Abstract: A mounting apparatus includes a securing mechanism, a drive bracket (20), and a fastener (50). The securing mechanism has a securing hole (15) defined in a circuit board (10). The drive bracket includes first and second side plates (23, 24). The first side plate defines a mounting hole (237) therein, corresponding to the securing hole of the circuit board. The second side plate forms two lines of tabs (243) for sandwiching the circuit board therebetween. The fastener engages into the securing hole of the securing mechanism and the mounting hole of the drive bracket, for preventing the circuit board releasing from the tabs.

Abstract: A symmetric multiprocessor computer is provided with a star interconnection architecture and a cooling system. The star interconnection architecture include a middle plane, and plural first processor boards and second processor boards configured vertically onto opposite surfaces of the middle plane. The first processor boards and the second processor boards are crisscross to each other at the opposite surfaces of the middle plane. The cooling system includes a first cooling module and a second cooling system module configured for generating a plurality of first airflows and second airflows for the first processor boards and the second processor boards respectively, wherein the paths of the first airflows and the second airflows are crisscross to each other at the opposite surfaces of the middle plane.

Abstract: A re-usable adapter card interfaces with a first card such that components requiring a lower certification level—e.g., commercial off-the-shelf (COTS) components or the like—may be isolated on the first card, wherein the adapter card includes high certification-level parts and communicates with the first card. The two cards are electronically and mechanically coupled to form the finished board assembly. The interface card may be re-used in a variety of current or future cabinet specifications, including, for example, cabinets manufactured in accordance with the Compact PCI (cPCI) 3U and 6U specifications.

Abstract: An electronic shelf assembly includes a frame having a plurality of card slots arranged in parallel to each other along an axis of the frame and a midplane having a plurality of connectors are arranged to align with the card slots. Conductive traces are connected to predetermined pins of the midplane connectors and provide point-to-point signaling pathways between midplane connectors aligned with different card slots. An application node card may reside in one of the plurality of card slots. The application node card may have an application processor, a disk controller, and an application card connector. The application card connector is adapted to interface with at least some of the pins of one of the plurality of midplane connectors. A disk storage card may reside in one of the plurality of card slots. The disk storage card may have at least one storage media unit and a disk interface connector.

Abstract: Embodiments of the present technique are directed to a blade system. The blade system may include a first blade module comprising a first conjoining channel, and a second blade module comprising a second conjoining channel aligned with the first conjoining channel, wherein the first blade module and the second blade module are symmetrical and mechanically coupled to form a conjoined blade, wherein electrical components of the first blade module and electrical components of the second blade module are electrically coupled via an electrical coupler routed through the aligned first conjoining channel and second conjoining channel.

Abstract: A backplane configuration is described for supporting a range of modular components mechanically and for making electrical connections between the components. The backplane is particularly well-suited to power distribution and control applications, such as in industrial motor drives, and so forth. The backplane includes a number of bays or slots for modular components, as well as a bus topography that allows for switched or common connections between the various components.

Abstract: A backplane for use in a push-in rack for peripherals includes slots with plug connectors that connect with peripherals which have been pushed into the push-in rack, and at least one further plug connector that connects the backplane to a control apparatus. An assigned optical signaling device is also provided for each slot. The backplane further includes a monitoring device operable to determine, for each connected peripheral, whether a peripheral is compatible with the connected control apparatus and, if the peripheral is incompatible, the monitoring device activates the respective optical signaling device assigned to the slot for the incompatible peripheral. The backplane is suitable for use in data processing apparatuses in conjunction with peripherals which are designed in accordance with the SAS (Serial Attached Small Computer System Interface) or SATA (Serial Advanced Technology Attachment) specification.

