Abstract: A modular server system includes a midplane having a system management bus and a plurality of blade interfaces on the midplane. The blade interfaces are in electrical communication with each other. A server blade is removeably connectable to one of the plurality of blade interfaces on the midplane. The server blade has a server blade system management bus in electrical communication with the system management bus of the midplane, and a network interface to connect to a network. A media blade is removeably connectable to one of the plurality of blade interfaces on the midplane, and the media blade has at least one storage medium device.

Abstract: A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.

Abstract: A device (20) for interconnecting electrical bundles, includes a plurality of pluggable connection and cross-connect cards (34 to 38) for the electrical bundles. The device further includes a “main” printed circuit (28, 28b) fitted with connectors or slots (29 to 33) designed and arranged to receive the pluggable cards, the printed circuit having a plurality of parallel tracks (46), each enabling two tracks (61 to 63, 68) or tracks starters (70 to 72) provided respectively on two distinct pluggable cards plugged in the connectors of the main printed circuit to be put to the same potential, each of the parallel tracks (46) being in contact with a respective pin (50, 150) of a plurality of connectors of the main printed circuit.

Abstract: A multiple blade computer server housing comprises a cabinet having a first side and a second side, at least one chassis positioned within the cabinet that houses a plurality of server blades and a plurality of interface cards, and at least one door panel hingedly mounted to the second side such that access to the second side is gained by opening the door panel. The door panel has mounted thereon at least one network switch card. Generally, the network switch card can be connected by cables to at least a portion of the plurality of interface cards. In another aspect, the invention pertains to a door for a computing blade server housing where the door comprises a door panel, a track system located on at least one side of the door panel, and plurality of interface connectors located along at least one edge of the door panel.

Abstract: A circuit device includes plural semiconductor circuit devices that are formed on independent substrates, respectively, and communicate with each other. Each of the semiconductor circuit devices includes: plural modules of an identical type, functions of which are substitutable for one another; a module selecting unit that selects, among the plural modules, usable modules that are a part of the plural modules; and a circuit block including an interface unit for the modules selected by the module selecting unit to exchange signals with the other semiconductor circuit devices. A logic module included in one of the semiconductor circuit devices belongs to a different type, a function of which is not substitutable for a function of a logic module included in at least one of the other semiconductor circuit devices.

Abstract: A system and method for an improved multiple hard-disk-drive data-storage enclosure. Some embodiments position drives in counter-rotating pairs, each simultaneously accessing half the data, such that seek-caused actuator rotational-acceleration vibration cause simultaneous canceling rotational torque. Some embodiments position the edge of a first drive (or drive pair) at an angle to the actuator midpoint of a nearby second drive (or drive pair), such that rotational-acceleration vibration from a seek-caused actuator rotation in the first drive does not cause a rotational movement into the second drive that affects the tracking or seek operation. Some further embodiments position drives in a herringbone pattern to redirect air flow in addition to reducing rotational-acceleration vibration interaction. Other embodiments include a printed wire circuit board mounted to reduce the rotational-acceleration vibration interaction.

Abstract: An enclosure for an input-output (IO) subsystem comprises: a backplane; a plurality of first slots for accepting corresponding IO option modules; a second slot for accepting an IO controller module; a plurality of first connectors corresponding to the plurality of first slots for connecting the corresponding IO option modules to the backplane; a second connector corresponding to the second slot for connecting the IO controller module to the backplane; and wherein the backplane includes communication links for interconnecting the second connector to each of the plurality of first connectors.

Abstract: An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.

Abstract: The present invention provides a flexible storage system through the use of portable, removable canisters holding multiple storage subsystems.

Abstract: A compensating advanced feature patch panel that can include removable modular or fixed electronic components located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides communications between an insulation displacement connector (IDC) at a PD/User end, and any standard interface type using unshielded twisted pair cables, such as an RJ45 connector at a switch end at performance levels of at least category 3, 5, 6 e, 6 and/or higher (e.g. 6 e or 7) and equivalent performance levels by compensating for the active electronics used in providing advanced features. Compensation is achieved in part through the separation and isolation of active and communication circuit elements.

Abstract: A server system comprises a server blade carrier. The server blade carrier carries a plurality of removably mountable server blades. Each blade includes a blade service controller operable to perform monitoring and management functions in the server blade. The carrier comprises at least one carrier service processor. The carrier service processor is operably connected to the blade service controllers of blade servers mounted in the carrier to provide higher level management functions and is configured to communicate management functions to and from the blades.

