Abstract: A device designed to reduce temperature rise in its control board. The device includes a switching element; a coil; a smoothing capacitor; an electrical connection member for electrically connecting the switching element with the smoothing capacitor and the coil; a control board that mounts a control element; a control signal line for electrically connecting the switching element with the control board; and a switching element placing portion for placing the switching element thereon. The electrical connection member is arranged between the switching element and the control board; the smoothing capacitor and the coil are arranged, with respect to the electrical connection member, on a side of the switching element; and end surfaces of the smoothing capacitor and the coil are positioned, with respect to the electrical connection member, apart from a plane where the switching element and the switching element placing portion are adjoined together.

Abstract: An electrical component is mounted a circuit board. A case covers the circuit board. The circuit board includes a plate-like metal core and an insulation portion. The insulation portion covers a surface of the metal core. The metal core is provided with a heat radiation portion exposed from the case.

Abstract: A system includes a circuit board, a multi-die package, and a heat dissipator. The circuit board has substantially planar opposing first and second sides. The multi-die package includes a substrate and a first set of one or more semiconductor devices on a first substrate side and a second set of one or more semiconductor devices on a second substrate side. The multi-die package is located at the first circuit board side. The heat dissipator is located at the second circuit board side, and thermally coupled to the second set of semiconductor devices. One or more portions of the circuit board are removed between the first circuit board side and the second circuit board side so as to define one or more holes through the circuit board and to facilitate thermal coupling between the second set of semiconductor devices and the heat dissipator through the one or more holes.

Abstract: The present disclosure relates to an apparatus for fastening a power semiconductor using an integral springy (elastic) clip, capable of fixing a power semiconductor, such as a diode and a MOSFET, using elasticity of a U-shaped clip by integrally molding the clip onto a housing of a plastic module. The apparatus includes an elastic (springy) clip integrally molded onto a lower surface of the housing and downwardly curved into a U-like shape in a bridge module in which a bridge of the power semiconductor protrudes through a through hole of the housing to be connected to a printed circuit board, whereby the power semiconductor is fixed by a force that the housing presses the power semiconductor.

Abstract: An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.

Abstract: A power supply converter (100) comprising a first FET (210) connected to ground (230), the first FET coupled to a second FET (220) tied to an input terminal (240), both FETs conductively attached side-by-side to a first surface of a metal carrier (120) and operating as a converter generating heat; and a packaged load inductor (110) tied to the carrier and an output terminal (241), the inductor package wrapped by a metal sleeve (113) in touch with the opposite surface of the metal carrier, the sleeve operable to spread and radiate the heat generated by the converter.

Abstract: A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole.

Abstract: According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board.

Abstract: An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.

Abstract: An electro-optical device includes: an element substrate and an opposing substrate disposed so as to oppose each other; liquid crystals encapsulated and sealed between the two substrates; a display region that displays an image by modulating incident light based on image information; a heat dissipation member disposed opposing a second surface of the element substrate, the second surface being on the opposite side as the opposing substrate; and a thermal conductive member disposed between the element substrate and the heat dissipation member. The dimension from the end portion of where the thermal conductive member and the element substrate make contact with each other to the end portion of the display region on the second surface of the element substrate is greater than the thickness of the element substrate.

Abstract: A heat sink installing device includes a base, a pair of guiding poles, a slidable cover, a pair of latches and a number of auxiliary wings. The pair of guiding poles is perpendicularly mounted on the base and separated from each other. The slidable cover is slidably fitted on the pair of guiding poles and defines a pair of through holes running through two opposite side surfaces of the slidable cover. Each of the latches is mounted on the slidable cover and latched on one of the guiding poles correspondingly. The plurality of auxiliary wings are correspondingly attached on a side surface of the slidable cover around the through hole and inclined towards the center of the through hole by a distal end thereof away from the slidable cover.

Abstract: A heat dissipating member is formed so as to be opposed to a reflection type liquid crystal panel. The heat dissipating member includes a heat receiving portion that is opposed to a reflection type light modulation element and has a heat receiving surface for receiving heat from the element, a heat dissipating fin that dissipates heat received on the heat receiving portion to the outside. The heat receiving portion has heat receiving convexes which project to the side at which the element is arranged from the heat receiving surface, and the convexes are formed such that ratios of areas of tip surfaces of the heat receiving convexes with respect to a unit area are larger on a center portion of a heat reception acceleration region rather than on an end of the heat reception acceleration region.