Abstract: A redundant pair of interconnected board sub-assemblies have substantially the same dimensions and level of functionality. A module interconnect card is configured to mechanically and electronically connect to the first and second board sub-assemblies. Each sub-assembly is configured (e.g., via a properly configured microcontroller) to compensate for a loss of functionality in the other sub-assembly. Each subassembly preferably includes a re-usable adapter card that interfaces with a first card such that components requiring a lower certification level—e.g., commercial off-the-shelf (COTS) components or the like—may be isolated on the first card, wherein the adapter card includes high certification-level parts and communicates with the first card. The two cards are electronically and mechanically coupled to form the finished board assembly.

Abstract: A method and apparatus for adapting a backplane from one type of connector to another type of connector is disclosed. The method includes providing a backplane with a plurality of connectors, each connector being of a first type of connector, providing at least one extension module having a plurality of connectors, each connector being of a second type of connector, and plugging the at least one extension module into at least one of the first plurality of first type of connectors, thereby converting the first type of connectors into the second type of connectors. In a preferred embodiment, the backplane is used in a SONET communications system, and the conversion is from DS1 to DS3 connectors. The conversion allows an individual user to begin with one type of connector, and later expand as the need arises to an additional type or types of connectors.

Abstract: A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane.

Abstract: A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations. A spring clip electrically links at least one module to the chassis.

Abstract: A first slot connector is mounted within a housing of an electronic system and is for connecting to a first plug-in card. A mezzanine board is installed within the housing. A second slot connector is mounted on the mezzanine board for connecting to a second plug-in card. The first and second plug-in cards align with similarly-shaped slot access panels in the electronic system.

Abstract: In a detection element for the current which flows from a power source to a disk apparatus internal circuit, a plurality of resistors are incorporated such that the detection resistance for consumption current can be selected. Based on apparatus identification information from an apparatus identification unit 31 such as a current identification signal outputting circuit or an apparatus identification structure provided in a disk apparatus unit, the detection element switching circuit switches the detection resistance value of the detection element. A voltage detection circuit detects the potential difference between both terminals of the detection element. When a current control circuit detects an excessive current based on the potential difference, the current control circuit turns off a transistor (FET).

Abstract: One embodiment of the invention provides a fully distributed, scaleable and modular rack architecture and management system. One feature of the invention provides device management throughout the rack system with a vertical interface column integrated into the rack cabinet. Within each rack unit (U) of the vertical interface column, the vertical interface column may deliver connectivity to a device housed within the rack cabinet thereby eliminating runs of cable typically necessary for management of such devices. The vertical interface column can be expanded as necessary to provide connectivity to more devices using hot-swappable interface modules. A rack management system allows both local and remote management access to all devices mounted in the rack cabinet and coupled to the vertical interface column. The rack management system may also access to devices mounted in other rack cabinets.

Abstract: A storage device backplane and an identification circuit for identifying using situations of the storage device backplane are provided. The storage device backplane possesses a first connection interface and a second connection interface, for being used as a first backplane supporting a motherboard, or a second backplane cascaded to the first backplane, or a first backplane supporting a daughterboard of the motherboard. The first and second backplanes possess the same storage device backplane structure. If the storage device backplane is used as the first backplane, a first connection interface of the first backplane is coupled to the motherboard or the daughterboard thereof; if the storage device backplane is used as the second backplane, a first connection interface of the second backplane is coupled to a second connection interface of the first backplane. The identification circuit identifies using situations of the storage device backplane and display corresponding correct indicator number.

Abstract: An Active edge connector for memory modules has a base including two PCB sides and a spacer separating the sides, with driver chips mounted on each side of each side, printed wiring electrically connecting a first set of electrical signals from each of the driver chips to a mother board on which the connector is mounted, and printed wiring for electrically connecting a second set of electrical signals from each of the driver chips to a memory module inserted in the edge connector. When a group of connectors are mounted on a mother board, electrical signals arriving at the first connector are routed to its driver chips, producing re-driven signals to the next connector, and so on. A decoder circuit provides addressing signals determining the last such connector to which the signals are intended, and which prevents the signals from going to any connectors containing memories not addressed.

