Having Backplane Connection Patents (Class 361/788)
  • Publication number: 20020085399
    Abstract: A modular DC power distribution system. A physically discrete input conversion module is utilized for converting a source AC signal to a high voltage DC signal. Multiple universal mounting sites are provided in a power supply backplane for engaging one or more of such input conversion modules. Within the power supply backplane, the high voltage DC signal is delivered to a DC distribution bus. A physically discrete DC step-down module is utilized for converting the high voltage DC signal from the DC distribution bus to a point-of-load DC signal distributable to application boards. The power supply backplane includes multiple universal mounting sites wherein one or more DC step-down modules may be installed or removed. In another embodiment, the DC power distribution system of the present invention includes a pre-charge system for permitting the input conversion modules and the DC step-down modules to be hot plugged into the power supply backplane.
    Type: Application
    Filed: December 28, 2000
    Publication date: July 4, 2002
    Applicant: International Business Machines Corporation
    Inventors: Terry Brooks, Girish Chandra Johari
  • Patent number: 6411506
    Abstract: A web server chassis having a plurality of web server processing cards coupled with a midplane is provided. A first network interface card may also be coupled with the midplane. The midplane may include printed circuitry operable to provide data communications between the plurality of web server processing cards and the first network interface card. A second network interface card may also be coupled with the midplane, the second network interface card operable to couple the plurality of web server processing cards with a private network. In a particular embodiment the first network interface card may be operable to couple the plurality of web server processing cards with a public network. A third network interface card may also be provided. The third network interface card may be operable to couple the plurality of web server processing cards with a management network.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: June 25, 2002
    Assignee: RLX Technologies, Inc.
    Inventors: Christopher G. Hipp, David M. Kirkeby
  • Publication number: 20020071260
    Abstract: An electronic board assembly carrying connectors on each side of its lower edge which is adapted to withstand the relatively strong forces required to insert or remove the assembly, e.g., from a backplane board, and yet provide many electrical contacts along the interconnection sites. The electronic board assembly comprises two symmetrical elementary PCBs electrically coupled together, each carrying a connector on its external lower edge. In one embodiment, these two PCBs are coupled together by a flexible adhesive insulative layer and maintained by mechanical devices such that the distance between these two connectors is set to a predetermined distance (to align precisely with the backplane board). The mechanical device used to maintain a predetermined distance between the two connectors of the assembly may comprise a U-shaped member, the upper part of this member being strategically inserted between these connectors.
    Type: Application
    Filed: December 10, 2001
    Publication date: June 13, 2002
    Applicant: International Business Machines Corporation
    Inventors: Bruno Centola, Claude Gomez, Christian Ouazana
  • Patent number: 6394815
    Abstract: A device for connecting an array of electronic-card-carrying modular structures to an external installation with which a flow of signals can be established, and also providing communication between the various modular structures. The device includes, near the array of modular structures, a plate provided with openings, terminal connection blocks coming from the installation, which should each be inserted into the openings and coupled directly to a connection block carried by a modular structure of the array and, fastened to the plate, a circuit for distributing signals between various modular structures, which is protected from the ambient environment. Such a device may find particular application to aircraft.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: May 28, 2002
    Assignee: Thomson-CSF Sextant
    Inventors: Claude Sarno, Henri Bouteille
  • Patent number: 6392142
    Abstract: A back panel has front-surface-side connectors on the front surface thereof and rear-surface-side connectors on the rear surface thereof. A plurality of front-surface-side printed wiring boards are mounted on the back panel as a result of connectors provided on an end of the plurality of front-surface-side printed wiring boards being connected with the front-surface-side connectors. A plurality of rear-surface-side printed wiring boards are mounted on the back panel as a result of connectors provided on ends of the plurality of rear-surface-side printed wiring boards being connected with the rear-surface-side connectors. When seen from the front side of the back panel, the front-surface-side connectors and the rear-surface-side connectors are orthogonal, and the front-surface-side printed wiring boards and the rear-surface-side printed wiring boards are orthogonal.
