Abstract: An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).

Abstract: A housing for hot-pluggable network tap modules. The housing allows a user to maintain all network taps in any given system in one housing and location. This increases the ease of maintaining multiple network taps and allows the network tap modules to be powered by a power supply included with the housing. The housings can greatly simplify the process of managing multiple taps. Moreover, the housing are compatible with hot-pluggable network tap modules as well as legacy network tap modules that were developed in the past.

Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

Abstract: A modular automation apparatus is provided that includes a base unit adapted to receive an automation module. The automation module includes at least one automation device for performing one or more specific automation functions and preferably a selectively programmable memory device for storing automation specific logic rules and/or controlling the specific automation functions. The base unit includes a frame having affixed thereto a control cabinet that houses a programmable logic controller (PLC) for executing the logic rules relayed or stored in the memory device and a power supply capable of powering the base unit and the automation module. When a base unit and an automation module are cooperatively assembled, the combination is capable of performing one or more automation functions specific to the automation module selected.

Abstract: A semiconductor package comprising multiple stacked substrates having flip-chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: An electronic circuit device having a power-supply structure capable of supporting fast signals in and above a GHz band is offered. A driver transistor is formed in a surface of a semiconductor substrate. Power-supply/ground pair transmission lines which provide the driver transistor with power and signal/ground pair transmission lines which transmit signals to a receiver are formed on the semiconductor substrate. The power-supply/ground pair transmission lines are connected to a drain layer of the driver transistor and a P+ layer in a P well. The signal/ground pair transmission lines are connected to a source layer of the driver transistor and a P+ layer in the P well.

Abstract: A system and method for configuring expandable buses wherein a host supports a plurality of expandable buses are provided. A plurality of devices are arranged to form a plurality of groups. Each group forms a chain of devices on an expandable bus. Each chain includes an input connector. The chains are configured such that connecting an expandable bus of the host to the input connector for a particular chain causes that particular chain to be directly connected to that particular expandable bus of the host. The absence of connecting any expandable bus of the host to the input connector for a particular chain causes that particular chain to be directly connected to a different chain so as to be indirectly connected to one of the expandable buses of the host.

Abstract: An electronic equipment control system including an electronic equipment body and a remote control terminal for providing an operation instruction to the electronic equipment body. The electronic equipment body has a receiving part for receiving a remote control signal, a movable operation unit for operating the electronic equipment body, a fixed operation unit, and an arranging part for moving the movable operation unit to bring the fixed operation unit into a visually identifiable state. The remote control terminal has input keys for providing the operation instruction, and a sending part for sending operation information input by the input keys.

Abstract: The invention provides a wire and component management system in an enclosure having a plurality of rack mounted drawers each having an integral component board. Each component board is configured to have a plurality of mounting openings strategically positioned to allow components to be mounted thereto in various orientations. The component mounting board and drawer are movable within the rack so that they can be easily serviced. The component mounting board and drawer are hingably mounted to the rack by a hinged wire manager. The hinged wire manager is formed of two arms joined by a hinge pin. Each of the arms has wire management features and the wire managed therein is routed around the hinge pin in a loop to allow movement of the component mounting board and drawer in and out of the rack while managing a bundle of wires connected to components on the board.

Abstract: A connection system detachably and mechanically connects an electronic component to a holder. The connection system has at least one stop element that provides a stopping position for the electronic component that is moved in relation to the holder. In the stopping position, the electronic component can be moved by a pivoting movement between an open position, wherein the electronic component can be separated from the holder, and an end position, wherein the detachable, mechanical connection is closed.

Abstract: An inductor obtained by laminating a plurality of ceramic layers having an internal coil conductor, and a thermistor obtained by laminating a plurality of ceramic layers having internal electrodes and having a predetermined resistance-temperature characteristic are laminated via an intermediate insulating layer. Both ends of the internal coil conductor of the inductor and the internal electrodes of the thermistor are connected to a pair of external electrodes. Thus, the inductor and the thermistor are connected in parallel.

Abstract: A reconfigurable circuit module comprises edge connectors for connecting with other reconfigurable circuit modules to form multi-dimensional arrays. Programmable devices such as FPGAs, CPLDs, etc. residing on the reconfigurable circuit modules control electric signal path functionality. An embedded controller microprocessor negotiates signal path compatibility between adjacent modules, preventing two or more programmable devices from simultaneously driving the same signal path.

