Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: A circuit arrangement (3) of modular design, in particular for propulsion of a railroad vehicle, having at least two series-connected, power-electronic modules (M1, M2, . . . Mn), which each have a DC isolation point. A first (M1) of these modules is connected to high voltage and a second (M1) is connected to frame or ground potential. The first module (M1) has a first power-electronics assembly (4) which is at high voltage and is connected to a power-electronics assembly (4) (which is at a lower potential) of the second or of a third module (M2). The power-electronics assemblies (4) of each module are arranged in one of several equivalent and dielectric material housings (10), each of which is normally designed in a cuboid shape. The housings (10) are arranged parallel and at a short distance away from one another with regard to their height on a plate (9) which is at frame or ground potential.

Abstract: A device, used in particular in telecommunications technology to supply power to parallel-connected, electrical loads has side-by-side arranged potential lines. These are secured inside a connecting housing, with connections for supplying the operating potential. The connections supply plug-in modules for connecting individual loads, which modules are fitted against the connecting housing in longitudinal direction of the potential lines. The potential lines are configured as rigid, parallel bus bars that project on a side from the connecting housing. With the aid of passages that make contact with the bus bars, the plug-in modules are fitted side-by-side onto the bus bars, such that they fit against the connecting housing or against each other, and are frictionally secured.

Abstract: A system of interlocking modules for use with a programmable logic controller. The system utilizes a plurality of modules, e.g. input/output modules, that are mechanically interlinked to obviate the need for a rack or back plane. Each module includes a movable plug portion that selectively may be moved into engagement with a corresponding plug receptacle of the next adjacent module. The mechanical interlocking features and the plug portions are designed to permit insertion and removal of individual modules disposed between adjacent modules, without moving either of the adjacent modules.

Abstract: Apparatus for providing EMI/RFI shielding to cables connected between electrical circuitry contained within an enclosure and the exterior environment. A fixed supporting flange is secured to the enclosure adjacent to a gap in the enclosure. An adjustable compression flange is secured to the enclosure adjacent to the gap. Cables extending from inside of the enclosure to the exterior environment pass through the gap. A compliant, resilient gasket is positioned over the gap, between the supporting flange and the compression flange. The compression flange bearing against the cables compresses the cables into the gasket.

Abstract: A structure wherein a hand held computer module can be conveniently and interchangeably coupled to accessory devices. The hand held computer module is detachably connected to a first accessory module by a first interlocking structure. The computer module includes the first interlock mechanism and the first accessory module includes the second interlock mechanism. The first and second interlock mechanisms are mated together to form a physical connection between the computer module and the first accessory module. The first accessory module also includes a third interlock mechanism which is similar to the first interlock mechanism. A second accessory module has a fourth interlock mechanism which is similar to the second interlock mechanism. The first accessory module can be detachably connected to a second accessory module by means of a second interlocking structure which includes the third and fourth interlock mechanisms.

Abstract: A multi-chip module (MCM) assembly has three stacked integrated circuit (IC) layers. The first IC layer is electrically flip-chip connected to a substrate. The back of the second IC layer may be glued to the back of the first IC layer, and the second and third IC layers are electrically flip-chip connected to each other. In one embodiment, the third IC layer is electrically connected to the substrate through a vertical interconnect element for high circuit density. In another, the second IC layer is electrically connected to the substrate using wire bonding for greater post-fabrication customization flexibility. In still another embodiment, the MCM assembly comprises two stacked IC layers where the second IC layer is electrically flip-chip connected to the first IC layer and the second layer is electrically connected to the substrate through a vertical interconnect element.

Abstract: A chassis system for housing a plurality of circuit boards, such as PCI standard bus boards, provides a rack-mountable chassis having an open front side and a motherboard with a plurality of board connectors arranged side-by-side with respect to the front end. The boards are mounted in individual frameworks that facilitate ready installation and removal from the chassis. In particular, the chassis includes a plurality of receiving blocks at the bottom rear of the chassis, aligned with each of the motherboard connectors. The receiving blocks receive pivots mounted on the back of each framework. The framework is inserted into, and removed from the front opening of the chassis in an upwardly pivoted position that clears the motherboard connectors and other obstructions in the chassis. The framework is pivoted into and out of engagement with the motherboard when the pivot is located in the receiving blocks. The chassis can include top-mounted tracks. The tracks receive rollers on the framework.