    Type: Grant
    Filed: April 8, 1999
    Date of Patent: May 21, 2002
    Assignee: Fujitsu Limited
    Inventors: Yoshinori Uzuka, Koji Hanada
  • Patent number: 6388895
    Abstract: Telecommunication main distribution frame structure including a PC board, several pairs of insertion pins, four insertion seats, four buses, four corresponding insertion seats connected with one end of the buses and four connectors connected with the other end of the buses. The PC board is formed with several insertion holes and soldering holes electrically connected with each other. The insertion seats are soldered at the soldering holes of the PC board. The corresponding insertion seats are inserted in the insertion seats. The PC board has a left board, a middle board and a right boards integrally connected with each other. Each of two openings of the insertion hole is provided with a circle of shallow conductive face divided-by a locating split into a left and a right halves. Each of two openings of the soldering hole is provided with a shallow conductive face. The insertion pin is a rectangular column made of insulating material.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: May 14, 2002
    Assignee: Ching Feng Blinds Ind. Co., Ltd.
    Inventor: Pey-Son Hsu
  • Patent number: 6377471
    Abstract: An apparatus and methods are provided for interfacing a disk drive to a computer system without requiring conventional power and signal cables between the apparatus and the disk drive. An interface assembly comprises a set of power connectors and a set of signal connectors for receiving corresponding connectors of a disk drive. One or more of the assembly connectors (e.g., the power connectors) are translatable in at least one dimension so that the assembly is not limited to disk drives having a particular spacing between their power and signal connectors. The interface assembly may comprise two printed circuit boards (PCB) or backplanes—one for the power connectors and one for the signal connectors. In this configuration one of the PCBs defines a set of apertures through which the connectors of the other PCB protrude, and the other PCB is slidably or otherwise translatable along a portion of the length of the first PCB so that the protruding connectors are movable within the apertures.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: April 23, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: Fay Chong, Jr., William L. Grouell
  • Patent number: 6377469
    Abstract: Electrical assemblies are introducable into the backplane via plug-connector systems. A processor assembly having a processor unit is thereby connectible to at least one bulk storage (LW1, . . . ,LW4) via a separate and/or control bus (DB). The respective bulk storage is accommodated on a separate bulk storage assembly. The data and/or control bus proceeding from the processor unit is conducted via the processor assembly, the backplane (BP) and the respective bulk storage assembly, being conducted thereover at least largely in the form of printed interconnects.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: April 23, 2002
    Assignee: Siemens Aktiengesellschaft
    Inventor: Rudolf Olwitz
  • Publication number: 20020021558
    Abstract: A device for transmitting signals between an automation system and field devices comprises a supporting plate and modules which are attachable to said supporting plate. The modules are provided with terminals especially for field devices. The supporting plate has arranged thereon data lines of a local bus and voltage-supply lines. The modules have at least local bus interfaces. The device additionally comprises at least one bus coupling module which is attachable to the supporting plate and which is provided with a local bus interface and a field bus interface for communication with said modules and said automation system.
    Type: Application
    Filed: May 22, 2001
    Publication date: February 21, 2002
    Inventors: Gerhard Schwarz, Udo Becker, Rainer Hillebrand
  • Patent number: 6347963
    Abstract: A system and method for converting the numerous quantities, types, and arrangements of plug-in card connectors, usually disposed on the backplane of equipment systems, to an orderly and standardized array of external connectors. The external connectors facilitate the electrical connection between the cards and one of a variety of specific external cable connectors.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: February 19, 2002
    Assignee: Cisco Technology, Inc.
    Inventors: Dean R. Falkenberg, Edward T. Iwamiya, Paul M. Elliot, Dyke T. Shaffer
  • Patent number: 6349036
    Abstract: A computer functional card adapting seat comprises a base and at least one computer functional card. The base has a circuit substrate therein; At least one terminal slot is formed in the circuit substrate. Each terminal slot is connected to a circuit control unit of the circuit substrate. At least one universal serial bus inserting hole, a first inserting hole for being supplied with DC power, and a second inserting hole for being connected to a computer are installed on the base. The universal serial bus inserting hole, and first and second inserting holes are connected to the circuit control unit. Thereby, the computer functional card is formed on the base for being communicated to a computer without needing to detach the case of the computer mainframe.
    Type: Grant
    Filed: July 25, 2000
    Date of Patent: February 19, 2002
    Assignee: Jess-Link Products Co., Ltd.