Abstract: The invention relates to a module for measuring purposes comprising an electrical or electronic circuit, which has at least one power supply connection and at least one data line connection for connecting, in the manner of a bus, to at least one other module of the same type that is also used for measuring purposes. According to the invention, the electronic circuit (80) is arranged inside a housing, the housing has a first contact surface (90) and a second contact surface (91), and the first contact surface (90) is joined to the second contact surface (91) of the other module (22, 32, 42) in a manner that permits it to be mechanically detached. The at least one power supply connection has a power supply contact (84a, 85a) in the first contact surface (90) and has a corresponding power supply contact (84b, 85b) in the second contact surface (91).

Abstract: Disclosed is an automated disk-ejection apparatus for use in a disk system. The disk system includes a disk box for housing a disk drive, and the auto-ejection apparatus comprises: a handle for pulling out or pushing back the disk box; a pushing mechanism for pushing the handle; and a control circuit for controlling the pushing mechanism. The featured disk apparatus is designed such that while the disk box needs to be pulled out in order for loading or replacing the disk drive, the pushing mechanism is activated to push the handle. The handle can thus be rotated along the pivot into an inoperative state, for subsequently to be pulled for withdrawing the disk box. Moreover, another embodiment of the present invention relates to using a pushing mechanism to push a rotatable panel of a disk box.

Abstract: The invention is related to the computer science and may be used in the design of miniature high-performance computing systems. The purpose of the invention is to increase the IC stuffing density and to reduce the microelectronic module assembly effort. The multilayered hybrid electronic module contains a backplane with multilayer wiring with ICs and sockets installed. A socket body is a box of elastic dielectric material, whose vertical walls have vertical metallized contact slots connected to the contact pads on the outer bottom surface of the socket. IC packages to be installed in the sockets have a rigid peripheral frame with cylindrical leads on the perimeter. The leads are parallel to the base of the package and lie in the same plane. Dimensions and shape of the IC package correspond to those of the socket cavity. Dimensions and positions of the IC leads correspond to those of the contact slots.

Abstract: A power lead and a ground lead are connected to corresponding pads of a die through an intra-package wiring substrate. A ground plane is formed in a mold under the intra-package wiring substrate extending along the bottom surface of the mold, and connected to the ground lead. A decoupling capacitor is connected to power wiring and the ground plane to prevent EMI caused by switching noise current generated by the power circuit of the die.

Abstract: Apparatus for connecting a plurality of electronic devices with corresponding backplanes to improve reliability of accessing the devices are described. In one embodiment, the apparatus includes first and second backplanes having connectors for at least one device. A device having a plurality of data paths has a first data path coupled to a data path connector of the first backplane. A second data path of the device is coupled to a data path connector of the second backplane. Alternatively, a Y-adapter is used to connect a single data path device to data path connectors of distinct backplanes. In various embodiments, the backplanes lie in a common plane. Alternatively, the backplanes lie in distinct parallel planes.

Abstract: A portable modular electronic system comprises a controller module, at least one memory module; and at least one application module that are mechanically connectable and disconnectable with respect to each other and include mating electrical connectors for communicating electrical signals between modules when the modules are mechanically connected.

Abstract: A modular backplane having a low-profile bridge module for industrial computers is disclosed. The modular backplane generally comprises a plurality of modular backplane segments and a plurality of bridge modules for connecting the modular backplane segments. Each modular backplane segment includes a front side and a back side, in which the front side has a plurality of slots and the back side has a primary dedicated connector and a secondary dedicated connector. Each bridge module includes a circuit board, a bridging integrated circuit, and a pair of connectors. One of the bridge connectors is engaged with the primary dedicated connector in one of the backplane segments and the other connector is engaged with the secondary dedicated connector in its neighboring segments, and vice versa, such that all the modular backplane segments are communicatively connected with another. The modular bridge is of a low-profile, and the dedicated connectors are provided in an area where no slot is formed.

Abstract: A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.

Abstract: A pluggable transceiver module comprising a housing having a first side and a face perpendicular to the first side, and a tab extending beyond the surface of the first side, and the tab sized to mate with a slot in a receptacle of a host device for receiving the pluggable transceiver module housing; a member slidably mounted on the first side proximate the tab; a lever rotatably mounted on the housing, whereby rotating the lever causes the member to slide between the tab and the slot on the receptacle and remove the tab from within the slot, thereby releasing the pluggable transceiver module from the receptacle. The lever includes a free end and a rotatably mounted end, the rotatably mounted end including an extension adjacent to the member, such that extending the free end outward causes the extension to drive the member inward.

Abstract: It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered.

Abstract: A portable modular electronic system comprises a controller module, at least one memory module; and at least one application module that are mechanically connectable and disconnectable with respect to each other and include mating electrical connectors for communicating electrical signals between modules when the modules are mechanically connected.