Abstract: The present invention relates to two modules containing electronic equipment, one relatively small, and one relatively large, that will be physically connected and used for extended operation in an environment where the ambient atmosphere contains moisture filled air or some other specified environmental contaminant. An absorber such as desiccant of a prescribed amount is contained within at least the relatively large module to control the absolute humidity and/or environmental contaminants within each module during extended operation in the ambient environment. Permeable wall portions are placed in the region between the relatively small module and the relative large module to allow for moisture and/or other specified environmental contaminants to pass from the relatively small module to the relatively large module. As such, the lifespan of the small module can be extended.

Abstract: A resin-encapsulated semiconductor package and a packaging structure, make it possible to provide for a high density mounting arrangement. Specifically, outer leads protrude from the two long sides of a rectangular package. The inner leads in the package, connected to the outer leads protruding from one long side, are connected through wires to the bonding pads of a semiconductor chip encapsulated in the package, whereas the inner leads in the package, connected to the outer leads protruding from the other long side, are in an electrically floating state in the package. The semiconductor packages are arranged in a direction on a card-shaped mounting board, and the opposed outer leads of adjoining semiconductor packages are electrically connected by wiring on the mounting board. The wirings are laid below the semiconductor packages so that they extend generally linearly.

Abstract: A multi-configuration modular computer that can be configured to be different types of personal computers or associated computer devices is disclosed. The multi-configuration modular computer comprises a display module, a keyboard and pointer device module, a motherboard and power module, and an expansion module. By selecting and combining different modules, the multi-configuration modular computer can be configured to be a LCD display monitor, a pen-based computer, a terminal, a network personal computer, a sub-notebook computer, a notebook computer or a desktop computer.

Abstract: The HT power supply unit modular support according to the invention comprises functional housings intended to accommodate the functional elements of the power supply unit, the insulating walls of which are formed by two protruding walls (2, 3) having overlapping complementary inclined surfaces (5, 6). Application to HT power supply units for X-ray sources.

Abstract: An electronics casing is formed from interlocking upper, lower and side panels and a pair of end plates. Grooves are formed in the outer surface of the lower panel for mounting the casing on the legs or struts of tripods or other lighting supports. The weight of the casing helps counter-balance lighting elements supported on the tripod and holds the casing in place. Multiple casings may be connected together using dovetail tongue and groove connectors on the sides of the casing.

Abstract: A universal enclosure system in a tower type manner for receiving different type mother boards therein includes the main body generally having at least a top wall, a bottom wall, a first and a second side walls, a front panel. Two kinds of different removable back panels are interchangeably adopted to cooperate with the main body for exclusively receiving a first type mother board, i.e., the ATX type, or a second type mother board, i.e., the NLX type, in the enclosure system wherein the first type mother board is bigger than the second type mother board. The first back panel cooperates with a first metal carrier which is adapted to mount the first type mother board thereon whereby the first type mother board is positioned in the interior of the enclosure system and almost very close to the first side wall.

Abstract: An electronic system contains a backplane circuit card which supplies power to various modules. Embedded power distribution planes each include one or more islands, each island being associated with a respective module. The island is electrically isolated from the body of the power plane except at a relatively small area, called the power ramp. The electronic current path from the power plane to the module goes through the power ramp and the island. Preferably, a pair of adjacent power planes at +48 VDC and 0 VDC are in the middle layers of the backplane with a ground plane on either side. Signal planes carrying circuit patterns for multiple data signals are deposited as additional layers on either side of the ground planes. The pair of power planes are nearly identical patterns, the differences being the location of power connections for the modules. In particular, the islands and power ramps are located in the same places on each power plane.

Abstract: A cabinet having a plurality of compartments adapted to have disposed in a corresponding one thereof one of a plurality of processing unit modules. Each one of the modules includes a case. The case has a motherboard mounting surface adapted to have mounted thereto one of a plurality of differently configured motherboards, each one of the differently configured motherboards having a different arrangement of a CPU, main memory and I/O adapted cards. The case also has a bulkhead mounting surface adapted to have mounted thereto one of a plurality of differently configured I/O bulkheads, each one of the differently configured bulkheads being configured for a corresponding one of the differently configured motherboards. The case has a fan mounting surface adapted to have mounted thereto one of a plurality of differently configured fan assemblies, each one of the differently configured fan assemblies being configured for a corresponding one of the differently configured motherboards.

