Abstract: In a leadframe type of semiconductor package, the internal electrical interconnectability of and signal routing between multiple dies laminated in a stack with the die paddle of the leadframe is substantially enhanced by laminating an “interposer” in the stack. The interposer comprises a dielectric layer and a metallic layer patterned to include wire bonding pads arrayed around the periphery of a surface thereof, and circuit traces interconnecting selected ones of the wire bonding pads in a single plane across the horizontal span of the interposer. In packages having multiple dies and relatively few leads, the bonding pads and circuit traces can be flexibly arranged on the interposer by the package designer to substantially increase the number and routings of internal electrical interconnections otherwise possible between the dies and between the dies and the leads of the package.

Abstract: A microelectronic device fabricating method includes providing a substrate having a mean global outer surface extending along a plane. A first portion is formed over the substrate comprising a straight linear segment which is angled from the plane and forming a second portion over the substrate comprising a straight linear segment which is angled from the plane at a different angle than the first portion. A layer of structural material is formed over the first and second portions. The structural material layer is anisotropically etched and a first device feature is ultimately left over the first portion having a first base width and a second device feature is ultimately left over the second portion having a second base width which is different from the first base width. Integrated circuitry includes a substrate having a mean global outer surface extending along a plane.

Abstract: A container case for a card type memory comprises a storage space having an inserting entrance for inserting the card type memory, a resilient engaging pawl provided inside of the storage space for engaging with the card type memory, a leaf spring for ejecting the card type memory out of the storage space by resilient power, and a rotation supporting projection provided inside of the storage space for rotating the card type memory at said rotation supporting projection in the storage space to be easily ejected from the storage space with a comfortable mechanical feeling.

Abstract: At least one brackets is attached to each of opposing sides of a chassis holding telecommunications equipment, providing enhanced structural support thereto. The bracket preferably comprises a series of cutouts that allow access to a plurality of mounting holes used to secure the bracket to the equipment chassis. The cutouts advantageously allow cables to be extracted from the bracket and dressed to the front of the equipment for attachment to the chassis or individual plug-in modules as required. The bracket is preferably open at the top and bottom portions thereof to allow cables to pass therethrough.

Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: The present invention relates to an improved mounting for stacking modem devices. Each mounting includes stacking feet and stacking slots that permit the mountings to be securely stacked on top of one another. Each mounting is configured to receive a modem device. Each mounting also includes connectors configured to interconnect with corresponding connectors of the modem device. For instance, each mounting and the modem have interconnecting power connections, RJ-45 connections, cable connections, and serial data connections. The modem devices can be slid into place for testing, initialization or installation without disassembling the stack. The present invention also provides configuring the mountings so the multiple modem devices can be connected back to back and communicating without a hybrid fiber/coax network connection.

Abstract: A memory module has memory chips in stacks. The lower memory chip in a stack has pins that are soldered to pads on the module substrate. A hollowed printed-circuit board (PCB) has a hollow opening on the bottom with about the same width, length, and depth as the top cap of the lower memory chip. The hollowed PCB fits over the top cap of the lower memory chip and has lower pads on its lower surface but outside of the hollow opening. The lower pads are soldered to the top shoulders of the pins of the lower memory chip. An upper memory chip has pins that are soldered to pads on the upper surface of the hollowed PCB. The hollowed PCB has a metal trace that re-routes a second bank-select signal from a no-connect pin of the lower memory chip to a bank-select pin of the upper memory chip.

Abstract: A power conversion and energy management system preferably includes a controller, one or more standard modules, and a custom (or semi-custom) backplane. The backplane preferably accommodates one or more modules and uses the modules to control power quality and/or flow to one or more input and/or output connections. The standard modules are preferably power modules such as an inverter module, converter module, or grid connect module. In addition to accommodating the modules, the backplane can include system components other than power electronics. The backplane can, for example, include external connectors, disconnects, fusing, and so forth, for a given application. The backplane can further include internal DC and AC buses to interconnect the modules. The backplane can also include a communications module, a user interface, a socket for control firmware, and slots for accommodating the standard modules.

Abstract: The invention relates to a module unit for memory modules and to a method for producing the module unit. A module unit of this type has at least one main module and submodules. The modules are arranged in a star-shaped manner and are arranged radially with their inner contact strips in slots of a central plug connector. The module unit has a substantially cylindrical housing, from which an outer contact strip of the main module protrudes.

