Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed.

Abstract: A drive unit for power control of electric motors comprises a circuit board (10) with surface leads and a number of logic components as well as power controlling semi-conductors (11), and two or more power distribution bars (16) which extend along the circuit board (10) and are connected to a power source and/or one or more motor connections. Each of the power distribution bars (16) is a sheet metal stamping formed with a number of integral connector pins (20) which are to be received in a number of apertures (22) in the circuit board (10) and rigidly connected to the surface leads for communication with the semi-conductors (11). Each one of the power distribution bars (16) is stamped from a flexible thin sheet metal and is folded along a longitudinal line (31) into two parallel sections (32,33). The connector pins (20) extend from a first one (32) of the two sections (32,33).

Abstract: A flexible wiring board that can bridge wires and also can prevent production of conductive foreign materials in use, to secure good performance of a magnetic head. The flexible wiring board for connecting therethrough a suspension substrate having mounted thereon a magnetic head of a hard disk drive and a control circuit substrate for actuating the magnetic head includes a short-circuit forming portion for forming a shorting portion for bridging wires to prevent electrostatic destruction of the magnetic head; and a cut for removing the shorting portion. When the flexible wiring board is cut along the cut, the shorting portion can be removed without producing conductive foreign material resulting from the cutting off of the shorting portion.

Abstract: A telecommunications power distribution circuit board carries a fuse holder for a plurality of GMT fuses through which power is supplied to connectors on a terminal block. Power is supplied to the fuses through a distribution circuit on the board by way of bullet connectors that are attached to the circuit board and plug into holes in a power supply bus bar.

Abstract: A method for potting a populated assembly using an anti-vibration potting compound, a populated assembly and a controller having a populated assembly, include a circuit configuration potted by using an anti-vibration, thixotropic embedding compound. The circuit configuration includes a baseplate, an electrical circuit mounted thereon and having electrical components, and a flexible printed circuit board passing through to the circuit and making electrical contact with the circuit through lead wires. The components on one hand, and the contact points for the lead wires on the flexible printed circuit board on the other hand, are potted by using the embedding compound in separate process steps.

Abstract: Resilient electrical interconnects are provided which have a non-uniform cross section which achieves an increased range of deflection and a predetermined relationship between compression force and deflection of the interconnect, and between resistance and deflection of the interconnect. A smaller cross sectional area decreases the spring rate, or compression force, of the interconnect during compression. Increased range of deflection and reduced spring rate enables improved compensation for surface irregularities and facilitates mounting of integrated circuit or other devices having large arrays of interconnects. The non-uniform cross section is provided by a single or compound slope, or alternatively a nonlinear curve, from the end of smaller cross-section to the end of larger cross-section.

Abstract: There is provided a technique of connecting easily the lead terminal to the board of the module. A plurality of clip lead terminals each has at one end thereof clip portions which are connected electrically to connecting terminals by sandwiching an end portion of a board of a module and the connecting terminals formed thereon between clip members of said clip portions and has a lead portion at the other end thereof. The clip lead terminals are arranged so as to be spaced from one another in parallel with one another with the leading edges of the respective clip portions aligned on a straight line. The clip lead terminals are connected to one another through a tie bar and a guide as a connecting portion, respectively, whereby the connecting clip lead terminal 18 is formed as one-body. The lead portions are bent on every other one, leading end portions of the bent lead portions and leading end portions of the non-bent lead portions are in parallel with each other viewing from a side of the board.

Abstract: Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element.

Abstract: An EMI countermeasure component is provided relative to an active element, which does not deteriorate a circuit function of the active element, but has a sufficient shielding effect against permeation of electromagnetic waves radiated to the exterior, and further suppresses a malfunction or the like due to mutual interferences between peripheral components or an electromagnetic induction to a signal line. The EMI countermeasure component is made of a composite magnetic body including soft magnetic powder having oxide films on the surfaces thereof and an organic binding agent, and extinguishes undesired high frequency electromagnetic radiation as heat due to its complex permeability.