    Inventors: Jessica Chang, Chao Jen Wang
  • Patent number: 6349037
    Abstract: An electrical machine, such as a router, switch, hub, etc., includes a housing in which a Primary Backplane and Secondary Backplane are mounted in stacked spaced relationship. A primary Bus is fabricated on the Primary Backplane and a secondary Bus is fabricated on the Secondary Backplane. Connectors with feed through elements provide mechanical support and electrical transmission between the Primary Backplane and Secondary Backplane.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: February 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: Roy Lee Draughn, Christopher Lee Durham, Robert Fung-chen Pan, Theodore Brian Vojnovich
  • Patent number: 6344975
    Abstract: The process of prototyping circuits such as a backplane or a circuit board has been modularized for achieving marked reductions in costs, time, and construction errors. Rather than repeating the recurring tasks, such as making bus connections between different circuit boards, of the prototyping process, the present invention implements a plurality of modules which can be separably coupled into an assembly having a planar arrangement for prototyping circuits, where each module specializes in a particular task. In the preferred embodiment, the plurality of modules includes a data bus module, a switchable data bus module, a power bus module, and a wire-wrap module. Each one of the plurality of modules includes a coupling face configured for coupling to one or more circuit boards.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: February 5, 2002
    Assignee: Lucent Technologies Inc.
    Inventor: Christopher R. Gayle
  • Publication number: 20020012236
    Abstract: An electronics cabinet is described as being suitable for use in an aircraft. Various embodiments of the cabinet include a databus that facilitates data communications between circuit boards inserted into the cabinet. The cabinet also preferably includes access holes that allow inserted circuit boards to connect directly to an aircraft wiring harness.
    Type: Application
    Filed: December 31, 1998
    Publication date: January 31, 2002
    Inventor: MARIO DIMARCO
  • Publication number: 20020012235
    Abstract: A modular mounting system which allows a circuit board to be removed, inserted or replaced through the front of the mounting frame without deactivating power to the equipment, and in the preferred embodiment without detaching any external cables. Connections for external equipment are disposed along the rear edge of the circuit board, and a row of contacts for the internal connections is provided along the bottom edge of the circuit board. The system of the invention provides a releasable connector which retracts the connector pins into a housing when a circuit board is inserted or removed, thus eliminating the possibility of a contact on the circuit board touching a live connector pin. In the preferred embodiment the external connections are made through adaptors that plug into external cable connectors provided on a connector plate detachably affixed to the rear of the mounting frame.
    Type: Application
    Filed: June 28, 2001
    Publication date: January 31, 2002
    Inventors: Richard A. Kupnicki, John Kupnicki, John E. Brook
  • Patent number: 6335867
    Abstract: Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: January 1, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Ishibashi, Takehisa Hayashi, Tsutomu Goto, Akira Yamagiwa, Tsuyoshi Watanabe
  • Patent number: 6328572
    Abstract: The motherboard MB1 of the present invention is a motherboard comprising a plurality of plug connectors 12 installed on the front face of the board 11 and a bus line for inter-connecting these plug connectors so as to allow inter-communication of daughter boards DB1-DB7 connected to the plug connectors 12. The motherboard is configured such that a termination board TB1 having a terminating resistance to decrease reflection noise of the bus line is connected to the plug connector at the last slot S8 of the bus line among the plug connectors 12, 12, . . . installed on the front face of the motherboard. Alternatively, the motherboard is configured such that the termination board is connected to the rear face of the last slot S8.
    Type: Grant
    Filed: July 27, 2000
    Date of Patent: December 11, 2001
    Assignee: Kel Corporation
    Inventors: Hiroshi Higashida, Kimiyasu Makino
  • Patent number: 6325636
    Abstract: A midplane printed circuit board having a plurality of first connectors operable to receive a plurality of web server processing cards is provided. A plurality of second connectors operable to receive a plurality of network interface cards may also be provided. Printed circuitry associated with the midplane printed circuit board may operable to couple each first connector with an associate of the plurality of second connectors. A third connector may also be provided operable to receive a first power supply. In accordance with one embodiment of the present invention, the printed circuitry is operable to distribute power from the first power supply to the plurality of first and second connectors.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: December 4, 2001
    Assignee: RLX Technologies, Inc.
    Inventors: Christopher G. Hipp, Guy B. Irving, David M. Kirkeby, Walter R. Otto
  • Patent number: 6327159
    Abstract: A wireform bracket provides a simple, elegant, low-cost solution for managing a large number of cables, while also allowing ample airflow at the back of a computer system. A wireform bracket in accordance with the present invention includes a plurality of bends, with each bend proximate a connector on the backplane of a computer system when the wireform bracket is attached to the back of the computer system. As cables are connected to the back of the computer system, each cable is fastened to the nearest bend using a tie-wrap, or some other cable fastening method known in the art. The present invention minimizes potential strain at the connectors by shifting any strain to the point at which the cable is attached to the wireform bracket, while also minimizing the disruption of airflow in the area immediately behind a computer system. In one embodiment, a wireform cable is formed from a ⅛ inch thick piece of steel wire, though other materials and thicknesses may be Mused.
