Having Backplane Connection Patents (Class 361/788)
  • Patent number: 11869544
    Abstract: An electronic device with parallel backplanes and a storage device with parallel backplanes. The electronic device includes a front inserting assembly, a rear inserting assembly, and a backplane assembly. The backplane assembly is connected to the front inserting assembly and the rear inserting assembly. The backplane assembly includes a plurality of backplanes arranged in parallel at intervals, the front inserting assembly includes a plurality of first units whose arrangement direction is the same as an arrangement direction of the backplanes, and the rear inserting assembly includes a plurality of second units whose arrangement direction intersects the arrangement direction of the backplanes. The backplane assembly is provided with the structure including the plurality of backplanes arranged in parallel at intervals and the channel between adjacent backplanes. In addition, the first units and the second units are connected to two opposite sides of the backplanes, respectively.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: January 9, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Na Wang, Can Chen, Yinzhong Tang
  • Patent number: 11836016
    Abstract: An interconnecting device for a signal plate and an interconnecting method therefor, relating to the technical field of server signal plate interconnection. The interconnecting device includes a back plate and a fine-adjustment device. The back plate includes a transverse plate and a vertical plate. Multiple sliding grooves are provided on the transverse plate and the vertical plate. A fine-adjustment device is provided on two sides of each of the sliding grooves. The interconnecting method for the signal plate comprises the following steps: (I) an IO plate is inserted into a vertical plate, (II) a CPU plate is inserted into a transverse plate; and (III) the IO plate and the CPU plate are finely adjusted and inserted.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 5, 2023
    Assignee: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Yanyan Zong, Wei Gong
  • Patent number: 11809248
    Abstract: A configurable connector is provided for a communication device, such as a gateway, that is located outdoors. The connector can engage with a corresponding interface of the gateway to provide communication signals and power signals to the communication device. The connector can be configured to select the power type provided to the communication device via the connector. The connector can have a first configuration to provide a first power type to the communication device or a second configuration to provide a second power type to the communication device. In the first configuration of the connector, power terminals of the connector can be connected directly to corresponding power wires providing the first power type. In the second configuration, the power terminals of the connector can be connected by jumpers to supplemental terminals in the connector that receive the second power type from the communication device.
    Type: Grant
    Filed: February 2, 2022
    Date of Patent: November 7, 2023
    Assignee: ADTRAN, INC.
    Inventors: Daniel M. Joffe, Jon Michael Chalmers, David Bernard Etzkorn
  • Patent number: 11765823
    Abstract: A system-in-package cellular assembly is disclosed. The assembly may include a main board including a multi-layer printed circuit board. The main board may include one or more through holes and be detachably connectable to an end-product via the one or more through holes and one or more connecting members. The main board may be reversibly, electrically couplable to the end-product via the one or more through holes and the one or more connecting members. The assembly may include an add-on board including one or more through holes and be detachably connectable to the main board via one or more connectors. The add-on board may be reversibly, electrically couplable to the main board via one or more main board surface mount connectors and one or more add-on board surface mount connectors. The add-on board may include at least one of one or more sensors or one or more sensor through holes.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: September 19, 2023
    Assignee: Signetik, LLC
    Inventors: Steven Poulsen, Christopher Lawson, Nalini Muppala
  • Patent number: 11726660
    Abstract: Techniques providing connectivity between a CPU and physical storage devices (PDs) can use a loop back path formed between two connectors of an extended PO slot when an extended I/O card is inserted therein. The two connectors can include a first connector having connectivity with the CPU over a first set of lanes, and a second connector having connectivity with the PDs over a second set of lanes. While the extended I/O card is inserted into the I/O slot, connectivity can be provided between the CPU and the PDs using connectivity provided between the CPU and the first connector and the first set of lanes; using the loop back path provided between the first and second connectors; and using connectivity provided between the second connector and the PDs over the second set of lanes.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: August 15, 2023
    Assignee: Dell Products L.P.
