Abstract: A testing apparatus and method of extending the life of a testing apparatus may comprise a chassis including a case having a testing module receptacle receiving a plurality of testing modules comprising at least one processor module and a plurality of test modules, each having the same physical footprint, including respective racking mechanisms and inter-module interface connectors; and a backplane with connectors connecting with a respective inter-module connector, and bus-work interconnecting the respective modules through the inter-module interface connectors and the backplane connectors. The backplane may comprise a battery and display connector. The chassis may comprise a display mounting receptacle configured to receive a display unit having a display connector configured to interface with the backplane display connector. A battery receptacle may receive a battery unit, such as a rechargeable battery.

Abstract: The present invention discloses a hillock for fixing PCB on backplane, a backplane and a backlight module. A hillock is used for fixing PCB on backplane; the hillock is provided with a PCB mounting hole for fixing the PCB; the bottom of the hillock is provided with a fixed structure for arranging the hillock on the backplane. In the present invention, because each hillock on the backplane is designed into an independent part, and the hillock is fixed on the backplane by a fixed structure at the bottom of the hillock, hillocks of corresponding positions and corresponding number are arranged on the backplane in accordance with different requirement, such as PCBs of different size, and requirements of components of different number. Thus, there is no need for production of backplanes of various specifications to adapt for the requirements of various PCBs and the like and components of different number, and only a kind of backplane is required to be produced.

Abstract: In the present invention, generation of occurrence of a wiring area is prevented, and a reflection by an inconsistency of a characteristic impedance of a high-speed signal line and a through hole connecting portion. By doing so, a conductor pattern of a raised shape is formed on each of front and back of a through hole, on a GND layer closest to the high-speed signal line in the vicinity of the connecting portion of the high-speed signal line and the through hole. Further, the conductor pattern is a trapezoidal shape, and is a shape which becomes wider as it becomes closer to the through hole.

Abstract: A backplane includes multiple vertical insertion plates separately arranged from each other, and connectors connecting circuit boards and a circuit serving as signal wiring are disposed on the vertical insertion plates. Each connector is electronically connected to the circuit of the vertical insertion plate on which the connector is disposed, so that when the connector on the vertical insertion plate connects a switch board with a service board, the switch board and the service board can implement signal interconnection through the signal wiring of the vertical insertion plate. Due to the backplane of a three-dimensional structure, the processing difficulty of the backplane is greatly lowered, the cost is greatly reduced, thus solving the problem of excessively large number of layers and excessively large size, which is caused by large-scale backplane wiring.

Abstract: A high density server including a plurality of portable devices is disclosed. The portable devices may be arranged in drawers, which may be assembled into shelves for mounting within the high density server. The server rack of the high density server has a substantially open bottom and open top to permit passive airflow in and around the portable devices housed therein. Because of the configuration of the portable devices within the server, the computing power density is increased over a traditional server. Also, the design of the portable devices and their placement within the high density server minimizes the need for active cooling and in some embodiments removes the need for active cooling mechanisms altogether. The portable devices are encased in a protective coating that facilitates heat dissipation away from the portable device. The portable devices include components found in traditional servers.

Abstract: A printed circuit board (PCB) for an Advanced Telecommunications Computing Architecture (ATCA) shelf. The ATCA shelf may include a backplane providing a payload power supply and a standby power supply. Additionally, the PCB may include a first shelf management controller (ShMC) and a multiport switch, the multiport switch electrically coupling the first ShMC with a second ShMC on a second PCB by way of the backplane, the first ShMC utilizing standby power provided by the backplane at least when payload power is not available.

Abstract: Herein disclosed are an apparatus, a system and a method, selectively linking signals between or among slots on a backplane. A backplane printed circuit board has defined slots, each of which receives a card or module. One or more arrays of solder ball mounting pads correspond to signal lines of the slots. Each of one or more signal mapping overlay printed circuit boards has at least one signal trace connected to solder ball landing pads. Selected solder ball mounting pads of the backplane printed circuit board are connected to selected solder ball landing pads of the signal mapping overlay printed circuit board by solder balls. The signal trace or traces of the signal mapping overlay printed circuit board or boards connect the corresponding selected signal lines between or among the slots of the backplane. The backplane and signal mapping overlay printed circuit boards may have mirrored connection arrays.