Abstract: The invention relates to a portable presentation device (1) comprising a container having a lid (3) and a base (4), a first display device (7) and a controller (10) for driving the first display device (7). The portable presentation device is in the form of a briefcase, with the first display device (7) built into the lid (3) of the briefcase. With the lid (3) opened so that the first display device (7) is perpendicular to the base, presentations may be conveniently given to a small group of viewers with the first display device (7) being manipulable by means of the controller (10). The controller (10) may also have its own display (11) so that the operator may easily view and control the presentation himself.

Abstract: A system and method for identifying a match between an industrial PC to a slot in a rack which uses a blind mating keying and locking plates, so that when the mechanical keying plate and locking plate do match, then full insertion of the PC into the slot is permitted. When a mis-match occurs, then full insertion is prohibited.

Abstract: A portable computer including a housing having first and second sections, the first section having an information input device and the second section having a case having a first fastening element; a display panel including a second fastening element at a rear surface of the panel, the case and the display panel being attached through the first and second fastening elements; a hinge coupling the first and the second sections to each other; and a display panel support member having a third fastening element, the display panel support member being attached to the display panel through the third fastening

Abstract: A set of modules from which custom passive backplanes can be assembled coplanarly couple together and are mounted on a rigid base plate which holds them coupled and coplanar. Each module has a plurality of orthogonally oriented card connectors. Preferably there is a CPU module into which is plugged a CPU card from which an ISA and a PCI originates. On one edge of the CPU module is an connector communicating with the ISA bus. This connector is for chaining together one or more ISA modules, each of which expands the ISA bus to three more ISA connectors. On an opposite edge of the CPU module is an connector communicating with the PCI bus. This connector is for chaining together one or more PCI modules, either 32-bit or 64-bit, each of which expands the PCI bus to three more PCI connectors. Power and ground can be jumpered from module to module or can be directly connected to any module.

Abstract: An electronic equipment has an enclosure, a backplane board, a connector, a child board, a connection plate on the bottom edge of the child board mating with the connector, a guide, a rack gear, and a pinion gear. The guide moves within a child board housing part inside the enclosure between an upper and a lower position along a substantially vertical direction. At the upper position, the guide slidably mates with the child board and guides the child board to a temporary attachment position substantially vertically, and movement from the upper to the lower position causes the child board at the temporary attachment position to move substantially vertically to a fully attached position. The rack gear fixed relative to the guide, and the rotating shaft has a pinion gear meshing with the rack gear, and is supported so as to rotate freely relative to the enclosure.

Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

Abstract: A common module for DDR SDRM and SDRAM on a motherboard, which computes and determines the resistance of the terminators on the motherboard so that the work current is controlled within the range allowed by an SDRAM controller, and can achieve the object of a DDR DRAM and SDRAM common layout without the need of an extra quick switch IC.

Abstract: A logic controller formed by self-contained device modules plugged onto a DIN rail and onto a backplane contained in the DIN rail, the modules variously comprising a power supply, a logic control, I/O devices and gateways, each I/O device having microprocessor power, and the modules having a sliding lock movable into position adjacent DIN-rail-engaging flexible tabs to block deflection of the tabs and removal of the module from the DIN rail.

Abstract: A prototype development apparatus includes a logic board (LB) including a plurality of integrated circuit (IC) sites each adapted to receive an IC, logic traces coupled to each of the IC sites, and a plurality of logic board connector sites (LBCSs) configured to provide access to a number of the logic traces and each adapted to receive a connector. Additionally, a mezzanine board (MB) has a plurality of mezzanine board connector sites (MBCSs) each adapted to receive a connector and configured to provide access to a number of mezzanine traces interconnecting the LBCSs. The MB board is coupled to the LB and a portion of the logic traces are coupled to a portion of the mezzanine traces. In another embodiment the MB does not have any active components. This is because in this embodiment, the MB is configured to connect the pins of the connector sites according to a predetermined program.

Abstract: In an electronic device, a board connection structure of the present invention is provided, that electrically connects conductive parts of multiple circuit boards arranged in layers. The board connection structure reduces the positional displacement of the two circuit boards without considering the positioning precision of connectors provided on each circuit board.

