Ic Card Or Card Member Patents (Class 361/737)
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Patent number: 7885858Abstract: Information handling systems are built to order with provisioned wireless wide area network (WWAN) service coordinated through a WWAN network provider as part of the manufacture of the information handling system. A WWAN component is built into the information handling system and then queried to retrieve a WWAN identifier, such as ESM or SIM information. The identifier is associated with end user information of the information handling system and formatted as a request for WWAN provisioning sent to a network service provider. The network service provider applies the WWAN identifier and end user information to contact the end user for setting up a WWAN account or, alternatively, to automatically set up a WWAN account for the end user.Type: GrantFiled: January 24, 2006Date of Patent: February 8, 2011Assignee: Dell Products L.P.Inventors: Pratik M. Mehta, Michael Ryan, Roger Cameron
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Publication number: 20110024507Abstract: Among other things, a portable memory card that conforms to a size, shape, and connection interface of an industry-standard memory card is smaller than and held by a support that conforms to a shape and size of an industry-standard credit card. The support is insertable into a receptacle with the connection interface of the memory card mated with a corresponding connection interface of the receptacle.Type: ApplicationFiled: July 30, 2009Publication date: February 3, 2011Inventors: KAZUNA TANAKA, JEFFREY S. KAPEC, YUKIKO NAOI, CHRISTIANO BUTLER, STEVEN WICKSMAN
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Patent number: 7881068Abstract: Provided herein is a composite layer including an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The composite layer includes a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the composite layer provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.Type: GrantFiled: January 15, 2009Date of Patent: February 1, 2011Assignee: Nokia CorporationInventors: Ramin Vatanparast, Mikko Aarras, Steven O. Dunford, Takaharu Fujii, Juhani Lainonen, Jaakko Nousiainen, Jukka I. Rantala, Pia Tanskanen, Tetsuya Yamamoto
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Patent number: 7881063Abstract: A nonvolatile memory card, including interface parts for plural kinds of memory cards; interface controllers corresponding to the interface parts for corresponding memory cards; and a switch configured to select a single one of the interface controllers.Type: GrantFiled: June 9, 2006Date of Patent: February 1, 2011Assignee: Ricoh Company, Ltd.Inventor: Masaharu Adachi
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Publication number: 20110019367Abstract: A method for manufacturing a plurality of plug-in cards (25) from a card body (6), preferably on a standard sized, ISO 7810, ID1 type, the method comprising the steps of defining said plug-in cards (25) on the card body (6) and making at least one score line (19) on the card body to define the same plurality of similar plug-in support cards (33) each comprising a single plug-in card.Type: ApplicationFiled: December 26, 2007Publication date: January 27, 2011Applicant: Oberthur Card Systems LimitedInventor: David K. Hatch
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Patent number: 7874491Abstract: A carrier arrangement having a carrier configured to fix a semiconductor chip, contacts located on the carrier and configured to make contact with the semiconductor chip, and an overvoltage protection in a form of a spark gap arrangement formed between the contacts.Type: GrantFiled: April 5, 2007Date of Patent: January 25, 2011Assignee: Infineon Technologies AGInventors: Marcus Janke, Peter Laackmann
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Patent number: 7872872Abstract: A computer card comprises a housing insertable into a slot of an electronic device and a power pin configured to provide power to the electronic device.Type: GrantFiled: July 30, 2007Date of Patent: January 18, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Paul J. Doczy, Jonathan R. Harris, Steven S. Homer
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Patent number: 7872871Abstract: A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a USB controller chip and a flash memory chip, or a single-chip (combined USB controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The low-profile USB device is optionally used as a modular insert that is mounted onto a metal case to provide a USB assembly having a plug shell similar to a standard USB male connector.Type: GrantFiled: July 5, 2007Date of Patent: January 18, 2011Assignee: Super Talent Electronics, Inc.Inventors: Siew S. Hiew, Jim C. Ni, Charles C. Lee, I-Kang Yu, Ming-Shiang Shen
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Patent number: 7872873Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB memory card includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. Passive components are mounted on a lower surface of the PCB using SMT methods, and IC dies are mounted using COB methods, and then the components and IC dies are covered by a plastic molded housing. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The PCBA includes dual-personality electronics for USB and EUSB communications.Type: GrantFiled: May 20, 2008Date of Patent: January 18, 2011Assignee: Super Talent Electronics, Inc.Inventors: Siew S. Hiew, Nan Nan, Abraham C. Ma