Abstract: A semiconductor module mounted on a vehicle is disclosed. The semiconductor module includes a semiconductor element, a forced-cooling type cooler, and a heat mass. Heat generated in the semiconductor element is conducted to the cooler. The heat mass is joined onto the semiconductor element, so as to be thermally coupled to the semiconductor element. The heat mass is formed such that the thermal resistance of a part of the heat mass that corresponds to a high temperature part of the semiconductor element in a heat generating state is lower than the thermal resistance of a part of the heat mass that corresponds to a lower temperature part of the semiconductor element.

Abstract: According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.

Abstract: A system for cooling an electronic device having a heat-generating component includes a passive cooling device having a cooling ability designed to expire after a predetermined amount of heat is absorbed from the heat-generating component and an active cooling device configured to at least one of dissipate heat generated by the heat-generating component and cool the passive cooling device, when the active cooling device is activated. The system also includes a controller configured to activate the active cooling device after a determination that a predetermined threshold condition has occurred, wherein the predetermined threshold condition is selected to occur after the passive cooling device cooling ability has substantially expired, to thereby substantially minimize power consumption of the active cooling device in cooling the heat-generating component.

Abstract: A mezzanine board alignment and mounting device includes a multi-stage pin connected to a main board near a mezzanine board connector disposed on the main board. The multistage pin includes a base adapted to connect to the main board, a point distal to the base adapted to pass through an opening on a mezzanine board, and a support disposed between the base and the point. A diameter of the point widens towards the support. A diameter of the support is wider than a diameter of the opening. When the point is fully inserted through the opening in the mezzanine board, the mezzanine board is aligned properly to connect with the mezzanine board connector on the main board.

Abstract: A fastening mechanism for fixing a radiator having a plurality of heat sinks to a circuit board includes two fixing rods fixed on the circuit board, a connecting member positioned between the heat sinks; and two fastening arms respectively connecting the connecting member to the fixing rods. An electronic device using the fastening mechanism is also provided.

Abstract: A folded system-in-package (SiP) assembly is provided for minimizing the footprint of two corresponding circuit board modules in a handheld electronic device. The assembly includes top and bottom circuit board modules that are electrically interconnected through a flex circuit. Either a plate or wrapped heat spreader may be thermally coupled to the top circuit board module to conduct heat from the heat-generating components mounted to the top circuit board module and to a case of the electronic device.

Abstract: A portable electronic device comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing. The heat-conduction structure is disposed in the housing and contacts the circuit board. The heat-dissipation structure is disposed outside the housing and connected to the heat-conduction structure, wherein heat is transmitted from the circuit board, passing the heat-conduction structure and the heat-dissipation structure to be dissipated out of the housing.

Abstract: A heat radiator is in the form of a rectangular body having two opposite longer sides and two opposite shorter sides, and includes a contact section located at an end surface of the heat radiator for contacting with a heat source and having at least one extension wall outward extended therefrom to divide the heat radiator into a first heat-dissipating zone, which consists of a plurality of curved radiation fins outward extended from the contact section toward the two longer sides, and a second heat-dissipating zone, which consists of a plurality of straight or curved radiation fins outward extended from the contact section and the extension wall toward the two shorted sides. These radially outward extended radiation fins not only provide increased heat radiating areas, but also guide airflow produced by a cooling fan to smoothly flow therethrough to carry heat away from the heat radiator in different directions.

Abstract: The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.

Abstract: A switching power supply device includes a case, a board that has circuit parts containing a switching element mounted thereon and is accommodated in the case, and a heat sink that is provided in the case so as to partition the inside of the case into a part mount chamber having the board accommodated therein and an air flow path through which air flows. The switching element of the circuit parts is mounted on the board while brought into contact with a surface of the heat sink that faces the part mount chamber, and cooled through the heat sink by the air flowing in the air flow path.

Abstract: The present invention provides an electronic device, comprising: a circuit board having at least one first heat-generating element and at least one second heat-generating element mounted thereon; a heat sink connected to said at least one first heat-generating element; a fan facing said heat sink; and an airflow guiding member placed between said fan and said heat sink for guiding the cooling air from said fan to said heat sink and said at least one second heat-generating element respectively.

