Abstract: A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.

Abstract: A semiconductor power module includes an active element and a passive element serving as semiconductor elements each having a first electrode on a front surface and a second electrode on a back surface thereof, a heat pipe having a first region defined as arrangement parts of the active element and the passive element on its one end side and electrically connected to one of the first and second electrodes of the active element and the passive element arranged in the first region, a cooling fin arranged in a second region defined on the other end side of the heat pipe, and a heat pipe provided to sandwich the active element, the passive element, and the cooling fin arranged on the heat pipe along with the heat pipe and electrically connected to the other of the first and second electrodes of the active element and passive element.

Abstract: A centrifugal fan assembly has a fan with a number of vanes at a peripheral edge of a rotor, a motor, arranged coaxially to the inside of the rotor, that rotates the fan, and a casing that houses the fan and the motor. The casing has an air inlet in the direction of a rotating shaft of the fan, and an air outlet in a radial direction. A first part of the casing near the air inlet is arranged relatively towards a center of the casing as compared to the other part of the casing. The motor is mounted on the first part.

Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.

Abstract: A heat sink for cooling a heat generating member, provided with a first cooling part which cools the peripheral edge part of the heat generating member and a second cooling part which cools the center part of the neat generating member, the first cooling part is equipped with a first base member having first fins on the top surface thereof and a recess at the bottom surface thereof, the second cooling part is equipped with a second base member which can be accommodated in the recess, a slide member which is provided on the top surface of the second base member and which is inserted in a through hole which is provided in the recess, second fins which are provided on the free end of the slide member, and a cooling water passage which is provided inside of the second base member and which is supplied with cooling water.

Abstract: Components and/or assemblies are applied on a substrate. The substrate has a populating side and a heat sink side, to which a heat sink is fitted. The populating side is provided with a cover, which together with a heat sink on the heat sink side of the substrate forms a type of housing for the populated substrate. Between substrate and heat sink, a guide channel for a cooling medium (e.g. air, etc.) is provided and the substrate has an opening. A fan is fitted above the opening in such a way that a cooling flow of the cooling medium generated by the fan is conducted through the guide channel on the heat sink side of the substrate and over the populating side of the substrate and thus over the mounted components and/or assemblies. The heated cooling medium is then conducted away with the aid of the cover.

Abstract: A heat dissipation device is disposed in an electronic device. The electronic device has an opening and an upper wall and a lower wall at the position where the opening is formed. The heat dissipation device includes an air passage and a pair of air deflectors disposed on two opposite sides of the air passage. A distance between the pair of air deflectors is smaller than a distance between the upper wall and the lower wall. The pair of air deflectors is located between the upper wall and the lower wall. The hot air inside the electronic device after passing through the air passage will not be obstructed by a barrier but is directly discharged outside the electronic device through the opening.

Abstract: An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.

Abstract: An air duct includes a top plate, two side plates extending from two lateral sides of the top plate, a baffle plate extending from the top plate and located between the side plates, and a torsion spring connected between the top plate and the baffle plate. The top plate and the side plates cooperatively define an air passage in the air duct. The baffle plate includes a first end pivotally connected with the top plate and an opposite second end. The second end of the baffle plate is rotatable relative to the top plate. The torsion spring includes two arms abutting against the top plate and the baffle plate, respectively. When the baffle plate is rotated relative to the top plate under an external force, the torsion spring resists such force.

Abstract: A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

Abstract: Heat is conducted from a primary component to a thermal dissipation structure. An airflow removes from the thermal dissipation structure. An air channel associated with the thermal dissipation structure diverts a portion of the airflow to a secondary component, thereby providing cooling to the secondary component.

Abstract: A heat dissipation device includes one of heat sinks with different specifications each of which includes a core and supports extending outwards and radially from the core, and a fixing frame receiving the one of the heat sinks therein. The fixing frame comprises a side plate, a plurality of vertical walls extending downwardly from the side plate, and two sets of slots defined in an inner side of the side plate. Each of the slots extends upwardly from a bottom surface of the side plate to a certain depth to form a step at a top thereof. The slots are staggered with the vertical walls. The supports correspondingly slide in one set of slots and abut corresponding steps.

Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, a first wall portion, and a second wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing and includes a circuit board having a first surface and a second surface, a first portion including the first surface, and a second portion including the second surface. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port to send cooling wind from the ejection port toward the first portion and the second portion. The first wall portion is located between the inner surface of the housing and the first portion, and constitutes a first ventilation path. The second wall portion is located between the inner surface of the housing and the second portion, and constitutes a second ventilation path.

Abstract: An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.

Abstract: There is provided an electronic device that includes a heatsink, a first dual IGBT coupled to the heatsink and configured to provide electrical power to a field exciter, a second dual IGBT coupled to the heatsink and configured to provide electrical power to a battery, a third dual IGBT coupled to the heatsink and common to the field exciter and the battery. The electronic device also includes a temperature sensor disposed in the heatsink, a cooling unit comprising a plenum and a variable source of air flow, and a controller. The controller is configured to receive a temperature reading from the temperature sensor and, based on the temperature reading, determine a desired level of cooling for at least one of the dual IGBTs, wherein an air flow rate provided by the cooling unit is determined based on the desired level of cooling.

Abstract: An electronic device includes a main body having an air inlet port and an air outlet port, an air channel having an air inlet port and an air outlet port and is arranged such that the air channel and the main body oppose each other, a boundary base disposed between the main body and the air channel, a heat sink mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter tightly mounted on an upper surface of a base of the heat sink so as to be positioned in the main body, cooling fans disposed near the air outlet port of the main body and the air outlet port of the air channel, and a first reactor disposed on a windward side of the heat sink in the air channel.

Abstract: An exemplary fan holder is adapted for fixing a fan onto a heat sink. The fan holder is strip-shaped, and includes a top side portion, a bottom side portion, a front side portion and a rear side portion joined together. Each of the side portions of the fan holder includes a slide portion and a sheath connected to each other. A position where the slide portion and the sheath are connected can be adjusted to change a length of the side portion.

Abstract: A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure.

Abstract: A simple configuration for cooling comprises a front-back air supply and exhaust system. A first circuit board is located in front of a relay circuit board. A cooling unit and a second circuit board are placed behind the relay circuit board in a chassis. A first air passage allows intake air through an intake hole in a front side of the first circuit board unit to pass through the first circuit board and then through an opening in the relay circuit board to the cooling unit. A second air passage allows intake air through an intake hole in a front face of the chassis to pass through a lateral side of the first circuit board and then through a vent hole in a partition provided at the lateral side of the first circuit board. The second circuit board is placed in the second air passage.

Abstract: A mounting device for a fan includes a base board and a frame mounted on the base board. The fan includes two spaced boards. The frame includes a fixing board defining a vent, and a fixing piece extending from a bottom side of the fixing board, below the vent. A number of rods extend from the fixing board around the vent, to be engaged in one of the boards of the fan. A protrusion protrudes from a distal end of the fixing piece to block the other one of the boards of the fan.

Abstract: A heat dissipation device includes a heat sink and a fan duct. The fan duct includes a cover and a baffle. The cover includes a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate. The baffle is located between the first sidewall and the second sidewall of the cover and pivotally contacts the first and second sidewalls. The baffle forms an angle with the top plate and is rotatable relative to the first and second sidewalls to adjust the angle between the baffle and the top plate.

Abstract: A power converter is installed in a casing attached beneath the floor of an electric vehicle. The power converter includes a capacitor unit and a power semiconductor module housed in a hermetically sealed part of the casing closed by a cover for closing an access port, and a cooler installed in an exposed part, the cooler cooling heat generated from the power semiconductor module. The power converter includes a bus bar that electrically connects the power semiconductor module and the capacitor unit, and a conductive bar that electrically connects the capacitor unit and the bus bar. The conductive bar is drawn from the upper surface of the capacitor unit, and is bent into a crank.