    Type: Grant
    Filed: April 29, 1999
    Date of Patent: December 4, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Douglas Davies, Michael Wortman
  • Patent number: 6324610
    Abstract: A shared communications device includes a multi-port jack housing having portions defining a plurality of recesses extending inwardly from the front for receiving respective mating plugs. Signal connectors are preferably positioned within each of the recesses and define respective communications ports. A circuit board is positioned within the multi-port jack housing and preferably extends adjacent the back. The shared communications device preferably includes at least one shared communications processor mounted on the circuit board and connected to the plurality of communications ports for processing inbound and outbound communications signals so that the signals are shared among the communications ports. A shared communications processor preferably communicates with two or more of the communications ports. In embodiments including a plurality of shared communications processors, a communications repeater bus is provided on the circuit board interconnecting the shared communications processors.
    Type: Grant
    Filed: June 15, 1999
    Date of Patent: November 27, 2001
    Assignee: Stratos Lightwave, Inc.
    Inventors: Randal B. Lord, Robert M. Scharf
  • Patent number: 6320750
    Abstract: A line replaceable module (LRM) configured with a plurality of mini-modules, each of which have relatively higher contact densities than currently available LRMs with the same form factor, for example, a Standard Electrical Module-Size E (SEM-E) form factor. The mini-modules are significantly less expensive than an entire module allowing such mini-modules to be disposable, eliminating relatively costly fault diagnostics and repair. Each mini-module includes a printed circuit board which includes a rigid primary portion, a rigid secondary portion and flexible portion interconnecting the primary and secondary portions. The rigid secondary portion may be configured to provide dual-sided interconnection to a backplane data bus. Use of the dual-sided rigid secondary portion provides for generous spacing for contact densities much higher than known contact densities for LRMs with the same form factor. The rigid primary portion carries the components forming the LRM.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: November 20, 2001
    Assignee: TRW Inc.
    Inventors: Barton G. Shaler, Donald A. Porter, Milton F. Damerow
  • Patent number: 6308235
    Abstract: A communications device includes a multi-port jack housing having portions defining a plurality of recesses extending inwardly from the front for receiving respective mating plugs. Signal connectors are preferably positioned within each of the recesses and define respective communications ports. A circuit board is positioned within the multi-port jack housing and preferably extends adjacent the back. The communications device preferably includes at least one communications processor mounted on the circuit board and connected to the plurality of communications ports for processing inbound and outbound communications signals. A communications processor preferably communicates with two or more of the communications ports. In embodiments including a plurality of communications processors, a communications bus is provided on the circuit board interconnecting the communications processors. The signal connectors may be electrical and/or optical, and may be compatibility with an RJ-45 jack.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: October 23, 2001
    Assignee: Stratos Lightwave
    Inventors: Robert M. Scharf, Randal B. Lord
  • Patent number: 6301104
    Abstract: An interface card-type motherboard containing a CPU, chipset, and memories. The interface card-type motherboard can be directly plugged to the original motherboard of a computer so as to upgrade the computer, whereby the computer can execute new software and connect with new peripheral devices.
    Type: Grant
    Filed: September 17, 1999
    Date of Patent: October 9, 2001
    Assignee: FriendTech Computer Co., Ltd.