Abstract: An expandable backplane is provided. The expandable backplane includes a baseboard management controller for connecting several disks, a first expansion board, a second expansion board, and a multiplexer. The multiplexer is connected between the baseboard management controller, the first expansion board, and the second expansion board. The multiplexer is used to control the second expansion board to be connected to the baseboard management controller via the first expansion board or control the second expansion board to be directly connected to the baseboard management controller according to a connection state of a Mini-SAS Cable connected between the first expansion board and the second expansion board.

Abstract: An apparatus includes a backplane having a ground plane. Conductor through holes extend through the backplane in rows and columns for conductors to project through the backplane in orthogonal arrays. Each row and column of the conductor through holes includes ground holes, each of which is sized to receive only a single ground conductor, with the single ground conductor in connection with the ground plane. Each row and column of the conductor through holes also includes signal holes, each of which is sized to receive only a single signal conductor, with the single signal conductor free of a connection with the ground plane. The backplane further has a plurality of nonconductor through holes at locations between and offset from the rows and columns of conductor through holes, with each of the plurality of nonconductor through holes having plating electrically connected to the ground plane.

Abstract: An image processing device includes a body that has a first connection portion and a second connection portion inside the body; an image processing board that is electrically connected to the first connection portion, the image processing board performing image processing; a functional board that is disposed so as to cover a part of the image processing board on one side of the image processing board; a side panel attached to the image processing board at a position opposite to the first connection portion, the side panel being a part of a side surface of the body; and an extension board disposed so as to cover another part of the image processing board on the same side as the functional board with respect to the image processing board, the extension board being electrically connected to the second connection portion and independently attachable to and removable from the image processing board.

Abstract: An electronic product includes a case; a first board placed inside the case; and a second board having an Electromagnetic Band Gap (EBG) structure inserted therein. The second board is coupled to an inside of the case facing the first board so as to shield a noise radiated from the first board.

Abstract: A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling.

Abstract: A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.

Abstract: The present invention discloses a backplane and a backlight module. The backplane comprises a frame formed by a plurality of brackets, and bridges which are arranged on the brackets and used for fixing PCBs; the bridges can rotate relative to the fixed points of the bridges to the brackets; the bridges are provided with chutes or through holes used for installing hillocks. In the present invention, because the backplane is formed into a frame structure through a plurality of brackets, the manufacturing cost is lower and a large number of materials are saved. Simultaneously, the bridges can rotate relative to the fixed points of the bridges to the brackets, so that the positions of hillocks on the bridges can be adjusted to satisfy the needs of the PCBs of different dimensions and enhance the universality of the backplane.

Abstract: In accordance with embodiments of the present disclosure, a backplane for electrically coupling modular information handling resources to one or more other information handling resources, may include a printed circuit board, a first plurality of slots, and a second plurality of slots. The printed circuit board may have a first surface and a second surface opposite the first surface. The first plurality of slots may be mounted to the first surface and the second plurality of slots may be mounted to the second surface, such that each of the second plurality of slots are offset from an adjacent slot of the first plurality of slots in a direction parallel to a plane defined by the first surface and each of the second plurality of slots are rotated approximately 180 degrees from an adjacent slot of the first plurality of slots.

Abstract: A backplane device may include an electrical bus, an optical fabric, and a plurality of card sockets. A particular one of the plurality of card sockets may include a first socket configured to receive a first electrical connector of a card and electrically connect the first electrical connector to the electrical bus; and a conversion device comprising a second socket configured to receive a second electrical connector of the card; and an optical transceiver configured to convert electrical signals received from the second electrical connector to optical signals and provide the optical signals to the optical fabric; and convert optical signals received from the optical fabric to electrical signals and provide the electrical signals to the second electrical connector.

Abstract: A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N?1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.

Abstract: A method of forming an assembly for tool-less backplane retention and insertion thereof into a housing including a housing mating device through which an installation path for an assembly is defined with a space in which a first part is positioned is provided. The method includes coupling a hub and a backplane body having opposing faces on which a second part and a backplane mating device are respectively disposed. The coupling includes inserting a backplane mating device protruding from one of the opposing faces of the backplane body through a hub mating device defined in the hub. The method further includes forcing a first stage of a two-stage mating device, which includes first and second elastically coupled stages and which extends from the hub, to elastically hook onto the backplane body during a near-completion of the insertion.