Abstract: A device for assembling transversal PCI expansion cards and a computer housing includes a vertical connection board which is installed in an internal space of a computer housing, with a riser card being fixed on the connection board. The riser card is provided with a plurality of insertion slots, and a side of the connection board is provided with a plurality of brackets, such that tail ends of PCI expansion cards can be horizontally locked on the brackets, thereby allowing more PCI expansion cards, which are superimposed, to be horizontally inserted in a limited space of the computer housing.

Abstract: A backplane has signal connectors for connecting signals of logical boards connected to an upper level of the backplane; signal connectors for connecting signals of logical boards connected to a lower level of the backplane; power source connectors for supplying power to the logical boards connected to the upper level of the backplane; and power source connectors for supplying power to the logical boards connected to the lower level of the backplane. Some power source connectors are formed at one end of the backplane and the other power source connectors are formed at the other end of the backplane.

Abstract: A multi-service network element is configurable for use in various types of communications networks. The network element has a service interface card, a service interface electrical connector for receiving the service interface card, an I/O electrical connector for receiving an I/O module, and a backplane. The backplane has a first side, an opposite side, a first means for electrically connecting the service interface electrical connector to the first side, and a second means for electrically connecting the I/O electrical connector to either side of the backplane. The backplane is partitioned into columns and rows of electrical connectors. Each column corresponds to a card slot for receiving a circuit pack and each row corresponds to a section of the backplane having traces for carrying a particular type of electrical signals between circuit packs.

Abstract: The present invention discloses a double-width Advanced Mezzanine Card, comprising a functional circuit, a first Tongue, and a second Tongue; both the first and second Tongues have interfaces that are connected to the functional circuit. The present invention further discloses a communication system with an Advanced Mezzanine Card, wherein a backplane has a slot that can accommodate two single-width AMCs or one double-width AMC; a double-width AMC having a first Tongue and a second Tongue is plugged in the slot; both the first and second Tongues have backplane interfaces, and the backplane interfaces are connected to the corresponding backplane interfaces on the slot.

Abstract: A motherboard for backplane buses is provided that reduces noise due to entry of external signals into signal wiring which interconnects modules, or noise due to any external signals entering a power supply after being routed around the power supply. An EBG pattern formed up of two wiring regions different from each other in impedance is periodically disposed in at least three arrays as part of the power supply layer(s) constituting a microstripline structure (one layer adjacent to a signal layer is a power supply layer, and the other layer is interposed in air) or a stripline structure (both layers adjacent to a signal layer are power supply layers); the part of the power supply layer(s) not being involved in signal transmission between the modules on the motherboard for backplane buses.

Abstract: A system and method for an improved multiple hard-disk-drive data-storage enclosure. Some embodiments position drives in counter-rotating pairs, each simultaneously accessing half the data, such that seek-caused actuator rotational-acceleration vibration cause simultaneous canceling rotational torque. Some embodiments position the edge of a first drive (or drive pair) at an angle to the actuator midpoint of a nearby second drive (or drive pair), such that rotational-acceleration vibration from a seek-caused actuator rotation in the first drive does not cause a rotational movement into the second drive that affects the tracking or seek operation. Some further embodiments position drives in a herringbone pattern to redirect air flow in addition to reducing rotational-acceleration vibration interaction. Other embodiments include a printed wire circuit board mounted to reduce the rotational-acceleration vibration interaction.

Abstract: A hybrid backplane uses multiple, parallel serial communication channels to provide flexibility and robustness in a motor drive control requiring high-speed data communication for the real-time control of motor waveforms.

Abstract: The invention relates to an electronic-board arrangement, comprising at least two electronic boards (110, 110a-110n), particularly integrated circuit boards, which are attached to a backplane (10) which provides electrical interconnection between the at least two electronic boards (110, 110a-110n). An electronic interconnect board (40) providing electrical interconnect between the at least two electronic boards (110, 110a-110n) is arranged in a space (90) in between the at least two electronic boards (110, 110a-110n) and the backplane (10).