    Inventor: Ta-Shin Hu
  • Patent number: 6288902
    Abstract: The present invention provides a modular data storage system that can constraint movement of a data storage module within an enclosure during operation, handling, and transportation. The present invention achieves the objective by employing compliant features at strategic locations in the data storage system by utilizing shock/vibration isolators and the frictional forces generated by the compliant elements to introduce damping effects. In addition, this invention provides a locking mechanism that will allow the user to smoothly insert, remove and firmly grip a data storage module.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: September 11, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Kwang Ho Kim, Julie McDonald
  • Patent number: 6285563
    Abstract: A support bracket, which can be used in a method of reinforcing a printed circuit board, secures the printed circuit board, such as a backplane having a plurality of electrical connectors that engage corresponding electrical connectors of daughter boards. The support bracket includes a cross member attachable to the printed circuit board in a direction substantially transverse to a direction of motion of the daughter boards. The support bracket also includes first and second end support members attached transversely to the cross member at corresponding ends of the cross member. The end support members are fixable to a support surface and are adapted to secure the support bracket in the direction of motion of the daughter boards.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: September 4, 2001
    Assignee: EMC Corporation
    Inventors: Erik Nelson, Edward Claprood, Paul T. Tirrell
  • Patent number: 6266252
    Abstract: A method and apparatus for enhancing memory speed and capacity utilizes a set of electronic switches to select a proper termination chip for the computer system bus. The apparatus includes one or more multi-sided termination boards with etched leads, lands and feed-throughs. The termination chips may be mounted on either one side, or both sides of each board. Connection between the termination boards and the mother board are made by means of a comb of contact fingers or edge-connector which mates with a connector on the mother board. The data lines and address lines of the computer bus are distinct from each other, and routed to the termination board via the edge connector. A set of CMOS TTL or FET switches are located adjacent to the comb, and are switched on and off by a decoded combination of address, control, or data lines or by a distinct enable line provided by the CPU, controller or other decoding means located on the motherboard.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: July 24, 2001
    Inventor: Chris Karabatsos
  • Patent number: 6260089
    Abstract: A method and apparatus are provided for implementing connections with circuits, such as very large scale integrated (VLSI) semiconductor integrated circuits. A physical connection assignment arrangement includes a plurality of connections, each having predefined, dual functions. A control signal identifies an orientation of the physical connection assignment arrangement. A selector logic circuit contained within the circuit is coupled to the plurality of predefined, dual function connections. The selector logic circuit receives the control signal and responsive to the control signal, selects one of the predefined dual functions for each of the plurality of connections.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: July 10, 2001
    Assignee: International Business Machines Corporation
    Inventor: Kerry Christopher Imming
  • Patent number: 6253266
    Abstract: A card cage that includes a top plane and a bottom plane and a card for use with the card cage. The card cage may operate in a variety of settings including a redundancy scheme and a load sharing scheme. The top plane and bottom plane, which replace the back plane that appears in a traditional card cage, are able to simultaneously receive a card (or cards). The top plane and bottom plane include connectors which may be coupled with other connectors on the top side and bottom side of the card to secure the card in the card cage.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: June 26, 2001
    Assignee: Inet Technologies, Inc.
    Inventor: Raffi S. Ohanian
  • Patent number: 6241530
    Abstract: The present invention is a backplane for printed circuit board modules. The backplane includes first and second redundant, signal transmission channels. Multiple pairs of substantially identical first and second connectors are mounted on the backplane. The first connector of each of the multiple pairs is connected to the first channel and the second connector is connected to the second channel. The first and second connectors each have a long dimension and a short dimension, and are positioned on the backplane with the first connector above the second connector and with the short dimensions of the first and second connectors being most proximate. Modules connected to the second connectors of are oriented substantially 180° opposite to the modules connected to the first connectors. This allows modules on the first channel to be quickly discerned from the modules of the second channel.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: June 5, 2001
    Assignee: Honeywell Inc.
    Inventors: Brett A. Eddy, Jason L. Glithero
  • Patent number: 6243273
    Abstract: Apparatus for mounting retrofit equipment modules into the equipment mounting cabinetry of an installed modular equipment signal network includes an interface module and mini-backplane combination which is adapted for insertion into the equipment cabinetry with electrical signal connection of the mini-backplane to the cabinetry master backplane, and for mounting retrofit modules inserted therein in electrical signal interconnectivity with others of the network equipment modules.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: June 5, 2001
    Assignee: Nortel Networks Limited
    Inventors: Roger Arthur Beun, William Locke Craig, Jr., Joseph John Lommen, Janice Parker Broniak, Derek Chunchi Liou, Jeffrey Scott Taylor
  • Patent number: 6239985
    Abstract: A method and apparatus for distribution of electrical signals in a circuit board. Specifically, the circuit board comprises a printed circuit board and a plurality of connectors attached to the circuit board for receiving components such as logic cards which each require a clock input. Each of the connectors may have a plurality of pins. A plurality of electrical conductors associated with the circuit board electrically couple a corresponding pin for a clock input from each connector to a common point by individual one of the plurality of electrical conductors. Each of the plurality of electrical conductors are so arranged that to have approximately the same length.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: May 29, 2001