Abstract: An electronic component has a plurality of chips which are stacked one above the other and contact-connected to one another. To form this component, a first planar chip arrangement is provided with the functional chips spaced apart from one another in a grid and with a filling material in the spaces between the chips to form an insulating holding frame that fixes the chips, the frame has chip-dedicated contact-connecting elements that serve for the electrical contact-connection to another chip of another chip arrangement and each chip has dedicated electrically conductive strips. At least one additional planar chip arrangement is formed by the same method as the first planar chip arrangement and is then stacked on the first planar chip arrangement so that the two chip arrangements lie one above the other and the respective contact-connecting elements of the two chip arrangements are connected to one another for electrical chip-to-chip contact-connection.

Abstract: An electronic equipment module, as well as a system and a method for mounting electronic equipment modules are disclosed, an electronic equipment module is provided as a symmetrical casting. The electronic equipment module includes a first chassis unit which attaches to a second chassis unit. Each chassis unit has a mounting recess adapted to receive one or more circuit assemblies. The mounting recesses can be separated by a cover applied to one unit, the other unit, or both. The module is normally mounted within a unit rack, and thus, can have a removably attachable, and re-orientable keyed surface on its rear face which mates with a corresponding keyed surface on the interior surface of the unit rack. The mounting system includes a mounting frame, a plurality of electronic equipment modules, and a unit rack coupled to at least one of the electronic equipment modules and the mounting frame.

Abstract: An enclosure for electronic circuitry includes a container that is formed to define an enclosed volume. An open end of the container is sealed by a printed circuit board which also provides electrical connection to the enclosed electronic circuitry by means of connectors mounted to its inside and outside surface.

Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

Abstract: A backplane is disclosed for attaching storage devices to the backplane that utilize removable media. The backplane is distributed and scalable. The backplane includes a generally horizontal portion for distributing electronic signals to the storage devices and a plurality of connectors coupled to said generally horizontal portion for receiving the storage devices. The storage devices are coupled to the backplane utilizing the generally horizontal portion. The storage devices are not coupled to the backplane utilizing a front or a back of any one of the storage devices such that the front and back of each storage device remain accessible when the storage devices are coupled to the backplane.

Abstract: An electronics assembly comprises a frame (1) that contains a motherboard (8) and a plurality of daughterboards (10). The frame has an opening opposite the motherboard to allow insertion of the daughterboards into the frame or removal of the daughterboards from the frame. The frame also has an injector/ejector mechanism (16, 18) for each daughterboard that is located on the daughterboard or the frame and a flange (28) that extends adjacent to the opening and on which the injector/ejector mechanism of each daughterboard is attached or engages at different locations along the length thereof. The flange (28) is divided into separate sections (30) that correspond to the different locations to allow the flange to flex at any adjacent location during insertion of a daughterboard without the flexing affecting the position of any adjacent location of the flange with respect to the motherboard.

Abstract: An electronic housing system is provided which includes at least two, especially plate shaped, electronic housings which can be snapped onto a mounting rail. The housing system includes a locking system including at least two housing portions, namely a starter unit and an end unit, and a key element. The starter unit is constructed as a key receptacle and the end unit is constructed as a lock complementary to the key element. The two housing portions can be locked with one another by rotation of the key element in the end unit. The locking system further includes an intermediate housing portion for positioning between the starter unit and the end unit, whereby the intermediate portion has an intermediate end unit for interlocking with the end of the key element, and an intermediate starter unit.

Abstract: A housing arrangement for a plurality of semiconductor chips (1) is disclosed, in which each of the chips is received in a respective frame or cassette (4), there being a first electrically conductive member (5), having portions (6) which are in electrical connection with one face of each of the chips and a second electrically conductive member (7), having portions (8) which are in electrical connection with an opposite face of each of the chips.

Abstract: Improved modular transient voltage surge suppressor apparatus that provide a simple structure for coupling multiple modules are disclosed. In general, such apparatus includes a substrate; a mounting post coupled to and extending substantially perpendicular to the substrate; and a transient voltage surge suppression module, wherein the module includes a non-conductive housing having a surge suppression circuit contained therein, and mounting means coupled to the non-conductive housing, the mounting means comprising a bore therethrough for slidably mounting the transient voltage surge suppression module on the mounting post, the bore having an internal profile corresponding to an external profile of the mounting post.

