Abstract: Embodiments are generally direct to a method and apparatus to provide power to a backplane. In one embodiment, a method is implemented in a backplane to receive power through an upper zone of the backplane. The power is provided by a rear transition power entry module (RT-PEM) operatively coupled to an interface in the upper zone. The power provided by the RT-PEM is routed to interfaces in a lower zone of the backplane. Each lower zone interface distributes at least a portion of the power to a component operatively coupled to the backplane.

Abstract: A modular packet network device uses bus bars to transfer primary power to either a backplane or directly to one or more cards that perform primary-to-logic-power conversion. The bus bars are fabricated in packages that reduce the transfer of differential and common-mode noise existing in the device chassis into the power delivery system through the bus bars. Other embodiments are also described and claimed.

Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.

Abstract: A backplane electronic circuit board of an electronic apparatus (10) comprises an interface connector with an external system and two interface boards (22, 23) connected to one another, a first interface board (22) being connected to the said interface connector and a second interface board (23) being intended for the connection of a set of electronic circuit boards of the said electronic apparatus (10). The backplane electronic circuit board (20) comprises reinforcement means (30, 40) installed between the said two interface boards (22, 23). Use in particular in an electronic apparatus on board an aircraft.

Abstract: A motherboard includes a main body and two relay devices attached on the main body. The main body includes a signal output terminal, a signal input terminal, a first connector module, and a second connector module. Each relay device includes a circuit board, a relay, and a third connector module. The input terminal outputs an input signal to the corresponding relay via the first and the third connector modules in turn. The relay corresponding to the signal input terminal outputs the input signal to the signal output terminal via the third connector module corresponding to the signal input terminal, the first connector module, the second connector module and the third connector module corresponding to the signal output terminal in turn.

Abstract: A modular electronic enclosure having a maximum height of 1 U and a width adapted to fit between the rails of a 19 inch rack is adapted to receive up to ten single-width Advanced Mezzanine Cards (AMCs) installed horizontally in the enclosure. Some modules that are not compliant with AMC standards may be installed in the modular electronic enclosure. A backplane, backplane structural support, combined card guide, chassis cover, and chassis bottom cooperate mechanically to provide a stiff, stable enclosure resistant to mechanical flexure. The modular electronic enclosure includes two hot-swappable cooling units which cooperate to establish push-pull cooling airflow. The modular electronic enclosure is further adapted to receive a Power Unit and an MCH. In another embodiment, the modular electronic enclosure includes a backplane with more than one core and has mounting locations and electrical connectors for up to twenty single-width 4 HP electronic modules.

Abstract: A first terminal of a first switch, a first idling pin, a third idling pin, and a power pin are connected together. A second terminal of the first switch, a first ground pin, a second ground pin, and a third ground pin are electrically connected together. A first terminal of the second switch, a second idling pin, a fourth idling pin, and a reset pin are electrically connected together. A second terminal of the second switch, a first ground pin, a second ground pin, and a third ground pin are electrically connected together. The first switch controls the motherboard to power on or power off, and the second switch controls the motherboard to reset.

Abstract: A modular industrial drive system includes a base that receives one or more control modules as a face template. The control modules provide a set of functionalities to the drive system, and the face template serves as a user interface to the drive system. The drive system can include a power module and a control module which define desired functionalities for the system.

Abstract: A server is disclosed, which includes two dividing plates disposed between the side plates, several rails disposed on the side plates and the dividing plates, at least one adapter board module, and several main boards. The dividing plates are parallel to the side plates. Each dividing plate has a position pin. The rails are parallel to the bottom plate. The main boards are slid in the rails. The adapter board module has a support piece and an adapter board. The support piece has position holes to be coupled to the position pins and fix the adapter board module on the dividing plates. The adapter board is disposed on the support piece and has two first gold finger interfaces. Each main board has a second gold finger interface. The first gold finger interfaces are coupled to the second gold finger interfaces, thereby each adapter board is connected to two main boards.

Abstract: A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane.

Abstract: A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.

Abstract: A networking appliance includes a chassis, an off-the-shelf motherboard mounted on said chassis, said motherboard including at least one expansion bus, one or more separately removable expansion module mounted on said chassis, and a number of card slots in the expansion module for accommodating expansion cards. A connection arrangement provides a signal connection between the card slots in the expansion modules and the expansion buses.

Abstract: An electronic device having a small size and improved in sensing ability is provided. A mobile phone 1 includes a first housing 2 having a housing opening 2h; a connector 67 arranged inside the first housing 2; a reinforcing frame 31 arranged to face the housing opening 2h to cover the connector 67; a sensor board 39 arranged on a surface facing the housing opening 2h of the reinforcing frame 31; and a touch sensor electronic 47 arranged on a surface facing the housing opening 2h of the sensor board 39. The reinforcing frame 31 has a recess 31d in a region which corresponds to the touch sensor electrode 47 and the connector 67.