    Assignee: International Business Machines Corporation
    Inventors: Jacques Feraud, Michel Verhaeghe
  • Patent number: 6239984
    Abstract: A backplane circuit board for an electronic chassis includes a bracket and an upper circuit board operatively connected to the bracket. A lower circuit board is also operatively connected to the bracket wherein the upper circuit board is offset from the lower circuit board and the upper circuit board is parallel to the lower circuit board.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: May 29, 2001
    Assignee: 3Com Corporation
    Inventors: Amir Koradia, Philip A. Ravlin, Douglas J. Pogatetz, Gerald A. Greco
  • Patent number: 6231139
    Abstract: A computer enclosure is used to mount a slot cover having a bent portion. The computer enclosure includes a rear panel, a fastener movably attached to the rear panel, and a fixing cover pivotably mounted to the rear panel and engaging with the fastener. The rear panel has a fixing plate for abutment of the bent portion of the slot cover. The fixing cover has a number of spring fingers for pressing the fixing plate of the rear panel. The bent portion of the slot cover is secured between the spring finger and the fixing plate thereby fixing the slot cover.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: May 15, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chia Hua Chen
  • Patent number: 6205033
    Abstract: The circuit board guide apparatus is comprised of multiple guides (105-107) that hold the edges of the circuit boards. The apparatus is additionally comprised of the rear portion (200) having a backplane retention portion and a rear snap-in sel-fretention feature. The apparatus has a front portion (300) that comprises the snap-in, self-retention feature. The guide retention devices (110-112) elevate the guides (105-107) from the sides of the electronic assembly enclosure and keep the guides (105-107) separate and parallel.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: March 20, 2001
    Assignee: Nortel Networks Limited
    Inventor: Joe Kelemen
  • Patent number: 6202110
    Abstract: Memory cards for a computer system are placed back-to-back on an active backplane, using wiring topology where the memory address and data busses are wired to pairs of symmetrical connectors. This topology takes advantage of symmetrical memory card pinouts to improve memory bus performance while reducing backplane cost and wiring complexity. The symmetrical layout of the data and address wiring allows two memory cards to be placed back-to-back on the backplane, maintaining the same relative position of data and address pins between cards. Since the data and most of the address lines are common to each card, and any such data or (common or non-unique) address pin on one card can be wired to any other such data or address pin, respectively, on the other card, the back-to-back arrangement provides for minimal address and data bus interconnect lengths between connectors.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: March 13, 2001
    Assignee: International Business Machines Corporation
    Inventors: Paul William Coteus, Robert Dominick Mirabella
  • Patent number: 6201708
    Abstract: A pin connection arrangement spanning a series of slots on a backplane 1 printed circuit board. The arrangement allows replaceable printed circuit board assemblies to be paired or mated while further allowing the printed circuit board assemblies to vary incrementally in width. The printed circuit board assemblies can be one slot wide 10a, 10b, two slots wide, 12a, 12b, three slots wide, 14a, 14b, on up to ‘n’ slots wide while being paired to a mate for sparing purposes. Backplane 1 provides a direct connection between paired printed circuit boards. The arrangement(s) allow expansion of printed circuit board area and volume while supporting paired applications that require only a single slot for a backplane connection per printed circuit board. Backplane 1 can be used for different width printed circuit board assemblies.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: March 13, 2001
    Assignee: Nortel Networks Limited
    Inventors: Neal W. Lewis, Lawrence F. Bizga, John R. Moseby, Franklin A. Lynch
  • Patent number: 6195266
    Abstract: A slot-type processor and one or more cache modules are incorporated into a vertically oriented, multiple chip module (CM) that is mounted to a printed circuit board. The MCM operates at ultra high frequencies and very high temperatures. Each component of the MCM has a heatsink, a thermal plate, and a series of mounting clips and screws which combine to dissipate heat. The heatsinks and thermal plates generate most of the electromagnetic interference (EMI) since they are not attached or grounded to the board. A series of alignment posts extend from the board and are used to individually and slidably mount each of the components to the board. Each thermal plate is grounded to the posts with grounding clips. The clips maintain contact with the thermal plate through wiping elements. Additional pressure is applied to the wiping elements through a post retaining bracket. The components are fully seated and retained in position with retaining cams.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: February 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: Russell S. Padgett, William D. Owsley, Rudolf E. Rehquate, Daniel J. Hunt, Edward N. Dials, A. Lamond Hodges
  • Patent number: 6191953
    Abstract: Structure for mounting a circuit card to a sheet metal wall includes upper and lower standoffs formed integrally with the wall. Each upper standoff extends a predetermined distance from the wall and is adapted to receive and hold a fastening member. Each lower standoff is formed integrally with the wall and includes a projection portion extending the same predetermined distance away from the wall and a hook portion having a support portion extending away from the projecting portion and a securement portion extending upwardly from the support portion and spaced from the projecting portion by a distance equal substantially to the thickness of the circuit card. Accordingly, a lower edge of the circuit card is supported by each lower standoff hook portion and fastening members are extended through holes in the circuit card to threadedly engage the upper standoffs.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: February 20, 2001
    Assignee: Avaya Technology Corp.
