Abstract: A heat dissipation structure of an electronic element includes a cooling fin, an aluminum heat dissipation seat which is provided on the cooling fin and at least one electronic element which is provided on the aluminum heat dissipation seat. At least one heat conducting copper column is provided on the aluminum heat dissipation seat by being tightly forced in or by a stamping method with a mold, and is located corresponding to the electronic element. Therefore, the present invention can conduct heat from the electronic elements, can reduce a manufacturing cost, can accelerate production, can decrease a manufacturing process, is environment friendly and is provided with a high heat dissipation efficiency.

Abstract: An RF package includes a substrate mountable on a base plate, a non-conductive cover overlying the substrate, and quasi-serpentine stepped source leads attached to an upper surface of the substrate and extending from at least one of a pair of opposite sides of the upper surface of the substrate to tapered lower surfaces of the cover. The cover includes a recess to receive the substrate. The recess includes stress distribution surface areas to engage and press outer edge portions of opposite sides of the substrate against a base plate or heat sink. The tapered lower surfaces of the cover engage with and press against the stepped source leads when securing the RF package to the base plate or heat sink using one or more fasteners or bolts. The cover includes structural features to improve preferential deformation when a mounting force is applied.

Abstract: A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: Disclosed is a reinforcement frame (38) fixed to an outer package (37) of a heated component unit in a display (69), wherein a first heat dissipation fin is included in the reinforcement frame (38). With such an arrangement, even when heat generated when a component unit (such as a backlight unit in a liquid crystal display) is driven, e.g. driving heat of various elements included in the component unit, is transmitted to the outer package (37) of the component unit, the driving heat is further transmitted to the reinforcement frame (38) which is in contact with the outer package (37) and dissipated by means of the first heat dissipation fin. Consequently, the various elements in the component unit are not impaired by driving heat.

Abstract: An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.

Abstract: One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at ˜1350 cm?1 with an intensity ID, a G peak at ˜1585 cm?1 with an intensity IG, and an intensity ratio ID/IG of less than 0.7 at a laser excitation wavelength of 514 nm. The thermal interface material has: a bulk thermal resistance, a contact resistance at an interface between the thermal interface material and the copper substrate, and a contact resistance at an interface between the thermal interface material and a solid-state device. A summation of these resistances has a value of 0.06 cm2K/W or less.

Abstract: A light-emitting diode (LED) heat dissipation aluminum bar and electricity conduction device includes a heat dissipation aluminum bar having a structure formed of multiple sections each having multiple heat dissipation fins. The heat dissipation aluminum bar forms a LED circuit board receiving slot and power channels and each power channel receives therein an insulation that encloses an electrically conductive bars. When an LED circuit board is received and secured in the LED circuit board receiving slot by fasteners, the fasteners, which are made electrically conductive, penetrate the insulations to contact the electrically conductive bars so as to supply electricity to the LED circuit board at the same time of fixing the LED circuit board. The LED circuit board has a structure formed of multiple sections interconnected to each other to allow for adjustment of the overall length thereof.

Abstract: A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.

Abstract: A tilt-type heat-dissipating module for increasing heat-dissipating efficiency and decreasing length of solder pin is disposed on a circuit substrate. The tilt-type heat-dissipating module includes a substrate unit, a heat-dissipating unit and an electronic unit. The substrate unit has a heat-dissipating body disposed on the circuit substrate, and one part of a top surface of the heat-dissipating body is a first inclined plane. The heat-dissipating unit has a plurality of heat-dissipating fins connected to the heat-dissipating body. The electronic unit has a plurality of electronic elements disposed on the first inclined plane of the heat-dissipating body. Each electronic element has a plurality of pins bent downwards from a bottom thereof in order to electrically connect to the circuit substrate, and heat generated by the electronic elements is transmitted to external environment by matching the heat-dissipating body and the heat-dissipating fins.

Abstract: A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink.

Abstract: A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.

Abstract: A clip includes a main body, a pair of locking members integrally formed at opposite ends of the main body, and a securing member secured onto one of the locking members. The one locking member includes an upper portion, a lower portion wider than the upper portion, and a step between the upper and lower portions. The securing member includes a handling portion and an engaging portion extending downwardly from the handling portion. A pair of flanges are formed on the engaging portion facing the main body and abutting the step. A clearance is defined between the flanges and the engaging portion receiving the upper portion. One of the engaging portion and the one locking member forms an engaging hole, and the other one forms a hook engaging into the engaging hole.