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Patent number: 7869218Abstract: A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions.Type: GrantFiled: July 11, 2008Date of Patent: January 11, 2011Assignee: Super Talent Electronics, Inc.Inventors: Jim Chin-Nan Ni, Siew S. Hiew, Abraham C. Ma
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Patent number: 7869219Abstract: A pen-type computer peripheral device includes an elongated housing containing a PCBA having a plug connector. The PCBA is secured to a positioning member that is actuated by way of a press-push button that is exposed through a slot defined in a wall of the housing. A spring-loaded mechanism includes a spring and a locking mechanism that locks the connector in a retracted position and a deployed position, and the spring biases the connector from the retracted position to the deployed position, or vice versa.Type: GrantFiled: January 29, 2009Date of Patent: January 11, 2011Assignee: Super Talent Electronics, Inc.Inventors: Abraham C. Ma, Jim Chin-Nan Ni, Nan Nan
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Patent number: 7864540Abstract: A peripheral card includes a circuit board, various circuit elements on the circuit board, a set of user terminals, a set of test terminals, and an enclosure that covers a portion of the circuit board and the circuit elements. The enclosure does not cover the user terminals and test terminals. After the peripheral card is tested, the test terminals are covered with a conformal contact coating in order to prevent access to the test terminals.Type: GrantFiled: October 31, 2007Date of Patent: January 4, 2011Assignee: SanDisk CorporationInventor: Hem Takiar
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Patent number: 7859850Abstract: An electronic card and expansion card combination includes an electronic card, for example, vertical insertion type Express card defining a 34 mm card accommodation space and accommodating a circuit board with an electric connector, and an expansion card, which has a flat sliding holder base movable in and out of the card accommodation space and carrying an adapter terminal set that contacts the metal contacts of the circuit board when the flat sliding holder base is extended out of the card accommodation space, and an expansion plate pivotally coupled to the flat sliding holder base and carrying a matching terminal set that contacts the adapter terminal set for the contact of metal contacts of a chip card to be inserted into a card insertion slot defined in the flat sliding holder base and the expansion plate after the expansion plate is turned to out of the flat sliding holder base.Type: GrantFiled: March 6, 2009Date of Patent: December 28, 2010Assignee: D&C Technology Co., Ltd.Inventors: Ju-Chieh Chan, Ying-Chi Lien, Hung-Ming Lin
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Patent number: 7859856Abstract: A protocol analyzer for analyzing traffic on a bus. A tap card is used to tap into a bidirectional bus. The tap provides a pass through connection from the card to the host and taps off of the bus. While tapping off the bus, stubs lengths are minimized and input capacitance is minimized. A repeater that preferably has no internal termination provides a differential input and a differential output or a single ended output. The bus lines are input to one of the inputs in the differential inputs and a reference voltage is provided to the other differential input. The reference voltage enables the tap to determine if the data is high or low. A jumper is also included in the tap such that the reference voltage can be selected from the host or from the pod.Type: GrantFiled: October 23, 2006Date of Patent: December 28, 2010Inventor: Eric J. Lanning
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Patent number: 7855892Abstract: A protective jacket for covering an electrical device is provided. The protective jacket includes a first shell and a second shell. The first shell includes a front cover, a rear cover, and an elastic strip. The front and the rear covers are formed apart from each other and have an individual hollow for receiving the insertion of the device. The elastic strip is formed between these covers. A space is defined on the first shell by theses covers, and the elastic strip together. The second shell is configured to be disposed within the space of the first shell, and has a slot for receiving the insertion of the device. Therefore, the protective jacket conforms to the shape of the device and is capable of covering the device compactly for preventing damages due to collision and avoiding dust and mist pollution so as to increase the life of the device substantially.Type: GrantFiled: December 26, 2007Date of Patent: December 21, 2010Assignee: Fruitshop International CorporationInventor: Chin-Sheng Lin
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Publication number: 20100302737Abstract: A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.Type: ApplicationFiled: May 28, 2009Publication date: December 2, 2010Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: EDWARD P. YANKOSKI, TERENCE G. WARD, GEORGE R. WOODY
