Abstract: A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively.

Abstract: Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant.

Abstract: An optical transceiver module is provided that has a pivoting bail latching mechanism that is extremely stiff and locks via a cam locking configuration rather than relying on spring-loading forces to bias the latching mechanism to and maintain the latching mechanism in a desired position. The stiffness of the pivoting bail latching mechanism provided by the cam locking configuration better ensures that forces exerted the transceiver module will not cause the transceiver module to come out of the cage while latched.

Abstract: A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.

Abstract: An electrical device, particularly for driving a motively and/or regeneratively operable electric machine, having at least one switching-element module, which may be for inverting and/or rectifying electric currents, the switching-element module being able to be cooled by a cooling device and resting at least indirectly thereon, a fixation element, at least one conductor, as well as the switching-element module and cooling device being disposed one above the other.

Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Abstract: The disclosure is directed at a configurable light emitting diode (LED) driver/dimmer for controlling a set of light fixture loads comprising: a power circuit; a primary digital controller for controlling the power circuit; a set of output current drivers, each of the set of output current drivers connected to one of the set of light fixture loads for controlling the associated light fixture load; a secondary digital controller for controlling the set of output current drivers; wherein the secondary controller transmits LED control information to control outputs of the set of output current drivers; and wherein the secondary digital controller provides digital feedback control information to the primary digital controller.

Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.

Abstract: A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.

Abstract: An electric assembly includes a heat sink defining a through hole and a notch communicating with the through hole; a circuit board defining a fixing hole; and a fastening assembly. The fastening assembly includes a fastener comprising a stem, a head connected one end of the stem, and a clamp connected to an opposite end of the stem; a limiting member comprising a main body slideably disposed on the stem and a limiting portion extending from the main body, the main body received into the through hole, and the limiting portion engageably inserted into the notch; and an elastic member disposed around the stem and between the head and the main body. Wherein the limiting portion is capable of sliding out of the notch and against the heat sink to compress the elastic member.

Abstract: An electronic device includes a shell, an electronic component received in the shell, and a heat sink arranged between the electronic component and the shell. The heat sink includes a first heat spreader attaching to the electronic component, a second heat spreader spaced from the first heat spreader, and a plurality of fins between the first and second heat spreaders. Each fin includes a pair of contacting portions, a pair of bending portions and a connecting portion each of which being flat. The contacting portions are respectively connected to the two heat spreaders. The bending portions respectively extend from the contacting portions towards each other. Each bending portion forms a rear end adjacent to the other bending portion. The connecting portion interconnects the rear ends of the bending portions at opposite ends thereof.

Abstract: A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.

Abstract: A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portion of a motor vehicle transmission having electrical and electronic components such as valves, solenoids, motors and sensors. Spaced from the inside surface of the cover where it is subjected on both sides to flow of transmission fluid is a plate or heat sink. An electronic controller is disposed on the outside of the cover and attached by heat transferring mechanical fasteners such as studs or bolts to the plate inside the cover. Preferably, the housing of the controller also includes a heat sink.

Abstract: According to one embodiment, an electronic device includes a printed wiring board, a first heat generating part and a second heat generating part secured to one surface of the printed wiring board, a plurality of first heat pipes, a second heat pipe and a heat sink. The first heat pipes each include a first end portion, a second end portion on an opposite side to the first end portion and a middle portion located between the first and second end portions and thermally connected to the first heat generating part. The second heat pipe includes a third end portion connected to the second end portion and a fourth end portion provided on an opposite side to the third end portion and thermally connected to the second heat generating part. The second heat pipe has a width dimension larger than that of the first heat pipe.

Abstract: Power electronic devices of an electronic control module are mounted in a power module disposed between the control module circuit board and an interior face of the control module case, with a prescribed separation distance between the circuit board and a housing of the power module. The power electronic devices are mounted on an inboard face of a power module substrate, and a heatsink thermally coupled to the opposite face of the substrate is fastened to an interior surface of the control module case. The substrate and heatsink are mounted in the power module housing, and the power electronic devices are electrically coupled to the circuit board by a set of compliant terminals that protrude from the inboard face of the power module housing. The terminals extend into plated holes in the circuit board, and have shoulders that limit their depth of insertion to establish the prescribed separation distance between the circuit board and the power module housing.