Abstract: A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and received in the mounting hole, and a fixture engaging the shaft and pressing the heat sink and a bottom end of the sleeve. The sleeve is filled between the end of the shaft and an inner face of the heat sink defining the mounting hole to perform an engagement of the shaft in the mounting hole of the heat sink, thereby fastening the fasteners to the heat sink. The shaft has a screw extending out of the mounting hole for mounting the heat sink on a printed circuit board.

Abstract: A semiconductor device including: an insulating substrate including a ceramic substrate having first and second principal surfaces, a first metallic conductor fixed on the first principal surface, and a second metallic conductor fixed on the second principal surface; a semiconductor element disposed on the first metallic conductor on the first principal surface; and a base plate connected to the second metallic conductor on the second principal surface, and on which the insulating substrate being disposed. The second metallic conductor includes a joint area connected to the second principal surface, and a non-joint area formed around the joint area.

Abstract: A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.

Abstract: An LED fixture include a mask structure and an LED module. The mask structure includes a cooling fin set of buckling type, an upper socket and a lower socket. The cooling fin set is constituted by a plurality of cooling fins that are encircled and inter-buckled to each other. An interior enclosed by the cooling fin set is formed into an accommodating space and a fitting hole connecting the accommodating space. The upper socket is assembled to one side of the fitting hole, while the lower socket is assembled to another side of the fitting hole. Meanwhile, the upper socket and the lower socket are respectively fastened by the cooling fin set through a clipping-and-abutting manner. The LED module is arranged by accommodating in the accommodating space and is connected to the cooling fin set as well. Accordingly, the entirely cooling effectiveness is promoted and the using lifetime is prolonged.

Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Abstract: A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer. Thus, the heat produced by a heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer.

Abstract: A memory heat sink device having an enlarged heat dissipating area is provided. The memory heat sink device includes two cooling fins that are respectively attached to a front side and a back side of a memory. Raised dots are protruded from a front (or back) side of the cooling fin attached to the front (or back) side of the memory. Each of the raised dots on the cooling fin has at least one sectional area and at least one connection portion. Thus, the heat sink area of the cooling fin increases and heat generated by the memory is easily dissipated by the sectional area through thermal convection.

Abstract: A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.

Abstract: A heat sink assembly including a first heat sink sub-assembly in thermal contact with a first heat source and including spaced apart columns of spaced horizontal fins extending outwardly from the first heat source, and a second heat sink sub-assembly in thermal contact with a second heat source and including spaced apart rows of space vertical fins extending outwardly from the second heat source, wherein the spaced apart columns of spaced horizontal and the spaced apart rows of spaced vertical fins are arranged in an interdigitated manner.

Abstract: The invention relates to a system unit of a computer. The system unit has a plug-in card populated with components and a fan which supplies an air flow to an air ducting body arranged in the system unit. The air flow is provided for cooling the plug-in card which is arranged in the system unit essentially parallel to the air ducting body. Cooling of the plug-in card is improved in that the air ducting body has a central conduit and a first and a second side conduit. The side conduits are provided with a plurality of openings which are arranged in a row and aligned essentially parallel to heat sinks arranged on the plug-in card. The central conduit has a constriction for the admission of air.

Abstract: A power amplification device includes a first power amplification unit having the positions of connectors thereof reversed, a second power amplification unit not having the positions of connectors thereof reversed, and a heat sink having a first flank thereof abutted on the heat radiation surface of the first power amplification unit, and having a second flank abutted on the heat radiation surface of the second power amplification unit. A transmitter using the power amplification device includes a plurality of power amplification devices, a distributor directly coupled to the input connectors of the power amplification devices, and a synthesizer directly coupled to the output connectors of the power amplification devices.

Abstract: An electronic device with improved heat dissipation properties comprises metallic housing. A base circuit board may be positioned within the housing in a plane parallel to the backside. Multiple connectors for coupling cassettes to the base circuit board may be positioned about the periphery of the base circuit board such that multiple cassettes may be positioned adjacent to each side of the housing. Each cassette includes a printed circuit board with a plurality of heat generating components coupled to the printed circuit board and having a thickness extending towards the side of the housing. The cassette includes a metallic housing with a heat dissipation structure contacting: i) the side of the housing; and ii) each heat generating component. Each of at least two heat generating components have different thicknesses and the heat dissipation structure had different thicknesses between the side of the housing and each heat generating component.