Abstract: A clamping assembly for use in conjunction with high voltage solid state devices. The clamping assembly includes a clamp frame having upper and lower clamping plates substantially composed of aluminum and joined together by four dielectric rods composed of glass laminate material. The clamping assembly further includes a compression assembly mounted in the upper clamping plate and including several spring washers disposed in a recess defined by the upper clamping plate. The position of a compression cap attached to the upper clamping plate by eight cap screws can by adjusted by way of the cap screws so as to compress, or deflect, the spring washers. The spring washers in turn exert a compressive force that is a function of the spring constant k of the spring washers as well as of the distance over which the spring washers are compressed by the compression cap. The compressive force thus generated is transmitted to a pivot ball seated in a recess collectively defined by the spring washers.

Abstract: A ruggedized electronics system is disclosed. The ruggedized electronics system includes at least one ruggedized electronics module. The electronics module has an electrical module coupling. The ruggedized electronics system also includes an open framed chassis provided with more than one electrical chassis coupling. At least one electrical chassis coupling is coupled to at least one electronic module. The electronics modules may be coupled to and decoupled from the chassis, so that the system may be selectively reconfigured.

Abstract: An electronics assembly comprises a frame (1) that contains a motherboard (8) and a plurality of daughterboards (10).

Abstract: A disk drive assembly includes a chassis adapted to be fixed on a computer housing, a module-mounting seat rotatable on the chassis between an exposed position and a concealed position, and a disk drive module attached to the seat. When the seat is disposed at the exposed position, the module is exposed within an opening in the computer housing, thereby permitting insertion of a recording medium into the module. When the seat is disposed at the concealed position, the module is deflected from the opening and is concealed entirely within the computer housing.

Abstract: The present invention is to provide a multi-chip module including a substrate, at least a chip, a plurality of bonding wires, and a cover body. The substrate has a top surface, a bottom surface, and at least a receiving chamber recessed inward from the top surface toward the bottom surface of the substrate. The chip is fixedly received in the receiving chamber and provided with a plurality of bonding pads. Each of the bonding wires has one end electrically connected to one of the bonding pads of the chip and the other end substantially horizontally electrically connected to a conductive pattern of the substrate. The cover body is fixedly mounted on the top surface of the substrate for covering the receiving chamber and isolating the chip from the outside, whereby the cover body is extremely adjacently mounted on the top surface of the substrate to effectively reduce the overall thickness of the module.

Abstract: An apparatus is provided for mounting electrical equipment on a wall. A mounting plate is mounted on the wall. The mounting plate includes a lip defining a linear channel extending across the front of the mounting plate. An equipment enclosure includes a complementary upward extending hanger for engaging the linear channel. A ground strip is attached to the wall plate below the linear channel. The equipment enclosure can be positioned at any point along the length of the linear channel by engaging its complementary hanger therewith and pivoting the enclosure downward until its rear surface engages the mounting plate and a grounding lug thereof engages the ground strip.

Abstract: An insertion extraction device (IED) (100) is suitable for use in attaching a movable object (40) to a fixed structure (20) with a limited amount of force. The IED (100) includes a mandrel (120) and a flexible sleeve (140). The mandrel (120) is constructed of a relatively hard material such as a metal and has a first section (126) with an elliptical, oval, or similar shape and a second section (128) for attaching to the fixed structure (20). The flexible sleeve (140) is constructed of a material such as nylon or urethane plastic. An operator is able to turn the mandrel (120) by turning the sleeve (140) with less than a certain amount of torque. When the operator applies an excessive amount of torque to the sleeve (140), the sleeve (140) slips over the mandrel (120), thereby limiting the maximum amount of force that can be applied to insert the movable component (40) into the fixed structure (20).

Abstract: A pluggable transceiver module comprising a housing having a first side and a face perpendicular to the first side, and a tab extending beyond the surface of the first side, and the tab sized to mate with a slot in a receptacle of a host device for receiving the pluggable transceiver module housing; a member slidably mounted on the first side proximate the tab; a lever rotatably mounted on the housing, whereby rotating the lever causes the member to slide between the tab and the slot on the receptacle and remove the tab from within the slot, thereby releasing the pluggable transceiver module from the receptacle. The lever includes a free end and a rotatably mounted end, the rotatably mounted end including an extension adjacent to the member, such that extending the free end outward causes the extension to drive the member inward.

Abstract: It is an object of the preset invention to provide a cabinet for the electronic device which ensures sufficient rigidity of the device even if made thin. The cabinet (3) according to the present invention has central chassis (4) in which a device main body is provided, and an upper case (5) and a lower case (6), which hold central chassis (4) between them and accommodate the device main body. The upper case (5) and lower case (6) are made thinner than conventional parts of such cabinets so as to make the device smaller. The central chassis (4) serves as a reinforcing material and can improve the rigidity of cabinet (3), thereby ensuring sufficient rigidity for the cabinet (3) even if the upper case (5) and the lower case (6) are made thinner to achieve a smaller size of the electronic device.

