Having Backplane Connection Patents (Class 361/788)
  • Patent number: 7083422
    Abstract: A switching system includes a backplane having slots, each including a first set of connectors designed according to a common specification. The slots include at least one extended slot and at least two normal slots, each normal slot including the first set of connectors, each extended slot including the first set of connectors and an additional second set of connectors. The backplane has signal lines to support a data channel between first set of connectors of the normal slot and the extended slot. The backplane also has signal lines to support a data channel between first set of connectors of the normal slot and the second set of connectors of the extended slot.
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: August 1, 2006
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, David R. Formisano, Marwan A. Khoury, Ho Wang, Arsham Andy Saffarian, Jerome A. Saint-Cyr, Douglas L. Stahl
  • Patent number: 7075795
    Abstract: A connector is configured for insertion and removal of a digital device. The connector has contacts arranged to make electrical connection to conductors on the digital device while the digital device is inserted in the connector. A first electromagnetic coupler is connected to at least one of the contacts of the connector. The electromagnetic coupler is configured for electromagnetic coupling at an interface to a second electromagnetic coupler that is connected to a communication bus.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: July 11, 2006
    Assignee: Intel Corporation
    Inventors: Yinan Wu, Mark Naylor, John L. Critchlow, Karl Wyatt, John R. Benham
  • Patent number: 7064962
    Abstract: A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features a transmitter port and receiver port for connection with separate parallel optic cables for separately transmitting and receiving data and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module having pluggable edge connectors. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: June 20, 2006
    Assignee: Stratos International, Inc.
    Inventors: William Wang, Hengju Cheng, WeiZen Lo
  • Patent number: 7064961
    Abstract: A communication device which is constructed so as to permit efficient mounting of cards such as printed boards, thereby enhancing convenience and economy and ensuring high-quality communications. A basic unit is constituted by a basic board having a common control section packaged thereon, and a basic back wiring board on which are arranged a basic card connector for mounting a detachable card unit for processing signals and a basic link connector for additionally connecting such a card unit and which has wiring formed on a substrate thereof. An extension unit is connected to the basic link connector to permit additional connection of the card unit.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: June 20, 2006
    Assignee: Fujitsu Limited
    Inventors: Akira Sawada, Mitsuaki Hayashi, Hironori Tanaka, Kouichi Kuramitsu, Miyuki Hashimoto, Wataru Takano, Mitsuo Fujimura
  • Patent number: 7060894
    Abstract: In a device for connecting microcomponents, in particular microreactors, which preferably have a plate-shaped design and preferably consist of silicon, a sealing plate having apertures which correspond to apertures in the microcomponents is arranged between the microcomponents.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: June 13, 2006
    Assignee: Merck Patent GmbH
    Inventors: Guido Pieper, Michael Schmelz, Hanns Wurziger, Norbert Schwesinger
  • Patent number: 7057901
    Abstract: A system having a removable protective enclosure for an electronic component. The protective enclosure may have a base and a circuit board that may be captured by the base without use of a tool or a separate fastener. A memory module may be disposed on the circuit board. The protective enclosure may be adapted to be mechanically and electrically coupleable to an enclosure.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: June 6, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brett D. Roscoe, George D. Megason, Christian H. Post
  • Patent number: 7057900
    Abstract: A system having a removable protective enclosure for an electronic component. The protective enclosure may have a base and a circuit board that may be captured by the base without use of a tool or a separate fastener. A memory module may be disposed on the circuit board. The protective enclosure may be adapted to be mechanically and electrically coupleable to an enclosure.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: June 6, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brett D. Roscoe, George D. Megason, Christian H. Post
  • Patent number: 7058274
    Abstract: A modular and adjustable backplane assembly for providing a fiber-optics backplane interface to a plurality of router cards functioning as a data router is provided. The assembly includes a first portion having a first array of connectors for interfacing with a compatible array of second connectors engaging specific ones of the router cards, and a second portion having a second array of connectors for interfacing with a compatible array of second connectors engaging specific others of the router cards. The mechanics of the assembly enable a moveable attachment with respect to the first and second portions such that they may be positionally adjusted during mounting, and wherein external data paths are provided from individual ones of the connectors to individual others of the connectors by fiber-optic conductors.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: June 6, 2006
    Assignee: Pluris, Inc.