Abstract: An interface circuit board apparatus can include a shared circuit board base, a transceiver section disposed on the circuit board base, and having circuit transceiver sites configured to receive a plurality of transceiver component types, a termination section disposed on the circuit board base, and having circuit termination sites configured to receive a plurality of termination component types, and a connection section operatively coupled to the transceiver and termination sections, wherein the transceiver section, the termination section and the connection section are configurable to support a plurality of interface types based on the plurality of transceiver component types and the plurality of termination component types.

Abstract: The invention relates to avionics equipment including a motherboard (108), at least one daughterboard (150) and, for each daughterboard, two supporting slides (116) attached directly to the motherboard and bearing the daughterboard. The invention also includes at least one mechanical connecting part (122A to 122D, 128A, 128B) between the motherboard (108) and at least one of the following: a backplane board (112) connected to an avionic connector (124), an avionic connector (124) and the rear face (106) of the avionics equipment.

Abstract: The embodiments of the present invention disclose a backplane and backplane system. The backplane includes at least two service slots with the same function and an exchange slot. Among the pins of different service slots with the same function respectively connected to the exchange slot, at least two pins are arranged to resemble a stepped form. When arranged in this manner, the distribution and orientation of the connection lines connecting the pins of the service slots with the same function to the exchange slot may be adjusted, and wiring density within a single wiring layer may be increased, which therefore enables the connection lines between the service slots and the exchange slot to be staggered from each other in less wiring layers or even one wiring layer, and as a result, decreases the number of the wiring layers to be used, and reduces the costs of the backplane.

Abstract: An electronic device includes a motherboard, a riser card, and a securing structure. The riser card connects to the motherboard, and includes a first surface with a second socket thereon for connecting with an expansion card. The securing structure is for securing the expansion card, and includes a first fixing plate, a second fixing plate, and a fixing member for fixing the expansion card. The first fixing plate is arranged on the first surface of the riser card, and includes a number of first latching portions corresponding to the second socket, the first latching portions are arranged on a line parallel to the second socket. The second fixing plate faces the first surface of the riser card, and includes a second latching portion corresponding to each first latching portion. The fixing member includes a first and second end portion latchable with each first and second latching portion respectively.

Abstract: An electronic apparatus includes: a first connector; a second connector; a first electronic unit connectable to the first connector; a second electronic unit connectable to the second connector; and a printed circuit board that includes the first connector and the second connector between a first extended center line toward a unit board of the first electronic unit and a second extended center line toward a unit board of the second electronic unit on a first side of the printed circuit board when the first and second electronic units are connected to the first and second connectors, respectively.

Abstract: A first backplane for being electrically coupled to a second backplane, a system monitoring module, and at least one transducer monitoring module includes a system interface bus configured to be coupled to the system monitoring module and the second backplane. The intermediate backplane also includes at least one monitor interface bus configured to be coupled to the at least one transducer monitoring module and the second backplane and an intermediate backplane bus configured to be coupled to the at least one transducer monitoring module and the system monitoring module.

Abstract: A data transport module includes a connector to be received and coupled to a backplane within a modular platform. The data transport module also includes another connector to be received and coupled in a slot resident on a board such that the data transport module is coplanar to the board when received and coupled in the slot. The data transport module further includes one or more data transport interfaces to forward data between the board and the backplane via the connectors.

Abstract: A backplane arrangement is provided for an electronic mounting rack with a base backplane with several contact strips, wherein a free space, into which at least one additional backplane can be inserted, is provided on the base backplane.

Abstract: Disclosed is an embodiment of a rack system including a universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane area on a second side of the rack system opposite to the first side, a power bus, a plurality of partitions, a plurality of module bays, and two or more service unit backplanes. The power bus may be configured to provide power to the modules coupled to the universal backplane area.

Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.

Abstract: A computer system includes a monitor, and a motherboard. The monitor includes a display screen, a switch set on the monitor, and a first video connector. The first video connector includes a first monitor identity pin, and a first ground pin. The motherboard includes a second video connector. The second video connector includes a second monitor identity pin electrically connected to the first monitor identity pin, and a second ground pin electrically connected to the first ground pin. The second monitor identity pin and the second ground pin are correspondingly connected to a power signal line and a ground line of the motherboard. The switch is connected between the first monitor identity pin and the first ground pin, to control the motherboard to power on or power off.

Abstract: The invention relates to an electronic-board arrangement, comprising at least two electronic boards, particularly integrated circuit boards, which are attached to a backplane which provides electrical interconnection between the at least two electronic boards. An electronic interconnect board providing electrical interconnect between the at least two electronic boards is arranged in a space in between the at least two electronic boards and the backplane.

