Ic Card Or Card Member Patents (Class 361/737)
  • Patent number: 8116083
    Abstract: A USB device including a tubular housing and a rear cap assembly including a handle structure that is rotatably connected to the tubular housing to facilitate deploying and retracting a plug connector through a front opening of the housing. The plug connector is fixedly connected onto the front end of a sliding rack assembly that is disposed in housing such that the sliding rack assembly is slidable along a longitudinal axis. The sliding rack assembly includes a carrier including a carrier tray for supporting electronic devices and an elongated positioning rod extending from a rear portion of the carrier tray. The positioning rod is operably engaged with an actuator portion such that manual rotation of the rear cap handle structure relative to the housing around the longitudinal axis causes the sliding rack assembly to slide inside the housing between retracted and deployed positions.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: February 14, 2012
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Abraham C. Ma
  • Publication number: 20120033388
    Abstract: An assembly includes a circuit board, a support perpendicular to the circuit board, and a mounting apparatus including a sliding bracket to accommodate an expansion card, a driving member pivotably mounted to the second support, and a clamping arm mounted to the sliding bracket. The sliding bracket is slidably mounted to the second support, and the driving member is fixed to the sliding bracket. The clamping arm is operable to press or release the expansion card. When the driving member is moved in a first direction, the sliding bracket is moved towards the circuit board, and the expansion card is moved to connect to the circuit board. When the driving member is moved in a second direction opposite to the first direction, the sliding bracket is moved away from the circuit board, and the expansion card disengages from the circuit board.
    Type: Application
    Filed: September 30, 2010
    Publication date: February 9, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: WEN-TANG PENG, GUANG-YI ZHANG, ZHE ZHANG
  • Patent number: 8107246
    Abstract: The invention relates to a format adapter comprising a storage device having: a front surface provided with electrical contact pads opposite a rear surface defining a lower peripheral border (2a); a body having a cavity (4) for receiving the device and opening on a front and rear side of the body, and; an adhesive film (8a), which is sensitive to pressure, adhered to the rear side of the body and which has at least one adhesive portion inside the cavity in order to hold the storage device. The adhesive film has an inner recess (10) essentially centered on the cavity and has at least one shoulder bordering on the cavity that assures a localized adhesion only on the lower peripheral border (2a) of the storage device. The invention also relates to a method for producing the adapter and to a use of the adapter for manufacturing and packaging the storage device.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: January 31, 2012
    Assignee: Gemalto SA
    Inventors: Jean-Christophe Fidalgo, Jean-Francois Martinent, Blandine Alleysson
  • Patent number: 8102658
    Abstract: A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: January 24, 2012
    Assignee: Super Talent Electronics, Inc.
    Inventors: Siew S. Hiew, Abraham C. Ma, Nan Nan
  • Patent number: 8102657
    Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: January 24, 2012
    Assignee: Super Talent Electronics, Inc.
    Inventors: Siew S. Hiew, Abraham C. Ma, Nan Nan
  • Patent number: 8097816
    Abstract: A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: January 17, 2012
    Assignee: Denso Corporation
    Inventors: Keiichi Sugimoto, Mitsuru Nakagawa
  • Patent number: 8092257
    Abstract: A memory card is disclosed resembling a CompactFlash card, but which is compatible with an ExpressCard slot.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: January 10, 2012
    Assignee: SanDisk Technologies Inc.
    Inventors: Jonathan Hubert, Jason P. Hanlon, Jordan Macdonald, Wesley G. Brewer
  • Patent number: 8089778
    Abstract: A hand-held electronic device including a body, a touch-sensing display area, and a holding area is provided. The touch-sensing display area located at a surface of the body is divided into several sub-touch-sensing areas disposed at a part of a surrounding region of the touch-sensing display area. The sub-touch-sensing areas have at least one access-sensing region. The access-sensing region is used for sensing a touch-control action so as to render the hand-held electronic device to perform a function corresponding to the touch-control action. The holding area is disposed outside the sub-touch-sensing areas. When a user only intends to hold the hand-held electronic device, the user's hands can put on the holding area and the hand-held electronic device would not perform any corresponding function.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: January 3, 2012
    Assignee: HTC Corporation
    Inventors: Yi-Shen Wang, Yi-Chi Lin
  • Patent number: 8085544
    Abstract: A data card includes a casing, a circuit board in the casing, a plug electrically connected with the circuit board and a cap part capable of covering the plug; wherein one end of the casing is provided with the plug; a card slot is defined in the casing at a joint of the casing and the plug, and the cap part covers a notch of the card slot when the plug is inserted into the cap part. The invention is mainly used in wireless data signal receiving or transmitting device.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: December 27, 2011
    Assignee: Huawei Device Co., Ltd.