Abstract: A semiconductor component includes a semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501) having first and second surfaces opposite each other, a semiconductor device (301) in the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501), and a flexible substrate (120, 401, 510, 610, 710, 1000, 1050, 1300, 1401, 1510, 1520) packaging the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501).

Abstract: A method for making connections to a microelectronic device having bump leads thereon. A substrate is provided having a front surface and a plurality of electrically conductive posts extending upwardly from the front surface. The posts are disposed in groups, wherein the posts of each group define a gap therebetween. Contacts are provided extending generally horizontally outwardly from each post remote from the front surface of the substrate. The microelectronic device is assembled to the substrate and posts so that the bump leads penetrate into the gaps and engage the contacts which wipe against the bump leads as they are inserted.

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond. The component carries the contact structures on both sides, the spacing of the structures on the first side being different than that of the second side.

Abstract: An electronic assembly comprising an electronic substrate and a plurality of conductive interconnection elements. The substrate has a first side having a plurality of terminals. Each interconnection element has a base secured to a respective one of the terminals, a contact region distant from the electronic substrate, and an elongate freestanding section which can bend when pressure is applied to the contact region.

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract: A control unit for a motor vehicle has a base plate with press-fit openings. A conductor track carrier is mounted on the base plate. The conductor-track carrier has electrical contacting tabs in the area of the press-fit openings. An electrical contact pin that projects from a supporting body is inserted into a press-fit opening in the base plate and there contacts the contacting tab. By virtue of a reserve of material which is reduced (used) as the contact pin is pressed in, the contacting tab is anchored in the press-fit opening in an essentially tension-less manner.

Abstract: An electronic assembly. The electronic assembly includes a first substrate which has a first set of contact pads and a second substrate which has a second set of contact pads. A plurality of elongate, springable interconnection elements are located between the first substrate and the second substrate. Each of the plurality of elongate, springable interconnect elements is free standing and has a portion permanently attached to a respective contact pad of the first set of contact pads and has a second portion contacting a respective contact pad of the second set of contact pads. The first and the second substrates are brought into a fixed relationship relative to one another.

Abstract: A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.

Abstract: A lead element for a microelectronic connection has a rigid body section connected to two parallel strip-like flexible leg sections. The leg sections each have tip ends that are offset from the rigid body section in a horizontal direction. The tip end of one leg section is permanently connected to a first microelectronic element. The tip end of the other leg section is releasably connected to the first microelectronic element and permanently connected to a second microelectronic element. Moving the first tip end relative to the second tip end in a vertical direction causes flexure of the leg sections in opposite directions.

Abstract: A flexible integrated circuit mounting apparatus and method for mounting a chip on a printed circuit board directed to the reduction of stresses within the mounting or interconnection medium, caused principally by a mismatch of the coefficient of thermal expansion between the chip circuit and the printed circuit board, and thus reduction of the likelihood of interconnection failure between the chip and the particular surface or device to which an interconnection is made.

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract: The amount of melting of the bonding wire is closely regulated, and reduction of size and improvement of uniformity of the free air ball is obtained for ball bonding at pitches of less than ninety mils even when bonding wire of reduced diameter is employed. Quenching of the bonding wire adjacent to the free air ball also limits the temperature rise in the bonding wire and the extent of a heat affected zone having less tensile strength and stiffness to less than one micron and with reduced grain enlargement. The present invention provides such a bond for electronic packaging of increased reliability, potential functionality, increased manufacturing yield and reduced process complexity.

Abstract: A control unit for a motor vehicle has a base plate, a conductor track substrate, an electronic circuit making contact with the conductor track substrate, and a housing cover. A contacting panel with integrally constructed press-in openings adjoins the base plate. Projecting from a support body that overlaps the contacting panel are conductor ends which protrude into the press-in openings and make electric contact there with the conductor track substrate.