Abstract: The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.

Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.

Abstract: An air volume control module for use with a vehicular air conditioning apparatus includes a circuit board including a control circuit for controlling the rotational speed of the blower of the vehicular air conditioning apparatus, a heat sink connected to the circuit board and including a fin for radiating heat generated by the circuit board, and a base housing surrounding the circuit board, the heat sink being inserted in the base housing with the fin projecting from the base housing. The base housing is mounted on the heat sink only by a locking finger. Either one of the base housing and the fin of the heat sink has a protective projection having a heightwise dimension greater than that of the locking finger.

Abstract: A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.

Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.

Abstract: An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.

Abstract: A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.

Abstract: According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.

Abstract: A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device.

Abstract: A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first fins. The inner end of each of the first fins is engagingly received in the inner end of the previous adjacent first fin, sandwiching the inner end of a corresponding second fin therebetween. The outer end of each of the first fins is engagingly received in the outer end of the previous adjacent second fin, and the outer end of each of the second fins is engagingly received in the outer end of the previous adjacent first fin.

Abstract: An image capturing device a circuit base, an image sensor, a cooling member, and an elastic member. The image sensor is disposed on the circuit base. The circuit board defines a first opening covered by the image sensor. The elastic member is interposed between the circuit board and the cooling member. The elastic member comprises a bulged elastic flange running through the first opening and compressively abutting against the image sensor and the circuit board and an elastic arm bent towards the cooling member and elastically abutting against the cooling member.

Abstract: A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.

Abstract: In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

Abstract: Mechanisms and systems for dissipating heat from an optical transceiver module to a module card cage system. In one embodiment, a thermal conductive label having at least one raised portion is attached to a surface of the module. The raised portion is configured to contact at least a portion of the card cage to dissipate heat from the module to the card cage. In another embodiment, the card cage has a protruding depression formed on a part of its surface that is above a slot configured to receive an optical transceiver module. The protruding depression is configured to contact at least a portion of the module to dissipate heat from the module to the card cage.

Abstract: An improved heatsink structure is disclosed. The present invention provides a type of heatsinks formed by stacking a plurality of particulates, in order to achieve a larger heat-dissipation surface area and higher heat-dissipation efficiency.

Abstract: A heat-transfer apparatus includes a heat-producing body, a heat sink adjacent to the heat-producing body, and a thermal interface material that includes a plurality of heat-transfer particles bridging the heat-producing body and the heat sink.

Abstract: One system of the present application includes an electronic assembly with a heat dissipating device, printed wiring board with electronic circuitry, bus bar, insulative grommet, and fastener. The board defines a bus with an interconnection pad and a board opening. The bus bar connects with the interconnection pad and defines a bar opening with a beveled shoulder portion that align with the board opening to define a passage to a fastening site of the heat dissipating device. The grommet defines a distal end portion opposite a proximal end portion shaped with a flange. The distal end portion is inserted into the passage with the flange abutting the beveled shoulder portion. The fastener extends through the grommet to provide a mechanical connection of the board and bar to the site and maintain thermal coupling between the board and device while the grommet electrically insulates the fastener from the bar.

Abstract: A circuit board includes a metal core having a plate shape, an insulation section covering a surface of the metal core, and a heat radiation section in which the metal core is exposed and which is provided at a circumference of the metal core.

Abstract: An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.

Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.

Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.

Abstract: A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components.

Abstract: A cooling system for reducing the thermal energy transfer from the heated spots of an RF coil assembly to a patient bore of an MRI system is disclosed. The MRI system includes a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about an RF space, and an RF coil assembly positioned within the RF space and about the patient bore. The cooling system is positioned within the RF space and includes a plurality of cooling modules configured to reduce an operating temperature of the MRI system. Each of the plurality of cooling modules further includes a thermoelectric cooler thermally coupled to the RF coil and a heat sink thermally coupled to the thermoelectric cooler opposite from the RF coil. The thermoelectric cooler is configured to extract heat from the RF coil when a current is applied to the thermoelectric cooler.

Abstract: An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic component positioned within the reservoir, and a thermally conductive layer conformally molded to the electronic component and disposed between the electronic component and the heat sink.

Abstract: An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axle pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.