circuit board module and to a case of the electronic device.

Abstract: Methods of providing arc resistant switchgear enclosures for dry-type transformers are provided. The enclosures have one or more arc-resistant features, including arc channels, arc fault dampers, and arc fault plenums. In a preferred embodiment, the method comprises providing a base structure with a dry-type transformer seated thereon, providing walls and a roof, wherein at least the front wall contains at least one longitudinal seam covered by an arc channel.

Abstract: A heat sink fan of the present invention includes a heat sink and a fan. The heat sink includes a base having a center axis and a plurality of fins extending radially outwardly from an outer circumference of the base and disposed in a circumferential direction. The fan includes an impeller portion disposed adjacently to the heat sink in the direction along the center axis, the impeller portion rotating about the center axis, and a frame portion for covering and fixing the impeller portion, part of the frame portion being opposed to the heat sink. The frame portion has at least one protruding portion. The protruding portion enters into a space between the fins which are adjacent to each other.

Abstract: A notebook computer 1 is provided with: a casing in which a CPU is accommodated; a heat-dissipating component 37 having a plurality of fins; and a fan 31, and operates such that heat transferred from the CPU to the heat-dissipating component 37 is heat-exchanged with air supplied from the fan 31, and released to the exterior of the casing. The heat-dissipating component 37 is disposed at an air outlet 32b of the fan 31. An opening 35 is formed, between the air outlet 32b and a fan main unit 33, in a fan case 32. First shutter means 39 is provided on a discharge outlet surface of the heat-dissipating component 37. With this structure, increase in cost and weight can be restrained, and dust on the heat-dissipating component can be removed with a simplified structure.

Abstract: A notebook computer is provided with: a casing in which electronic components including a CPU are accommodated; and a heat-dissipating unit including a heat-dissipating component 37 having plural fins, and a fan 31 for supplying air to the heat-dissipating component 37. A communicating path 35 is formed between an air outlet 32b of the fan 31 and a surface 37b of the heat-dissipating component 37 on a side thereof that opposes the fan 31, so as to communicate them. An opening 32c is formed in a fan case 32 between the air outlet 32b and a main unit 33 of the fan. A duct 36 is provided so as to communicate the opening 32c with the heat-dissipating component 37. With this structure, an electronic device can be provided which has a built-in heat-dissipating unit that can restrain increase in cost and weight, and remove dust on the heat-dissipating component.

Abstract: Embodiments of an inspection system deploy active cooling to dissipate heat in a portable handset. In one embodiment, the inspection system comprise a visual inspection apparatus with a handle portion and a head portion coupled to the handle portion. The head portion can have a display and a circuit board coupled to the display and a heat sink in thermal connection with the circuit board. To facilitate active cooling, the apparatus may include an air moving device in flow connection with the heat sink, where the air moving device comprises a motor and an impeller and where the motor and the circuit board are sealed from the environment.

Abstract: A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Abstract: The present invention provides an electronic device, comprising: a circuit board having at least one first heat-generating element and at least one second heat-generating element mounted thereon; a heat sink connected to said at least one first heat-generating element; a fan facing said heat sink; and an airflow guiding member placed between said fan and said heat sink for guiding the cooling air from said fan to said heat sink and said at least one second heat-generating element respectively.

Abstract: An arrangement of a mother circuit board and daughter circuit boards in a power instrument improves current and voltage capabilities. A mother board is mounted to a base panel of an enclosure, and a number of daughter boards are attached to and extend from the mother board. Each daughter board has substantially identical circuitry and produces substantially the same amount of current. The daughter boards together provide a total output current equal to a sum of each individually generated current. The amount of power generated by the instrument can be increased by attaching additional daughter boards to the mother board. The total current produced by the daughter boards is provided to and output from the mother board via a low inductance output path. The low inductance output path ensures that a sudden increase in current does not result in a large voltage spike that adversely affects instrument operation.

Abstract: An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.

Abstract: An air guiding device is mounted on a main board. The air guiding device and the main board cooperatively form an air passage therebetween for allowing cooling air to pass therethrough. The air passage includes an inlet at a first end of the air guiding device, a first outlet at an opposite second end of the air guiding device, and a second outlet. The air guiding device includes a top wall, two sidewalls, and a shielding assembly. The top wall includes the second outlet therein at an intermediate portion thereof. The second outlet opens toward the second end. The sidewalls extend downwardly from opposite sides of the top wall. The shielding assembly is positioned on the top wall for regulating a size of the second outlet.

Abstract: A notebook computer 1 is provided with: a casing 20a in which electronic components including a CPU are accommodated; and a heat-dissipating unit 30 that includes a heat-dissipating component 37 having a plurality of fins 37a to which heat is transferred from the CPU, and a fan 31 for supplying air to the heat-dissipating component 37, and, in the heat dissipating unit 30, heat exchange between heat transferred from the CPU to the heat-dissipating component 37, and air supplied from the fan 31, is performed to release heated air to the exterior of the casing 20a. A communicating path 36 is formed, between an air outlet 32b of the fan 31, and an inflow surface 37b of the heat-dissipating component 37, for communicating therebetween, and a dust removal path 38 is formed in the communicating path 36 so as to communicate with the exterior of the casing 20a.