    Inventor: Peter John Doyle
  • Patent number: 7057899
    Abstract: A compensating advanced feature patch panel that can include removable modular or fixed electronic components located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides communications between an insulation displacement connector (IDC) at a PD/User end, and any standard interface type using unshielded twisted pair cables, such as an RJ45 connector at a switch end at performance levels of at least category 3, 5, 5e, 6 and/or higher (e.g. 6e or 7) and equivalent performance levels by compensating for the active electronics used in providing advanced features. Compensation is achieved in part through the separation and isolation of active and communication circuit elements.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: June 6, 2006
    Assignee: Hubbell Incorporated
    Inventors: Shadi A. AbuGhazaleh, Robert C. Baxter, Rehan Mahmood, Alan C. Miller, Michael R. O'Connor
  • Patent number: 7050307
    Abstract: Circuit board orientation in a computer system. A system includes a first set of circuit boards and a second set of circuit boards. The first set of circuit boards may be mated via a first and second set of connectors to the second set of circuit boards such that the first set of circuit boards is oriented substantially orthogonal with respect to the second set of circuit boards. Each of the boards may be accessible and hot swappable.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: May 23, 2006
    Assignee: Sun Microsystems, Inc.
    Inventors: Drew G. Doblar, Robert E. Cypher, Stephen K. Gee
  • Patent number: 7044745
    Abstract: An electronic device has several superposed main printed circuit boards (2, 3, 4), of which one has e.g. the electronic components of a radio, another has the electronic components of a multimedia device and a third has the electronic components of a vehicle navigation device. On the front side of the electronic device, a connection printed circuit board (9) which is oriented crosswise to the main printed circuit boards (2, 3, 4) is provided with plug-in connecting parts (11, 13, 15) which engage on the front side of the main circuit boards (2, 3, 4).
    Type: Grant
    Filed: November 1, 2001
    Date of Patent: May 16, 2006
    Assignee: Siemens Aktiengellschaft
    Inventors: Jörg Reinhardt, Joachim Spratte
  • Patent number: 7042717
    Abstract: An array of disk drives may be mounted onto a backplane that may slide as a single unit into an enclosure, such as a rack mounted enclosure. The backplane may allow the disk drives to be arranged in multiple columns and rows such that the disk drives are generally parallel to each other. Such an arrangement affords excellent airflow around the disk drives and greatly simplifies servicing of the disk array.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: May 9, 2006
    Assignee: LSI Logic Corporation
    Inventors: Mohamad El-Batal, Bret Weber, Mark Nossokoff
  • Patent number: 7042735
    Abstract: The invention efficiently mounts substrates to back planes and accomplishes high quality signal transfer. Connectors to which N adaptor substrates are fitted and connectors to which M bus switch substrates are fitted are provided to a multi-layered back plane. Signal pin groups of the connector on the adaptor substrate side are grouped into M data paths. Signal pins of the connector on the adaptor substrate side and corresponding signal pins of the connector on the bus switch substrate side are arranged horizontally in such a fashion as to exist on the same plane (with positions in a Z direction being substantially equal). Therefore, wiring patterns for connecting corresponding signal pins can be formed substantially linearly and a large number of substrates can be efficiently mounted to a limited area.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: May 9, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Tsutomu Koga, Mitsuru Inoue, Nobuyuki Minowa
  • Patent number: 7038918
    Abstract: A compensating advanced feature patch panel that can include removable modular or fixed electronic components located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides communications between an insulation displacement connector (IDC) at a PD/User end, and any standard interface type using unshielded twisted pair cables, such as an RJ45 connector at a switch end at performance levels of at least category 3, 5, 5e, 6 and/or higher (e.g. 6e or 7) and equivalent performance levels as required by compensating for the active electronics used in providing advanced features through the use of inductive, capacitive and reactive circuit elements to compensate for advanced feature electronics.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: May 2, 2006
    Assignee: Hubbell Incorporated
    Inventors: Shadi A. AbuGhazaleh, Robert C. Baxter, Rehan Mahmood, Alan C. Miller, Michael R. O'Connor
  • Patent number: 7035115
    Abstract: A backplane for a motor controller having a control module and one or more axis modules provides both low power and low powered signals and high power used to produce motor drive signals.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: April 25, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventor: Phillip John Walesa
  • Patent number: 7032129
    Abstract: An Integrated Communication System (ICS) with fail-over serial data connectivity is disclosed. In one aspect, an ICS may comprise a chassis including a System Switch Processor (SSP) for providing connectivity to a plurality of slots. A Serial Alarm Processor (SAP) may be operatively coupled to the ICS through one of the slots, an include at least one serial port for providing serial data connectivity. A Primary Single Board Computer (SBC) and at least one secondary SBC may be disposed in the slots. The ICS may be configured to pass control of serial data connectivity from the Primary SBC to a secondary SBC in the event of the failure of the Primary SBC. Various methods for fail-over serial data connectivity are also disclosed.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: April 18, 2006
    Assignee: Cisco Technology, Inc.