Abstract: A modular packet network device has a chassis in which multiple logic cards mate to the front side of an electrical signaling backplane. Logic power for the logic cards is supplied from a group of power converter cards that convert primary power to the logic voltages required by the logic cards. The power converter cards lie in a separate cooling path behind the backplane. Advantages achieved in at least some of the embodiments include removing primary power planes from the signaling backplane or portion of the backplane, providing redundant, upgradeable power modules whose individual failure does not cause logic card failure, and providing cool air to power converter circuits that would be subject to only heated air if located on the logic cards. Other embodiments are also described and claimed.

Abstract: A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending along a longitudinal axis between a front end and a rear end positioned proximate to the header. The guide rail also includes board guides extending from the main wall along the longitudinal axis that are configured to engage a card module circuit board or board guide of the card module to guide the card module to the header. The guide rail also includes heat sink flanges extending from the main wall along the longitudinal axis that are configured to engage a heat sink of the card module to dissipate heat from the heat sink to the main wall.

Abstract: An industrial module apparatus includes a frame, a module signal integrated backplane, a plurality of function modules and a module terminal panel. The module signal integrated backplane is disposed at a side of the frame. The function modules can be inserted into the frame and electrically connected to the module signal integrated backplane for signal transmission, and can be removed from the frame for replacement. The function modules include a video analysis module, a network module, and/or a sensing module. The module terminal panel is connected to the module signal integrated backplane and serves as a signal transmission port for the function modules.

Abstract: A connector for a disk drive unit includes a base, a curve portion, a tab, a support, a hook, and a first spring arm. The base has a left portion, a right portion, a bottom portion, and a top portion. The curve portion extends from a back of the top portion of the base. The tab is adapted to be inserted into a retention opening of a static wall of a server. The support extends substantially horizontally from an opposite end of the curve portion, and is adapted to flex up and down when the tab is inserted into the retention opening of the static wall of the server. The hook is physically connected between the support and the tab, and is adapted to flex the support when the hook pressed into contact with a top of the retention opening, and to snap fit around the top of the retention opening when the connector is completely inserted into the retention opening.

Abstract: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on the inside of the doors. The doors are connected, by one of the vertical sides thereof, to a frame of the control box in question by hinges in an articulated manner, and can be closed by a closing mechanism on the opposite vertical side. A first hinge section is fixed to a vertical section of the frame by a fixing section, and the door is mounted on an articulated section of the first hinge section in an articulated manner by a second hinge section applied thereto.

Abstract: A secure insert comprises a shell including a lid and a container configured to receive and encase one or more circuit cards, wherein the shell is further configured to be inserted into and engage a card slot area of a chassis. A bridge connector is disposed inside the shell and configured to couple the one or more circuit cards to a chassis connector. A tamper sensor is disposed inside the shell and configured to detect unauthorized tamper events.

Abstract: A structure for transmission in a power supply, particularly to a power structure for transmission for bearing large DC current, wherein the power supply includes a power input port for connecting to DC input power and a DC/DC conversion circuit for converting the DC input power into DC output power. The architecture including at least one power transmission board for disposing the power input port, wherein the power transmission board is electrically connected to the power process board with the DC/DC conversion circuit mounted thereon by at least one power conduction element. Therefore, through the power conduction elements replacing the conventional connecting wires with large diameter to connect the power input port and the power process board without disobeying the safety regulation, not only the space occupied by the bent connection wires can be reduced, but the collisions and damage to other components caused therefrom also can be avoided.

Abstract: Apparatus includes a plurality of terminal base assemblies each having at least one module, at least some of the plurality of terminal base assemblies having varying levels of redundancy in the at least one module, the plurality of terminal base assemblies being connected together by circuitry within each of the plurality of terminal base assemblies.

Abstract: A mobile container may include a bottom element, a top element, a front element, a back element, and two side elements defining a containment volume. The two side elements may have a length longer than a length of either the front element or the back element. The containment volume may be configured to include a plurality of rack frames. Each rack frame may include a module insertion area on a first side of the rack frame, a universal backplane area, and a power bus. The universal backplane area may be positioned on a second side of the rack frame opposite to the first side and may include at least one mounting surface configured to mount two or more backplane boards. At least two of the backplane boards may be configured to couple to two respective modules that each have at least two different functions and are insertable through the module insertion area. The at least two different functions of at least one backplane board may include rack power and management functions.