Abstract: A computer system includes a plurality of blade servers, a midplane, a supplemental midplane, and a peripheral device separate from the blade servers. The midplane includes a plurality of connectors connecting the midplane to the plurality of blade servers. The supplemental midplane is separate from the midplane and includes a body, a plurality of connectors, and a peripheral connector. The plurality of connectors are attached to the body and connect the supplemental midplane to the plurality of blade servers. The peripheral connector is attached to the body and connects the supplemental midplane to the peripheral device. The plurality of connectors of the supplemental midplane communicate with the peripheral connector of the supplemental midplane. The plurality of connectors of the supplemental midplane are configured to be removably connectable to the midplane.

Abstract: One embodiment of the invention provides a fully distributed, scaleable and modular rack architecture and management system. One feature of the invention provides device management throughout the rack system with a vertical interface column integrated into the rack cabinet. Within each rack unit (U) of the vertical interface column, the vertical interface column may deliver connectivity to a device housed within the rack cabinet thereby eliminating runs of cable typically necessary for management of such devices. The vertical interface column can be expanded as necessary to provide connectivity to more devices using hot-swappable interface modules. A rack management system allows both local and remote management access to all devices mounted in the rack cabinet and coupled to the vertical interface column. The rack management system may also access to devices mounted in other rack cabinets.

Abstract: An extendable enclosure for circuit cards provides the capability for a customer to purchase a low cost system up-front, but still allow for growth.

Abstract: A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).

Abstract: A signal routing circuit board has electronics common to circuit boards coupled to the signal routing circuit board. The signal routing circuit board may be coupled to a storage array circuit board and at least one input/output (I/O) controller circuit board. The storage array circuit board has storage device connectors to couple storage devices to the storage array circuit board.

Abstract: A shelf for receiving a plurality of electronic circuit boards, the electronic circuit boards having a structure where a connecter installing part is provided at a front end part of each of the boards and an optical transmitting and receiving element for optical communications between two or more of the electronic circuit boards is provided at a rear end part of each of the boards, includes a plurality of connectors arranged on a backboard of the shelf, the shelf having a right hexahedral-shaped configuration, the connectors detachably supporting the connecter installing parts of the electronic circuit boards; and a bonnet attached to a front surface opening part of the shelf so as to form a closed space, the bonnet having a mirror surface situated at a rear surface of the bonnet so that an optical communication signal being received and transmitted between two or more of the electronic circuit boards is reflected.

Abstract: An interconnect system may be used to interconnect node boards and one or more switch boards coupled to a common backplane in a computer system shelf or chassis. The interconnect system may interconnect the node boards and switch board(s) using external signal paths external to the backplane. In one embodiment, the signal paths may be connected to a rear transition module (RTM) that provides conversion between electrical node board signals and optical switch board signals. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A universal backplane connection (3) for computer storage chassis. The overall backplane connection (3) has at least one universal backplane (30) that is connected to the SAS expander daughter board (33), and to the hard disk drives (10) through its HDD (e.g. SAS) connector (39). Each universal backplane board has discrete components on-board, such as resistors, capacitors, voltage regulation ICs, Light Emitted Diodes (LED), HDD connector receptacles, power connector, General Purpose Input and Output ICs and a high-speed connector. Some of the discrete components and ICs Regulate the DC current to provide a safe and stable power source to the HDDs (10). The HDD connector (39) enable “hot-swap” function to the HDD (10), while other discrete components and amplifiers ensure data integrity of the system. LEDs provide a system status signal to the users. A high-speed connector (37), e.g.

Abstract: A power supply and control device intended for retrofitting permanently-installed fixtures. The permanently-installed fixtures include permanently-installed power supplies. This device is a portable device which provides power for a plurality of rental fixtures of the type which otherwise would require being permanently installed. The power supply also includes a logic board in the power supply which separates logic signals.

Abstract: A rack has a plurality of LEDs arranged on the front surface thereof correspondingly to respective units. The rack is provided with an LED lighting circuit which lights these LEDs, on the back of a display section and an input section. The LED lighting circuit has an LED lighting control section and a memory. The LED lighting control section acquires correspondence relation information indicating correspondence between servers and apparatuses from the input section, and stores the information in the memory. When a server is selected, the LED lighting circuit lights some of the plurality of LEDs based on the correspondence relation information stored in the memory.