Abstract: An apparatus and system is provided for coupling an ethernet switch to communication link(s) in a communication network without requiring the disconnection and reconnection of the communication link(s). A module is configured to accommodate components of an ethernet switch, and can be modularly introduced into a communication rack and quickly engaged with rack-mounted mating connectors which are coupled to the communication link(s).

Abstract: An antistatic strapping apparatus for binding and securing a plurality of semiconductor device carrier trays, the apparatus including a strap member having opposed ends and a side defined as a top side spaced from a side defined as a bottom side and a major surface defined by the opposed ends and top and bottom sides. A loop portion of a hook and loop fastening combination constitutes the major surface area on the top side of the strap member. A piece of hook portion having the same width as the strap member of the book and loop fastening combination secured to the top side at a first end of the strap member, the hook portion extending the length of the strap member by at least about 80 mm. A conductive thread is sewn in a multiplicity of lengthwise tracks on the second side of the major surface to prevent build-up of static electricity.

Abstract: Two substantially identical LED modules each have a nonconductive base having a straight edge and a pair of faces, at least one LED on the base, and two conductive traces on the base connected to the LED and forming on one of the faces inner and outer contacts spaced along a line perpendicular from the edge with the outer contact between the inner contact and the edge. The modules are juxtaposed at the edges with the lines aligned with each other and the one faces generally coplanar. A clip has a nonconductive body bearing on the one faces of both of the bases at the edges and two respective conductors on the clip body having portions spaced apart along the aligned lines and bearing on the contacts of both bases. The clip body and conductors are pressed against the bases to engage the conductors with the respective contacts and secure the bases together.

Abstract: Electronics devices having a housing with ergonomic features that enhance the ability of a user to hold the electronics devices for extended periods of time using different grips. The housing has a middle gripping region that is narrower than a top section and a bottom section positioned to either side of the gripping region. A keypad structure is positioned at the middle gripping section on a front surface of the housing. The back surface of the housing has a depression positioned generally at the midline of the housing. The depression engages the fingertips, the palm, or other portions of the hand when the user holds the electronics device. Rounded corners where the lateral surface of the housing meet the front surface and the back surface contribute to the user's comfort when holding the electronics device.

Abstract: A system of interlocking modules for use with a programmable logic controller. The system utilizes a plurality of modules, e.g. input/output modules, that are mechanically and electrically interlinked. Modules are electrically connected to adjacent modules by plug portions The mechanical interlocking features and the plug portions are designed to permit insertion and removal of individual modules disposed between adjacent modules, without moving either of the adjacent modules. Also, the plug portions are designed to isolate the electrical connections from vibration.

Abstract: An integrated computer module having an EMI shielding plate which doubles as a mechanical retainer for a disk drive within the module and as an shield to insulate the disk drive's electronics from electromagnetic interference (EMI) emanating from a main PCBA located nearby. The module is adapted for removable insertion into a docking bay within a host assembly, and upon such insertion for connecting to a host connector and thereby controlling a display device.

Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: A memory module includes parallel first and second printed circuit boards, each having a mounting edge, a chip mounting side with a set of memory chips mounted thereon, and signal traces that extend from the mounting edge and that are connected to the set of memory chips on the chip mounting side. A signal conductor unit is disposed between the first and second printed circuit boards, and interconnects the signal traces on the first and second printed circuit boards.

Abstract: A portable computer having a main computer body and a keyboard unit slidably attached to the main computer body and movable to various positions in front of the main computer body. A display unit is also slidably attached to the main computer body and movable to various positions up and away from the computer main body.

Abstract: A semiconductor chip is provided with a dielectric element having conductive features interconnecting electronic elements within the chip with one another. The conductive features replace internal conductors, and can provide enhanced signal propagation between elements of the chip. The conductive features on the dielectric element are connected to contacts on the chip by deformable conductive elements such as flexible leads so that the dielectric element remains movable with respect to the chip. The dielectric element may have a coefficient of expansion different from that of the chip itself.

Abstract: An isolation mounting system for disk drive and other storage modules in which the operating unit (e.g., a disk drive) is locked more firmly into its operating position. During shipping and installation the lock is disengaged to allow full use of the elastomeric or other shock mounting system. Thus, the storage module of the present invention simulates a hard mount system during operation and a soft mount system during shipping and handling. A data storage module constructed according to one embodiment of the invention includes a data storage device, typically a disk drive, shock mounted in a housing and a lock selectively engagable between the data storage device and the housing. The lock is operable between a first disengaged position in which the lock does not restrict movement of the data storage device within the housing and a second engaged position in which the lock restricts substantially all movement of the data storage device within the housing.

Abstract: An array module containing an array of electronic units is mounted in an installation frame. The electronic units can be mounted by rails in a hermetically sealed array housing and blind-mate connectors can connect the units to a rear plate. Blind-mate connectors also can connect the rear plate to the installation frame for external connection. A plurality of resilient mounts are fastened to the installation frame to protect the frame and storage array module from external shock. A thermal transfer mechanism transfers thermal energy between the electronic units and a region exterior to the installation frame. The electronic units can be enclosed in hermetically sealed chambers having side rails for rigidly fastened to the unit and a resilient support connecting the side rails to at least one of the covers of the hermetically sealed chamber.

Abstract: A mounting apparatus for mounting a data storage device in a computer housing includes a bracket, a securing means and a flexible plate. The bracket has a first face for supporting a data storage device, a second face opposite the first face and locking holes in its front portion. The securing means is mounted to a bottom of the data storage device and is moveable with the data storage device to be slid into the corresponding locking hole of the bracket. The flexible plate has a rear end securely fixed to the second face and a front end that has an operating portion extending out of the housing for being operable to move the front end away from the front portion of the bracket. The flexible plate further defines through holes for engaging with the locking holes to releasably block the sliding movement of the data storage device.

Abstract: A device for transmitting signals between an automation system and field devices comprises a supporting plate and modules which are attachable to said supporting plate. The modules are provided with terminals especially for field devices. The supporting plate has arranged thereon data lines of a local bus and voltage-supply lines. The modules have at least local bus interfaces. The device additionally comprises at least one bus coupling module which is attachable to the supporting plate and which is provided with a local bus interface and a field bus interface for communication with said modules and said automation system.

Abstract: A computer functional card adapting seat comprises a base and at least one computer functional card. The base has a circuit substrate therein; At least one terminal slot is formed in the circuit substrate. Each terminal slot is connected to a circuit control unit of the circuit substrate. At least one universal serial bus inserting hole, a first inserting hole for being supplied with DC power, and a second inserting hole for being connected to a computer are installed on the base. The universal serial bus inserting hole, and first and second inserting holes are connected to the circuit control unit. Thereby, the computer functional card is formed on the base for being communicated to a computer without needing to detach the case of the computer mainframe.

Abstract: A structure wherein a hand held computer module can be conveniently and interchangeably coupled to accessory devices. The hand held computer module is detachably connected to a first accessory module by a first interlocking structure. The computer module includes the first interlock mechanism and the first accessory module includes the second interlock mechanism. The first and second interlock mechanisms are mated together to form a physical connection between the computer module and the first accessory module. The first accessory module also includes a third interlock mechanism which is similar to the first interlock mechanism. A second accessory module has a fourth interlock mechanism which is similar to the second interlock mechanism. The first accessory module can be detachably connected to a second accessory module by means of a second interlocking structure which includes the third and fourth interlock mechanisms.

Abstract: A clamping arrangement is provided for compression mounted power electronic devices that is assembled from component parts to form a clamping module. The clamping module provides suitable clamping force to a power electronic device interposed between two heat sink arrangements. The clamping arrangement utilizes clamping beams disposed on either side of the two heat sinks and the interposed power electronic device, elongated members that span and retain each end of each clamping beam against relative movement, and an arrangement for applying a desired clamping force to the heat sinks and the power electronic device. The kit of component parts can be assembled into a clamping module about a power electronic device disposed between two heat sinks and is easily assembled or field disassembled from economical parts.

Abstract: A cryopump system includes an integral assembly having a refrigerator, cryopumping surfaces cooled by the refrigerator, a first electronic module for controlling the cryopump, and a second electronic module which is removably coupled to the first module. The second electronic module has a first surface abutting a complementary first surface of a housing of the first electronic module. Preferably, the first controller module has three orthogonal surfaces of approximately the same dimensions. Electronic modules can be removably coupled to each of the three surfaces. The cryopump system includes a module cap which is coupled to an end of an electronic module to shield electrical connections between two coupled electronic modules. The electronic modules comprise a channel of rectangular cross section having slots for mounting printed circuit boards.

Abstract: A multiple line grid (MLG) for use in a multiple line grid array(MLGA) packaging incorporates therein circuit elements, e.g., metal lines, resistors, capacitors, inductors, transistors or combinations thereof, with a view to reducing a size of a printed circuit board on which it is mounted. The MLGA package includes a semifinished package including a surface with a first metal pattern formed thereon for connecting a number of input/output terminals, a printed circuit board(PCB) including a top surface with a second metal pattern formed thereon according to the first metal pattern; and at least of a MLG which is disposed between the semifinished package and the PCB. The MLG includes a non-conductive body incorporated therein a plurality of circuit elements and multiple number of conductors in the form of a column. Each of the conductors is electrically isolated from each other and is electrically connected to the first and the second metal patterns.

Abstract: An electronic part module which is configured to electrically connect an electronic component to a motherboard via a socket, including a conversion board and a sub board. The conversion board is configured to convert a signal from the electronic component and has a plurality of pins projected from the conversion board. The plurality of pins are configured to contact the socket. The sub board is provided between the conversion board and the socket and has a plurality of holes each having a diameter same as or larger than that of each of the plurality of pins which pass through the plurality of holes, respectively.

Abstract: This is a semiconductor power module provided with: a ceramic substrate; a metallic plate bonded to a surface of this substrate; a cylindrical metallic flange which is hermetically bonded to a surface of substrate or the metallic plate; a ceramic housing for hermetically sealing an opening of the metallic flange; and at least one or more semiconductor chips soldered to the metallic plate. The metallic flange is made of metal with a low thermal expansion coefficient. A hermetically sealed container is created by welding the metallic flange, the ceramic substrate and the housing with silver brazing. Moreover, external collector, emitter and gate electrodes are bonded on the housing by using the silver brazing. The collector, emitter and gate conductive pillars are respectively connected to the external collector, emitter and gate electrodes with calking. Thus, this hermetically sealed container is strong in mechanical strength and high in explosion-proof durability and excellent in moisture resistance.

Abstract: A method for packaging a semiconductor device includes connecting a plurality of wire leads to a corresponding plurality of electrical connection pads on the semiconductor device, covering at least a portion of the semiconductor device and at least a portion of each of the wire leads with an encapsulating material, and removing a portion of the encapsulating material and a portion of each of the wire leads to form a packaged semiconductor device wherein each of the wire leads has an exposed portion only at an end. The invention also includes a packaged semiconductor device having an integrated circuit device with a plurality of electrical connection pads, a plurality of wire leads coupled to the plurality of electrical connection pads, and a covering of encapsulating material covering at least a portion of the integrated circuit device and covering each of the wire leads, wherein each of the wire leads has an exposed end.

Abstract: An electronic circuit module has an electronic circuit module main body and two signal pedestals, one on each side of the main body. The first signal pedestal is formed at a level higher than the second signal pedestal by an amount equal to the vertical thickness of the second signal pedestal. Signal lines are formed on a bottom surface of the first signal pedestal and on a top surface of the second signal pedestal. When connected to adjacent electronic circuit modules, the first signal pedestal of the electronic circuit module overlaps a second signal pedestal of one adjacent electronic circuit module, and the second signal pedestal underlaps a first signal pedestal of another adjacent electronic circuit module to electrically connect electronic circuit modules in multiple stages, improving signal connections and reducing the size of the electronic circuit module package.

Abstract: A line replaceable module (LRM) configured with a plurality of mini-modules, each of which have relatively higher contact densities than currently available LRMs with the same form factor, for example, a Standard Electrical Module-Size E (SEM-E) form factor. The mini-modules are significantly less expensive than an entire module allowing such mini-modules to be disposable, eliminating relatively costly fault diagnostics and repair. Each mini-module includes a printed circuit board which includes a rigid primary portion, a rigid secondary portion and flexible portion interconnecting the primary and secondary portions. The rigid secondary portion may be configured to provide dual-sided interconnection to a backplane data bus. Use of the dual-sided rigid secondary portion provides for generous spacing for contact densities much higher than known contact densities for LRMs with the same form factor. The rigid primary portion carries the components forming the LRM.