Abstract: A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: An electronics cooling system comprises a tubular fan duct and an electronics housing. The fan duct includes has a fan duct casing containing a fan with rotor blades and stator vanes. The electronics housing is mounted directly on the tubular fan duct, such that the electronics housing and the fan duct casing together enclose an interior space. A cooling airflow path extends from a high-pressure region of the tubular fan duct, through an inlet hole into the interior space, and out a bleed hole into a surrounding environment. The electronics cooling system further comprises three electronics mounts within the interior space. A first electronics mount is located immediately adjacent to the inlet hole, on the fan duct. A second electronics mount is located immediately radially outward of the stator vanes, on the fan duct. A third electronics mount is located immediately adjacent to the bleed hole, on the housing.

Abstract: A lamp module for use in non-destructive testing and inspection. The module including a module body with a front and rear end, and a side wall. The module body includes a mounting chamber located within the side walls. A plurality of LEDs are mounted within the chamber and oriented to so as to emit light out of the front end of the body. At least one LED emits light having a wavelength selected to produce fluorescence of an illuminated material. A fan is mounted to the body to dissipate heat generated by the LEDs when the fan is activated. Electrical connectors extend out of the body and are electrically connected to the LEDs and the fan for supplying current. The module can be installed in various structures or systems, including in a luminaire, an overhead light housing or a track light system.

Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.

Abstract: A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.

Abstract: An illumination device (b1-01) is provided which comprises a housing (b1-03) equipped with an aperture (b1-37), first (b1-33) and second (b1-35) diaphragms disposed in said housing and in fluidic communication with said aperture, and an LED (b1-15) disposed between said first and second diaphragms.

Abstract: A cooling structure (10A) for an electronic device includes: a housing provided with an air inlet and an air outlet; a fan; and a circuit board (2) disposed in the housing. A heat generating component (3) is mounted on one surface of the circuit board (2). A heat release member (4) having fins (45) and a heat transfer plate (41) is disposed between the one surface of the circuit board (2) and an opposite wall (12) of the housing. The heat release member (4) extends, in an arrangement direction of the fins (45), beyond both sides of the heat generating component (3). For example, in an intermediate zone, a resistant layer (8) for suppressing heat transfer from the fins (45) to the opposite wall (12) is formed between the opposite wall (12) and the fins (45).

Abstract: An electronic device includes a housing and a chip. The housing includes a main body and a supporting portion. The main body has an inner surface and an outer surface, and an opening disposed on the outer surface. The supporting portion is disposed on the inner surface, and has a heat dissipating chamber that communicates with the opening. The chip is disposed on the supporting portion, and the heat generated by the chip is transmitted via the housing.

Abstract: Cooling is performed efficiently by constituting: a fan which is provided with an outlet; a heatsink which is provided with an inlet with a larger size than that of the outlet of the fan in a height direction and through the interior of which an airflow generated by the fan passes; and a guide member which is disposed between the fan and the heatsink and which is configured to guide the airflow to an outer surface of the heatsink.

Abstract: An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group.

Abstract: An exemplary heat dissipation device includes a heat sink and a fixing frame. The heat sink defines receiving depressions at an outer peripheral surface thereof. The fixing frame includes a peripheral side plate encircling the heat sink, fixing legs extending downwards from the side plate, and an elastic member disposed on the side plate. Protruding members extend inwardly from the fixing legs. The heat sink is rotatably received in the fixing frame. When the heat sink is in an unlocked state, the protruding members align with the receiving depressions, respectively. When the heat sink is rotated to a locked state, the protruding members abut a bottom of the heat sink thereby limiting axial movement of the heat sink relative to the fixing frame and the elastic member is received in a corresponding receiving depression and limit rotation of the heat sink in both clockwise and counterclockwise directions.

Abstract: One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement.