Abstract: An improved redundant computing apparatus has a chassis assembly configured to (i) mount to a standard electronic equipment rack and (ii) consume substantially 1U of space in a particular direction within the standard electronic equipment rack. The chassis assembly includes a housing and a midplane disposed within the housing. The apparatus further includes a set of power supply/blower assemblies configured to electrically connect to and electrically disconnect from the midplane of the chassis assembly in a hot swappable manner, and a set of computing devices configured to electrically connect to and electrically disconnect from the midplane of the chassis assembly in a hot swappable manner. By way of example, the set of computing devices is adapted to move data into and out of a set of disk drives on behalf of a set of external host computers.

Abstract: In the VCD-On-Demand system, the EDA tool has the following attributes: (1) RCC-based parallel simulation history compression and recording, (2) RCC-based parallel simulation history decompression and VCD file generation, and (3) On-demand software regeneration for a selected simulation target range without simulation rerun. When the user selects a simulation session range, the RCC System records a highly compressed version of the primary inputs from the test bench process. The user then selects a narrower region, the simulation target range, within the simulation session range for a more focused analysis. The RCC System dumps the hardware state information of the hardware model into a VCD file. The RCC System then allows the user to proceed directly to view the VCD file from the beginning of the simulation target range without having to rerun the entire simulation from the beginning of the simulation session range.

Abstract: An improved device and method for mounting an avionic system is shown. The design provides varying locations of key components, which allows a single mounting system to be used with several varieties and configurations of aircraft within the crowded confines of an instrument panel. Ranges of flexibility with this system include the ability to arrange modules horizontally, and the ability to locate the display unit vertically. The multi-dimensional mounting flexibility of the mounting system shown allows electronic modules to be mounted in close proximity to a display unit, which greatly increases accessibility of the modules over prior configurations where modules were housed in the nose of the aircraft, the rear of the aircraft, or other remote locations. Installation, repair, and replacement are all greatly simplified with this configuration.

Abstract: The embodiments of the present invention relate to an improved printed circuit board having additional rows of ground vias to reduce crosstalk in the board. A printed circuit board according to one embodiment of the present invention comprises a first row of vias and a second row of vias, each having a plurality of signal vias. The circuit board also comprises a plurality of rows of vias being coupled to a ground plane between the first row of signal vias and the second row of signal vias. According to one embodiment, the plurality of rows of vias being coupled to a ground plane comprise rows of vias having different sizes. Some of the vias are designed to receive a component, while others are generally smaller and designed to provide a return current path for the signal vias.

Abstract: A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features a transmitter port and receiver port for connection with separate parallel optic cables for separately transmitting and receiving data and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module having pluggable edge connectors. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board.

Abstract: A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.

Abstract: A switched fabric mezzanine storage module (560) includes a storage module (562) and a switched fabric connector (563) coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (506), where the switched fabric storage mezzanine module is coupled to a payload module (502) having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector (518) coupled to a rear edge (519) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane (504).

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract: A subrack having a front side and a rear side, wherein the subrack is coupled to receive an Advanced Mezzanine Card module, the subrack includes a monolithic backplane having a first portion and second portion, where the first portion runs substantially along the front side and the second portion runs substantially along the rear side. A first slot is to receive the Advanced Mezzanine Card module inserted via the front side and connect the Advanced Mezzanine Card module directly to the second portion of the monolithic backplane. A second slot is to receive the Advanced Mezzanine Card module inserted via the rear side and connect the Advanced Mezzanine Card module directly to the first portion of the monolithic backplane.

Abstract: A modular server system includes a midplane having a system management bus and a plurality of blade interfaces on the midplane. The blade interfaces are in electrical communication with each other. A server blade is removeably connectable to one of the plurality of blade interfaces on the midplane. The server blade has a server blade system management bus in electrical communication with the system management bus of the midplane, and a network interface to connect to a network. A media blade is removeably connectable to one of the plurality of blade interfaces on the midplane, and the media blade has at least one storage medium device.