Abstract: An assembling electronic device includes a plurality of functional modules, a characterized casing having a plurality of receiving cavities, and a terminal circuit. Each of said functional modules is shaped and sized to detachably receive in the respective receiving cavity so as to securely retain the functional module in the characterized casing in position. The terminal circuit is provided at the characterized casing to electrically connect with the terminals of the functional modules when the functional modules are detachably received in the receiving cavities respectively so as to form a complete circuit for the functional modules, such that each of the functional modules is replaceably mounted in the characterized casing for enhancing a user-personalizability.

Abstract: In an active semiconductor backplane for a liquid crystal spatial light modulator, spacers (25) which are distributed over the backplane extend above an array of electrical and/or electronic elements and comprise at least two layers essentially of the same material and occuring in the same order as is found in at least one of the electrical or electronic elements, such as an NMOS transistor (52). The latter is formed from a stack of layers on a silicon substrate (51) comprising polysilicon (56), continuous silicon oxide (57) modified to include gate oxide GOX (55), metallic gate electrode (59), continuous silicon oxide (58) and a metallic drain electrode (60) which is coupled to a spaced mirror electrode over the layer (58). Likewise, spacer (25) comprises the layers (57 and 58) with metallic (67, 68) deposited simultaneously with electrodes (59, 60). The foot of layer (57) is differently modified to include field oxide layer (69) and polysilicon layers thin oxide (71).

Abstract: A data storage system having an interconnect, storage devices coupled to a first side of the interconnect, and a processing subsystem coupled to a second side of the interconnect that is substantially opposite the first side. The method involves a user (e.g., a customer) receiving a fault signal from the data storage system (e.g., an email notification, a GUI message, an LED pattern, etc.), identifying a component of the data storage system as faulty in response to receiving the fault signal, and replacing the identified component with a new component. In general, the user replaces the identified component in a hot-swapping manner when the identified component is a storage device or a power supply. Additionally, the user replaces the identified component in a powered-down manner when the identified component is a portion of a storage processing circuit (e.g., an internal fan, a memory circuit, a storage processing circuit, etc.).

Abstract: A multi-service platform system (100, 200, 300, 400) includes a computer chassis (101, 201, 301, 401) having a plurality of 3U slots (205), a backplane (104) integrated in the computer chassis, a switched fabric (106) on the backplane. At least one of a VMEbus network and a PCI network are coincident with the switched fabric on the backplane. A payload module (102) having a 3U form factor is coupled to interface with one of the plurality of 3U slots, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Abstract: A blade-type optical transmission apparatus includes a plurality of main-signal blades, each of which is provided with an external optical signal interface unit, a cross-connect unit, and an internal optical signal interface unit, a blade enclosure in which the plurality of main-signal blades are enclosed, and a back plane which is situated inside the blade enclosure and provides a ring connection for the internal optical signal interface unit between the main-signal blades.

Abstract: A bladed architecture, backplane-based network (100) having N payload slots (108) includes an N/2 slot switch module (102), wherein the N/2 slot switch module is reconfigurable to one of a left-hand slot switch configuration (603) and a right-hand slot switch configuration (605), and wherein the N/2 slot switch module is coupled to N/2 of the N payload slots such that the bladed architecture, backplane-based network is in a sub-optimal configuration (601).

Abstract: For electrical backplanes and the like, a power plane adaptation to improve the propagation of high-speed signals through clearances in an embedded power plane is disclosed. In exemplary embodiments, the power plane is segmented in a high-speed connector region, such that a portion of the metal layer that forms the power plane is retained in the high-speed connector region—but isolated from the power-delivery portion of the power plane. The isolated portion is connected to digital ground, and clearances are formed therein where high-speed signaling throughholes will pass through the region. In some embodiments, various attainable advantages include better manufacturability, better matching and control of high-speed signaling throughhole impedance, and improved noise isolation. Other embodiments are described and claimed.

Abstract: Techniques for accommodating chassis tolerances use joiners which enable outer side panels for a front card cage to reference a front side of a midplane, and outer side panels for a rear card cage to reference a rear side of the midplane. The joiners couple the outer side panels together in a rigid but accommodating manner regardless of variations in midplane board thickness. Accordingly, both the front and rear card cages are capable of accurately and consistently referencing from the midplane sides. Not only do these techniques solve registration drawbacks which exist in conventional midplane installation approaches involving the bolting of midplanes to the middles of pre-constructed frames, these techniques further enable accurate direct connection of other components such as a power supply subsystem (e.g., to the midplane front side) and a fan assembly (e.g., to the midplane rear side) thus alleviating the need for burdensome cables.

