Flexible Connecting Lead Patents (Class 361/776)
  • Patent number: 5297008
    Abstract: Electrical leads are provided for improving access to high density electronic devices. The leads include a polymeric dielectric core comprising a metallic conductive layer having at least two separate conductive paths thereon. The conductive paths are ideally suited to connect a pair of terminals disposed on a circuit element to a pair of conductive surfaces on a printed circuit board, without requiring any additional surface area to meet the lead requirements.
    Type: Grant
    Filed: December 31, 1991
    Date of Patent: March 22, 1994
    Assignee: Compaq Computer Corporation (COMPAQ)
    Inventor: Howard S. Estes
  • Patent number: 5233503
    Abstract: A pressure-contact type semiconductor device with pressure-contact electrodes for external connection is disclosed. The pressure-contact electrodes are mounted through an insulating material on a metal substrate having semiconductor elements mounted thereon side-by-side. The pressure-contact electrodes are wire-bonded to the terminals of the semiconductor elements. Flexible insulating sheets are inserted between the metal substrate and the pressure-contact electrode and between the pressure-contact electrodes respectively. The insulating sheets are fixed onto the metal substrate and the pressure-contact electrodes through an adhesive.
    Type: Grant
    Filed: October 9, 1991
    Date of Patent: August 3, 1993
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Shoichi Furuhata