Abstract: An automation device comprising a modular assembly associated with a hardware element. This assembly includes in the primary group of modules a bus coupler 20, a feeder unit 21 to distribute feeder power at voltages Uin, Uout for the automated units, functional modules 22 and a terminating module 30.

Abstract: An active package for an integrated circuit may include an integrated circuit and an active component that is part of the circuit topology for the integrated circuit. The active component forms at least a portion of the housing for the integrated circuit. The integrated circuit may be housed in a shell formed by one or more discrete components. The active package may be formed in the same geometry and dimensions as a standard passive integrated circuit package, or may be formed in a shape to fit inside a standard or specially made battery package, or for another special application. A smart component may include a discrete component or a semiconductor-based resistor, capacitor or inductor, and a separate integrated circuit housed in the same housing as the discrete component or a semiconductor-based resistor, capacitor or inductor. The integrated circuit may control at least one electrical parameter of the discrete component or a semiconductor-based resistor, capacitor or inductor.

Abstract: In a semiconductor chip are arranged power pads, ground pads and signal pads. A ground line is provided which is formed as one in the vicinity of the chip and branches off at some distance from the chip. Signal lines and power lines are each formed over one of the branched ground lines. The signal lines and the power lines are extended radially together with the underlying ground lines. Each of the signal lines and the power lines are extended together with the corresponding ground line to form a stacked pair line.

Abstract: The invention relates to a rack for electronic plug-in units, comprising a backplane. The backplane comprises at least one connector to which a connector provided in the electronic plug-in unit connects when the plug-in unit is pushed into the rack. The backplane is attached to the rack with a fastener made of a resilient material. A moment arm is formed between a point which attaches the fastener to the rack and the backplane. When the plug-in unit is pushed into the rack, there is a tolerance for alignment of the connectors enabling connection of the connectors. Furthermore, when the plug-in unit is in the rack, the mobility of the backplane prevents the connectors and/or the backplane from breaking as the rack moves.

Abstract: Portable memory storage cards can be stacked together in a receiver that also serves as a player, allowing for compact and efficient storage and usage of those cards. The portable memory storage cards have at least one contact on both sides, positioned such that the cards are reversible. A receiver for the cards also serves as the player. A set of contacts is provided at one end of a storage cavity, into which an arbitrarily large number of cards may be stacked together, such that their contacts touch to form a bus. The stacked cards are biased against the set of contacts to establish physical contact between the set of contacts in the storage cavity and contacts on the adjacent card. The cards each include at least one alignment guide to restrict the motion of adjacent cards relative to one another when cards are stored in the cavity of the receiver.

Abstract: A chassis for fiber optics communication equipment, having a housing with first and second opposing sides, and a back panel cooperating with the housing to provide fore-and-aft slots for cassettes containing optical communication equipment. A remote user interface module for making connections to other items of equipment, and a local user interface module for display of conditions in the cassettes, are situated at opposite sides of the housing, and are both connected to the base by docking stations which allow these modules to be interchanged in position so that either of the first or second sides of the housing may become the front of the chassis; i.e. may be adjacent the local user interface module. This allows the chassis to be reversible so that the cassettes can be removed either from the front or from the rear of the chassis while the local user interface module remains at the front of the chassis.

Abstract: The invention relates to an electrical device (1) comprising a housing (10), Said electrical device (1) has fixing elements (12) for detachably fixing a card (20) to the housing (10). The fixing elements (12) are bracket-shaped and are positioned in such a way that said fixing elements (12) can be elastically deflected from an inoperative position. The fixing elements (12) are deflected at least temporarily from the inoperative position to fix the card (20) to the housing (10).

Abstract: The coupling apparatus couples two cards of a first size to fit in to a chassis having slots of second size. The coupling apparatus can connect two 3U cards together by clamping the first card and the second card between a first plate and a second plate to effectively form a combined card of a second size. Thus two 3U cards can be connected together and inserted into a 6U slot in a 6U chassis.

Abstract: A fixing device is described. The fixing device is for fixing a power supply unit in a computer cover having a first side plate and a second side plate. The first side plate has a square orifice and a guide slot connecting to the square orifice. The fixing device comprises a rotary-tightening-up device. The rotary-tightening-up device, made of plastic, has a first side member and a second side member. The fixing device further comprises plastic hook connected to the rotary-tightening-up device. The plastic hook is guided by the guide slot, thereby rotating the rotary-tightening-up device to mount the power supply unit upon the second side plate of the computer cover.