    Inventors: Lars Borresen, Sudhakar Valluru, William Davids
  • Patent number: 7031168
    Abstract: Module substrates each having the functions of input, power supply, and output/communication corresponding to the required model are attached to a base substrate having shared bus wiring. Thus, a main CPU of an input module can discriminate the respective module substrates to perform the control operation corresponding to the model, thereby sharing the module substrates among different models.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: April 18, 2006
    Assignee: Omron Corporation
    Inventors: Shigeyuki Kato, Takafumi Kishi, Maakazu Kido, Toshimichi Surga, Gen Yoneda, Akira Takaishi, Atsushi Mukai, Yoshihiro Nagami, Hirofumi Hosokawa
  • Patent number: 7027308
    Abstract: A PCB having a card slot receiving a card provided with signal input/output pins and a circuit element to provide extended capability is inserted, and having data transmission pins, a power pin and a ground pin in correspondence to the signal input/output pins, comprises an electronic device internally provided for impedance matching with the card, and having a first end connected to one of the data transmission pins and a second end connected to one of the power pin and the ground pin. With this configuration, a card slot internally comprises an electronic device for impedance matching, so that a space of the PCB can be efficiently utilized.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: April 11, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-Kwon Park, Chan-youn Won
  • Patent number: 7023845
    Abstract: The present invention provides a network device that fully utilizes the available space in a standard telco rack through the use of multiple mid-planes. Full utilization of available space allows a high switching capacity network device including both physical layer switch/router subsystems and upper layer switch/router subsystems to be fit in one telco rack. Inter-mid-plane connections may be provided by connecting switch fabric cards and/or control processor cards to each of the mid-planes. Providing a multi-layer network device in one telco rack allows for intelligent layer 1 switching (for example, dynamic network connection set up), allows for one network management system to control both layer 1 and upper layer networks and eliminates grooming fees.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: April 4, 2006
    Assignee: Ciena Corporation
    Inventors: Corey Simons, Peter B. Everdell, Brian Branscomb, Daniel I. Westerberg
  • Patent number: 7023703
    Abstract: A housing for an adapter module is provided with a bail latch mechanism that serves to engage and disengage the frame into which the adapter module housing fits. The housing is stamped and formed from a piece of sheet metal and the bail latch is rotatably mounted in the housing. The bail latch is movable between two positions and the bail latch engages a cam member that is stamped and formed in one side of the housing so that movement of one end of the bail latch over the cam member cams one of the two free ends of the bail latch inwardly into the housing to thereby release the housing from the adapter frame.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: April 4, 2006
    Assignee: Molex Incorporated
    Inventor: Kirk B. Peloza
  • Patent number: 7019984
    Abstract: The invention relates to an electrical connector that can be used to electrically connect a daughtercard to a backplane.
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: March 28, 2006
    Assignee: Litton Systems, Inc.
    Inventors: Michael P. Driscoll, Stephen Vetter, Robert M. Bradley, Lee A. Wolfel, Robert O. Beadle
  • Patent number: 7019983
    Abstract: An electronic assembly is described which includes a printed circuit board, and a processor and a memory mounted on the printed circuit board. A routing channel is provided in the printed circuit board comprising a plurality of conductors interconnecting the processor and the memory. A regulator assembly includes a regulator for providing power to the processor, a first connector mounted on the printed circuit board adjacent a first edge of the routing channel, and a second connector mounted on the printed circuit board adjacent a second edge of the routing channel opposite the first edge. The first and second connectors are coupled to the regulator and facilitate distribution of the power to the processor. The regulator and the first and second connectors form a bridge across the routing channel.