    Inventor: Shuai Zhao
  • Publication number: 20110310568
    Abstract: A circuit arrangement has a populated circuit carrier and includes a flat insulation carrier having a top side and a patterned metallization layer on the top side and a first power semiconductor chip arranged on a first section of the metallization layer. The first power semiconductor chip has a first lower chip load terminal electrically conductively connected to the first section. A shunt resistor is arranged on a second section of the metallization layer. The shunt resistor has a lower main terminal electrically conductively connected to the second section. An electrically conductive connection is provided between the first section and the second section. The electrically conductive connection includes a constriction between the first section and the second section so that a current which flows between the first lower chip load terminal and the lower main terminal during operation of the circuit arrangement must pass through the constriction.
    Type: Application
    Filed: June 17, 2011
    Publication date: December 22, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Tao Hong, Markus Thoben
  • Patent number: 8077469
    Abstract: A chip card holder, for securing a chip card in an electronic device, includes a housing, an elastic member and a strip member. The housing defines a receiving chamber. The elastic member is secured in the receiving chamber and has an elastic foldable resisting section. The strip member connects with the resisting section and an end of the strip exposes from the receiving chamber. A chip card is assembled in the receiving chamber, the resisting section of the elastic member resists against the chip card, the resisting section is folded elastically by pulling the strip member and the chip card is withdrawn by the pushing of the resisting section.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: December 13, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Cheng-Lung Chang
  • Patent number: 8077451
    Abstract: A retention assembly for securing a surface contact card in a portable electronic device includes a main body defining a receiving groove in the main body, and a locking member slidably positioned on the main body adjacent to the receiving groove. The locking member is slidable from a first position at a side of the receiving groove to a second position on a top of the receiving groove, and is latched at the second position, thereby pressing opposite ends of the surface contact card.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: December 13, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Zi-Ming Tang
  • Patent number: 8071895
    Abstract: A data storage device and methods of manufacture are provided which tend to protect the device against moisture and shock. The device includes a circuit board, a coating, a housing, and preferably a sealant. The circuit board is in electrical communication with an electrical interface. The coating is disposed at least on the circuit board to generally encapsulate the circuit board. The housing is sized and configured to generally encompass the circuit board and the coating. The housing includes a housing opening being sized and configured with the electrical interface being at least partially exposed therethrough. The sealant is preferably disposed within the housing substantially intermediate the interior surface of the housing and the coating on the circuit board. Further, at least one of the coating and the sealant may be disposed substantially intermediate the electrical interface and the housing opening.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: December 6, 2011
    Assignee: Kingston Technology Corporation
    Inventors: George Shiu, Wei H. Koh
  • Patent number: 8068344
    Abstract: An electronic apparatus, which accommodates a chip card, includes a casing, a limit element and a carrier. The limit element is connected to the casing and has a protruding part. The carrier is slidingly disposed on the casing and has at least a contact area disposed on a side of the carrier. The limit element is located at a first position as the protruding part contacts the contact area, and the limit element is located at a second position as the protruding part is away from the contact area. The protruding part moves between the first position and the second position.