Abstract: A server including a backplane, first and second EM units is provided. The signal of the first EM unit is determined whether or not to be transmitted to a bus at the backplane according to statuses of the first EM unit and other EM unit(s). The signal of the second EM unit is determined whether or not to be transmitted to the bus according to statuses of the second EM unit and other EM unit(s). Thus, the server prevents the first and the second EM units on the backplane simultaneously connected to the backplane to cause a signal short between the first and the second EM units.

Abstract: A system comprises a primary backplane and a secondary backplane. The primary backplane has a surface region substantially devoid of components and a plurality of connectors to which electronic devices can be mated. The secondary backplane is removably mated to the primary backplane within the region. The secondary backplane has at least two connectors adapted to mate to at least two of the electronic devices. At least two electronic devices communicatively interconnect through the primary and secondary backplanes.

Abstract: For electrical backplanes and the like, a power plane adaptation to improve the propagation of high-speed signals through clearances in an embedded power plane is disclosed. In exemplary embodiments, the power plane is segmented in a high-speed connector region, such that a portion of the metal layer that forms the power plane is retained in the high-speed connector region—but isolated from the power-delivery portion of the power plane. The isolated portion is connected to digital ground, and clearances are formed therein where high-speed signaling throughholes will pass through the region. In some embodiments, various attainable advantages include better manufacturability, better matching and control of high-speed signaling throughhole impedance, and improved noise isolation. Other embodiments are described and claimed.

Abstract: Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that provide return paths for the first set of signals to reduce cross-talk or impedance. Vias that conduct input or output signals can be placed next to vias that provide return paths for the input or output signals to reduce cross-talk. The vias that provide the return paths can conduct, for example, ground signals, power supply signals, or both. Vias that conduct power supply signals can be placed next to vias that provide return paths for the power supply signals to reduce impedance. The vias that provide the return paths for the power supply signals can conduct, for example, ground signals. The via configurations reduce cost and increase yield, and the via configurations are modular.

Abstract: The present invention provides a flexible storage system through the use of portable, removable canisters holding multiple storage subsystems.

Abstract: A system and method for an improved multiple hard-disk-drive data-storage enclosure. Some embodiments position drives in counter-rotating pairs, each simultaneously accessing half the data, such that seek-caused actuator rotational-acceleration vibration cause simultaneous canceling rotational torque. Some embodiments position the edge of a first drive (or drive pair) at an angle to the actuator midpoint of a nearby second drive (or drive pair), such that rotational-acceleration vibration from a seek-caused actuator rotation in the first drive does not cause a rotational movement into the second drive that affects the tracking or seek operation. Some further embodiments position drives in a herringbone pattern to redirect air flow in addition to reducing rotational-acceleration vibration interaction. Other embodiments include a printed wire circuit board mounted to reduce the rotational-acceleration vibration interaction.

Abstract: A subrack having a front side and a rear side, wherein the subrack is coupled to receive an Advanced Mezzanine Card module, the subrack includes a monolithic backplane having a first portion and second portion, where the first portion runs substantially along the front side and the second portion runs substantially along the rear side. A first slot is to receive the Advanced Mezzanine Card module inserted via the front side and connect the Advanced Mezzanine Card module directly to the second portion of the monolithic backplane. A second slot is to receive the Advanced Mezzanine Card module inserted via the rear side and connect the Advanced Mezzanine Card module directly to the first portion of the monolithic backplane.

Abstract: An Integrated Communication System (ICS) with fail-over serial data connectivity is disclosed. In one aspect, an ICS may comprise a chassis including a System Switch Processor (SSP) for providing connectivity to a plurality of slots. A Serial Alarm Processor (SAP) may be operatively coupled to the ICS through one of the slots, an include at least one serial port for providing serial data connectivity. A Primary Single Board Computer (SBC) and at least one secondary SBC may be disposed in the slots. The ICS may be configured to pass control of serial data connectivity from the Primary SBC to a secondary SBC in the event of the failure of the Primary SBC. Various methods for fail-over serial data connectivity are also disclosed.