Abstract: A flexible printed circuit having wiring patterns printed on a flexible resin film, comprising a narrow flexible area having first wiring patterns and constituting a flexible wiring part and a broad connection area adapted to be adhered to a main board and having second wiring patterns connected to the first wiring patterns and adapted to be electrically connected to wiring patterns on the main board. The second wiring patterns serve to electrically connect the first wiring patterns of the flexible wiring part to the wiring patterns on the main board. Also included is a conductive adhesion surface formed on the broad connection area along a side of the main board, having a width larger than a width of the first wiring patterns, and extending from an inside of a region to an outside thereof. The region is defined in the broad connection area by extending a boundary of the flexible area into the broad connection area.

Abstract: An electronic device includes an integrated circuit chip, an interposer and a printed circuit board. A first ball connector is used to connect the interposer to printed circuit board. The interposer may be connected to the integrated circuit chip by a second ball connector or a wire bond. The first ball connector is disposed on a cantilever structure formed in the interposer. The cantilever is formed by creating a channel in the interposer. The cantilever absorbs stress caused by a difference between the thermal expansion of the integrated circuit chip as compared to the printed circuit board. The cantilever thus reduces stress in the ball connector by allowing the ball connector to move within a plane defined by the interposer.

Abstract: An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.

Abstract: High density bonding pads in a printed circuit board for mounting a semiconductor chip are provided using a simple structure and at a low cost, while minimizing the difference in levels of bonding pads. A printed circuit board for mounting semiconductor chip(s) includes conductive traces on both sides of a base material, the first traces on a first surface of the base material having first bonding pads, the second traces on a second opposite surface of the base material having the second bonding pads. The bonding pads are located in rows adjacent each other with the base material having openings leading to the second bonding pads, such that chip bonding wires are connectible from the chip directly to the first bonding pads and through the openings to the second bonding pads.

Abstract: According to known methods, several circuit board pieces in a three-dimensional arrangement of an electronic module are connected together electrically by the film connectors and arranged around an operator control or actuator element in the three-dimensional form. The assembly of such modules is, however, very costly because the circuit boards must all be fastened mechanically. By using film connectors with greater stiffness, circuit board pieces can be held over these directly without additional mechanical securing devices and the three-dimensional circuit board arrangement can be secured by appropriate securing devices in the three-dimensional form. A preferred application is for electronic modules with operator control and/or actuator elements where the space available is very limited, in particular for modules fitted in motor vehicles.

Abstract: A circuit board has traces attached to a flexible trace surface such that the traces can be displaced in a direction of thermal expansion of a component attached to the traces without causing the failure of the solder joint between the component and the trace. In one embodiment, the printed circuit board substrate is etched away in areas not covered by the traces such that flexible protuberances are formed from the substrate underneath the traces. In one method for constructing such a circuit board, a conductive layer is deposited on the printed circuit board substrate. The conductive layer is then etched to form conductive traces. The printed circuit board substrate is then selectively etched using the traces as a mask for etching the printed circuit board substrate. In a second printed circuit board embodiment, a flexible layer of a material is deposited onto the printed circuit board substrate. The traces are then formed on top of the flexible layer.

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance.

Abstract: A flexible interconnect for flexibly connecting an integrated circuit chip to a substrate. The flexible interconnect includes a flexible core, formed of a polymeric material, fully covered by a layer of an electrically conductive metal. A layer of a compliant material is provided beneath the input/output pad of the substrate and/or integrated circuit chip to reduce mechanical stresses on the flexible interconnect. The substrate and integrated circuit chip may include depressions to receive ends of the flexible interconnect. In one embodiment, the flexible interconnect may be tubular in shape and positioned on a protrusion formed on the substrate.