    Inventors: Trevor J. Aggus, Matthew J. Gawron
  • Patent number: 6181570
    Abstract: A module of an electrical device has a printed circuit board which may be pushed into the device and plugged onto a backplane of the device. A cuboid cage is connected to the printed circuit board of the device. The cuboid cage has a backplane arranged perpendicular to the printed circuit board of the device and is connected to the circuit board by means of connectors. The backplane of the cage has its own connectors for electrical connection to separate modular cage push-in units, in the form of cards or boards, which may be inserted into the cuboid cage of the device.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: January 30, 2001
    Assignee: Siemens Nixdorf Informationssysteme Aktiengesellschaft
    Inventors: Friedhelm Ellebrecht, Franz-Josef Knoop
  • Patent number: 6175507
    Abstract: An apparatus for mounting a backplane circuit board to an electronic chassis is provided. An electronic chassis includes a first card guide assembly and a second card guide assembly. The first card guide assembly includes first and second guide pins. The first guide pin of the first card guide assembly is positioned adjacent a first end of the first card guide assembly and the second guide pin of the first card guide assembly is positioned adjacent a second end of the first card guide assembly. The second card guide assembly includes first and second guide pins. The first guide pin of the second card guide assembly is positioned adjacent a first end of the second card guide assembly and the second guide pin of the second card guide assembly is positioned adjacent a second end of the second card guide assembly.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: January 16, 2001
    Assignee: 3Com Corporation
    Inventors: Amir Koradia, Philip A. Ravlin, Douglas J. Pogatetz, Gerald A. Greco
  • Patent number: 6172876
    Abstract: A unique cabinet mounted I/O assembly adapted for integration into a control system which allows a block I/O assembly to be mounted in both sides of the cabinet allowing a blind fit of power and signal connections insuring that power will be provided to the block I/O assembly before any application of signals thereto and preventing any mismatching of I/O units to wrong processor blocks in the cabinet by a color matching scheme.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: January 9, 2001
    Assignee: Elsag International N.V.
    Inventors: Richard E. Benson, Jr., Thomas H. Burchard, Youngminh Kim, Donald L. Oros, David S. Priscak, Arthur Rousmaniere
  • Patent number: 6169658
    Abstract: A rack (70) for a plurality of electronics modules (36) that does not include inlet and outlet air cooling plenums. The rack (70) includes a heat exchanger (72) including three separate sections (78, 80, 82), where each section (78, 80, 82) include spaced-apart parallel fins (84, 86, 88). First and second end sections (80, 82) of the heat exchanger (72) include cooling fins (86, 88) that extend parallel to each other in a front-to-back direction relative to the direction the modules (36) are slid into the rack (70). The first and second end sections (80, 82) are positioned at opposite ends of a center section (78), where the fins (84) of the center section (78) extend in a direction transverse to the direction the modules (36) are slid into the rack (70). The channels between the fins (86, 88) in the first and second end sections (80, 82) are aligned with inlet and outlet ports (94, 98) extending through a back panel (52) of the rack (70).
    Type: Grant
    Filed: October 13, 1999
    Date of Patent: January 2, 2001
    Assignee: TRW Inc.
    Inventors: John J. Arena, David M. Smith, Richard A. Matonis
  • Patent number: 6163464
    Abstract: Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: December 19, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Ishibashi, Takehisa Hayashi, Tsutomu Goto, Akira Yamagiwa, Tsuyoshi Watanabe
  • Patent number: 6160716
    Abstract: A connector with a staggered contact design is described. The connector comprises a first row of connector pins, the connector pins alternately proximal pins and distal pins. The connector further comprises a second row of connector pins alternately proximal pins and distal pins. The distal pins of the connector carry the signals, while the proximal pins are ground or power signals.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: December 12, 2000
    Assignee: Rambus Inc
    Inventors: Donald Perino, David Nguyen
  • Patent number: 6154373
    Abstract: Secondary backplane boards are secured to a main backplane board to provide interconnection paths in a direction transverse to interconnection paths provided on the main backplane board, so that current manufacturing capabilities of multi-layer backplane boards are not exceeded.