Abstract: A new method is provided for mounting high-density wire bond semiconductor devices. A layer of dielectric is deposited over the first surface of a metal panel. One or more thin film interconnect layers are then created on top of the dielectric layer. The BUM technology allows for the creation of a succession of layers over the thin film layers. The combined layers of thin film and BUM form the interconnect substrate. One or more cavities are created in the second surface of the metal panel; openings through the layer of dielectric are created where the layer of dielectric is exposed. One or more wire bond semiconductor die are inserted into the cavities, are die bonded and wire bonded to the openings that have been created in the layer of dielectric. Openings are created in the bottom BUM layer; solder balls are inserted and attached to this BUM layer for the completion of the Ball Grid Array (BGA) package.

Abstract: A vertically mountable semiconductor device including at least one bond pad disposed on an edge thereof. The bond pad includes a conductive bump disposed thereon. The semiconductor device may also include a protective overcoat layer. The present invention also includes a method of fabricating the semiconductor device, including forming disconnected notches in a semiconductor wafer, redirecting circuit traces into each of the notches, and singulating the wafer along the notches to form bond pads on the edges of the resultant semiconductor devices. A method of attaching the semiconductor device to a carrier substrate includes orienting the semiconductor device such that the bond pad is aligned with a corresponding terminal of the carrier substrate, and establishing an electrical connection between the bond pad and the terminal.

Abstract: A one system module in which a ceramic PCB and an epoxy PCB are disposed inside a module body and a power element and a signal element are respectively mounted at the upper portion of each PCB, wherein a groove is made at the lower side surface and at the middle side surface of the module body to support the ceramic PCB and the epoxy PCB formed in a two-story structure, and a power pin for receiving a power signal from an external source is mounted on the ceramic PCB and a signal pin for receiving various signals from an external source is mounted on the epoxy PCB. With this one system module, the ceramic PCB and the epoxy PCB can be firmly supported by the groove made on the module body. And, since the power pin and the signal pin are separately disposed on the two PCBs, use of the socket is reduced, so that the area utility of the PCB is increased as well as acquiring a compact module.

Abstract: The object of the present invention is to provide a stacked semiconductor device which can diffuse heat generated by the semiconductor chip in the module substrate, other semiconductor chips, the mother board, and the radiator plate, and can prevent needless increases in the temperature of an operating semiconductor chip; in order to achieve this object, the stacked semiconductor device of the present invention comprises a mother board and a module-stacked body mounted on the mother board, the module-stacked body comprising staked two or more modules each of which comprises a module substrate and a semiconductor chip mounted to the module substrate, wherein at least one radiator hole is formed in each of the module substrates and the mother board so that the radiator hole faces to the semiconductor chips.

Abstract: An edge-mountable integrated circuit (IC) package and methods of manufacturing and assembling the same onto a printed wiring board (PWB). In one embodiment, the package includes: (1) a substrate having a major surface and a substantially planar edge and (2) a conductive coating having a first region located on a portion of the major surface and a second region located on a portion of the substantially planar edge, the second region being substantially planar to allow the second region to be reflow soldered to the adjoining printed wiring board PWB.

Abstract: A circuit design is logically partitioned into a plurality of blocks. As a first hierarchial assembly level, the blocks are fabricated as individual submodules each including at least one electronic component with component connection pads on a top surface, and a first interconnect structure including at least one interconnect layer bonded to the top surfaces, and interconnecting selected ones of the component connection pads. Submodule connection pads are provided on upper surfaces of the submodules. As a second hierarchial assembly level, a second interconnect structure is bonded to the upper surfaces and interconnects selected ones of the submodule connection pads.

Abstract: A family of related programmable logic devices is provided. The family includes a first programmable logic device having n number of logic modules. The first programmable logic device is incorporated into a first package, with the n number of logic modules bonded out to the first package. A second programmable logic device has a number of logic modules greater than n. The second programmable logic device is incorporated into a second package of substantially the same size as the first package and having an identical pin assignment, with only n number of the logic modules of the second programmable logic device bonded out to the second package.