    Inventors: Aric Hadav, Thomas N. Dibb, Amitai Alkalay
  • Patent number: 11617281
    Abstract: A rack adapted for receiving a component, a system including the rack and the component and a method of delivering power to the component mounted in the rack are disclosed. The rack comprises a backplane, a power panel, and a main controller. Each stage of the backplane includes a backplane power connector and a backplane data connector that are respectively connectable to a component power connector and to a component data connector when the component is inserted in the backplane stage. The main controller detects an insertion of the component in a given backplane stage by receiving a signal emitted by the backplane data connector of that backplane stage, acquires a set of power parameters of the component, and causes the power panel to provide power to the backplane power connector of that backplane stage according to the set of power parameters of the component.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: March 28, 2023
    Assignee: OVH
    Inventor: Christophe Maurice Thibaut
  • Patent number: 11429164
    Abstract: A compact and mobile information handling system, such as a tablet, including a thermally-configured chassis having one or more fans and one or more inlets for directing air flow directly across components of the information handling system to cool such components by convection. Such fans may additionally direct air flow across a heat exchanger and/or heat pipe coupled to heat-producing components like a central processing unit and/or graphics processing unit. Components of the information handling system may be positioned on the thermally-configured chassis and used to efficiently direct the air flow throughout the chassis without requiring additional space. The inlets and outlets may be positioned on one or more sides of the information handling system.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: August 30, 2022
    Assignee: Dell Products L.P.
    Inventors: Allen B. McKittrick, Qinghong He
  • Patent number: 11404810
    Abstract: The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.
    Type: Grant
    Filed: April 25, 2021
    Date of Patent: August 2, 2022
    Assignee: Celestica Technology Consultancy (Shanghai) Co. Ltd
    Inventors: Yaxu Chen, Yuan Xue
  • Patent number: 11061837
    Abstract: In an aspect of the disclosure, an apparatus, a computer-readable medium, and a method are provided. The apparatus may be a service processor. The service processor receives, a first command or data of a UBM protocol from a UBM host running on a host of the service processor. The UBM protocol is a first protocol supported by the service processor. The first command or data instructs a backplane controller of the host to perform a first task. The service processor generates a second command or data of a second protocol supported by the service processor. The second command or data instructs the backplane controller to perform the first task. The service processor sends the second command or data to the backplane controller.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: July 13, 2021
    Assignee: AMERICAN MEGATRENDS INTERNATIONAL, LLC
    Inventors: Timothy Bouda, Umasankar Mondal, Shibu Abraham
  • Patent number: 11057316
    Abstract: Disclosed embodiments include a network switch having a first group of switch elements and a second group of switch elements. The second group of switch elements is cross-connected to the first group of switch elements to passively route network traffic through the network switch in accordance with a predefined configuration.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 6, 2021
    Assignee: Facebook, Inc.
    Inventors: Che Kin Leung, Xu Wang, Zhiping Yao, Hans-Juergen Schmidtke, Lingjun Wu
  • Patent number: 11012120
    Abstract: A system comprising a rack and at least one line replaceable module, the rack further comprising a primary transmission circuit comprising a primary antenna, primary emission components designed to generate an emitted power containing uplink data, and primary receiving components designed to receive downlink data, the line replaceable module comprising a secondary transmission circuit comprising a secondary antenna, secondary receiving components designed to receive the emitted power and the uplink data, and secondary emission components designed to generate the downlink data, the emitted power, the uplink data and the downlink data being transmitted via a shared coupling between the primary antenna and the secondary antenna.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: May 18, 2021
    Assignees: Safran Electronics & Defense, Safran Electrical & Power
    Inventors: François Guillot, Jean-Marc Blineau, Philippe Avignon, Serge Roques, Franck Albero
  • Patent number: 10905008
    Abstract: A wiring board includes: a wiring-board body including a first surface and a second surface opposite to the first surface, and including at least one insulator layer; pads formed at at least one of an internal layer boundary plane and the first surface and the second surface defining a first plane; and via conductors connected to corresponding ones of the pads, and arranged in parallel to extend in a thickness direction of the wiring-board body. Each of first and second ones of the pads adjacent to each other in planar view at the first plane is connected to corresponding ones of the via conductors. The via conductors corresponding to the first pad are arranged differently from the via conductors corresponding to the second pad, in planar view.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: January 26, 2021
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takahiro Hayashi, Takuya Hando
  • Patent number: 10770814
    Abstract: A direct mate orthogonal electrical connector assembly includes first and second electrical connectors configured to be mated to respective first and second substrates such that the second substrate is perpendicular to the first substrate.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: September 8, 2020
    Assignee: FCI USA LLC
    Inventors: Wilfred J. Swain, Steven E. Minich, Mark R. Gray
  • Patent number: 10551884
    Abstract: The present invention provides an ATX specification power supply comprising redundant power supply architecture. A casing where the ATX specification power supply is located includes an ATX specification housing and a frame provided in the ATX specification housing. The frame is defined with a plurality of power module assembly regions and a modulation module assembly region in the ATX specification housing. The power module assembly regions are for a plurality of power modules to be provided therein, and the modulation module assembly region is for a power modulation module to be provided therein. The plurality of power modules and the power modulation module are further connected to a power integration backplate provided in the ATX specification housing, enabling the ATX specification power supply to construct redundant power supply architecture.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: February 4, 2020
    Assignee: SEA SONIC ELECTRONICS CO., LTD.