Abstract: A system and apparatus for monitoring and control of the operation of various types of industrial plants, including power plants, nuclear power plants and plants including various types of mechanical, electrical and chemical machinery. The invention employs modular non-microprocessor based, non-software based digital hardware that enables communication between sensors and control logic and between the control logic and actuators that control a functional aspect of each plant.

Abstract: A software architecture for a mobile terminal for a wireless telecommunications system and for other applications. The software architecture includes a plurality of layers arranged in order from layers providing higher level services to layers providing lower level services, at least one software module in each layer, and interface means for permitting communication among software modules pursuant to a set of defined dependency rules.

Abstract: A cable management system provides cable management for a switch chassis configured to receive a plurality of line card units. The cable management system comprises a cable guide arrangement configured to guide each of a plurality of cables from a line card such that the cables extend out from the line card unit and lie substantially within a plane.

Abstract: A system comprises a backplane configured to receive a first signal and a second signal from a first plug-in unit, and a third signal and a fourth signal from a second plug-in unit, wherein the backplane is further configured to communicate each of the signals to one or more mid-plane connectors. The system further comprises the one or more mid-plane connectors configured to output the first and third signals at a first output as separate signals, and configured to output the second and fourth signals at a second output as separate signals. The system further comprises one or more I/O panels each configured to receive the first and third signals at a first input and to receive the second and fourth signals at a second input.

Abstract: A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention.

Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: A patch panel includes a back plane having front mounted pairs of termination locations, and an interconnect location electrically connected to each pair of termination locations. The termination locations connect to two patch cords. The interconnect location defines an access device for selectively accessing the termination locations. An interconnect module interfaces with the interconnect location. The module can include test access, power over Ethernet, or circuit protection features.

Abstract: A method and apparatus are provided for an embedded wireless interface that is embedded in, for example, one of an input and output controller device for controlling input and output communications with off-board devices, within a memory controller device and a processor motherboard. The embedded wireless interface may be utilized as a wireless test access point to provide signal stimulations for test purposes or to monitor communications over a specified wired communication link.

Abstract: A high-speed signal transmission apparatus comprises: a housing; a plurality of daughter boards juxtaposed to one another in the housing; board-side connectors each provided on corresponding each of the juxtaposed daughter boards; and cable-side connectors fixed in the housing; wherein each of the board-side connectors is insertable/removable into/from corresponding each of the cable-side connectors, and wherein a cable group whose impedance matching can be achieved makes connection between the predetermined cable-side connectors.

Abstract: In a media gateway, a single RTM is placed in bi-directional communication with a active TPM and also in bi-directional communication with a backup TPM. This is accomplished in part by implementation of a signaling and control bus interface between the LIU/Framer hardware of the RTM and the control processing unit (CPU) of the TPM. This interface provides for arbitration between multiple control sources, and for snooping of the input connection state and signaling information between the LIU/Framer and any other control entity. The interface also prevents contention by multiple control sources driving signal information to the LIU/Framer device.

Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.

Abstract: A power supply system is provided, which includes a power supply subrack (PSS) and a power cable distributor (PCD). The PSS includes one or more power modules and a third connector (51), and the PCD is adapted to introduce one or more electrical signals from power input cables. The third connector (51) in the PSS is connected to the PCD and adapted to feed the introduced electrical signals to the power modules. Furthermore, a power cable distributor, a power supply subrack adapted to work with the PCD and an integrated equipment are provided.

Abstract: A 1/16 DIN power controller configuration is provided that includes a housing, a circuit board carrier disposed within the housing and capable of engaging at least three circuit boards within the housing, a power supply circuit board disposed within the housing and engaged by the circuit board carrier, and a communications circuit board disposed adjacent the power supply circuit board within the housing and engaged by the circuit board carrier. The communications circuit board includes Ethernet/IP and/or Modbus TCP protocols, and in alternate forms includes RS-232 and RS-485 with Modbus RTU protocol, DeviceNet, Profibus DP, CanOpen, and/or EtherCat.

Abstract: A plug-in unit-mounting structure which makes it possible to efficiently mount plug-in units having different sizes in all slots. PIUs of printed board type which are different in size are mounted using respective mounting frames associated therewith. Box-shaped PIUs are also mounted using respective mounting frame associated therewith. However, no guide rail is provided on the metal shelf per se, for guiding each PIU for mounting the same therein.

Abstract: A communication cabinet and methods for installing active component into a communication cabinet, the method includes: removing at least one passive communication connector being connected by at least one wire to at least one customer connector within the communication cabinet; installing at least one printed circuit board that are connected to at least one active communication component and to at least one slim edge connector; wherein the printed circuit boards are shaped such as to be completely positioned within the communication cabinet; and connecting the at least one wire to the at least one slim edge connector.