Abstract: In a modular tower building block system for containing computing system devices, an I/O bus is incorporated into the modular blocks of the building block system by using a printed circuit board to carry the I/O bus in each modular block. The printed circuit board is mounted and positioned in each modular block to electrically connect with a printed circuit board in a next adjacent modular block when two modular blocks are stacked on each other. Also, there are a plurality of I/O buses on the printed circuit boards and only one I/O bus is distributed from each modular block. The printed circuit board is precisely located in each modular block at a predetermined position. Alignment pins and receivers provide alignment between stacked modular blocks to precisely position one modular block to the other modular block. This also aligns electrical connectors on the printed circuit boards of the stacked blocks so that the connectors on the printed circuit boards from two blocks mate when the two blocks are stacked.

Abstract: A semiconductor chip is die-bonded on a tape. A plurality of electrodes for power supply for supplying power are formed at an upper surface of the semiconductor chip, and a plurality of electrodes for signal communication for communicating signals are formed at a lower surface of the semiconductor chip. The semiconductor chip, the tape and the like are sealed within a package. A power supply wiring formed external to the package is connected to an electrode for power supply. Thus, a semiconductor device is obtained which efficiently releases the heat generated at the semiconductor chip and contemplates increasing the number of electrodes for signal communication.

Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: An electrical interconnection system for electronic modules that are mountable on a support and stackable against other similar modules where the interconnection system allows for pivotable attachment of the modules to the support and electrical contacting with adjacent modules, such that power and data transmissions can occur therebetween, through an interconnection that protects the contacts during pivoting attachment of the module to the support and assures a reliable and easily established interconnection therebetween.

Abstract: A method and apparatus for supporting within a chassis enclosure a plurality of microprocessors, each operably coupled to a heat sink, includes mounting within the chassis enclosure one or more retention brackets, each retention bracket adapted to receive at least one microprocessor and a cover engaged about the top of at least one microprocessor, the cover being releasably fastenable to the retention bracket, and further including the coupling together of multiple retention brackets to form a bridge-like assembly.

Abstract: An electronic system contains a backplane circuit card assembly for distribution of electrical signals to one or more modules. The card assembly includes a plurality of pluggably connected base cards, which provide redundant function. Preferably, two base cards in a single plane are connected by a single smaller parallel offset jumper card, the cards being coupled by pluggable connectors. The system preferably includes redundant power supply modules and redundant functional modules, which plug into the backplane from both sides. The modules connected to any one of the base cards provide minimum system functionality in the absence of the other card and its modules. Due to the redundant function, it is not only possible to replace any module, but is possible to replace a base card itself, while the system remains operational. The exemplary embodiment is an intelligent redundant array of independent disks (RAID) storage server having concurrent maintenance capability.

Abstract: A VXI chassis which has user selectable or configurable slot 0 locations. The VXI chassis includes a personality module interface coupled to the VXI backplane comprised in the chassis. The personality module interface or slot is adapted to receive a personality module. The personality module can be inserted into the personality module interface or slot in one of a plurality of orientations. Based on the orientation of the inserted personality module, the personality module is operable to selectively route signals on the backplane to enable one of a plurality of locations to operate as the slot 0 location. In the preferred embodiment, the VXI chassis can house a plurality of C size and/or B size VXI/VME cards, and the VXI chassis is configurable between different slot 0 locations for different size cards, i.e., between either a C-size or B-size slot 0 controller.

Abstract: The present invention discloses a power semiconductor module 10 having encapsulated submodules 1 which, for example, is suitable for power switches, rectifiers for the like in industrial or traction drives. The submodules 1 have a sandwiched structure made up of a ceramic substrate, one or a few power semiconductor chips and a molybdenum wafer, and are potted in plastic. They are held in plug-in locations 19 on a common baseplate 11 and make contact via a stack arrangement of conductors 12, 14, 18. Retention and contact of the submodules 1 take place reversibly via pressure contacts 15, 16, 20, clamp contacts 21 or the like. Important advantages of the power semiconductor module 10 relate to the simple and easily scaleable structure, improved ability to withstand thermal load cycles, and the robustness and easy interchangeability of the submodules.

Abstract: The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.

Abstract: Disclosed is a main unit and at least one expansion unit having a housing that contains a jack extending from the top of the housing and a plug extending from the bottom of the housing, the jack of one module mating with the jack of another module. Each module, including the main unit, each contain at least one circuit panel between the jack and the plug. A rigid, non-flexible connector electrically connects the jack and the plug of each unit to the circuit panel. In addition, the top side of each panel contains a flange around the periphery of the top side that mates with a recess that runs around the periphery of the bottom side of an adjoining module to attach the two modules together.