    Inventors: Sheng-Chien Chou, Kuan-Pao Lee
  • Patent number: 10546617
    Abstract: Provided herein are systems and apparatus for reducing vibration interaction between hard drives. In one implementation, an apparatus is provided comprising a backplane that comprises a substrate comprising an at least partially flexible material and a connector island assembly formed in the substrate. The connector island assembly comprises a spring element and a connector island. The spring element extends from a main portion of the substrate, and the connector island extends from the spring element. The connector island assembly is surrounded by the main portion of the substrate and configured to flex independently of the main portion of the substrate.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: January 28, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventors: Jeffrey D. Wilke, David W. Niss, Toshiki Hirano, Lidu Huang
  • Patent number: 10405068
    Abstract: A network device may include multiple line cards and a switch fabric assembly electrically connected to the line cards. The switch fabric assembly includes: for each of the line cards, a line card connector providing electrical connectivity between the line card and one or more cables; a cable mesh assembly including the cables, the cables providing electrical connectivity between each line card connector and multiple switch connector groups; and multiple switch application specific integrated circuits (ASICs), each of the switch ASICs being electrically connected to one of the switch connector groups.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: September 3, 2019
    Assignee: Juniper Networks, Inc.
    Inventors: Boris Reynov, Shreeram Siddhaye, Jack W. Kohn, Venkata S. Raju Penmetsa
  • Patent number: 10324878
    Abstract: In one or more embodiments, one or more systems, methods, and/or processes may detect commencement signals from respective backplanes. For each backplane of the backplanes, the one or more systems, methods, and/or processes may further configure a multiplexer to select a coupling associated with the backplane; may further provide, via a serial interface and the multiplexer, first information to the backplane; may further receive, via the serial interface, second information from the backplane; may further store the second information from the backplane; may further provide at least a portion of the second information to at least one of information handling system firmware, an operating system, and a boot management controller; and may further boot the operating system with the at least the portion of the second information associated with at least one of the backplanes.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: June 18, 2019
    Assignee: Dell Products L.P.
    Inventors: Timothy M. Lambert, Jeffrey Leighton Kennedy
  • Patent number: 10206297
    Abstract: Systems, methods, apparatuses, and software for data systems are provided herein. In one example, a meshed computing architecture is presented that includes a midplane comprising PCIe interconnect, storage modules configured to couple to a first portion of the PCIe interconnect, controller modules configured to couple to a second portion of the PCIe interconnect, and fabric modules configured to couple to a third portion of the PCIe interconnect. The first portion of the PCIe interconnect communicatively couples each of the storage modules to each of the controller modules and each of the fabric modules, the second portion of the PCIe interconnect communicatively couples each of the controller modules to each of the fabric modules, and third portion of the PCIe interconnect communicatively couples the controller modules to each other.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: February 12, 2019
    Assignee: Liqid Inc.