Abstract: A modular electronic assembly includes a chassis, a housing supported by the chassis having an access opening through a first wall of the housing, a removable access panel or releasable member at least partially covering the opening, and a midplane supported by the chassis and slidably removable from the chassis through the opening when the housing is mounted on the chassis. A method of constructing a modular electronic assembly is also disclosed.

Abstract: The embodiments of the present invention relate to an improved printed circuit board having additional rows of ground vias to reduce crosstalk in the board. A printed circuit board according to one embodiment of the present invention comprises a first row of vias and a second row of vias, each having a plurality of signal vias. The circuit board also comprises a plurality of rows of vias being coupled to a ground plane between the first row of signal vias and the second row of signal vias. According to one embodiment, the plurality of rows of vias being coupled to a ground plane comprise rows of vias having different sizes. Some of the vias are designed to receive a component, while others are generally smaller and designed to provide a return current path for the signal vias.

Abstract: An electronics module comprises an electronics assembly having a first connector and a second connector. The first and second connectors are disposed on opposite ends of the electronics assembly. A case encloses the electronics assembly. The first connector is accessible through a first side of the case and the second connector is accessible through a second side of the case. A locking tab is disposed on the case and is biased to an extended position. A sliding member is slidably coupled to the case and is operable to move the locking tab to a retracted position.

Abstract: An input/output transition board system for collecting and distributing input/output signals between a backplane board and an I/O board while allowing for additional electronic devices. The input/output transition board system includes a transition board having at least one front connector and at least one rear connector. The front connector is connectable to a corresponding rear panel connector within a backplane board. The rear connector is connectable to a corresponding front I/O connector of an I/O board. The transition board collects and passes the signals between the I/O board and the backplane board. The transition board is also preferably active with additional electronic devices connected to the transition board.

Abstract: An electronic device that includes a housing that defines an envelope and that defines a horizontal routing channel within the envelope. A plurality of boards is arranged horizontally within the housing and at least one board includes input-output ports. At least one communication conduit is coupled to an input-output port. The boards that include input-output ports are recessed with respect to the envelope and are arranged such that the input-output ports are adjacent to the routing channel. Communication conduits are routed through the routing channel.

Abstract: The invention relates to a computer rack, frame or system having a direct current power supply positioned at the upper portion of the rack. In one variation, the DC power supply is placed in the highest shelf in the computer rack. In another variation, the DC power supply is placed on top of the computer rack. In yet another variation, a dual column computer rack with a back-to-back configuration is implemented with DC power supplies placed in a top shelf of the one of the computer columns. The DC power supply may comprise of one or more direct current power supply modules configured to provide fail over protection. In another aspect of the invention, the power supply modules are placed in a separate rack and provide direct current to support computers in one or more computer racks.

Abstract: A system and method for an improved multiple hard-disk-drive data-storage enclosure. Some embodiments position drives in counter-rotating pairs, each simultaneously accessing half the data, such that seek-caused actuator rotational-acceleration vibration cause simultaneous canceling rotational torque. Some embodiments position the edge of a first drive (or drive pair) at an angle to the actuator midpoint of a nearby second drive (or drive pair), such that rotational-acceleration vibration from a seek-caused actuator rotation in the first drive does not cause a rotational movement into the second drive that affects the tracking or seek operation. Some further embodiments position drives in a herringbone pattern to redirect air flow in addition to reducing rotational-acceleration vibration interaction. Other embodiments include a printed wire circuit board mounted to reduce the rotational-acceleration vibration interaction.

Abstract: A backplane assembly includes a main backplane having a first power conductor, a backplane strip having a second power conductor, and connecting members disposed between the main backplane and the backplane strip. The connecting members hold the backplane strip in a fixed position relative to the main backplane and electrically connect the first power conductor and the second power conductor. In one arrangement, the connecting members include source standoffs which extend from a source area of the main backplane to the backplane strip, and target standoffs which extend from a target area of the main backplane to the backplane strip. The source and target standoffs and the second power conductor provide a current path which increases current carrying capacity from the source area to the target area above that provided by the first power conductor alone. Thus, the backplane assembly is well-provisioned for distributing high currents to circuit boards.