Abstract: A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a backplate attached to an underside of the circuit board. The heat sink includes a pair of securing legs at two corners of the heat sink, and a pair of securing members. Each securing leg defines a securing hole thereon. Each securing member includes a spring thereon positioned between the corresponding securing legs and the circuit board. The securing members are secured in the corresponding securing holes to secure the heat sink to the circuit board.

Abstract: A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.

Abstract: A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.

Abstract: A heat dissipating device includes a supporting component installed on a circuit board. A plurality of openings is formed on the supporting component. The heat dissipating device further includes a plurality of heat dissipating components disposed on a side of the supporting component and installed inside the plurality of openings respectively for dissipating heat generated by a plurality of heat sources disposed on the other side of the supporting component. The heat dissipating device further includes a plurality of elastic components for pressing the plurality of heat dissipating components so that the plurality of heat dissipating components contacts the plurality of heat sources closely.

Abstract: A heat-dissipating mechanism with a thermo-conducting sheet is arranged between a pluggable optical transceiver and a heat sink. One of the optical transceiver and the heat sink includes the thermo-conducting sheet. The heat sink is assembled with a cage to be movable vertically and against a downward force. The optical transceiver includes a projection that comes in contact with the heat sink. The heat sink includes a rail with a pocket. When the transceiver is inserted into the cage, the projection first runs along the rail to lift the heat sink upward; subsequently, the projection is set within the pocket to allow the thermo-conducting sheet to contact the transceiver.

Abstract: The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe is used to transfer heat from the condensation portion of a vapor chamber to cool a bottom portion of a finned heat dissipation space and transfer the heat to a colder location on the heat fins. In another proposed embodiment, the water vapor chamber is placed in a heat sink and is adapted to thermally connect to at least one heat pipe.

Abstract: A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin soldering process. A plurality of protruding structures protrudes from the soldering portion uniformly. The protruding structures are beneficial for getting a better soldering quality.

Abstract: An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.

Abstract: A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol.

Abstract: A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the bracket, and replaced by other cantilevers with different sizes to mount a plurality of heat sinks having different sizes.

Abstract: DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.

Abstract: A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.

Abstract: An exemplary heat sink assembly includes a heat sink and a clip resiliently clamping the heat sink on a printed circuit board. The heat sink includes a base and a plurality of first fins and two central second fins extending upwardly from the base. The clip includes a locating portion fixed between the second fins of the heat sink, a pair of elastic portions extending outwardly from opposite ends of the locating portion and oriented towards substantially opposite directions, and two hooks extending outwardly from ends of the operating members, respectively. An acute included angle is formed between each elastic portion and the locating portion of the clip in an original relaxed position, and the acute included angles become approximately right angles when the clip is preassembled in the heat sink with the elastic portions abutting the second fins.

Abstract: A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.

Abstract: A magnesium alloy compound type thermal metal material includes a heat dissipation surface layer formed of a magnesium alloy, a contact surface layer formed of gold, platinum, silver, or copper alloy, and a fusion layer, which is an eutectic structure joined between the heat dissipation surface layer and the contact surface layer under and formed therebetween subject to application of a high temperature and a high pressure, such that the thermal conductivity metal alloy of the contact surface layer absorbs heat energy quickly from the heat source and transfers absorbed heat energy to the heat dissipation surface layer for quick dissipation; the internal molecules of the product are joined tightly together subject to the applied pressure, and the surface of the product allows for electroplating.

Abstract: An information processing apparatus having improved cooling efficiency is disclosed. The information processing apparatus includes a first chassis and a second chassis separated from each other at a prescribed distance, the first chassis accommodating a substrate on which high heat generating parts such as a CPU and a chipset are mounted, and the second chassis accommodating low heat generating and low heat resistance parts. Because of this structure, the first chassis and the second chassis are thermally isolated, and the surface area of the apparatus is increased, thereby improving the cooling efficiency of the apparatus.

Abstract: An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.

Abstract: An RF power amplifier including a single piece heat sink and an RF power transistor die mounted directly onto the heat sink.

Abstract: A solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is gallium nitride based. The switch is secured relative to the bus bar and the bus bar is configured to communicate heat away from the switch. An example method of arranging a switch includes mounting a gallium nitride based switch relative to a bus bar and communication heat away from the gallium nitride based switch using the bus bar.