Abstract: A backplane for an electronic data communication system is disclosed. The backplane comprises at least one ultra-wideband transmitter configured to transmit data in the form of a plurality of pulses in a wireless manner and at least one ultra-wideband receiver configured to receive the plurality of pulses and decode the plurality of pulses to retrieve the data. The data is to be transmitted wirelessly from a first module comprising the at least one ultra-wideband transmitter to a second module comprising the ultra-wideband receiver within the electronic communication system, the first and second modules residing in the system housing.

Abstract: In one exemplary embodiment, a system for supplying electrical connectivity to one or more circuit board based devices includes a backplane and at least one module. The backplane includes a mounting surface having a plurality of modular power connectors. The at least one module includes an interface portion, a power connection portion, and a circuit board. The power connection portion is configured to connect with the corresponding one of the plurality of modular power connectors. The circuit board includes a plurality of power-related electrical contacts and a plurality of data-related electrical contacts. At least one of the plurality of power-related electrical contacts is connected with the power connection portion, and at least one of the plurality of data-related electrical contacts is connected with the interface portion.

Abstract: A patch panel includes a back plane having front mounted pairs of termination locations, and an interconnect location electrically connected to each pair of termination locations. The termination locations connect to two patch cords. The interconnect location defines an access device for selectively accessing the termination locations. An interconnect module interfaces with the interconnect location. The module can include test access, power over Ethernet, or circuit protection features.

Abstract: A system and method for an improved multiple hard-disk-drive data-storage enclosure. Some embodiments position drives in counter-rotating pairs, each simultaneously accessing half the data, such that seek-caused actuator rotational-acceleration vibration cause simultaneous canceling rotational torque. Some embodiments position the edge of a first drive (or drive pair) at an angle to the actuator midpoint of a nearby second drive (or drive pair), such that rotational-acceleration vibration from a seek-caused actuator rotation in the first drive does not cause a rotational movement into the second drive that affects the tracking or seek operation. Some further embodiments position drives in a herringbone pattern to redirect air flow in addition to reducing rotational-acceleration vibration interaction. Other embodiments include a printed wire circuit board mounted to reduce the rotational-acceleration vibration interaction.

Abstract: A computer module for electrically coupling a motherboard with add-in cards comprises risers connected to the motherboard and oriented facing toward each other, where the risers are connected to the add-in cards at different elevations above the motherboard, so that the add-in cards are parallel to the motherboard and overlap each other. The computer module includes a frame that can be rotated or adjusted to accommodate the need to connect with motherboard slots in various locations.

Abstract: An electronic system having a backplane designed for efficient routing of signal traces. The system includes two or more daughter cards that are connected to multiple other daughter cards in the system. These daughter cards are mounted centrally to the backplane in the system. Connections between those two daughter cards and the backplane are made through electrical connectors that are distributed in columns along the length of the daughter cards. The connectors are positioned with space between the connectors. The space forms routing channels such that signals that must be connected to the central cards from a daughter cards on either side may be routed through the routing channels.

Abstract: The present invention provides a method for allowing a multi-drive tray (MDT) to be interchanged with a battery backup unit (BBU) tray within a disk enclosure blade (DEB) of a blade server. The DEB is implemented comprising a plurality of controller cards and a plurality of MDTs. One of the MDT slots within the DEB is configured to be interchanged with a BBU tray. The BBU tray is designed to include multiple BBUs and is configured to have packaging, mounting, and air flow characteristics that are similar to an MDT. In one embodiment, a controller card queries each MDT slot within the DEB and determines if any of the queried MDT slots contain a BBU tray. If a queried MDT slot contains a BBU tray, the controller card manages the queried MDT slot as a BBU slot. Otherwise, the controller card manages the queried MDT slot as an MDT slot.