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: March 28, 2006
    Assignee: Newisys, Inc.
    Inventors: Leslie J. Record, William G. Kulpa, Robert Gontarek
  • Patent number: 7016202
    Abstract: A power actuation structure for turning electric power ON and OFF of a computer host through an extension mechanism without wiring includes a switch located on a circuit board of the computer host. The computer host has partitions to define installation areas for holding electronic devices. Each of the partitions has a displacement section corresponding to the switch. The displacement section has an actuator which may be driven to compress the switch to set the electric power ON or OFF.
    Type: Grant
    Filed: May 3, 2004
    Date of Patent: March 21, 2006
    Assignee: Evserv Tech Corporation
    Inventor: Shoei-Yuan Shih
  • Patent number: 7007809
    Abstract: A card cage includes first and second card cage walls; a first, upper pair of members, comprising a front and a rear member, supported between the first and second card cage walls; a second, lower pair of members, comprising a front and a rear member, supported between the first and second card cage walls; a backplane supported between the front members and the rear members; and a plurality of alignment pins. The alignment pins are inserted through corresponding holes in the backplane and the front and rear members.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: March 7, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Michael J. Greenside
  • Patent number: 7009848
    Abstract: Memory modules without signal-conditioning devices (unbuffered, unregistered) are provided in a system by using adapter cards that have signal-conditioning devices and are then operated in the manner of memory modules with signal-conditioning devices (buffered, registered). Systems can thereby be expanded in a very simple manner and can be flexibly adapted according to requirements, and for this purpose only one type (unbuffered, unregistered) of memory module is required.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: March 7, 2006
    Assignee: Infineon Technologies AG
    Inventors: Hermann Ruckerbauer, Maksim Kuzmenka
  • Patent number: 6998534
    Abstract: A partition structure of in a computer casing provides a partition with two guide grooves and a joining member with two engaging parts corresponding to the guide grooves respectively. Each of the guide grooves has an upper opening, a locating part and a lower opening respectively for engaging with engaging parts of the joining member. One of the guide grooves is shorter and the upper opening and the lower opening 322c are wider than rest part in the respective guide groove for facilitating the joining member 23 being assembled to or disassembled from the partition 32 handily.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: February 14, 2006
    Assignee: Asia Vital Component Co., LTD
    Inventor: Yen-Lin Chu
  • Patent number: 6994562
    Abstract: In an apparatus for multiplex communication, a bus line constitutes a bus type network for connecting a plurality of terminal communication equipments. A plug-shaped terminating resistance device is detachably provided at an end of the bus line to reduce reflection noise.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: February 7, 2006
    Assignee: Yazaki Corporation
    Inventors: Norihito Suzuki, Hisafumi Maruo, Masashi Nagao, Masayuki Saito, Masayuki Sato, Takanori Watanabe
  • Patent number: 6992255
    Abstract: An integrated circuit arrangement or package includes a set of contact pads arranged in a pattern and a multi-layer conductive structure, which electrically connects the set of contact pads to at least one signal line. The conductive structure provides impedance matching between the pads and the at least one signal line.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: January 31, 2006
    Assignee: International Business Machines Corporation
    Inventors: Modest Oprysko, Lei Shan, Jeannine M. Trewhella
  • Patent number: 6987674
    Abstract: Two sets of disk drives are mounted in a grid arrangement onto a backplane to form a removable multi-disk drive unit for a high capacity disk storage system. The removable units may be mounted into an enclosure that contains a RAID controller. The disk drives are mounted such that the longest edge of the disk drive is perpendicular to the plane of the backplane.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: January 17, 2006
    Assignee: LSI Logic Corporation
    Inventors: Mohamad El-Batal, Bret Weber, Mark Nossokoff
  • Patent number: 6985967
    Abstract: A data processing system including a plurality of web server processing cards coupled with a midplane is provided. A first network interface card may be coupled with each of the web server processing cards through the midplane. Each of the plurality of web server processing cards may be coupled with a public network communication router over a first communication path. The public network communication router may be coupled with a public network and operable to route data packets to and from the web server processing cards. In accordance with one embodiment, each of the plurality of web server processing cards may be coupled with a private network communication router, over a second communication path. In this embodiment, the private network communication router may be coupled with at least one private processing system operable to provide processing services upon receipt of a processing request from one of the plurality of web server processing cards.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: January 10, 2006
    Assignee: RLX Technologies, Inc.
    Inventor: Christopher G. Hipp
  • Patent number: 6977821
    Abstract: A backplane has a plurality of interface slots that each couple to a number of buses. Depending upon the embodiment, these buses include a power distribution bus, a digital ground bus, an earth ground bus, a system timing bus, a time division multiplexed bus, a system control bus, a hardware resource bus, a media data bus, and one or more network distribution buses. Various modules can be interfaced with the backplane and function independently and/or dependently upon one another, including shelf controllers, switches, and application boards. In one embodiment, the backplane can include two backplanes, wherein the second backplane further provides connections between such modules and one or more external connectors.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: December 20, 2005
    Assignee: 3Com Corporation
    Inventors: Salvador Aguinaga, Jr., Dwight Dipert, Martin Schwan
  • Patent number: 6966784
    Abstract: A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: November 22, 2005
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Koenraad F. Van Schuylenbergh, Armin R. Völkel, Thomas H. DiStefano, Michel A. Rosa, David K. Fork, Eugene M. Chow, Meng H. Lean
  • Patent number: 6965959
    Abstract: A system and method for introducing user-defined (e.g., proprietary) signals into a standard backplane. A front side backplane portion is provided with a set of connector holes that are electrically separated from corresponding connector holes provided on the backplane's rear side portion. Thus, whereas the separated front side connector portion is operable with standard bus signals, the rear side connector portion can support an independent signal pathway to carry one or more user-defined signals.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: November 15, 2005
    Assignee: Alcatel
    Inventors: Ignacio A. Linares, Robert S. Gammenthaler, Jr., Gerald R. Dubois
  • Patent number: 6963941
    Abstract: A high-speed short-loop bus topology that routes the bus into a first expansion connector and out of a first expansion card inserted within the connector is disclosed. The bus is not routed out of the first expansion connector. Instead, the bus is routed from the first expansion card into a second expansion card by a jumper mechanism. The bus is routed through the second expansion card and out of a second expansion connector housing the second expansion card, where the bus can be terminated or routed into another expansion connector having another expansion card. By routing the bus in this manner, it is shorter than prior art buses found in loop-through bus systems and capable of substantially maintaining a uniform transmission line impedance. Moreover, the operating bandwidth of the short-loop bus is increased since the bus is short and does not have stubs or signal reflections.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: November 8, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Terry R. Lee
  • Patent number: 6958916
    Abstract: A rackmount computer system comprises a 2U rackmount chassis. The system also comprises a card cage adapted to receive at least four vertically stacked and horizontally oriented cards. The card cage is insertable into the 2U rackmount chassis.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: October 25, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Arlen L. Roesner, Tillman Frazier Taylor
  • Patent number: 6932617
    Abstract: A backplane system allowing a very large number of interconnections between high-connectivity printed circuit boards and a backplane is disclosed. The backplane is fragmented into a plurality of backplane parts that comprise connectors on their edges to mate connectors arranged on the high-connectivity printed circuit boards. These backplane parts may also include other connectors on their edges to couple to extension printed circuit boards requiring less interconnections or cables. Interposers can be used to link several backplane parts and provide enhanced air circulation.
    Type: Grant
    Filed: October 5, 2004
    Date of Patent: August 23, 2005
    Assignee: International Business Machines Corporation
    Inventors: Pierre Debord, Rene Glaise, Claude Gomez
  • Patent number: 6934786
    Abstract: A system and method for selecting a hardware master from a plurality of computing devices and controlling the communication of a master control signal(s) to one or more of the plurality of computing devices includes monitoring first and second connectors coupled with a midplane to detect the presence of first and second computing devices, respectively. Master control signals may be transmitted to the second computing device if the first computing device is not coupled with the first connector. Transmission of the master control signals to the second computing devices may be prevented if the first computing device is coupled with the first connector. In accordance with a particular embodiment of the present invention, master control signals may be transmitted to the first computing device if the first computing device is coupled with the first connector.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: August 23, 2005
    Assignee: RLX Technologies, Inc.
    Inventors: Guy B. Irving, David M. Kirkeby
  • Patent number: 6934163
    Abstract: In one embodiment, a dummy via is created in a circuit board. The dummy via is positioned and coupled to a portion of a transmission line. This portion of the transmission line is further coupled to a signal lead of a connector, which creates additional capacitance to lower the impedance of the connector.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: August 23, 2005
    Assignee: Intel Corporation
    Inventor: Keith Dow
  • Patent number: 6930890
    Abstract: The present invention provides a network device with multiple modules or printed circuit boards where certain of the modules are reverse orientated with respect to the other modules. Reverse orientating certain modules better utilizes routing resources and enables a high switching capacity network device, including both physical layer switch/router subsystems and upper layer switch/router subsystems, to be fit in one telco rack. Providing a multi-layer network device in one telco rack allows for intelligent layer 1 switching (for example, dynamic network connection set up), allows for one network management system to control both layer 1 and upper layer networks and eliminates grooming fees. Compared with separate layer 1 and upper layer network devices or a multi-layer network device occupying multiple telco racks, a single network device saves valuable telco site space and reduces expenses by sharing overhead such as the chassis, power and cooling.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: August 16, 2005
    Assignee: Ciena Corporation
    Inventor: Brian Branscomb
  • Patent number: 6924986
    Abstract: Disclosed is a system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the second pluggable module is laterally offset from the first pluggable module. The first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. The first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: August 2, 2005
    Assignee: EMC Corporation
    Inventors: Steven D. Sardella, Stephen E. Strickland, Bassem N. Bishay, Thomas J. Connor, Jr.
  • Patent number: 6922342
    Abstract: A computer system employing redundant power distribution. A computer system includes power distribution boards arranged to distribute power such that the computer system may continue to operate if there is any single point of power failure. The computer system includes a first plurality of circuit boards, a plurality of switch circuit boards and a first and second power distribution board. The plurality of switch circuit boards may be coupled to the first plurality of circuit boards and may convey address and data information between the first plurality of circuit boards. The first power distribution board and the second power distribution board may be coupled to independently distribute power to each of the first plurality of circuit boards. At least two of the first plurality of circuit boards may be coupled to independently distribute power to each of the plurality of switch circuit boards.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: July 26, 2005
    Assignee: Sun Microsystems, Inc.
    Inventors: Drew G. Doblar, Robert E. Cypher
  • Patent number: 6909614
    Abstract: A multi-layer power backplane system is disclosed for use with various power electronic and other systems. The power backplane includes multiple mechanical, conductor and isolation layers which serve to route power to and from various components. The layers are isolated from one another by support/isolation panels which may receive conductors used to route power. Data signals may also be routed through the system. The system accommodates fluid cooling of the electronic components by an additional layer of conduit support and isolation. The overall system provides a high degree of flexibility and modularity in defining a power backplane for a wide range of circuitry and components which may be mounted thereto once the power backplane is designed and assembled.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: June 21, 2005
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Dennis L. Kehl, Timothy A. Roebke, Lee A. Gettelfinger
  • Patent number: 6906929
    Abstract: A computer backplane is disposed with at least an AGP slot, a PCI slot and/or an EISA slot. The PCI slot can be used to electrically connect with PCI cards. The EISA slot and the PCI slot are in alignment to allow that a CPU card can be connected simultaneously to both the EISA slot and the PCI slot. The AGP slot is used to electrically connect with an AGP card. Such an arrangement allows for ease of replacement of the AGP card and a lower production cost.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: June 14, 2005
    Assignee: ICP Electronics Inc.
    Inventor: Tsai-Sheng Chiu
  • Patent number: 6903939
    Abstract: The present invention discloses a physical shelf architecture for high density metallic cross connect systems. The present invention is intended to overcome the problems associated with the physical interconnections of metallic paths in cross connect switching systems. The physical architecture of the present invention effectively performs physical interconnections required by high density metallic cross connect systems. The physical architecture enables for a scalable design and structure of racks and shelves. In particular, inter-connect levels can be performed with devices-to-devices, boards-to-boards, shelves-to-shelves, and racks-to-racks.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: June 7, 2005
    Assignee: Turnstone Systems, Inc.
    Inventors: Ramon C. W. Chea, Jr., P. Kingston Duffie, Timothy John Hodgkinson
  • Patent number: 6903940
    Abstract: The present invention is related to a Compact Peripheral Component Interconnect (cPCI) front panel assembly that is adapted to keep its corresponding cPCI front card's printed circuit board from bending. The cPCI front panel assembly should make its corresponding printed circuit board stronger to prevent circuit board damage and to maintain the cPCI front card envelope standard even before the card is inserted into the card slot. The front panel assembly should be stronger than its corresponding cPCI front card's circuit board. The front panel couples its stronger strength with its weaker circuit board. In addition, the front panel assembly prevents the bending of its corresponding circuit board at the upper, middle, and lower portions. The present invention provides the important advantage of protecting the cPCI front card even before the card is inserted into a card cage.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: June 7, 2005
    Assignee: Sun Microsystems, Inc.
    Inventor: Peter Cuong Dac Ta
  • Patent number: 6894902
    Abstract: The present invention discloses a computer expansion device with a universal serial bus (USB) interface, comprising: a housing having an installation space; a circuit board, disposed in the housing and having a USB port and a power supply terminal; the USB port electrically coupled to a first USB interface signal IC by a circuit, and such IC being electrically coupled to three first connecting ends by circuits, and electrically coupled to a second USB interface signal IC by another circuit, and such IC being electrically coupled to four second connecting ends; wherein the three first connecting ends and a second connecting end selectively coupled to a peripheral device with a USB interface conversion function by an electric connection such that the USB interface signals are transmitted, and the rest of the three second connecting ends are respectively coupled to a USB interface socket.
    Type: Grant
    Filed: April 22, 2003
    Date of Patent: May 17, 2005
    Inventor: Cheng Chun Chang
  • Patent number: 6894905
    Abstract: An “H layout” according to the present invention affords for a smaller, simpler, less expensive and higher performance midplane for use in a communication system for connecting various modules together. The layout is based on the concept of symmetry around a mid-section, which allows for the reuse of APM cards on the top and bottom of a midplane. All high-speed tracks on the midplane are concentrated in the center thereof. Front and back connectors on the midplane are staggered so as to permit very high module densities while maintaining manageable finger access. The present invention has the advantages of: reducing high-speed track lengths in a backplane or midplane; simplifying high speed track routing by having almost only horizontal tracks on the midplane, thus reducing crossing over; and providing a smaller midplane, thus reducing costs.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: May 17, 2005
    Assignee: Nortel Networks Limited
    Inventors: Rudy Vianna, Simon Richardson, Christopher S. Knapton
  • Patent number: 6870742
    Abstract: A system board includes a control unit; connectors arranged in series in one direction and accepting a connecting means for inputting and outputting data; and signal lines connecting the control unit to the connectors and including at least one branch point, wherein sub signal lines branched off at the same branch point are equal in length and/or loads of path from the branch point to the connecting means.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: March 22, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myun-Joo Park, Byung-Se So, Sang-Won Lee, Jae-Jun Lee
  • Patent number: 6867554
    Abstract: A ballast control provided on a through-slot wave solderable daughter card package that is vertically mountable on a mother board.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: March 15, 2005
    Assignee: International Rectifier Corporation
    Inventors: Thomas J. Ribarich, Dana Wilhelm, Derek Brown
  • Patent number: 6855001
    Abstract: The invention relates to a modular system comprising an electrical base unit (1) with a plurality of slots each for receiving a pluggable electrical unit (2), each pluggable electrical unit (2) being connected to the base unit (1) by means of a multi-pin plug-in connection comprising a plug-in contact device (23) and a mating plug-in contact device (13) and the base unit (1) being provided with signal processing means (12).
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: February 15, 2005
    Assignee: ABB Patent GmbH
    Inventors: Andreas Goers, Helmut Michel, Reiner Bleil