Abstract: A display unit is rotatably supported on an apparatus body of a portable electronic apparatus, by a hinge portion. The display unit has a hollow boss projecting into the apparatus body, and the boss is engaged with the apparatus body to be rotatable around the rotation center axis of the hinge portion. An inner hole in the boss communicates with the inside of the display unit and with the inside of the apparatus body, thereby forming a communication path coaxial with the rotation center axis. In the apparatus body, there is provided a light emission element for emitting image data to be transmitted to the display unit, in form of an optical signal into the communication path. In the display unit, there is provided a light receive element for receiving the optical signal from the light emission element through the communication path.

Abstract: A modular structure for attachment to a rail includes securement members received and supported on either side of the rail. The rail includes a support web and parallel side flanges. The structure is constructed from a molded plastic base unit to which metallic securement members are assembled. The base unit preferably includes a rigid side and a flexible side. The securement members are substantially identical to one another, facilitating manufacturing and assembly, and reducing the number of different parts in the final module. The securement members each include v-shaped slots for engaging the side flanges of the rail. The base unit may be configured as a blank end unit, or may include features for creating terminal blocks, I/O blocks, switches, circuit board supports and the like.

Abstract: Secure operations within an integrated circuit are protected. In order to perform the protection a plurality of single event upset detectors are distributed within the integrated circuit. The single event upset detectors include bit-registers. Each of the plurality of the single event upset detectors is monitored for a single event upset. When a single event upset in any of the single event upset detectors is detected, an error condition is indicated.

Abstract: A connector having capable of pivotal movement comprises a first member constituted by a shaft made of an insulating material and having a convex rounded or arcuate portion. One end of the shaft is secured. A second member is mounted for pivotal movement about the periphery of a rounded portion of the shaft adjacent the other end thereof. A plurality of electrodes, which may comprise parallel thin strip-like conductors concentric with the pivot axis, are provided on the periphery of the rounded portion of the shaft. The second member supports a plurality of spring-biased electrical contacts each having an element thereof urged into contact with one of the electrodes.

Abstract: A card rack is provided for removably housing two types of circuit packs in respective first and second portions, e.g., upper and lower portions of the card rack. The card rack includes connectors for interconnecting components on the circuit packs with one another and to input and output cables. The input cables are connected only to circuit packs of one type which are disposed only in one, e.g., the lower, portion of the card rack. The upper card rack portion overhangs the lower card rack portion for, in combination with sides of the card rack, forming a recessed space through which the input cables are routed to the lower portion circuit packs. The passage of the cables through the recessed space isolates the cables from becoming entangled with traffic passing in front of the card rack and thereby avoids the need for a separate door enclosing the front portion of the card rack.

Abstract: A frame structure for mounting telecommunications equipment including a frame, a plurality of sealing covers, a plurality of fasteners, and a plurality of wire protective sleeve. The frame having a base, two support frames, and an upper frame. A receiving recess is provided to accommodate transmission conductors (optic cables, electric cables or lead wires) of telecommunications equipment. A positioning recess formed between the plate bodies at the upper and lower covers of the inner side of the sealing covers and the fastening plates allows the sealing covers to be mounted over the edge of the inner lateral plates of the opening of the receiving recess on the support frames. A fastener is then passed into a hollowed hole of the outer lateral plate on the sealing cover and further into a fastening hole, with the plate body of the sealing cover being pressed downwardly. A press element is then pressed into a fastener body to secure the connection.

Abstract: A docking device for a portable computer includes a body adapted to receive a portable computer. The body encloses a number of electronic components adapted to be connected to a portable computer via a number of signal lines. A connector is provided in the body which mechanically connects the number of signal lines within the body to a corresponding number of signal lines within the portable computer. The docking device also includes a signal connection means interposed between the portable computer and the electronic components for selectively electrically interconnecting the particular ones of the signal lines within the body to corresponding signal lines among the number of signal lines within the portable computer in response to an operating state of said portable computer. A preferred embodiment of the docking device further includes a control means for controlling the selective electrical interconnection of the particular ones of the number of signal lines by the signal connection means.