    Inventors: Jason Breakstone, Andrew R. Heyd, Seth Walsh, Christopher R. Long, Michael D. Harrington
  • Patent number: 10194008
    Abstract: Disclosed embodiments include systems and methods that may promptly confirm performance information about a network element (NE) when the NE is operating as an active system. For example, disclosed embodiments may include one of communication devices that is connected, together with other communication devices, to a network monitoring device. The communication device may use a redundancy configuration with the other of the communication devices and may output, upon the occurrence of a prescribed event, prescribed information to the network monitoring device about what the communication device measured when performing a prescribed operation as an active system. The network monitoring device may monitor a redundancy system for switching the plurality of communication devices between an active system and a standby system. The network monitoring device may also display prescribed information about one of the communication devices when the communication device operates as an active system.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: January 29, 2019
    Assignee: NEC Corporation
    Inventor: Hajime Iwata
  • Patent number: 10143100
    Abstract: A modular networking device connection system includes a modular networking system chassis that defines a modular networking device slot. An internal wall is located in immediately adjacent the modular networking device slot, and includes a internal wall connector that connects to a modular networking device positioned in the modular networking device slot. A networking processing device is located opposite the internal wall, and includes a networking processor that is mounted to a networking processing device board and coupled via at least one trace to a networking processing device connector that is mounted to the networking processing device board. The networking processing device connector is directly connected to the internal wall connector by a first cable that transmits signals received through the internal wall connector directly to the networking processing device connector for provision to the networking processor via the networking processing device board.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: November 27, 2018
    Assignee: Dell Products L.P.
    Inventors: Vittal Balasubramanian, Per Henrik Fremrot, Joanne C. Zhang
  • Patent number: 10070526
    Abstract: Techniques and mechanisms to provide a connector for securing to a first printed circuit board (PCB). In an embodiment, the connector is configured to receive a second PCB, where a first hardware interface of the connector includes conductors to facilitate bilateral decoupling from (and coupling to) respective hardware interfaces of the first PCB and the second PCB. A first conductor of the first hardware interface includes a first portion configured to move, relative to a housing structure of the connector, in response to the connector receiving a portion of a device which comprises the second PCB. A second portion of the first conductor is configured to be brought into contact with a conductive pad of the device. In another embodiment, the connector includes housing structures configured to move relative to one another while the connector is secured to the first PCB.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: September 4, 2018
    Assignee: INTEL CORPORATION
    Inventors: Charles C. Phares, Kevin J. Ceurter
  • Patent number: 9977762
    Abstract: A hierarchical array computer architecture comprised of a master computer connected to a plurality of node computers wherein each node has a memory segment. A high speed connection scheme between the master computer and the nodes allows the master computer or individual nodes conditional access to the node memory segments. The resulting architecture creates an array computer with a large distributed memory in which each memory segment of the distributed memory has an associated computing element; the entire array being housed in a blade server type enclosure. The array computer created with this architecture provides a linear increase of processing speed corresponding to the number of nodes.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: May 22, 2018
    Assignee: INTERNATIONAL MICROSYSTEMS, INC.
    Inventor: Peter A. Schade
  • Patent number: 9967913
    Abstract: In view of the above, a wireless network access device is provided. In an example implementation, the wireless network access device includes a radio interface having a plurality of individually addressable radio paths for providing a connection to corresponding radio modules. Each radio module includes a radio configured to communicate with client devices in a corresponding coverage area. Each radio module is configured to operate independently of the other radio modules. A network interface is included to provide data network access. The wireless network access device includes a processor to manage communication between the client devices that communicate with the radio modules and a data network via the radio interface and the network interface when the wireless local area network device includes at least one connected radio module.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: May 8, 2018
    Assignee: Xirrus, Inc.