Abstract: A protocol analyzer for analyzing traffic on a bus. A tap card is used to tap into a bidirectional bus. The tap provides a pass through connection from the card to the host and taps off of the bus. While tapping off the bus, stubs lengths are minimized and input capacitance is minimized. A repeater that preferably has no internal termination provides a differential input and a differential output or a single ended output. The bus lines are input to one of the inputs in the differential inputs and a reference voltage is provided to the other differential input. The reference voltage enables the tap to determine if the data is high or low. A jumper is also included in the tap such that the reference voltage can be selected from the host or from the pod.

Abstract: In one exemplary embodiment, a system for supplying electrical connectivity to one or more circuit board based devices includes a backplane and at least one module. The backplane includes a mounting surface having a plurality of modular power connectors. The at least one module includes an interface portion, a power connection portion, and a circuit board. The power connection portion is configured to connect with the corresponding one of the plurality of modular power connectors. The circuit board includes a plurality of power-related electrical contacts and a plurality of data-related electrical contacts. At least one of the plurality of power-related electrical contacts is connected with the power connection portion, and at least one of the plurality of data-related electrical contacts is connected with the interface portion.

Abstract: A backplane has signal connectors for connecting signals of logical boards connected to an upper level of the backplane; signal connectors for connecting signals of logical boards connected to a lower level of the backplane; power source connectors for supplying power to the logical boards connected to the upper level of the backplane; and power source connectors for supplying power to the logical boards connected to the lower level of the backplane. Some power source connectors are formed at one end of the backplane and the other power source connectors are formed at the other end of the backplane.

Abstract: A contact bank, which can be terminated, or is terminated, at least one terminal module serving for signal communication and being adapted to allow telecommunications lines to be connected therewith, or at least one supplementary module, of a telecommunications distribution point, which is connected to a terminal module, whereby the contact bank further is mountable or mounted in the telecommunications distribution point, includes: (a) a plurality of tapping contacts directly and permanently electrically connected to the contacts of the module in the terminated condition of said contact bank; (b) a smaller number of outlet contacts than of tapping contacts; (c) a plurality of remote-controllable switches for selectively electrically connecting said outlet contacts to said tapping contacts; and (d) a control device for controlling the plurality of switches.

Abstract: An assembly includes a circuit board, a terminal and a pin. The circuit board is for a controller and includes terminal mounting holes. The terminal mounting holes include a first mounting hole and a second mounting hole. The terminal includes a first mounting post that has an interference fit with said first mounting hole. The terminal also includes a second mounting post that has a transitional fit with the second mounting hole. A pin is electrically coupled to one or more of the first mounting post and the second mounting post and couples to a block connector.

Abstract: A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes.

Abstract: The present disclosure provides a flexible and space-saving arrangement of hardware modules in an Intelligent Electronic Device (IED). A module for an IED is configured to engage a slot or socket of a backplane of the IED in order to communicate, in a point-to-point mode over a serial backplane bus system that encompasses the slot or socket, with two neighboring modules in the IED. The module includes a source selector configured to select, in a receiving mode, between reception of signals transmitted via a nearest neighbor slot, or via a next-nearest neighbor slot. The source selector evaluates signals directed towards a rear side of a circuit board of the module, with the rear side being substantially devoid of electronic components.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: An embodiment of a printed circuit board according to the present invention is provided with an insulating layer, a conductive layer that is laminated on the insulating layer and that has a connecting portion and a circuit pattern portion formed connected to the connecting portion, and a film cover layer that covers the insulating layer and the conductive layer via an adhesive layer and that has an opening for connecting a mounted component to the connecting portion. The circuit pattern portion is provided with a recessed portion that is concave with respect to the connecting portion.

Abstract: The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole. The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.

Abstract: The present invention relates to a method and a printed board assembly for use in a MicroTCA system, wherein backplane pin connectors of the printed board assembly are arranged to be received in receiving connectors of a backplane interconnect, characterized in that it comprises at least one switch unit which is arranged with physical output/input ports that have physical port numbers that can be overridden by logical port numbers, an optimal routing of a number of sets of conductive threads in the printed board assembly arranged so that none of the conductive threads cross over each other while connecting physical output/input ports of the switch units with the backplane pin connectors, and printed circuit board layers arranged to shield signals travelling in the conductive threads in conductive layers of the printed circuit board layers from any significant crosstalk.