Abstract: A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first main surface 30B and a second main surface 30C configured to be located on the opposite side of the first main surface 30B. Semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2 are arranged in the first main surface 30B and the second main surface 30C in a zigzag pattern in cross-sectional view; and the semiconductor modules 20 are mounted onto some or all of the semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2.

Abstract: A motor controller, which is inexpensive and has small size, is provided by reducing the size of a heat sink used in the motor controller and the number of all parts of the motor controller, wherein said motor controller includes a heat sink, a power semiconductor modules that is in close contact with the heat sink, a substrate (4) that is electrically connected to the power semiconductor module, and a fan (6) that generates the flow of external air and supplies cooling air to the heat sink, wherein said heat sink is formed by combining two kinds of heat sinks, which include a first heat sink (7) and a second heat sink (8), so as to conduct heat therebetween, and, wherein said power semiconductor module is in close contact with the second heat sink (8).

Abstract: Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and methods are particularly suitable in NEMA-4 electrical enclosures used in electrical submersible pump applications.

Abstract: The invention relates to an illumination device (1) comprising at least one preferably ceramic substrate plate (2), at least one luminous element (3) arranged on a front side (A) of the substrate plate (2) in particular at least one light emitting diode (LED) (3), and at least one preferably metallic heat sink (4) connected, in particular adhesively bonded and/or soldered, to a rear side (B) of the substrate plate (2) over a large area, wherein the coefficients of thermal expansion of substrate plate (2) and heat sink (4) differ at least by the factor 1.5, in particular by a factor greater than 2. The heat sink (4) has at least one preferably linear recess (6) on its side facing the rear side (B) of the substrate plate (2).

Abstract: A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed along the plurality of memory circuits. Finally, the system may include a heat pipe, a vapor chamber, or a combination thereof, extending along the heat spreader. In another embodiment, a system may include a heat spreader configured to mount to an in-line memory module, and an evaporative cooling system at least substantially contained within dimensions of the heat spreader.

Abstract: An electronic device includes a circuit board comprising a first surface and a second surface, a heat sink positioned on the first surface, and a support positioned on the second surface to support the circuit board. The circuit board includes a pair of first locating holes extending through the first surface and the second surface. The heat sink includes a pair of second locating holes corresponding to the first locating holes. The support includes a pair of locating posts projecting from a pair of diagonal corners thereof and extending through the corresponding first and second locating holes to limit unwanted movement of the heat sink and a shim projecting from a center thereof to prevent the circuit board from flexing. Dimensions of the shim are contoured to provide compensation for bending of the support under an applied load.

Abstract: A power semiconductor module includes an insulating substrate with a conductive circuit layer attached to one side and a baseplate attached to the other side. A power semiconductor device is attached to the conductive circuit layer. The conductive circuit layer and the baseplate are formed of a material with a coefficient of thermal expansion less than about 8.0×10?6/° C. and a density less than about 4 g/cm3.

Abstract: A graphics card includes a graphics processing unit (GPU), a heat dissipation fin, an electric cooling module and a thermoelectric generator. The electric cooling module has a cold side and a hot side. The cold side contacts the GPU, and the hot side contacts the heat dissipation fin. The thermoelectric generator contacts the heat dissipation fin and is electrically connected to the electric cooling module. Furthermore, a method for dissipating the heat of the graphics card is also disclosed herein.

Abstract: The present invention provides a highly reliable electric power converter reduced in parasitic inductance.

Abstract: A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.

Abstract: According to one embodiment, a cooling device includes a cooling fan, a heat sink, an inserting portion, a projection, and a holder. The inserting portion is provided on one of the cooling fan and the heat sink. The projection is provided on the inserting portion, and protrudes in a direction intersecting an inserting direction of the inserting portion. The holder is provided on the other one of the cooling fan and the heat sink, and configured to receive the inserting portion. The holder includes (i) an opening portion configured to engage with the projection, (ii) a first supporter facing the inserting portion in a first direction intersecting the inserting direction of the inserting portion and a protruding direction of the projection, and (iii) a second supporter facing the inserting portion in a second direction different from the first direction.

Abstract: The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.

Abstract: A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base. A plurality of clasps extends upwardly from the connecting member. The clip is clasped by the clasps of the connecting member to be attached thereto. The clip is pressed downwardly to engage with a plurality of hooks of a bracket around the electronic component of the printed circuit board to make the base intimately contact with the electronic component.

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors. The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.