    Inventor: Michael J. Delagarrigue
  • Patent number: 9966678
    Abstract: A Next Generation Form Factor (NGFF) connector apparatus can include a plurality of upper signal pins and an upper ground (GND) pin that is longer than other upper pins. The NGFF connector apparatus can also include a plurality of lower signal pins and a lower power (PWR) pin that is longer than other lower pins.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: May 8, 2018
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Chin-Lung Chiang, Jyun-Jie Wang, Meng-Chen Wu, Raghavan V Venugopal, Patrick Raymond, Andrew Potter
  • Patent number: 9880916
    Abstract: A method for managing a system may include gathering, with a system manager, data about a first system event and a second system event. The method further includes determining, with the system manager, a plurality of first system event attribute values and a plurality of second system event attribute values. The first and second system event attribute values are based on the data gathered about the first and second system event. The method further includes generating, with the system manager, a display of the plurality of first system event attribute values in hierarchal relation to the plurality of second system event attribute values.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: January 30, 2018
    Assignee: International Business Machines Corporation
    Inventors: Thomas S. Brugler, Vincent C. Conzola, Randall A. Craig, John P. Franks, Mark E. Molander
  • Patent number: 9858227
    Abstract: An apparatus, including a case having a front panel, and multiple transceiver modules mounted on the front panel. The apparatus also includes at least one midplane adapter card having a first connector configured to transport networking signals, and a second connector configured to transport bus signals. The apparatus additionally includes a switch input/output board mounted within the case, coupled to the multiple transceiver modules, and having multiple first slots configured to accept the first connectors, and networking switch circuitry coupled to the first slots and configured to establish a network connection between two or more of the transceiver modules. The apparatus further includes a motherboard mounted within the case, and having a bus with multiple second slots configured to accept the second connectors, and a processor configured to manage the networking switch circuitry and to receive and process data commands in response to communications received from the transceiver modules.
    Type: Grant
    Filed: February 8, 2015
    Date of Patent: January 2, 2018
    Assignee: SILICOM LTD.
    Inventor: David Castiel
  • Patent number: 9836430
    Abstract: A backboard applied in an electronic device includes a storage extended chip, a serial attached small computer system interface (SAS) hard disk drive (HDD) connector, a convertor, a first election unit, and a second election unit. An input pin of the convertor is coupled to a plurality of input pins of the SAS HDD, to receive the data signal from the SAS HDD connector. The first election unit is coupled to a first ground pin of the SAS HDD connector, enable pins of the convertor and the storage extended chip. The second election unit is coupled to the first ground pin of the SAS HDD connector and an enable pin of the storage extended chip. When the SAS HDD connector is coupled to a SATA HDD or a SAS HDD, the storage extended chip operates and receives a SAS signal from the SAS HDD connector.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: December 5, 2017
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yang Gao, Kang Wu
  • Patent number: 9829935
    Abstract: In computing scenarios involving multiple computational units, an enclosure (e.g., a rack or server cabinet) may store the units and provide resources such as shared power and network connectivity. Additionally, the components of the units may communicate through a Serial Attached SCSI (SAS) bus, but many such enclosures provide little or no integration with the SAS buses, thus entailing extensive SCSI cabling. Presented herein are architectures for enclosures presenting a set of slots for trays storing respective computing blades, where such trays include SAS connectors that connect directly (i.e., without cabling) with connectors on a midplane that interconnects the blades into a SAS bus featuring at least one integrated SAS expander. Additional architectural variations involve providing SAS expander on one or both of the midplane and the blades; grouping blades into subsets having distinct SAS buses; and interconnecting the SAS buses and expanders of multiple midplanes in the enclosure.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: November 28, 2017
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Mark Shaw, Wilson V. Vu
  • Patent number: 9820403
    Abstract: A split backplane for a telecommunication, networking, or computing device includes a power backplane comprising power connectors; a signal backplane comprising signal connectors, wherein the signal backplane is separate from the power backplane, and wherein one or more modules are adapted to selectively connect to the power connectors and the signal connectors simultaneously; and an alignment bar connected between the power backplane and the signal backplane for alignment and stiffening of the power backplane and the signal backplane together for signal integrity and to prevent connector pins from bending or failing between the one or more modules, the power connectors, and the signal connectors.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: November 14, 2017
    Assignee: Ciena Corporation
    Inventors: Simon J. E. Shearman, Anthony J. Mayenburg
  • Patent number: 9760521
    Abstract: The invention relates to a detachable switch fabric card. In one embodiment this is accomplished by a fabric element including at least one chip to perform the switching between a plurality of fabric access card and two or more backplane connectors to match the backplane connectors.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: September 12, 2017
    Assignee: TEJAS NETWORKS LIMITED
    Inventors: Uri Avimor, Yoav Gvili
  • Patent number: 9726833