Abstract: A second printed wiring board is opposed to a surface of the first printed wiring board. A support member supports the first and second printed wiring boards. A first connector is mounted on the first printed wiring board. A second connector is mounted on the second printed wiring board. A wiring connects the first printed wiring board to the second printed wiring board. The first and second connectors are separately mounted on the first and second printed wiring boards, respectively. The sizes of the first and second printed wiring boards can be reduced as compared with the case where connectors are arranged in a row on a single printed wiring board, for example. This results in a reduction in the size of the printed circuit board unit. A large number of the printed circuit board units can be coupled to the back panel.

Abstract: The invention relates to avionics equipment including a motherboard (108), at least one daughterboard (150) and, for each daughterboard, two supporting slides (116) attached directly to the motherboard and bearing the daughterboard. The invention also includes at least one mechanical connecting part (122A to 122D, 128A, 128B) between the motherboard (108) and at least one of the following: a backplane board (112) connected to an avionic connector (124), an avionic connector (124) and the rear face (106) of the avionics equipment.

Abstract: A physical hardware architecture is provided to fulfill flexibility, serviceability and configurability of a multi-processor system. The architecture mainly includes a bottom plane, plural processor boards and a function board. On the front section of the top side of the bottom plane, the processor boards are configured thereon. The function board faces downwards and is configured in an edge-to-edge connection with the front edge of the bottom plane. Function card(s) may be configured vertically on the bottom surface of the function board. On the rear section of the top side of the bottom plane expansion card(s) are configured vertically. With main system fan(s) located on the top of the function board and auxiliary system fan configured under the bottom plane, the multi-processor system will also achieve optimum cooling capability through the architecture.

Abstract: The invention provides an electronic mobile communications/entertainment device capable of a plurality of modes of operation, comprising a basic module having circuitry common to the operation of the device in said plurality of modes of operation, and a plurality of supplementary modules, each supplementary module being provided in the form of a housing cover for the device and including controlling means configured to provide for a corresponding mode of operation when coupled to the basic module, the supplementary modules being interchangeably attachable/detachable to the basic module so as to provide respective modes of operation, and the device only being operational when one of said plurality of supplementary modules is attached to the device.

Abstract: One embodiment of the invention provides a fully distributed, scaleable and modular rack architecture and management system. One feature of the invention provides device management throughout the rack system with a vertical interface column integrated into the rack cabinet. Within each rack unit (U) of the vertical interface column, the vertical interface column may deliver connectivity to a device housed within the rack cabinet thereby eliminating runs of cable typically necessary for management of such devices. The vertical interface column can be expanded as necessary to provide connectivity to more devices using hot-swappable interface modules. A rack management system allows both local and remote management access to all devices mounted in the rack cabinet and coupled to the vertical interface column. The rack management system may also access to devices mounted in other rack cabinets.

Abstract: A configurable multi-faceted input/output (I/O) panel may be used in a computer or electronic device to present multiple I/O interfaces to a user. The configurable multi-faceted I/O panels may be configured by a user such that one of a plurality of different I/O faces is accessible to the user. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: An apparatus, system, and method are disclosed for a scalable, composite, reconfigurable backplane. The backplane is made up of one or more blade aggregation modules which provide switching for attached devices. The blade aggregation module connects to transition cards that then connect with blade modules. The blade aggregation module provides connectivity to the connected modules, which may connect to a second blade aggregation module through the transition cards. The transition cards may additionally connect with unit aggregation modules to connect rows of blade modules together. Transition cards can also provide outside connectivity. The backplane, made up of blade aggregation modules, transition cards, and unit aggregation modules, is highly scalable and versatile, and also provides an unblocked airflow path to facilitate cooling the blades.

Abstract: A system comprises a chassis and a system board contained within the chassis. The system board has an edge connector adapted to receive an add-in card in a configuration in which the system board and add-in card are substantially co-planar.

Abstract: A computer housing (41) for free-standing use includes a computer (10) with slots for the insertion of extension cards, and further at least one card carrier (20) for carrying extension cards (51). The card carrier (20) includes a carrier connector (47) whereby the card carrier (20) is connectable, by inserting the card carrier (20) in the computer housing (41), via the carrier connector (47), with a communication connector (49) of the computer (10), at least one adapter connector (48) into which an extension card (51) is pluggable, and wherein the card carrier (20) includes a communication connection between the carrier connector (47) and the at least one adapter connector (48).

Abstract: A modular patch panel for interconnecting a data storage system controller to data storage enclosures is provided. The modular patch panel includes a chassis and modular interface circuitry. The chassis has a front end and a back end, the front end and the back end being horizontally opposed, the back end attaching to a panel portion of a rack system, the panel portion electrically connecting to the data storage enclosures over a set of point-to-point connections. The modular interface circuitry has (a) a data storage interface portion electrically connected to the set of point-to-point connections through the panel and (b) a controller interface portion electrically connecting to the data storage system controller through the front end. The modular interface circuitry is interchangeable through an opening in the front end.