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Patent number: 7834275Abstract: A secure electronic entity comprising a support and a microcircuit having an active surface which is at least partially covered by a resin, wherein at least one distinct element masks the active surface in an at least partial manner, characterized in that the element (13) is joined to the resin (16) in a more resistant manner than to the support (11).Type: GrantFiled: April 22, 2005Date of Patent: November 16, 2010Assignee: Oberthur TechnologiesInventor: François Launay
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Publication number: 20100284152Abstract: In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage.Type: ApplicationFiled: July 19, 2010Publication date: November 11, 2010Inventor: David Bennitt HARRIS
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Patent number: 7830672Abstract: An electromagnetic shielding carrying case comprising a front and middle panel hingedly connected to a rear panel. The front panel and middle panel further comprise respective electromagnetic shielding members with a card holding means affixed to each. The carrying case has a closed state wherein the continuous upstanding walls of the front and rear panels are brought into engagement with one another so as to form an enclosure around the middle panel, thus shielding contactless smartcards within from being powered up by an RFID reader. A releasable locking means affixed to a front portion of the rear panel temporarily holds front panel closed, and can be unlocked so that the front panel pivots open, creating the first open state of the carrying case wherein contactless smartcards can be inserted and removed from both card holding means. The middle panel can also be pivoted open to reveal a pocket within the rear panel that holds paper currency and the like.Type: GrantFiled: June 27, 2008Date of Patent: November 9, 2010Inventor: Michael William Kitchen
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Patent number: 7830666Abstract: An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.Type: GrantFiled: July 31, 2007Date of Patent: November 9, 2010Assignee: Super Talent Electronics, Inc.Inventors: Siew S. Hiew, Jim C. Ni, Paul Hsueh, Charles C. Lee, Ming-Shiang Shen
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Patent number: 7823322Abstract: A semiconductor chip has an active face in which an integrated circuit region is implanted. The chip includes an inclined lateral contact pad extending beneath the plane of the active face and electrically linked to the integrated circuit region. An electronic module includes a substrate having a cavity in which the chip is arranged. The module can be applied to the production of thin contactless micro-modules for smart cards and contactless electronic badges and tags.Type: GrantFiled: November 9, 2007Date of Patent: November 2, 2010Assignee: STMicroelectronics SAInventors: Romain Palmade, Agnes Rogge
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Patent number: 7813137Abstract: A memory card (100) includes a main body portion (1) and a rotatable portion (2) connected by a pair of hinges (3) to rotate around an axis extending across a width of the memory card. A conductive member (12) includes a base (121) retained in the main body portion (1) to form a SD card interface and an extension (122) extending beyond the main body portion to form a USB plug interface. The rotatable portion has a slot (2117) and a slider (22) movably received in the slot. The slider (22) includes a locking projection (2215) holding a distal end (123) of the extension at a closed position and sliding away the distal end to expose the second interface at an opened position.Type: GrantFiled: April 18, 2007Date of Patent: October 12, 2010Assignee: Hon Hai Precision Ind. Co., LtdInventors: Hao Gu, Qi-Sheng Zheng, Zhi-Quan Mou, Jia-Yong He, Xiao-Hai Zhou
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Patent number: 7811101Abstract: A retractable memory drive in accordance with the present invention comprises a top casing, a middle carrier, an electronic device such as a USB thumb drive, and a bottom casing. There are guide rails that allow the middle carrier to remain in an appropriate position. There is also a metal spring clip coupled to the middle carrier for contacting a connector of a device coupled to the drive to provide for improved EMI and ESD protection.Type: GrantFiled: June 3, 2008Date of Patent: October 12, 2010Assignee: Kingston Technology CorporationInventors: Choon Tak Tang, George Shiu
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Publication number: 20100254096Abstract: Embodiments are described including a device comprising a carrier frame. The device includes a first connector on a first side of the carrier frame, and the first connector connects to a host system when the carrier frame is inserted into the host system. The device includes a second connector on a second side of the carrier frame, where the second side of the carrier frame is perpendicular to the first side. The second connector electrically couples to the first connector and connects to an input/output (I/O) adapter card inserted into a third side of the carrier frame, where the third side perpendicular to the first side. Consequently, the device has a flat structure that receives an adapter card and reorients the electrical connection of the adapter card. The device includes external visual status indicators and a switch for hot-swapping of the adapter card carrier in a running host system.Type: ApplicationFiled: April 1, 2009Publication date: October 7, 2010Inventors: Daehwan Kim, Kiron Malwankar
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Patent number: 7802997Abstract: An improved structure for a USB bluetooth wireless connector includes a circuit board, a body, and a housing. The circuit board includes a top surface and a bottom surface. The body includes an upper board and a lower bracket, and that the circuit board is interposed between the upper board and the lower bracket. The housing includes a top surface, a bottom surface, and two side surfaces. The body is provided with at least one anchoring hole; and the housing is provided with at least one engaging portion for engaging and securing together the body and the housing. A plurality of connecting terminals are integrally arranged on the circuit board so as to greatly reduce volume of the USB bluetooth wireless device and to lower the possibility of damage on the device or USB receptacle due to impact thereon.Type: GrantFiled: January 26, 2009Date of Patent: September 28, 2010Assignee: Vencer Co., Ltd.Inventor: Ting-Hung Kuo
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Patent number: 7804163Abstract: A secured digital (SD) card including a bottom plastic piece having a plurality of lateral sides, said bottom plastic piece further having a cavity interposed along said plurality of lateral sides, in accordance with an embodiment of the present invention. The SD card further having a top cover and a printed circuit board (PCB) assembly positioned in said cavity, said top cover for covering said PCB assembly inside said cavity, one of said plurality of lateral sides of said bottom plastic piece having a notch, said SD card further having a male guide insertably positioned inside said notch, said SD card further having a female switch clamped onto said male guide to form a write-protect switch.Type: GrantFiled: May 3, 2007Date of Patent: September 28, 2010Assignee: SuperTalent Electronics, Inc.Inventors: Siew Sin Hiew, Nan Nan, Abraham Chih-Kang Ma, Paul Hsueh
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Publication number: 20100232118Abstract: An ultrasonic weld is provided in a cover component, is formed protruding from the cover component, and is provided so that it can join the cover component and the body component together by being fixed to the body component with ultrasonic welding. A locking mechanism is provided so that it can join the cover component and the body component together via engaging portions that engage with each other. The locking mechanism includes a first engaging portion provided in the cover component, and a second engaging portion that is provided in another component fixed to the body component, and that can engage with the first engaging portion. Thus, it is possible to decrease the number of components, and also reduce equipment costs and production control costs.Type: ApplicationFiled: March 4, 2010Publication date: September 16, 2010Applicant: J.S.T. Mfg. Co., Ltd.Inventors: Akihiro Tochi, Masaki Tsujimoto
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Patent number: 7795714Abstract: A molded secured digital (SD) card having a bottom plastic piece having a plurality of lateral sides, said bottom plastic piece further having a cavity interposed along said plurality of lateral sides, in accordance with an embodiment of the present invention. The molded SD card further having a printed circuit board (PCB) assembly positioned in said cavity, one of said plurality of lateral sides of said bottom plastic piece having a notch recess, said molded SD card further having a male guide insertably positioned into said notch recess, said molded SD card further having a female switch clamped onto said male guide to form a write-protect switch.Type: GrantFiled: May 3, 2007Date of Patent: September 14, 2010Assignee: SuperTalent Electronics, Inc.Inventors: Siew Sin Hiew, Nan Nan, Abraham Chih-Kang Ma, Paul Hsueh
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Patent number: 7791893Abstract: Charging or recharging a capacitor powers a USB key. The capacitor is connected to the USB plug. Inserting the key in a powered device charges or recharges the capacitor. Alternatively, the capacitor is connected to the USB plug and a rotatable generator electrically is connected to the capacitor. A sliding gear having teeth engages with complimentary teeth of the generator. A spring disposed at each end of the sliding gear to restrain the sliding movement of the gear. Movement of the sliding gear kinetically charges or recharges the capacitor. The USB key can include the capacitor alone or the kinetic arrangement or the combination of the capacitor and the kinetic arrangement.Type: GrantFiled: March 6, 2007Date of Patent: September 7, 2010Assignee: International Business Machines CorporationInventors: David F. Champion, William R. Duffy, III
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Patent number: 7791892Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.Type: GrantFiled: January 31, 2007Date of Patent: September 7, 2010Assignee: International Business Machines CorporationInventors: Michael J. Domitrovits, Edward J. Donnelly, Raymond F. Frizzell, Jr.