Abstract: Connection elements which, for example, may be used to facilitate interconnection to and stacking of electronic assemblies or may include an elongated conductive core, such as a wire or a hollow tube structure, coated with a layer of elastomeric material containing conductive particle such that the elastomeric material is conductive at least when compressed. The substrates of multi-chip modules (MCMs) have electrical connection sites in the form of metal-lined channels in the substrate edges, and the connection elements are pressed into the channels. Separate compression or clamping elements may be employed to enhance conductivity, as well as to facilitate external connections. The elongated conductive core may take the form of a hollow tube structure which may be expanded under internal pressure to compress the layer of elastomeric material. The compression elements may take the form of printed circuit boards.

Abstract: A power distribution system utilizing a power distribution circuit board having a front and back side with at least one connector on each side. The connector on the front side is disposed to mate with a selected power supply and the connector on the back side is disposed to mate with a substantially identical power supply. The connector on the back side is rotated 180.degree. so that substantially identical power supplies can be located in close proximity to each other while maintaining required conductor spacing in order to provide an improved power distribution system.

Abstract: In a module mounting structure, a plurality of lead frames are affixed to an affixing block of resin and then respectively soldered to a plurality of input/output pads provided on a daughter board. Subsequently, lugs protruding from both end portions of the affixing block are inserted in reference holes formed in the daughter board in order to prevent the block from being displaced. Input/output pads are provided on both sides of the daughter board, and electronic parts are mounted on both sides of the daughter board. The lead frames affixed to the affixing block are inserted in through holes formed in a mother board, and then soldered to the mother board. The structure is adaptive to an increase in the number of pins of the daughter board and an increase in module mounting density.

Abstract: A modular front panel system for circuit cards utilizes hinged, interlockable, first and second circuit-card-carrying front panels. Each panel has a hinge component, e.g. a pivot element) that can mate with the component on the other panel (e.g., a groove). The hinged arrangement permits the panels to be releasably secured to one another so as to form a card assembly unit. The hinged arrangement also permits the panels to be moved angularly with respect to one-another, thereby facilitating assembly and disassembly of the two hinge components without obstruction by components mounted on the circuit cards. This is particularly well suited to applications in which the circuit cards have surface mounted connectors that mate and electrically connect when the panels are moved angularly. Moreover, the hinge arrangement permits a panel to be readily added and interlocked with, or removed from, an existing card assembly in electrical equipment, without requiring replacement of the existing front panel.

Abstract: A central electrical assembly with an electrical or electronics unit is specified, which can be used in particular for motor vehicles; the central electrical assembly being of modular construction. A contact supporting body forming one module and being used to accommodate contacts or plugs with contacts which produce the connection between electrical cables and the central electrical assembly, a relay and fuse box being another module, having at least one conductor track level and plug-in slots for accommodating electrical devices, the relay and fuse box and the electrical or electronics unit being connectable with a central lifting screw to the contact supporting body in such a manner that the connections are produced between the electrical cables and the central electrical assembly, in particular the conductor track levels and the plug-in slots.

Abstract: A computer system includes a chassis having an internal connector with a first portion in electrical contact with a first external peripheral device, and second portion in electrical contact with a second external peripheral device. An adapter is coupled between an internal device and the internal connector. The internal device is associated with either the first or second external peripheral devices. The adapter has either a first portion that connects the internal device to the first portion of the internal connector or a second portion that connects the internal device to the second portion of the internal connector in order to couple the internal device to its associated external peripheral device.

Abstract: A digital input/output circuit board includes a plurality of module receptacles for selectively mounting input modules or output modules, wiring terminals for attaching field wires to electrically connect the circuit board to field devices, a hot wiring terminal for attaching a hot power wire, a neutral wiring terminal for attaching a neutral power wire, and a device for selecting the status of each of the module receptacles as either an input or an output, to enable a computer connected to the circuit board to receive input signals to read the state of the field devices and to send output signals to activate other field devices.

Abstract: An input/output module functioning as a peripheral channel adapter or gateway to a network in a high speed digital processing system, the input/output module including a plurality of circuit board assemblies and an enclosure for enclosing the circuit board assemblies, the enclosure including a frame having side panels which are hinged to the frame on opposite sides thereof and movable between closed and open positions for providing access to the circuit board assemblies, a plurality of the input/output modules are enclosed within a housing made of metal, that provides EMI shielding for the input/output modules, the enclosures for the plurality of input/output modules defining metal bulkheads within the housing, and a blower located within the housing forwardly of the input/output modules for circulating cooling air through the input/output modules, the input/output modules being configured so that the volume of cooling air supplied to the application specific assemblies is greater than the volume of cooling a

Abstract: Circuit supporting modules form a three-dimensional communication interconnect mesh. A first embodiment three-dimensional communication interconnect is a tetrahedral lattice having a regular, isotropic, three-dimensional topology in which each module connects to its four physically closest neighbors. The structure of the tetrahedral interconnect is isomorphic with a diamond lattice structure. In a second embodiment the interconnect is hexahedral. A characteristic of both is embodiments is that, although connections are made to plural other modules, the physical connections are made along the same direction.