Abstract: A multi-pin connector for connecting a signal line on a backboard side and a signal line on a daughter board side has open pins where the signal lines are not connected. In order to prevent transmission loss on the signal lines caused by these open pins, terminating resistances are connected to both ends of the open pins, and ends of the terminating resistances opposite to the open pins are connected to ground or to a power supply.

Abstract: The coupling apparatus couples two circuit cards to fit into a larger chassis. A coupling element can connect two similar sized circuit cards or two different sized circuit cards together by coupling the first circuit card and the second circuit card to effectively form a combined circuit card of a larger size. The larger size may allow for more features, may make it easier to dissipate heat, may make the circuit cards easier to shield, and/or may allow for the use of larger and less expensive components on the circuit cards.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: In a computerized device requiring a relatively large amount of power during operation (e.g., between approximately 10 kW to 15 kW) at a relatively large current (e.g., between approximately 200 and 300 amperes), an electrical conductor or power distribution assembly having a substantially flat, planar geometry electrically couples a power supply, via bus bars, to a midplane of the computerized device. The substantially flat planar geometry of the power distribution assembly minimizes conduction and radiation of electromagnetic interference (EMI) by the electrical conductor during operation of the computerized device.

Abstract: A circuit board includes at least one insulator layer and a plurality of conductors over which a plurality of signals is carried. A plurality of terminals is coupled to at least a subset of the plurality of conductors. A void is formed in the circuit board between at least two terminals.

Abstract: A blade (202a) with first circuit entity (210) having a transmit output (280) coupled to a first connector (260) and a receive input (282) coupled to a third connector (264), and a second circuit entity (212) having a transmit output (284) coupled to the fourth connector (266) and a receive input (286) coupled to a second connector (262). The first, second, third and fourth connectors of the blade (202a) are adapted to connect to a peer-to-peer backplane (104) that electrically connects the blade (202a) to a remote blade (202b) through remote connectors (150, 152, 154, 156) on the backplane (104). The backplane (104) cross-connects the first connector (140) to a remote second connector (152) cross-connects the second connector (142) to the remote first connector (150). The backplane cross-connects the fourth connector (146) to a remote third connector (154) and cross-connects the third connector (144) to a remote fourth connector (156).

Abstract: A network device uses a multiple component connector plane to interconnect functional cards within the network device. Each of the components of the connector plane may be configured to contain a subset of the total interconnectivity of the connector plane and, optionally, to interconnect one or more subsets of the functional cards in the network device. The reduced connectivity of each component enables each component to be made in a less complex fashion. Using printed circuit board technology, this reduction in complexity enables lower layer count boards to be used to form the connector plane, resulting in lower overall costs. The connector plane may be a mid-plane or a back-plane.

Abstract: A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

Abstract: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

Abstract: A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

Abstract: An assembly couples first and second backplanes together. The first backplane is configured to carry first electrical backplane signals among a first set of circuit boards. The second backplane is configured to carry second electrical backplane signals among a second set of circuit boards. The assembly includes a first switch configured to convey at least some of the first electrical backplane signals between circuit boards of the first set of circuit boards. The assembly further includes a second switch configured to convey at least some of the second electrical backplane signals between circuit boards of the second set of circuit boards. The assembly further includes a fiber optic cable joining the first and second switches together. The first and second switches are configured to exchange fiber optic signals through the fiber optic cable thus forming a cohesive backplane interconnect system between the first and second sets of circuit boards.

Abstract: An electronic system includes a chassis, a backplane having a printed circuit board and at least one connector extending from the printed circuit board and a backplane stiffener. The backplane stiffener includes a portion adjacent the printed circuit board, wherein the printed circuit board is between the chassis and the portion. The portion is stationarily retained relative to the printed circuit board and the chassis without requiring perforation of the printed circuit board for the insertion of fasteners. In particular embodiments, stiffener portions may be provided on each face of the circuit board and ioined to one another by couplers.

Abstract: A high-speed router backplane is disclosed. The disclosed construction and layout techniques enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that use signaling across the backplane at trace speeds of 2.5 Gbps or greater. Specific ranges of differential trace geometry characteristics, with significant single-ended coupling to adjacent ground planes, have been found to provide the parameters needed for such signaling. New trace routing and layering techniques also help in the realization of a backplane embodiment containing roughly 600 operable high-speed differential pairs, while also providing sufficient electromagnetic interference management to allow power distribution to occur within the same backplane.