Abstract: A circuit board connection structure is formed by a first substrate having a first electrode pattern, a second substrate having a second electrode pattern, and a film circuit member electrically connecting the first and second electrode patterns. The film circuit member includes lead electrodes having an exposed portion partly connected to the first electrode pattern at a part of the exposed portion closer to an edge of the film circuit member. The film circuit member may further includes lead electrodes having an exposed portion partly connected to the second electrode pattern at a part of the exposed portion closer to an edge of the film circuit member. The circuit board connection structure may be incorporated in various electronic devices, including a liquid crystal display device.

Abstract: A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The respective package leads are each connected to the corresponding PC board areas by one or more flexible bond wires. In addition to electrically connecting the package leads to the respective PC board sections, the bond wires collectively secure the package to the heat sink in a manner allowing for relative lateral movement between the respective flange and heat sink surfaces in response to thermal stresses.

Abstract: A method of stacking electronic components is disclosed. A first electronic component having a first interconnection substrate with a first set of contact pads on at least one surface thereof is provided. At least a first semiconductor device with resilient contact structures mounted thereto is provided. The first semiconductor device is positioned relative to the first electronic component with the resilient contact structures extending therefrom and electrically contacting the first set of contact pads of the first interconnection substrate.

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract: Packaging (1) for cable assemblies (2), is constructed with cable assemblies (2) in a case (3), the cable assemblies (2) being routed along an interior of the case (3), a circuit board (4) positioned by the case (3) over the cable assemblies (2), and electrical connectors (5) on ends of selected cable assemblies (2) connect to the circuit board (4).

Abstract: A three-dimensional circuit structure that interconnects an integrated circuit chip, along with additional active devices and passive components to a substrate by way of a high density multichip interconnect decal disposed on the integrated circuit chip. The three-dimensional circuit structure thus comprises the substrate, an integrated circuit attached to the top of the substrate, and the high density multichip interconnect decal attached to the integrated circuit. One or more passive components and relatively small active devices are attached to the top of the high density multichip interconnect decal. A plurality of three-bond, daisy-chained wedge bonds are used to interconnect the active devices and passive components to the substrate by way of the HDMI decal. Each wedge bond comprises a wire that initiates at an HDMI decal bond pad, an intermediate stitch bond at an integrated circuit bond pad, and terminates at a substrate bond pad.

Abstract: A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.

Abstract: A stackable data carrier arrangement including a cardshaped carrier element, at least one integrated semiconductor circuit arranged on the carrier element, at least one external terminal arranged on the carrier element and connected to the semiconductor circuit for making electrical contact therewith, the external terminal being formed so as to circumscribe an edge area of the carrier element and having a respective terminal area on the edge area and adjoining opposite main areas of the carrier element, the terminal areas being electrically connected to one another, includes means defining two slots provided in the carrier element, the slots extending parallel to one another from the edge area into the carrier element to approximately the same extent as the external terminal arranged between the slots, so that a contact tooth bendable perpendicularly to the main areas of the carrier element is formed by the region of the carrier element situated between the slots.

Abstract: The invention relates to microcircuit packaging techniques, and more particularly to the packaging of a structure compiled of several microcircuits. In an arrangement according to the invention, unpackaged components (2) are mounted on a substrate (20), and to the substrate (20) there is attached a tape (4); on the side of the tape directed away from the substrate, there are formed solder bumps (10). By the solder bumps (10), the whole structure can be mounted to a circuit board by applying conventional surface-mounting techniques. The connections between the solder bumps (10) and the I/O lines of the substrate are realised by conductive patterns formed on the tape, and by leads (14) provided at the edges of the tape.

Abstract: An electronic circuit board with one or more semiconductor chips installed thereon, and a manufacturing method therefor, are disclosed. The circuit board with semiconductor chips installed thereon includes: one or more semiconductor chips; an insulated circuit board having wire bonding pads for connection to the bonding pads of the semiconductor chips; a plurality of wires connected between the bonding pads of the semiconductor chips and the wire bonding pads of the circuit board; and a plurality of protecting covers for insulating the wires and the semiconductor chips. The circuit board includes an opening smaller than the semiconductor chips, and wire bonding pads formed around the opening. The semiconductor chip includes bonding pads which are formed on the central portion of the surface of the semiconductor chip. The protective cover covers the chip and the wires.