Abstract: An apparatus is provided and includes a housing, including a housing mating device, through which an installation path for an assembly is defined with a space in which a first part is positioned, a backplane body having opposing faces on which a second part and a backplane mating device are respectively disposed, and a hub, in which a hub mating device is defined, and from which a two-stage mating device extends, the two-stage mating device including first and second elastically coupled stages. The hub and the backplane body are coupled to form the assembly and the assembly is installed/removed in/from the space with the second stage of the two-stage mating device elastically hooked by the housing mating device or released from the housing mating device and the first and second stages of the two-stage mating device biasing the hub and the backplane body to remain coupled.

Abstract: The present invention discloses a communication apparatus. The communication apparatus includes one or more board and a backplane. The board includes a connector and a function processing unit circuit connected to the connector. The backplane includes at least one group of board connectors. Each group of the board connectors includes two board connectors that receive signals from different boards. The board connector includes connection terminals connected to the connector on boards. The two board connectors are distributed up and down, and the connection terminals of the two board connectors are distributed symmetrically around a center. The foregoing communication apparatus and backplane are cost-efficient.

Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.

Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.

Abstract: The invention provides, in one aspect, an access control system that comprises an access control panel coupled to an access control expansion box. The access control panel includes one or more access control boards disposed within a first rack-mount enclosure, each control board providing at least an interface for monitoring and/or controlling access to one or more building entry points or zones via associated sensors and/or intrusion prevention devices, collectively, “security devices.” The access control expansion box includes a plurality of input/output (I/O) boards disposed within a second rack-mount enclosure. The I/O boards provide an interface for at least (i) sending signals received from one or more additional security devices to the control boards, and/or (ii) sending signals received from the control boards to one or more of the additional security devices.

Abstract: Software architecture for a mobile terminal for a wireless telecommunications system and for other applications. The software architecture includes a plurality of layers arranged in order from layers providing higher level services to layers providing lower level services, at least one software module in each layer, and interface means for permitting communication among software modules pursuant to a set of defined dependency rules.

Abstract: A server chassis layout structure includes a chassis body, a partition plate, and a power backplane module. The chassis body includes a bottom plate, first and second top plates, and two side plates. The first and second top plates form a first opening therebetween. The side plates are mounted between the bottom and top plates. The partition plate includes at least one retaining portion and is perpendicularly fixed to the bottom plate below the first opening. The partition plate divides the chassis body into first and second sections. The power backplane module includes at least one lock portion and is vertically inserted into the chassis body via the first opening. The lock portion interferes with the retaining portion so as to assemble the power backplane module into the chassis body above the partition plate, and both the power backplane and the partition plate are exposed via the first opening.

Abstract: A modular packet network device has a chassis in which multiple logic cards mate to the front side of an electrical signaling backplane. Logic power for the logic cards is supplied from a group of power converter cards that convert primary power to the logic voltages required by the logic cards. The power converter cards lie in a separate cooling path behind the backplane. Advantages achieved in at least some of the embodiments include removing primary power planes from the signaling backplane or portion of the backplane, providing redundant, upgradeable power modules whose individual failure does not cause logic card failure, and providing cool air to power converter circuits that would be subject to only heated air if located on the logic cards. Other embodiments are also described and claimed.

Abstract: A dongle for connecting a disk drive assembly to the backplane of a storage enclosure is disclosed. The dongle includes: a housing having a disk drive connector portion having a plurality of contact pins for connecting to a disk drive assembly and having a PCB holding portion having walls that define a recess; and, a PCB located within the recess, the PCB having a plurality of contact fingers on at least one surface at an edge of the PCB to form a backplane connector for connecting to the backplane. At least some of the disk drive connector contact pins are in electrical connection with at least some of the contact fingers of the backplane connector.

Abstract: Embodiments are described including a device comprising a carrier frame. The device includes a first connector on a first side of the carrier frame, and the first connector connects to a host system when the carrier frame is inserted into the host system. The device includes a second connector on a second side of the carrier frame, where the second side of the carrier frame is perpendicular to the first side. The second connector electrically couples to the first connector and connects to an input/output (I/O) adapter card inserted into a third side of the carrier frame, where the third side perpendicular to the first side. Consequently, the device has a flat structure that receives an adapter card and reorients the electrical connection of the adapter card. The device includes external visual status indicators and a switch for hot-swapping of the adapter card carrier in a running host system.

Abstract: Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.