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: November 29, 2011
    Assignee: Inventec Corporation
    Inventors: Chao-Lun Chiang, Chien-Chung Liao, Chih-Lin Ho
  • Patent number: 8064205
    Abstract: A storage device can include a first outer surface and a second outer surface opposite the first outer surface. The storage device can further include first and second sets of contacts arranged to couple to first and second connectors, respectively. The first outer surface can be closer to the first set of contacts than the second set of contacts, and the second outer surface can be closer to the second set of contacts than the first set of contacts. In a particular embodiment, the storage device can include a circuit board having first and second major surfaces. The first and second sets of contacts are disposed on the first and second major surfaces, respectively. The storage device can be in a form of a solid-state drive. Further, the storage device can be communicatively coupled to a process of an information handling system.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: November 22, 2011
    Assignee: Dell Products, LP
    Inventors: Munif M. Farhan, James R. Utz
  • Patent number: 8064206
    Abstract: A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the semiconductor memory element of an upper side. The semiconductor memory elements are electrically connected to the connection pads of the wiring board via metal wires.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: November 22, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Taku Nishiyama, Kiyokazu Okada, Yoriyasu Ando, Tetsuya Yamamoto, Naohisa Okumura
  • Patent number: 8059413
    Abstract: A computer housing is adapted for mounting an interface card, and includes a housing body and a positioning device. The housing body includes a mounting portion and a first fixing portion disposed adjacent to the mounting portion. The positioning device includes a positioning component having a second fixing portion. The positioning component is pivotable relative to the housing body between a card retaining position, where the second fixing portion engages the first fixing portion and the positioning component is disposed to be capable of blocking removal of the interface card from the mounting portion, and a card releasing position, where the second fixing portion is disengaged from the first fixing portion and the positioning component is disposed to permit removal of the interface card from the mounting portion.
    Type: Grant
    Filed: April 1, 2009
    Date of Patent: November 15, 2011
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Wei-Chih Sun, Yu-Cheng Liang, Chien-Chi Chen
  • Patent number: 8059414
    Abstract: Disclosed is a miniature portable memory device, comprising: a memory card unit; a shell, which is provided with a reception slot inside for receiving and accommodating said memory card unit, one end of said shell is provided with a first opening portion for insertion of said memory card unit into said reception slot, and a second opening portion is provided on said shell, so that when said memory card unit is inserted into said reception slot, said memory card unit is exposed to outside of said shell through said second opening portion; and a cover body, provided with a connection portion, that can be inserted into said first opening portion of said shell, and well fits therein.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: November 15, 2011
    Assignee: Yu Ge Wei International Corp.
    Inventor: Chung-Yu Wei
  • Patent number: 8059415
    Abstract: An embodiment disclosed herein relates to a communications module. The communications module includes a body composed of a plastic resin and a plurality of conductive traces and contact pads defined on a portion of a surface of the body. The module also includes at least one substantially vertical ridge defined on the body surface, and at least one pocket defined on the body suitable for receiving an electronic component. The communications module may also include a body composed of a plastic resin and conductive features defined on a surface of the body configured to render the communications module operable without implementing a printed circuit board as part of the body. Additional embodiments relate to systems and methods for attaching one or more optical transmit assemblies to the communications module and for electrically connecting conductive traces in a temporary fashion on the surface of the body of the communications module.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: November 15, 2011
    Assignee: Finisar Corporation
    Inventors: Stephen T. Nelson, Donald A. Ice, Darin James Douma
  • Patent number: 8045331
    Abstract: A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: October 25, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho-Seong Seo, Young-Min Lee, Kyu-Sub Kwak
  • Patent number: 8031473
    Abstract: A control device has a base plate, a cover plate coupled to the base plate, a cavity formed between the base plate and the cover plate, a circuit carrier disposed in the cavity, and a conducting track carrier electrically coupled to the circuit carrier. The base plate has a continuous recess that is configured and arranged for feeding a casting compound into the cavity between the base plate and the cover plate. The casting compound is embodied to at least partly enclose the circuit carrier and/or the conducting track carrier in a vibration-damping manner.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: October 4, 2011
    Assignee: Continental Automotive GmbH
    Inventors: Stefan Beer, Josef Loibl, Hermann-Josef Robin, Karl Smirra
  • Patent number: 8024857
    Abstract: A substrate for a semiconductor package having a reinforcing member that prevents or minimizes distortions is presented. The substrate for the semiconductor package includes a substrate body, an insulation layer, and a reinforcing member. The substrate body has a first region having a plurality of chip mount regions, a second region disposed along a periphery of the first region, a circuit pattern disposed in each chip mount region and a dummy pattern disposed along the second region. The insulation layer covers the first and second regions and has an opening exposing some portion of each circuit pattern. The reinforcing member is disposed in the second region and prevents deflection of the substrate body.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: September 27, 2011
    Assignee: Hynix Semiconductor Inc.