Abstract: An expandable data processing chassis and method of assembly of an expandable data processing chassis includes stackable circuit board housings and a central circuit board housing. The stackable circuit board housings and the central housing each have a rigid interlockable stabilizing frame plate to maintain mechanical tolerances as stackable circuit board housings are added to the stack. Each of the circuit board housings also has an associated backplane for coupling the circuit boards received in each housing to each other and to the central housing. The backplanes also extend to a power backplane for supplying power to the circuit boards received in the expandable data processing chassis.

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component, such as a data acquisition device, a wireless communications device, an output device or driving devices for a clock circuit. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device.

Abstract: An improved contactor control system comprising several modules, such as a contactor module, an overload/controller module, a communication module, a bell alarm module, and a power terminal module which are electrically interconnected through a plug-in unit, and mechanically interconnected through one or more snap-in units, and which modules can be interchangeable and arranged relative to the overload/controller module according to a particular industrial application.

Abstract: Each IC package carrier holds a single ZIP or SIP package between its side walls having openings to provide air flow for cooling the package and to allow heat generated within the package to dissipate. A locking strip member is provided to prevent loosening of the held package. Locking elements of snap fasteners are mounted on the side walls to allow several IC package carriers be attached to each other for producing an IC package assembly. The IC package assembly held by the several attached carriers can be inserted into a socket to connect circuits within the packages with external circuitry.

Abstract: An electronics package for protective enclosure and connection of the circuit to a system backplane having electromagnetic shielding and enhanced packaging density is provided. The electronics package comprises an enclosure having a first cover and a second cover. Each cover of the enclosure is formed from a multilayer circuit board having an insulating support layer of a selected thickness and of a sufficient rigidity to serve as a protective covering for the electronics package, and a shielding layer formed by a conductive plane of a thickness less than the selected thickness of the insulating support layer. At least one cover of the enclosure is a multilayer circuit board having an electronic circuit formed thereon. The electronics package further comprises a circuit card positioned within the housing and having a connector positioned on the back for mating and connection with the system backplane.

Abstract: The structure of an outdoor communication device includes a device body and a mounting base. The device body includes a device body, a disk-like mounting portion, a plurality of units, and a cylindrical cover. The units are enclosed in rectangular parallelepiped cases and are stacked and mounted on the mounting portion and serve to separately store electrical circuits for driving the device. The cylindrical cover has an opening portion on one end face side and serves to store the stacked units. The opening portion is fixed to the mounting portion. The mounting portion is detachably mounted on the mounting base such that the device body is suspended from and fixed to the mounting base with the mounting base being located above the device body. Fixing members are used to fix the units while the units are stacked on the mounting portion, such that the units are stacked substantially in a form of a cross.

Abstract: A stabilized power supply device includes a substrate and a passive part laminate layered on the substrate. The passive part laminate, shaped as a single flat board, includes a thin charge storage film element. A thin magnetic inductive film element is laminated on the thin charge storage film element. The device also includes an active part incorporated in a flip chip. The flip chip, including semiconductors and bump electrodes, is mounted on an upper surface of the passive part laminate. The upper surface of the passive part laminate includes terminals for connecting the passive part laminate to the bump electrodes. This connection also fixes the active part to the passive part laminate.

Abstract: A relay (1), particularly a relay with solder terminal pins (13) connected onto a plug adaptor that is formed by a base (20) of insulating material with male plug elements for plugging the adaptor and relay into a circuit. The adaptor has a male connector member with a plurality of conductor elements embedded or inserted into the base and a plurality of high-current blades bent respectively off from the conductor elements. After soldering of the terminal pins (13) to the conductor segments (25), the base region surrounded by a circumferential wall (22) is filled with casting compound. As a result thereof, the arrangement is sealed on all sides and the adaptor with the blade is stabilized and strengthened, so that it can withstand high plugging forces.