Abstract: A connector for microelectronic includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract: A connector for microelectronic elements includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract: First and second electronic parts interconnected by a nonconductive nanoporous film having first and second parallel surfaces, said film having metal-filled pores extending through the thickness of the film, such that each of said parts is contacted by the metal in at least several pores, a number of the pores being perpendicular to the surfaces of the film, and other pores being oblique to the surfaces of the film, whereby thermal dissipation is enhanced in the plane of the film.

Abstract: Solder balls are attached to a flexible printed-circuit board which is shaped so as to be able to cover at least an upper surface, a side surface, and a lower surface of an IC chip, and the flexible printed-circuit board is placed on the IC chip. Then, the flexible printed-circuit board is folded over edges of the IC chip, and bonded to outer surfaces of the IC chip by an adhesive sheet. Thereafter, a sealing resin is poured into a gap between the upper surface of the IC chip and the flexible printed-circuit board, and cured, thereby completing a semiconductor package.

Abstract: In the case of the relay, connecting elements which are anchored in the base body are passed out of the base body (1) at the side and are bent at right angles to the base plane as push-in posts (12). The push-in posts (12) are formed by sections which are rolled in in the form of sleeves or channels are bent outwards from the contour of the relay structure with an axis at right angles to the base plane and form pushing-in shoulders (14) with their respective upper edge.

Abstract: A solderless electrical interconnection is made using electrically conductive hook fasteners (15) that are embedded in a substrate (12). The upper part (20) of the fastener is exposed on the top side of the substrate, the central part (22) is embedded within the substrate itself, and the lower or hook portion (17) of the fastener protrudes from the bottom side of the substrate. Electrically conductive pathways (30), defined on the top side of the substrate, make contact with the exposed upper part of the hook fastener. The electrically conductive runners on the top side have a continuous signal path through the substrate to the bottom side of the substrate via the electrically conductive hook fastener. The hook fastener (15) is engaged to electrically conductive loop fasteners (60) on a second substrate (70) in order to create a solderless electrical interconnection and mechanical interlocking between the two substrates.

Abstract: An electrical interconnection between a flip chip and a substrate. The interconnection includes a substrate having conductive pads to which wire bumps are attached. Each wire bump includes an elastically deformable stub section attached to the ball section, and a pointed tip. The pointed tip pierces a soft conductive layer located on a conductive pads of a flip chip. The elastic deformation of the stub section provides for consistent electrical connections between the flip chip and the substrate when the flip chip and the substrate are non-planar. An adhesive is located between the flip chip and the substrate and encompasses the wire bumps.

Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.

Abstract: A surface mountable flexible interconnect (10) for connecting two circuit board (30, 32) consists of a flex circuit (12) with solderable runners (14) on one side, the runners traversing the flex circuit from one end to the other. There is a solderable pad (16) at the end of each runner, and each solderable pad has a solder bump (18) fused to it. A rigid carrier ring (20) is used to hold the flex circuit in position prior to placement on the PCB. The flex circuit is formed into a U-shaped loop (26), and the loop is aligned to the carrier so that the loop is situated in an aperture (24) in the carrier. The solder pads lie directly under the carrier ring and face away from it. An adhesive (22) bonds the flex circuit to the carrier ring.

Abstract: Routing density of a wiring substrate (10) is increased by providing a nested plating bus (18) as a supplement to an external plating bus (16). A first group of conductive traces (14) is connected to the nested plating bus, while another group of traces is connected to the external plating bus. After the conductive elements are plated, the nested plating bus is removed by etching, milling, or stamping techniques. Use of a nested plating bus increases I/O count for a given substrate area and/or reduces the need to have routing on more than one layer of the substrate.