    Inventors: Young Hy Jung, Jae Sung Oh, Ki Il Moon, Ki Chae Kim, Chan Sun Lee, Jin Ho Gwon, Jae Youn Choi
  • Patent number: 8027165
    Abstract: A flash memory card structure with an external contact structure according to a published standard, such as the USB standard, also includes a second data transmission path, such as a wireless one. A removable cap fits over the card to cover the external contacts when they are not being used as a memory data path. One of two or more different caps may be selected to be placed on the card in order to control operation of the second data transmission path, such as to select the distance of wireless transmission from one of two or more pre-set distances. Power to operate the memory card through the second path, when not connected to a host, may also be provided through the external contacts by including a battery in the caps.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: September 27, 2011
    Assignee: Sandisk Technologies Inc.
    Inventors: Robert F. Wallace, Edwin J. Cuellar, Eliyahou Harari, Yoram Cedar
  • Publication number: 20110228487
    Abstract: An integrated circuit card includes a laminate, solder bumps, a die and a package. The laminate includes a core board sandwiched between two conductive layers. The conductive layers are connected to each other with solder bumps filled in apertures defined in the core board. The die is provided on one of the conductive layers. The package is provided on the die and an area of the conductive layer around the die.
    Type: Application
    Filed: June 9, 2010
    Publication date: September 22, 2011
    Applicant: MAO BANG ELECTRONIC CO., LTD.
    Inventors: Tse Min Chu, Jimmy Liang
  • Patent number: 8023269
    Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.
    Type: Grant
    Filed: August 15, 2008
    Date of Patent: September 20, 2011
    Assignees: Siemens Energy, Inc., Arkansas Power Electronics International, Inc.
    Inventors: David J. Mitchell, Anand A. Kulkarni, Ramesh Subramanian, Edward R. Roesch, Rod Waits, Roberto Schupbach, John R. Fraley, Alexander B. Lostetter, Brice McPherson, Bryon Western
  • Patent number: 8018038
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: September 13, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Patent number: 8013332
    Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: September 6, 2011
    Assignee: SanDisk Technologies Inc.
    Inventors: Warren Middlekauff, Robert Miller, Charlie Centofante
  • Patent number: 8014130
    Abstract: Various embodiments of a USB drive pen device are disclosed herein. In one embodiment, a USB drive pen device includes a USB plug assembly having a flash controller and a flash memory device, a pusher assembly including a rotator having one or more tabs disposed thereon, and a housing for housing at least a portion of the USB plug assembly and the pusher assembly. The housing includes a tunnel and an inner tube extended from the tunnel disposed within the housing. An intersection between the tunnel and inner tube includes one or more angled corners to lock the USB plug assembly in either a deployed position or a retracted position. Other methods and apparatuses are also described.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: September 6, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: David Nguyen, Nan Nan, Abraham C. Ma, Jim Chin-Nan Ni, Charles Chung Lee, Ming-Shiang Shen
  • Patent number: 8009440
    Abstract: A computer device includes a chassis, a card connector, and a cartridge. The card connector is attached to the chassis and is adapted to receive a card. The cartridge includes a guide plate, a card holder, and an actuator. The guide plate is removably engaged to the chassis. The card holder is connectable to the card and movable, relative to the guide plate, between an engaged position and a disengaged position. In the engaged position, the card is connected the card connector, and in the disengaged position, the card is disconnected from the card connector. The actuator is engaged with the guide plate, and the actuator linearly moves between a first position and a second position relative to the guide plate. The movement of the actuator from the first position to the second position causes the movement of the card holder from the disengaged position to the engaged position. The computer device is a server, and the cartridge is introduced into front face or a rear face of the server.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: August 30, 2011
    Assignee: International Business Machines Corporation
    Inventors: Norman B. Desrosiers, Dean F. Herring, Kevin D. Johnson, Eric A. Stegner, Robert W. Stegner, Paul A. Wormsbecher
  • Publication number: 20110188211
    Abstract: A data card includes a casing, a circuit board in the casing, a plug electrically connected with the circuit board and a cap part capable of covering the plug; wherein one end of the casing is provided with the plug; a card slot is defined in the casing at a joint of the casing and the plug, and the cap part covers a notch of the card slot when the plug is inserted into the cap part. The invention is mainly used in wireless data signal receiving or transmitting device.
    Type: Application
    Filed: April 20, 2011
    Publication date: August 4, 2011
    Applicant: HUAWEI DEVICE CO., LTD.
    Inventor: Shuai ZHAO
  • Publication number: 20110182040
    Abstract: A data storage device comprising a card-shaped body, a memory within the card-shaped body, and a connector for connecting the memory to a personal computer. The card-shaped body comprises a swipable portion with a magnetic stripe arranged to be read by a magnetic stripe card reader. The card-shaped body can comprise a main portion with a recess and a connector portion comprising the memory and connector. In that case, the connector portion is hingably mounted on the main portion to be rotatable between a closed position in which the connector portion is located within the recess, and an open position in which the connector of the connector portion is located outside of the recess so that it can be used to connect the memory to a personal computer.
    Type: Application
    Filed: July 14, 2009
    Publication date: July 28, 2011
    Inventors: Peter Anthony Ronald Ellul, Stephen James Brown
  • Patent number: 7971793
    Abstract: The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: July 5, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Tamaki Wada, Michiaki Sugiyama, Junichiro Osako
  • Publication number: 20110157838
    Abstract: Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals.
    Type: Application
    Filed: December 10, 2010
    Publication date: June 30, 2011
    Applicant: SONY CORPORATION
    Inventors: KAORI MORITA, TOMOYASU YAMADA, TAMOTSU KIYAKAWAUCHI, AKITOMI KATSUMURA, KOJI SHIOZAWA
  • Patent number: 7965520
    Abstract: An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: June 21, 2011
    Assignee: Sony Ericsson Mobile Communications AB
    Inventors: Håkan Bygdö, Per Holmberg
  • Publication number: 20110134613
    Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
    Type: Application
    Filed: December 7, 2010
    Publication date: June 9, 2011
    Applicant: INTERSIL AMERICAS INC.
    Inventors: Zaki MOUSSAOUI, Nikhil Vishwanath KELKAR
  • Patent number: 7950586
    Abstract: An improved smart card is provided, which is adapted for easy extraction from a smart card socket, or example, in a mobile telephone. Facilitating the easy extraction is a structural deviation in the plane of at least one of the sides of the smart card to enable an increase of an external force on the smart card to thereby cause the extraction of the smart card from a socket. The structural deviation may be a change in the thickness of the smart card or a roughened surface in the smart card's enclosure. The smart card may be a SIM card. Also provided is a method of extracting a smart card from a socket, which method may include the steps of engaging a structural deviation in the plane of at least one side of the smart card's enclosure and applying a force to the engaged structural deviation.
    Type: Grant
    Filed: August 12, 2007
    Date of Patent: May 31, 2011
    Assignee: SanDisk IL Ltd.
    Inventor: Alfredo Fernandez
  • Patent number: 7941916
    Abstract: A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads are formed on a lower surface of the PCBA substrate, which is exposed through a bottom of the casing. The PCBA is fabricated on a substrate carrier, then positioned inside of a mold assembly. During the molding process, a rod extends from an upper portion of the mold assembly and pushes the substrate against the lower surface. A vacuum is then applied to hold the substrate against the lower surface of the mold, and the rod is subsequently withdrawn from the mold cavity during injection of the molten molding material. A single cavity mold assembly provides molding material extends over front and back edges of the memory card.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: May 17, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: Paul Hsueh, Jim Ni, Kuang-Yu Wang
  • Patent number: 7944703
    Abstract: A flash memory device includes one or two panels that are attached solely by a thermal bond adhesive to either a frame or integrated circuits (e.g., flash memory devices) disposed on a PCBA. The frame is disposed around the PCBA and supports peripheral edges of the panels. The thermal bond adhesive is either heat-activated or heat-cured, and is applied to either the memory devices, the frame or the panels, and then compressed between the panels and flash memory devices/frame using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. An optional insulating layer is disposed between the panels and the ICs. An optional conforming coating layer is formed over the ICs for preventing oxidation of integrated circuit leads or soldering area, covering or protecting extreme temperature exposure either cold or hot, and waterproofing for certain military or industrial applications.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: May 17, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Nan Nan, I-Kang Yu, Abraham C. Ma
  • Patent number: 7944702
    Abstract: A press-push type computer peripheral “flash drive” device includes an elongated (e.g., metal) tubular casing containing a PCBA having a plug connector. A plastic housing assembly includes front and rear cap portions mounted over the open ends of the tubular casing, and a fixed plastic sleeve portion disposed in the tubular casing. The PCBA is secured to a plastic sliding rack structure that is disposed in the tubular casing and includes an actuating button protruding through a slot formed in a wall of the tubular casing. When the actuating button is manually pushed and slid along the slot, a portion of the sliding rack structure slides against the plastic sleeve portion in deploying and retracting the USB connector out of the device.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: May 17, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Nan Nan, Abraham C. Ma
  • Patent number: 7929311
    Abstract: A portable electronic device includes a housing, a circuit board received in the housing, and a memory card retaining mechanism received in the housing. The memory card retaining mechanism includes a plurality of conductive parts. The plurality of conductive parts cooperatively form an antenna integrated with the memory card retaining mechanism and connected to the circuit board.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: April 19, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventors: Yen-Jung Tseng, Cho-Kang Hsu
  • Patent number: 7929714
    Abstract: An integrated audio transducer with associated signal processing electronics is disclosed. A silicon audio transducer, such as a MEMS microphone or speaker, can be integrated with audio processing electronics in a single package. The audio processing electronics can be configured using control signals. The audio processing electronics can provide a single line serial data interface and a single line control interface. The audio transducers can be integrated with associated processing electronics. A silicon microphone can be integrated with an Analog to Digital Converter (ADC). The ADC output can be a single line serial interface. The ADC can be configured using a single line serial control interface. A speaker may be integrated with a Digital to Analog Converter (DAC). Audio transducers can also be integrated with more complex processing electronics. Audio processing parameters such as gain, dynamic range, and filter characteristics may be configured using the serial interface.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: April 19, 2011
    Assignee: QUALCOMM Incorporated
    Inventors: Seyfollah Bazarjani, Louis D. Oliveira
  • Patent number: 7916488
    Abstract: A chip card holding module (24) having a connector portion (26) and a securing member (28) is described. The connector portion includes a base (261) defining two latching slots (263) on two lateral sides and a plurality of terminals (30) arranged on two opposite ends (261c, 261d) of the base. The securing member comprising a resisting plate (281) and a pair of connecting plates (282) respectively extends from two ends of the resisting plate, the connecting plates being inserted into the latching slots so as to define a space for receiving a chip card.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: March 29, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Ming-Shiung Chang
  • Publication number: 20110062239
    Abstract: A payment card manufacturing process for a magnetic device (QChip) with a bit coil array to individually write several dynamic magnetic data bits into the magnetic material. The magnetic device fits inside the payment card's magnetic strip and contributes to the data recorded statically in the magnetic stripe. The magnetic device edges physically nearest the leading and trailing dynamic magnetic data bits are trimmed very closely and precisely by scoring the tops with deep reactive ion etching to produce deep trenches, and then back-grinding up from underneath to the trench bottoms. The magnetic device is inserted into a high precision die or laser cut opening in the magnetic stripe in each payment card. The locations of the static magnetic bits in the magnetic stripe are precisely recorded maintaining continuous signal integrity and integration during card personalization after electronically sensing the X,Y locations of the magnetic device's dynamic magnetic data bits.
    Type: Application
    Filed: September 12, 2009
    Publication date: March 17, 2011
    Inventors: Rachel Lau, Paul Tsao, Kerry Brown
  • Publication number: 20110051371
    Abstract: The present invention provides a vehicle power module and a power converter including a power semiconductor element (328), a plurality of connecting conductors (371U, 372U, 373U) for transmitting current to the power semiconductor element (328), and a metallic base (304) upon which the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted; and the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted upon the metallic base (304) so as to form a looped current path. Desirably, the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, 373U) are arranged so as to form two or more looped current paths.
    Type: Application
    Filed: July 30, 2009
    Publication date: March 3, 2011
    Applicant: Hitachi Automotive Systems, Ltd
    Inventors: Katsunori Azuma, Mutsuhiro Mori, Kinya Nakatsu, Seiichi Hayakawa, Fusanori Nishikimi
  • Patent number: 7898813
    Abstract: A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the semiconductor memory element of an upper side. The semiconductor memory elements are electrically connected to the connection pads of the wiring board via metal wires.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: March 1, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Taku Nishiyama, Kiyokazu Okada, Yoriyasu Ando, Tetsuya Yamamoto, Naohisa Okumura
  • Patent number: 7894198
    Abstract: A flash memory device, includes a case (1) having a chamber and an opening (1120) at one end thereof. A memory module (2) is received in the chamber and has a plug (22) formed at one end thereof. A pole (3) has a first portion (30) received in the chamber to drive the plug of the memory module moving in or out of the opening, and a second portion (31) opposite to the first portion. A revolver mechanism (5) has a main body (51) which is rotatable, and a spindle (52) assembled to the main body and rotatablely coupled to the second portion to drive the pole moving along a linear direction.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: February 22, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Zhi-Wen Zhu, Jin-Kui Hu, Xue-Yuan Xiao
  • Patent number: 7887342
    Abstract: A structure having an USB memory module has a housing and a storage device. The housing is hollow and has a chamber defined therein. The memory module of the data storage device is partially received in the chamber of the housing and partially exposed beyond the housing.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: February 15, 2011
    Assignee: Walton Advanced Engineering Inc.
    Inventor: Hong-Chi Yu
  • Patent number: 7889506
    Abstract: A function expansion datacard including a main board, a connector, a housing and a holder is provided. Several chips and the connector are disposed on a surface of the main board. The connector is situated near the edge of the main board. The housing disposed on the main board covers the chips and exposes a connection surface of the connector. The holder movably disposed at the housing is moved in and out the housing. The holder is situated over the connector and moves in a direction perpendicular to the connection surface.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: February 15, 2011
    Assignee: Inventec Corporation
    Inventor: Cheng-Hsing Huang
  • Patent number: 7885078
    Abstract: An electrical card (100) includes an insulative frame (1) having a pair of detachable side bars (112) spaced from each other and a transverse bar (116) assembled onto the side bars to interconnect the side bars; a detachable upper cover (12) attached to a rear end of the frame; an upper shell (2) and a lower shell (3) mounted to an upper side and a lower side of the side bars respectively; a detachable lower cover (4) attached to the lower shell and disposed beneath the upper cover; a circuit board (5) supported by the frame and located between the frame and the upper shell; and an electrical connector (6) attached to a front end of the frame and electrically connected to the circuit board.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: February 8, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hao Gu, Qi-Sheng Zheng, Zhi-Quan Mou, Xiao-Hai Zhou
  • Patent number: RE42410
    Abstract: An adapter to be attached to a memory card for changing an external shape such that it can be inserted into a memory card insertion section of specific type equipment is provided. The adapter includes: an adapter body for defining a space housing the memory card; a write protect mechanism including a write enable/disable setting member which is slidable with respect to the adapter body; and a terminal portion located in the adapter body, which is formed so as to be electrically connected to a terminal portion of the memory card when the memory card is housed in the adapter body, and in which the write protect mechanism sets whether to enable or disable writing of data into the memory card in accordance with the position of the write enable/disable setting member.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: May 31, 2011
    Assignee: Panasonic Corporation
    Inventors: Hiroyuki Yamada, Masayoshi Yano