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Patent number: 7782624Abstract: An electronic apparatus includes a semiconductor chip 15, a first substrate 10A having an antenna 12 formed on a first face 10a thereof and having the semiconductor chip 15 loaded on a second face 10b thereof, a second substrate 20A on which the first substrate 10A is provided so as to face the semiconductor chip 15, and which is connected to the outside, copper core solder balls 18 electrically connecting the first substrate 10A and the second substrate 20A, and a resin material 30 disposed between the first substrate 10A and the second substrate 20A. The second substrate 20A is provided with a thermal via 27 which radiates the heat in the semiconductor chip 15.Type: GrantFiled: December 15, 2008Date of Patent: August 24, 2010Assignee: Shinko Electric Industries Co., Ltd.Inventor: Tomoharu Fujii
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Patent number: 7778037Abstract: The present invention discloses a dual interface data storage apparatus, including: a memory module, a first interface and a second interface connected with the memory module, a housing, and a movable carriage for carrying the memory module, the first interface, and the second interface. The housing accommodates the memory module, the first interface and the second interface, and has a first opening at one end and a second opening at the other end for either allowing the first interface or the second interface to pass through the first opening or the second opening.Type: GrantFiled: September 27, 2007Date of Patent: August 17, 2010Assignee: Phison Electronics Corp.Inventor: Hong En Huang
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Publication number: 20100195290Abstract: A multi-memory media adapter having a plurality of ports, each having at least one set of contact pins adapted to connect to different types of flash cards. Signals are mapped to the contact pins depending upon the type of flash card. In one embodiment, a controller has signal lines connected to an interconnection means which connects wires, cables or traces to the sets of contact pins. Signals are mapped on the signal lines depending upon the type of flash card inserted.Type: ApplicationFiled: April 13, 2010Publication date: August 5, 2010Applicant: MCM PORTFOLIO LLCInventors: Sreenath Mambakkam, Arockiyaswamy Venkidu, Larry Lawson Jones
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Patent number: 7768789Abstract: A case-grounded flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips and a controller chip. The PCBA is encased inside an upper case and a lower case, with a Serial AT-Attachment (SATA) connector that fits through an opening between the cases. The cases can be assembled with the PCBA by a screw-together or thermal-bond adhesive method. Triple-axis case-grounding tabs draw any electro-static-discharges (ESD) current off the upper case along a primary axis and onto a PCBA ground through a secondary axis that is screwed into the PCBA. An intermediary axis between the primary and secondary axes fits around a PCBA notch while the secondary axis passes through a metalized alignment hole on the PCBA for grounding. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the triple-axis case-grounding tabs.Type: GrantFiled: March 29, 2007Date of Patent: August 3, 2010Assignee: Super Tatent Electronics, Inc.Inventors: Jim Chin-Nan Ni, Ken Qi-Jin Li, Abraham C. Ma, Ming-Shiang Shen
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Publication number: 20100177487Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.Type: ApplicationFiled: January 13, 2010Publication date: July 15, 2010Inventors: Nauman Arshad, Jing Kwok, Ivan Straznicky, Martin Terence Cassels
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Patent number: 7755897Abstract: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.Type: GrantFiled: December 27, 2007Date of Patent: July 13, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Fei Chen, Di-Qiong Zhao, Yi-Chyng Fang, Yue-Bin Wang