    Abstract: An optical interconnection assembly for the mutual connection of a plurality of signal switching circuit boards that may be coupled to a common planar support, backplane, includes a planar support frame, adapted to receive an ordered arrangement of connectors, which includes a series of first connectors arranged to face corresponding signal transmission ports of said boards, and a series of second connectors arranged to face corresponding signal reception ports of the boards. The support frame is adapted to guide the deployment of an interconnection circuit between corresponding pairs of first and second connectors.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: August 8, 2017
    Assignee: CONSIGLIO NAZIONALE DELLE RICERCHE
    Inventors: Vito Basile, Irene Fassi, Gianluca Guadagno
  • Patent number: 9591784
    Abstract: A chassis for mounting sub-rack modular units is disclosed that includes a frame defining a forward opening through which modular units are inserted to attach to the frame, a first backplane attached to the frame and that operates to provide a first functionality to one or more attached modular units that are coupled to connectors of the first backplane, and a second backplane attached to the frame and that operates to provide a second functionality to one or more attached modular units that are coupled to connectors of the second backplane, wherein the second functionality is different than the first functionality.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: March 7, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Matthew A. Butterbaugh, Eric A. Eckberg, Camillo Sassano, Kevin L. Schultz, George W. Van Leeuwen
  • Patent number: 9547575
    Abstract: Systems and methods are disclosed which facilitate the management of host computing devices through the utilization of a host computing device control component. The host computing device control component includes a state monitoring component that monitors operating states of the control component. Based on monitoring the operating of the control component, the state monitoring component causes the generation of one or more visual indicator indicative of the operating state of the control component.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: January 17, 2017
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Matthew T. Corddry, Wyatt D. Camp, Jacob Gabrielson
  • Patent number: 9510476
    Abstract: A server includes a housing having a server-module storage space, a power source disposed in the rear side inside the housing, and a pair of server modules having horizontally symmetrical and vertically reversible shapes. When a pair of server modules is properly inserted into the housing of a server, they can receive electric power from the power source via connectors. Even when a pair of server modules is vertically reversed and inserted into the housing of a server, it is possible to secure electrical connection between the power source and the vertically reversed server modules. An erroneous insertion preventing measure is applied to the server-module storage space and a back panel fixed to a riser card, attached to each server module, so as to prevent erroneous insertion of server modules into the housing of a server. This may establish compatibility and standardization between server modules for use in servers.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: November 29, 2016
    Assignee: NEC CORPORATION
    Inventor: Takayuki Shirokaze
  • Patent number: 9374915
    Abstract: The invention relates to a backplane configuration for use in an electronic crate system, said backplane configuration comprising a first-type backplane and a second-type backplane; wherein the first-type backplane is coupled to the second-type backplane by mechanical connection means; wherein the first-type backplane and the second-type backplane are spatially separated from each other by a distance which is sufficient such that electromagnetic interferences between the first-type backplane and the second-type backplane are eliminated or at least minimized; and wherein the first-type backplane is adapted to be electrically coupled with at least one first-type module, and the second-type backplane is adapted to be electrically coupled with at least one second-type module.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: June 21, 2016
    Assignees: Warsaw University of Technology Institute of Electronic Systems, Deutsches Elektronen-Synchrotron DESY
    Inventors: Krzysztof Czuba, Tomasz Jezynski, Frank Ludwig, Holger Schlarb
  • Patent number: 9160088
    Abstract: Backplane communication system including a backplane and a rack assembly having an array of electrical connectors with respective mating ends. The backplane communication system also includes a plurality of guide pins that each have a cross-sectional diameter taken transverse to an axis of the guide pin. The backplane interfaces with the rack assembly such that the guide pins extend through guide holes of the backplane and the electrical connectors are aligned with mating windows. Each of the guide pins has a leading segment that extends through the corresponding guide hole and a trailing segment that is disposed within the corresponding guide hole. The cross-sectional diameter along the trailing segment is greater than the cross-sectional diameter along the leading segment.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: October 13, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Jared Evan Rossman, Christopher Ritter, Robert Paul Nichols
  • Patent number: 9099820
    Abstract: An electronics module that includes a printed circuit board (PCB), a connector, a housing with a shroud, and an interposer. The PCB defines a plane of the PCB. The connector is coupled to the PCB to form a circuit board assembly (CBA). The connector includes a plurality of header pins oriented perpendicular to the plane. The housing is configured to receive the CBA. The housing is configured to define an opening in a wall of the housing proximate to the connector when the CBA is installed. The wall is characterized as perpendicular to the plane. The interposer is configured to couple to the housing. The interposer includes a plurality of mating pins oriented parallel to the plane. Each of the mating pins defines a forked end configured to make electrical contact with each of the header pins when the interposer is inserted into the opening.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: August 4, 2015
    Assignee: Delphi Technologies, Inc.