Abstract: A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel.

Abstract: An electric part fixing structure for a motor-driven compressor includes an electric part having a plurality of leads and a guide member for positioning the leads. The guide member is made of a plastic and has a guide hole through which the lead is passed.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a heat sink, and a fixing portion. The circuit board includes a heating component. The heat sink has a plate shape and faces the heating component. The fixing portion is attached to the heat sink and fixed to the circuit board at least at two points.

Abstract: An electro-optical device may include: an electro-optical panel, a holding member that includes a main body part arranged to surround the periphery of the electro-optical panel, and a holding part protruded from the main body part and holding the electro-optical panel, and a heat radiating member that is disposed opposing the electro-optical panel through an opening of the holding member from the opposite side of the light incident plane of the electro-optical panel.

Abstract: A solar cell module junction box includes a plurality of terminals (30) respectively connected to solar cells, a housing (10) one-piece formed with the terminals (30), a cover (50) coupled to an upper portion of the housing (10) to close the housing (10), a pair of cable members (60) respectively connected to the terminals (30) spaced apart from each other along a transverse direction of the housing (10), a flat diode (20) arranged between the terminals (30) and configured to cause an electric current to bypass a damaged solar cell, and a plurality of heat sinks (25) arranged at the rear side of the diode (20) to dissipate heat generated in the diode (20) or a heat diffusion member (29) made of an insulating heat diffusion material (29a) alone or formed by covering a heat diffusion pad (29b) with the insulating heat diffusion material (29a).

Abstract: An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink extends above the free surface. The external heat-sink includes a first dissipative portion and a second dissipative portion for contacting the first and second heat-sinks on the free surface, respectively, as well as an insulating portion for electrically insulating the first dissipative portion from the second dissipative portion. The first dissipative portion and the second dissipative portion are symmetrical with respect to the insulating portion. An extension of the external heat-sink may provide a stabilizing element. The extension of the external heat-sink may alternatively thermally and electrically interconnect two insulating bodies, each body embedding at least one integrated circuit chip.

Abstract: An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

Abstract: A device includes a first switch and a second switch, each switch being integrated on a chip having a back surface and an opposite front surface. Each chip includes a first conduction terminal and a control terminal on the front surface, while a second conduction terminal of the switch is located on the back surface. The first switch and the second switch are connected in a half-bridge configuration with the first switch's second conduction terminal electrically connected to the second switch's first conduction terminal. The chips are installed in a common package comprising an insulating body with an embedded heat sink. The chips of the switches are mounted on the heat sink such that the second conduction terminal of the first switch and the first conduction terminal of the second switch are in contact with the heat sink, with the heat sink providing the electrical connection between the two switches.

Abstract: A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending along a longitudinal axis between a front end and a rear end positioned proximate to the header. The guide rail also includes board guides extending from the main wall along the longitudinal axis that are configured to engage a card module circuit board or board guide of the card module to guide the card module to the header. The guide rail also includes heat sink flanges extending from the main wall along the longitudinal axis that are configured to engage a heat sink of the card module to dissipate heat from the heat sink to the main wall.

Abstract: A monolithic microwave integrated circuit structure having a semiconductor substrate structure with a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface and a metal layer on an opposite surface overlaying the interconnection section and absent from overlaying at least one of the input section and the output section.

Abstract: An apparatus includes a plurality of islands each carrying multiple cantilevers. The apparatus also includes a fluidic network having a plurality of channels separating the islands. The channels are configured to provide fluid to the islands, and the fluid at least partially fills spaces between the cantilevers and the islands. Heat from the islands vaporizes the fluid filling the spaces between the cantilevers and the islands to transfer the heat away from the islands while driving the cantilevers into oscillation. The apparatus may also include a casing configured to surround the islands and the fluidic network to create a vapor chamber, where the vapor chamber is configured to retain the vaporized fluid. The islands and the fluidic network could be formed in a single substrate, or the islands could be separate and attached together by a binder located within the channels of the fluidic network.

Abstract: A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device.

Abstract: An illuminated sign includes a plurality of straight fin heat sinks framed together; a plurality of LED plates framed together, each LED plate comprising a plurality of LEDs arranged in rows on a front surface, and a plate heat sink on a rear surface, the plate heat sinks being in contact with the straight fin heat sinks; and an LCD panel mounted in front of the LED plates by framing.

Abstract: The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields. According to the invention, an electrically conductive sheet metal part (170) is arranged on the circuit board (110) which forms a Faraday cage for the electronic components (160, 162) with the circuit board. The electrically conductive sheet metal part (170) is furthermore in thermal contact to the electronic components (160, 162) and in thermal contact to the housing (100) of the control device (10) and thereby deflects heat from the electronic components (160, 162) into the housing (100).

Abstract: An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm includes a fixing bracket connected to the guide rail and a sliding bar slidably connected with the fixing bracket. An engaging post is formed on the sliding bar. The sliding bar is slidable along the fixing bracket, such that a total length of each of the mounting arms is variable to adjust the locations of the engaging posts of the mounting arms.

Abstract: An exemplary heat dissipation device includes a base plate, a bracket engaged with the base plate, and a heat radiator mounted on the base plate and the bracket. The bracket includes two parallel arms. The bracket defines an opening between the arms. Each of the arms extends downwardly two clasps. Each clasp of each arm comprises a blocking part and a connecting part connecting the blocking part. The base plate is received into the opening of the bracket and sandwiched and secured by the blocking parts of the clasps and the arms of the bracket.

Abstract: There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.

Abstract: A method of fabrication, a device structure and a submount comprising high thermal conductivity (HTC) diamond on a HTC metal substrate, for thermal dissipation, are disclosed. The surface roughness of the diamond layer is controlled by depositing diamond on a sacrificial substrate, such as a polished silicon wafer, having a specific surface roughness. Following deposition of the diamond layer, an adhesion layer, e.g. comprising a refractory metal, such as tantalum, and at least one layer of HTC metal is provided. The HTC metal substrate is preferably copper or silver, and may be provided by electroforming metal onto a thin sputtered base layer, and optionally bonding another metal layer. The electrically non-conductive diamond layer has a smooth exposed surface, preferably ?10 nm RMS, suitable for patterning of contact metallization and/or bonding to a semiconductor device. Methods are also disclosed for patterning the diamond on metal substrate to facilitate dicing.

Abstract: A frequency converter for driving a motor, includes a circuit board, having at least one first heat-generating element mounted thereon; a heat sink, connected to the at least one first heat-generating element; a fan, facing the heat sink; and a bracket, for positioning the at least one heat-generating element relative to the heat sink and the circuit board. The frequency converter includes a separating member for separating at least one portion of at least one second heat-generating element from the circuit board to prevent the cooling air guided to the at least one second heat-generating element from flowing to the circuit board. The frequency converter includes an airflow guiding member for guiding the cooling air from the fan to the heat sink and the at least one second heat-generating element and a flow guiding gate dispensing more airflow to the region corresponding to the at least one first heat-generating element.

Abstract: A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the resistive element. The heat spreader also includes one or more leg portion that extends from the body portion and are associated with the heat sink in a thermally conductive relationship.

Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.

Abstract: A socket and heat sink unit for use with a removable LED light module includes separate socket and heat sink portions that are coupleable to each other. The socket can releasably couple to a removable LED light module. The heat sink can couple to the socket and extends about a central axis. The heat sink includes a plurality of fin members that extend outward from a central core portion. At least two adjacent fin members define a channel therebetween at the junction of the fin members to the central core portion. The channel can receive a fastener therein to couple the socket to the heat sink. An extrusion process can be used to manufacture the heat sink portion, and to form one or more fastener holes in the heat sink portion sized to receive one or more fasteners to fasten the heat sink portion to the socket portion.

Abstract: A power converter design is disclosed with a novel approach to thermal management which enhances the performance and significantly reduces the cost of the converter compared to prior art power converters. The invention minimizes the heating of one power component by another within the power converter and therefore enables the power converter to work at higher power levels. Essentially, the power converter uses a heatsink having a high length to width ratio, a linear array of power components thermally coupled to the heatsink parallel to the long axis of the heatsink and a heat removal system which produces the highest cross sectional thermal flux perpendicular to said long axis. In addition, a number of ancillary thermal management techniques are used to significantly enhance the value of this basic approach.

Abstract: A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).

Abstract: A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member.