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Patent number: 7741971Abstract: The Invention, titled the “Split Chip” by the Inventor, contemplates an RFID enabled consumer oriented tracking system which protects consumer privacy by splitting a miniaturized silicon RFID transponder circuit into a retained piece and a detached piece. The two pieces are electrically connected by a fine piece of conductive material. Each piece is dependent upon the other in order to disgorge data. The electrical connection between the two pieces can be severed by the consumer by tearing the fine piece of conductive material at a designated spot on the substrate making the Split Chip moribund. Upon a return or refund of the consumer item the original data can be recovered through a laser guidance system which connects the retained piece and its alpha numeric identifier to a back end host computer administration network.Type: GrantFiled: April 22, 2007Date of Patent: June 22, 2010Inventor: James Neil Rodgers
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Publication number: 20100149758Abstract: The present invention relates to a package module for a memory IC chip, in which first solder pads provided on an upper surface of the memory IC chip is electrically connected to lower contact pads provided on the periphery of the ground pad, lower contact pads is soldered upward with lead frames and upper contact pads, and lastly a molding layer is used for packaging and enclosing the above elements, while only exposing the lower contact pads and the upper contact pads. Therefore, it will facilitate that each of upper contact pads of a lower layer is correspondingly soldered to one of lower contact pads of an upper layer as the upper layer and the lower layer are stacked together. Thus, it is capable of obtain high acceptable production yield, while accomplishing the object of expanding the memory capacity in total when stacking the layers of the package structure.Type: ApplicationFiled: April 15, 2009Publication date: June 17, 2010Applicant: Kun Yuan Technology Co., Ltd.Inventors: Cheng-Ho HSU, Kuei-Hua LIU
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Publication number: 20100142158Abstract: An electronic device is described. The electronic device includes a body member defining a receiving cavity, a chip card received in the receiving cavity and a cover member. The cover member is slidably mounted to the body member and capable of opening or closing the receiving cavity.Type: ApplicationFiled: February 26, 2009Publication date: June 10, 2010Applicant: FIH (Hong Kong) LimitedInventors: LEE-HAN NG, LUCAS HUANG
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Patent number: 7733657Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).Type: GrantFiled: July 26, 2005Date of Patent: June 8, 2010Assignee: NXP B.V.Inventors: Reinhard Fritz, Gerald Schaffler, Joachim Schober
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Publication number: 20100128447Abstract: A memory module includes a circuit board having socket mating contacts at a socket interface and VRM contacts at a VRM interface. Memory devices are coupled to the circuit board. The memory devices are electrically connected to corresponding socket mating contacts and the memory devices are electrically connected to corresponding VRM contacts. A voltage regulator module is coupled to the circuit board at the VRM interface. The voltage regulator module is electrically connected to the VRM contacts.Type: ApplicationFiled: November 21, 2008Publication date: May 27, 2010Applicant: TYCO ELECTRONICS CORPORATIONInventors: ALAN ROBERT MACDOUGALL, STEVEN J. MILLARD, JAMES A. LEIDY
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Patent number: 7719845Abstract: A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, multiple side edges, a chamfer extending between a pair of the side edges, a plurality of pads disposed on the lower circuit board surface, and a conductive pattern which is disposed on the upper circuit board surface and electrically connected to the pads. At least one electronic circuit device is attached to the upper circuit board surface and electrically connected to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board and the electronic circuit element such that sections of the upper circuit board surface, including one which extends along the entirety of the chamfer, is not covered by the body.Type: GrantFiled: April 20, 2006Date of Patent: May 18, 2010Assignee: Amkor Technology, Inc.Inventors: Sang Jae Jang, Chul Woo Park, Jae Dong Kim, Choon Heung Lee
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Patent number: 7719847Abstract: A multi-memory media adapter having a port, a surface, and a set of contact pins adapted to connect to different types of flash cards. Signals are mapped to the contact pins depending upon the type of flash card. In one embodiment, a controller has signal lines connected to an interconnection means which connects wires, cables or traces to the sets of contact pins. Signals are mapped on the signal lines depending upon the type of flash card inserted.Type: GrantFiled: August 11, 2008Date of Patent: May 18, 2010Assignee: MCM Portfolio LLCInventors: Sreenath Mambakkam, Venkidu Arockiyaswamy, Larry Lawson Jones
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Patent number: 7719846Abstract: A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.Type: GrantFiled: December 29, 2006Date of Patent: May 18, 2010Assignee: Incard SAInventors: Paolo Frallicciardi, Edoardo Visconti
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Patent number: 7715200Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.Type: GrantFiled: September 26, 2008Date of Patent: May 11, 2010Assignees: Samsung Electronics Co., Ltd., Samsung Electro-MechanicsInventors: Jung-Chan Cho, Yang-Je Lee, Hyun-Seok Choi, Yong-Hyun Kim, Jung-Hyeon Kim, Hyo-Jae Bang, Do-Hyung Kim, Kyoung-Sun Kim, Young-Ho Lee, Jae-Sang Baik, Yong-Jin Kim
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Patent number: 7710736Abstract: An enclosed re-programmable non-volatile memory card includes a cover that is hinged to the card to normally cover a set of external contacts to which the memory is connected but which can be rotated out of the way by hand to expose that set of contacts for connection with a mating receptacle of a host device. A second set of electrical contacts having a different pattern than the covered set may also be provided on the card. The covered set of contacts may be in accordance with the universal serial bus (USB) plug standards. A latching mechanism built into the hinged cover holds it firmly in a closed position but allows its manual release to expose the covered set of contacts. One exemplary release mechanism utilizes a resiliently held element that is moveable by hand against the resilience, and another employs a hand slideable latch.Type: GrantFiled: August 4, 2006Date of Patent: May 4, 2010Assignee: SanDisk CorporationInventors: Warren Middlekauff, Robert C. Miller
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Patent number: 7703692Abstract: Disclosed herein is a memory card that is a second memory card provided in connection with a first memory card. The first and second memory cards include: a body portion having the shape of a rectangular plate; and guide portions that project from both sides of the body portion in a width direction of the body portion and extend in a longitudinal direction of the body portion. Each guide portion has a thickness less than a thickness of the body portion. The first and second memory cards are equal in thickness and length of the body portion and distance between tips of the guide portions. The body portion of the second memory card has a width greater than a width of the body portion of the first memory card.Type: GrantFiled: November 15, 2007Date of Patent: April 27, 2010Assignee: Sony CorporationInventors: Yoshitaka Aoki, Keiichi Tsutsui
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Patent number: 7697300Abstract: An electronic unit, in particular a control device for a motor vehicle, has a printed circuit board, populated with electronic components, and a housing enclosing the printed circuit board. The printed circuit board has at least one first section, arranged at a distance from the housing and equipped with electronic components on both sides thereof, and at least one second section which is connected to the housing by way of a heat-conducting adhesive layer.Type: GrantFiled: July 28, 2004Date of Patent: April 13, 2010Assignee: Siemens AktiengesellschaftInventors: Jens Brandt, Nikolaus Kerner
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Patent number: 7686654Abstract: A memory card is disclosed resembling a CompactFlash card, but which is compatible with an ExpressCard slot.Type: GrantFiled: June 29, 2007Date of Patent: March 30, 2010Assignee: SanDisk CorporationInventors: Jonathan Hubert, Jason P. Hanlon, Jordan Macdonald, Wesley G. Brewer
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Patent number: 7679174Abstract: A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.Type: GrantFiled: March 27, 2007Date of Patent: March 16, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Okada, Kiyokazu Okada, Akinori Ono, Taku Nishiyama