    Inventor: Robert C. Beer
  • Patent number: 9086857
    Abstract: A fastening device for an expansion card includes a first rack, a second rack opposite to the first rack, and a fastener. The first rack defines a first opening. A supporting plate extends from the first rack toward the second rack. A position tab extends up from the supporting plate. The fastener engages with the first rack and comprises a resilient arm. The supporting plate supports a bottom surface of a first end of the expansion card. The position tab is received in a mounting hole defined in the first end of the expansion card. The resilient arm is deformed and extends through the first opening, and is blocked by the first rack and abuts a top surface of the first end of the expansion card. A second end of the expansion card is fastened to the second rack.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: July 21, 2015
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) Co., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Li-Ren Fu
  • Patent number: 9077168
    Abstract: A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: July 7, 2015
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Gwun-Jin Lin, Kuo-Fu Su
  • Patent number: 9072192
    Abstract: A composite flexible circuit planar cable includes a flat cable, a first section, and a second section. The flat cable includes a plurality of straight line like parallel and non-jumping conductor lines. At least one jumping line is formed on the first section to interchangeably connect a selected conductive line of the first section to an another selected conductive line. The second section may also form at least one jumping line to interchangeably connect a selected conductive line of the second section to an another selected conductive line. Through such a jumping line, electrical connection can be formed between signal terminals and corresponding and interchanged signal terminals. The plurality of conductor lines of the flat cable includes at least a pair of differential signal conductor lines, a grounding line, and a power line.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: June 30, 2015
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Gwun-Jin Lin, Kuo-Fu Su
  • Patent number: 9059551
    Abstract: A backplane apparatus, including a first backplane structure and a second backplane structure, where the first backplane structure is configured to transmit power and low-speed signals, and the second backplane structure is configured to transmit high-speed signals, low-speed signals, or optical signals. The first backplane structure includes a first backplane, multiple first connectors, and a connected space, where the first connectors are arranged on the first backplane and boards are electrically connected to the first backplane. The second backplane structure includes multiple second backplanes and multiple second connectors, where the second connectors are arranged on the second backplanes, the second backplanes are installed on the first backplane, and the second connectors are electrically connected to boards by crossing the connected space or via the first connectors. The present invention also discloses a communication device.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: June 16, 2015
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Fangming Liu, Guodong Zhang, Sang Liu
  • Patent number: 9058719
    Abstract: Gaming terminals, gaming systems, and electrical and mechanical connector assemblies for coupling a gaming terminal to a chair positioned in front of the gaming terminal are presented herein. A gaming system is disclosed. The gaming system includes a gaming terminal for playing a wagering game and a chair positioned in front of the gaming terminal. The chair includes electronic components operated by a digital data signal and powered by a power supply signal. The gaming terminal includes an electrical connector assembly for coupling to a complementary electrical connector assembly on the chair. The electrical connector assembly also includes a switching device for automatically electrically coupling the electronic components with a power supply signal from a power supply once the respective electrical connector assemblies are securely coupled.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: June 16, 2015
    Assignee: WMS GAMING INC.