    Type: Grant
    Filed: March 24, 1999
    Date of Patent: November 28, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Andrew C. Durston, Liang Hwang, Hector F. Rodriguez
  • Patent number: 6147863
    Abstract: An industrial computer including a passive backplane generally compliant with the PCI/ISA industrial standard promulgated by the PICMG technical committee, but with certain exceptions. One exception being that the plug-in CPU card has been replaced by a plug-in "feature" card which includes features normally found on prior art CPU cards but not the microprocessor. Also the in-line ISA and PCI backplane connectors used for conventional CPU cards have been replaced by preferably two in-line SECC connectors for the feature card. In the preferred embodiment a third SECC connector is used to connect a PENTIUM II to the backplane, and a further connector is used to connect the PENTIUM II's voltage regulator module to the backplane. All communications between the processor, feature card, voltage regulator module, and backplane I/O buses are via signal lines in or on the backplane. This invention allows the entire CPU and associated features to be quickly swappable in case of malfunction.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: November 14, 2000
    Inventors: Ronald L. Moore, Thomas T. Rittmaster
  • Patent number: 6147871
    Abstract: A low profile riser card assembly for a computer system is provided by incorporating two uniaxial back to back peripheral connectors. The peripheral card connectors extend outwardly along a single axis from opposing sides of a riser card. The riser card is attached to a riser card connector mounted on the circuit board and is held in a perpendicular to the axis and in an upright position with respect to the circuit board. In the assembly of the present single invention, the uniaxial back to back peripheral card connectors are retained on the riser card in a parallel orientation with respect to the riser card connector to produce a low profile computer assembly.
    Type: Grant
    Filed: November 19, 1998
    Date of Patent: November 14, 2000
    Assignee: International Business Machines Corporation
    Inventors: John R. DeWitt, Jay Henry Neer
  • Patent number: 6144561
    Abstract: A reconfigurable connectorization panel assembly for a circuit board housing rack or chassis, particularly suitable for use in cable television (CATV) headend equipment. Each circuit module for use in the rack has an associated rear panel assembly or "connectorization panel" that bolts onto the rear side of a chassis which supports the rack and a backplane. The connectorization panels extend plug-action connectors through openings in the rear panel of the chassis and in the backplane, and mate with corresponding connectors on the circuit modules. On the rear side, the connectorization panels provide appropriate drop side connectors required for input/output signal cabling. The connectorization panel adapts a particular slot in the chassis for a particular type of input/out cabling and connectors. The slot can be reconfigured for a different type of circuit module by affixing a different type of connectorization panel.
    Type: Grant
    Filed: December 1, 1998
    Date of Patent: November 7, 2000
    Assignee: Scientific-Atlanta, Inc.
    Inventors: James Eugene Cannella, Jr., Tareq K. Hassan, Kamal I. Parikh, Robert A. Saluski
  • Patent number: 6142830
    Abstract: A circuit board such as a memory module board mounts a plurality of memory modules that are electrically connected to a module bus on a first surface of the board. The module bus is coupled to a connector at a first end thereof that permits an electrical coupling of a plurality of electrical conductors of the module bus to an external large integrated circuit board, and a terminating resistor device at a second end thereof for properly terminating predetermined ones of the plurality of electrical conductors of the module bus. The module bus is extended beyond the last memory module along the bus by a length which is sufficient to substantially limit reflections and/or crosstalk between the conductors and thereby improve signaling along the module bus. In a first embodiment, the module bus is extended around an edge of the board and for a predetermined distance over any unused portions of the backside of the board.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: November 7, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventor: Steffen Loeffler
  • Patent number: 6127748
    Abstract: An installation for the electrical connection between an assembly of items of electrical equipment which are affixed onto a common baseplate and a system for command and control of that assembly. The installation includes an electrical interface device which provides a connection of signals from the equipment in the assembly with the signal linkage connected to the system. The interface device can be mechanically dissociated from the base plate and is attached to it by a detachable fixing element. The device includes a casing which houses a printed circuit by which two connectors are located which respectively provide the electrical connection with the assembly and with the linkage and which are interconnected through a printed circuit. One of the connectors is specifically adapted to the type of linkage used.
    Type: Grant
    Filed: March 15, 1999
    Date of Patent: October 3, 2000
    Assignee: Schneider Electric SA
    Inventors: Michel Girard, Emmanuel Latour, Didier Sibille