Abstract: An electronic device includes a display, a cover, and a blocking board. The display defines a rear side. A motherboard and a first cooling assembly are secured to the rear side of the display, and a second cooling assembly is secured to the motherboard. The cover is secured to the rear side for coving the rear side, and defines a number of air inlets and air outlets. The blocking board is secured to a side of the motherboard, and located between the first cooling assembly and the second cooling assembly. A first air path is defined by the air inlet, the display, the first cooling assembly, and the air outlet, and a second air path is defined by the air inlet, the motherboard, the second cooling assembly, and the air outlet. The first air path and the second air path are divided by the blocking board.

Abstract: The present invention provides a modular circuit card configuration for distributing heat among a plurality of circuit cards. Each circuit card includes a housing adapted to dissipate heat in response to gas flow over the housing. In one aspect, a gas-cooled inverter includes a plurality of inverter circuit cards, and a plurality of circuit card housings, each of which encloses one of the plurality of inverter cards.

Abstract: An information handling system's thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier allows airflow through the air channel to a vent opening of the information handling system. The airflow through the air channel cools the base of the thermal barrier so that an end user will experience reduced thermal energy if the information handling system rests on the end user, such as in the end user's lap.

Abstract: An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.

Abstract: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Abstract: A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component.

Abstract: A heat dissipation module includes a fan and a thermal fin portion. The fan includes a fan body, a plurality of blade units and a plurality of blade extensions. The blade units are connected to the fan body. The blade extensions protrude from the blade units, respectively. A first surface is formed on a side of each of the blade extensions. A distance between the first surface and an axis of the fan body is increasing along an inflow direction. The thermal fin portion includes a plurality of fin units and a plurality of fin extensions respectively protruding from the fin units. A second surface is formed on a side facing the fan extension of each of the fin extension. An identical gap is formed between at least one portion of the first surface and at least one portion of the second surface.

Abstract: A heat dissipation member is disposed opposing a reflective light modulation element, and includes: a heat receiving surface that receives heat from the element; a heat dissipation surface; and heat dissipation fins that protrude from the heat dissipation surface. The fins are formed so that the density at which the fins are disposed is greater at the center area of the heat dissipation surface than at the end areas of the heat dissipation surface, or are formed so that the cross-sectional surface area of the fins is greater at the center area of the heat dissipation surface than at the end areas of the heat dissipation surface.

Abstract: A battery pack including battery cells, a housing to house the battery cells, and a cooling device that cools air flowing through the housing. The cooling device may be installed on an intermediate portion of the housing. The cooling device may include a cooling pipe, in which water flows.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat-generating component in the housing, a first radiating portion in the housing thermally connected to the heat-generating component, a second radiating portion in the housing thermally connected to the heat-generating component, and a fan configured to blow air to the first radiating portion and the second radiating portion.

Abstract: According to one embodiment, a television apparatus includes an exothermic component, a heat transfer mechanism, a plurality of heat releasing fins, a fan, and a deflecting member. The exothermic component is housed in a housing. The heat transfer mechanism is at least partially housed in the housing. The heat transfer mechanism includes a heat receiving portion that receives heat from the exothermic component, a heat releasing portion that releases heat, and a heat transferring portion that houses a medium to transfer heat from the heat receiving portion to the heat releasing portion. The heat releasing fins are thermally connected to the heat releasing portion and arranged with gaps therebetween. The fan generates an air flow flowing through the gaps. The deflecting member is located at least downstream of the gaps to cover the gaps. The deflecting member deflects the air flow toward an exhaust outlet formed in the housing.

Abstract: A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins.

Abstract: According to one embodiment, an electronic apparatus includes a housing including an opening area and a closing area, a fan in the housing, a first area between the fan and the opening area, a second area between the fan and the closing area, and a windshield in the second area.

Abstract: The present invention relates to a heat dissipating device. More particularly, the present invention relates to a heat dissipating device in which an air flow is directed to a heat dissipating member by flapping a blade for making a driving unit and a device therefor small, improving heat dissipating efficiency and reducing noise therefrom.

Abstract: The present invention relates to a heat dissipating device. More particularly, the present invention relates to a heat dissipating device in which an air flow is directed to a heat dissipating member by alternating rotation of blades within a preset range of angle for making a driving unit and a device thereof smaller, and improving heat dissipating efficiency.