    Inventors: Eric T. Miner, Scot Salzman, Toriono A. Granger
  • Patent number: 8995148
    Abstract: In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: March 31, 2015
    Assignee: Dell Products L.P.
    Inventors: Lawrence A. Kyle, Robert Johnson, Shawn Hoss
  • Patent number: 8964219
    Abstract: An image forming apparatus includes an installation section, a control board, a first connection terminal provided on an outer surface of the control board, a first electrical connection member provided on the installation section and electrically connected to a point of reference potential, a substrate installable in the installation section in a thickness direction of the control board, an external connection terminal provided on the substrate and externally exposed, a second connection terminal provided on a first surface of the substrate and connected to the first connection terminal when the substrate is installed into the installation section, and a second electrical connection member provided on a second surface of the substrate. The second electrical connection member makes contact with the first electrical connection member and is electrically connected to the point of reference potential via the first electrical connection member when the substrate is installed into the installation section.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: February 24, 2015
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Tetsuo Ishizuka
  • Patent number: 8963365
    Abstract: A multi-energy storage device system is provided that includes a first energy storage device (ESD) coupled to a direct current (DC) link. A bi-directional buck/boost converter includes an output channel coupled to the DC link and an input channel. A second ESD coupled to the input channel has a usable energy storage range defining an entire amount of usable energy storable therein. A database includes stored information related to a known acceleration event. A system controller is configured to acquire the stored information related to the known acceleration event and, during the known acceleration event, cause the buck/boost converter to boost the voltage of the second ESD and to supply the boosted voltage to the DC link such that after the known acceleration event, the state of charge of the second ESD is less than or substantially equal to a minimum usable energy storage state of charge.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: February 24, 2015
    Assignee: General Electric Company
    Inventors: Robert Dean King, Irene Michelle Berry
  • Patent number: 8953337
    Abstract: The present invention relates to an electronic device including plural circuit board units that can be removed from the electronic device. The electronic device is designed to increase a data transfer rate between the circuit board units by using a circuit board for interconnect for electrically coupling the circuit board units placed in the electronic device, and using a cable for electrically or optically coupling the circuit board units placed in the electric device, or both of the cables.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: February 10, 2015
    Assignee: Alaxala Networks Corporation
    Inventors: Masaaki Inoue, Takashi Matsumoto, Kazuhiro Matsuo, Junji Baba, Manabu Sawa, Kazuo Sugai
  • Patent number: 8953312
    Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ?° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: February 10, 2015
    Assignee: Fujitsu Limited
    Inventors: Akira Shimasaki, Hideo Kubo
  • Patent number: 8944832
    Abstract: A method includes securing a midplane in a chassis, wherein the midplane has one or more connectors, and securing a circuit board in a module, wherein the circuit board has one or more connectors secured along a leading edge of the circuit board for selectively connecting with the one or more connector on the midplane. The method further includes positioning the module so that the circuit board within the module is orthogonal to the midplane, and manually actuating a handle from an unlatched position to a latched position to rotate a cam plate and cause a cam surface of the cam plate to pull the circuit board toward the midplane and connect the one or more connector on the circuit board with the one or more connector on the midplane.
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: February 3, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Brian M. Kerrigan, Robert M. Lindsay
  • Patent number: 8936477
    Abstract: An apparatus includes a chassis securing a midplane and forming a bay orthogonally aligned with the midplane. A module secures a circuit board with connectors for connection with connectors on the midplane. A handle includes a proximal link pivotally coupled to the module, a distal link pivotally coupled to the proximal link, and a spring for transmitting torque from the distal link to the proximal link. A cam plate is secured for rotation with the proximal link, wherein the cam plate includes a cam surface for engaging a latch arm that extends into the bay. Still further, an over-center spring is used to retain the cam plate in a latched position. Manual actuation of the handle from the unlatched position to the latched position causes the cam surface to pull the circuit board toward the midplane and connect the circuit board connectors with the midplane connectors.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: January 20, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Brian M. Kerrigan, Robert M. Lindsay
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel