With Shielding Structure Patents (Class 361/800)
  • Patent number: 7656674
    Abstract: A control module, in particular for a motor vehicle transmission, which includes a first housing part, on which an electronic circuit part is located, a second housing part, and a carrier, on which a flexible conductor film is located; the flexible conductor film is electrically connected—in a housing interior located between the first housing part and the second housing part—with the circuit part and the flexible conductor film is electrically connected outside of the housing interior—with electrical components mounted on the carrier, the control module having a stack-shaped design, with which the carrier rests, via a first side, on an interior side of the first housing part on which the circuit part is mounted, the circuit part is located in a recess in the carrier, the flexible conductor film is located on the second side of carrier, which faces away from the first housing part, and the second housing part is mounted on a side of the flexible conductor film facing away from the second side of the carrier.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: February 2, 2010
    Assignee: Robert Bosch GmbH
    Inventors: Gerhard Wetzel, Peter Sprafke
  • Patent number: 7652889
    Abstract: An apparatus adapted for locating position of an electronic system or device in an information technology (IT) center comprises a connector strip adapted for attachment to a rack cabinet configured for mounting multiple electronic devices, and a jumper adapted for interfacing an electronic device of the multiple electronic devices and configured to mate with and attach to the connector strip. The apparatus further comprises a logic adapted to identify position of the interfaced electronic device in the rack cabinet based on attachment of the jumper to the connector strip.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: January 26, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Thane M. Larson, Christopher G. Malone
  • Patent number: 7652891
    Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: January 26, 2010
    Assignee: RadiSys Corporation
    Inventors: Christopher D Lucero, Javier Leija, James C Shiplev, Christopher A Gonzales
  • Patent number: 7652897
    Abstract: A high frequency unit (e.g., an RF signal selection switch) includes, as its external terminals, a terrestrial input terminal, a CATV input terminal, an RF output terminal, a selection signal terminal, a power supply terminal and a ground potential terminal. The external terminals are attached to a shielding case surrounding the peripheral edge of a wiring substrate. The shielding plate is disposed in contact with the rear face of the wiring substrate.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: January 26, 2010
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Masanori Kitaguchi
  • Patent number: 7649751
    Abstract: An alignment system for a mezzanine-type printed circuit board is provided. The alignment system includes tab portions formed from the insulating material of the printed circuit board, in which the tab portions engage receptacles and limit movement of the printed circuit board.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: January 19, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John D. Nguyen, Jon Kolas
  • Patent number: 7643311
    Abstract: An electronic device protected against electromagnetic disturbances comprising: a support structure having a first and second electronic component, wherein the support structure includes a conductive means surrounding each of the first and second electronic components; a first and second insulating block formed overlying the first and second electronic components on the support structure; and a metal layer overlying the first and second insulating blocks that are formed over the first and second electronic components, wherein the metal layer is electrically connected to the support structure through the conductive means to protect the first and second electronic components from the electromagnetic disturbances irradiating from each of the first and second electronic components.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: January 5, 2010
    Assignee: STMicroelectronics SA
    Inventor: Romain Coffy
  • Patent number: 7643310
    Abstract: A shielding device (10) and method are provided. The shielding device (10) includes a frame (21) and an enclosure (22). The enclosure (22) includes a cover portion (221) and a first peripheral wall (222) connecting to the cover portion (221). The frame (21) includes a second peripheral wall (21) and a plurality of guiding sheets (215) connected to the second peripheral wall (211). The first peripheral wall (222) is detachably received in the frame (21). A gap (23) is formed between the first peripheral wall (222) and the guiding sheets (215), used to detach the enclosure (22) from the frame (21).
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: January 5, 2010
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: Jiang Long
  • Patent number: 7636244
    Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: December 22, 2009
    Assignee: Apple Inc.
    Inventors: Michael Kriege, Dan Hong, John DiFonzo, Stephen Zadesky, David Lynch, David Lundgren, Nick Merz
  • Patent number: 7633768
    Abstract: An EMI shielding device (1) is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: December 15, 2009
    Inventor: Chin-Fu Horng
  • Patent number: 7633766
    Abstract: A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: December 15, 2009
    Assignee: Molex Incorporated
    Inventors: Kent E. Regnier, David L. Brunker, Martin U. Ogbuokiri
  • Patent number: 7633762
    Abstract: On a circuit board to be mounted on a metal chassis, a tuner having a metal sleeve protruding from a side of its case is mounted, with the sleeve protruding beyond an edge of the circuit board. A metal ground plate is fitted on the sleeve. With a flexible leg portion formed at a lower portion of the ground plate disposed on the chassis, the circuit board is fixed to the chassis with screws, thereby the leg portion comes into elastic contact with the chassis.
    Type: Grant
    Filed: August 15, 2008
    Date of Patent: December 15, 2009
    Assignee: Funai Electric Co., Ltd.
    Inventors: Hideo Yonezawa, Naohito Doi
  • Patent number: 7623360
    Abstract: According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: November 24, 2009
    Assignee: Laird Technologies, Inc.
    Inventors: Gerald Robert English, Allan Richard Zuehlsdorf
  • Patent number: 7619900
    Abstract: A dual-board case for multi-mainboard system includes a rectangular-sectioned tubular housing, in which two track sets are provided; and two mainboard trays being movably mounted on the two track sets to locate at an interior of two opposite lateral walls of the tubular housing. Each of the two mainboard trays has a loading surface, on which a mainboard is mounted; and the two mainboard trays are mounted on the track sets with their loading surfaces and accordingly, the two mainboards mounted thereon facing toward each other. Therefore, the dual-board case allows a multi-mainboard system to have optimal spatial arrangement to achieve best heat-dissipation efficiency and largely reduce noises.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: November 17, 2009
    Assignee: Mitac International Corp.
    Inventors: John McClure, Chun-Hung Lee
  • Patent number: 7619898
    Abstract: A control box for electrical actuators comprises a cabinet consisting of a lower part (2) containing a control printed circuit board and provided with a row of gates (3) for various plugs, and an upper part (4) with a power supply and optionally also a battery pack. The lower part (2) is configured as an independent closed housing, and the upper part (4) is configured as two independent closed housings (5, 6). The upper side of the lower part (2) is provided with an area (7) for receiving a lower side of the two independent housings (5, 6) of the upper part, and means (13, 14; 16, 17) are provided in the lower part and the two housings of the upper part for securing the housings of the upper part to the lower part. The two housings of the upper part do not or essentially do not extend outside the area on the upper part.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: November 17, 2009
    Assignee: Linak A/S
    Inventor: Svend Erik Knudsen Jensen
  • Publication number: 20090268421
    Abstract: A shielding assembly (10) for electronic device is provided. The shielding assembly (10) includes a base frame (14) and a cover (16). The base frame (14) includes a peripheral wall (142). The peripheral wall (142) encloses a receiving space (144). The peripheral wall (142) is defined a groove (149) surrounding the receiving space (144). The cover (16) cover the receiving space (144), the cover (16) has a side wall corresponding to and being engaged with the groove (149) of the base frame (14).
    Type: Application
    Filed: December 3, 2008
    Publication date: October 29, 2009
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: HUNG-CHEN WU
  • Publication number: 20090268420
    Abstract: A shielding assembly (100) comprises a circuit board (10), a shielding frame (20), and a ground plate (30). The circuit board (10) has a plurality of ground contracts (16). The shielding frame (20) is disposed to the circuit board (10). The ground plate (30) is mounted between the circuit board (10) and the shielding frame (20), and has a plurality of pins (36) connected with the ground contracts (16).
    Type: Application
    Filed: December 3, 2008
    Publication date: October 29, 2009
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventor: JIANG LONG
  • Patent number: 7609531
    Abstract: An exemplary flat panel display (200) includes a display module (210), a printed circuit board (220), and a shield member (230). The display module includes a rear surface (212) and a side surface 214 adjacent to the rear surface. The printed circuit board is electrically coupled to the display module. The shield member is configured to protect the printed circuit board from electromagnetic interference, and includes a shield cover (236) and a fixing member (232). The shield cover and the fixing member are separate parts. The printed circuit board is received in the shield cover, the fixing member is fixed onto the side surface of the display module, and the shield cover is fixed onto the rear surface of the display module via the fixing member.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: October 27, 2009
    Assignees: Innocom Technology (Shenzhen) Co., Ltd., Innolux Display Corp.
    Inventors: Rong-Ping Xia, Xian-Lei Meng, Zhao-Hui Hu, Lei Guo
  • Patent number: 7609530
    Abstract: A conductive elastomeric shielding device (400) for use with an electronic device includes a raised surface (401) and a sidewall (405) formed with the raised surface (401). A turret section (406) is formed with the sidewall (405) where an engagement member (407) projects from the turret section (406) for frictional engagement with an aperture (408) in a printed circuit (PC) board (410). The raised surface and sidewall are manufactured of an elastomeric shielding material for shielding radio frequency (RF) radiation for electronic components used therewith.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: October 27, 2009
    Assignee: Delphi Technologies, Inc.
    Inventor: Chris R. Snider
  • Patent number: 7606044
    Abstract: The teachings of the present disclosure provide a housing for a modular component of an information handling system. The housing may include a wall member generally defining a first plane, one or more holes formed in the wall member, and one or more structural support members adjacent to the one or more holes. The one or more structural supports may extend from the first plane defined by the wall member to resist deformation of the wall member in at least one direction.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: October 20, 2009
    Assignee: Dell Products L.P.
    Inventors: Edmond Ira Bailey, Laurent Andrew Regimbal
  • Patent number: 7606045
    Abstract: A head or bottom element of a component support, having guide rails arranged side-by-side and aligned in an insertion direction for receiving a printed circuit board of a plug-in module, wherein the guide rails are formed by one-piece guide elements of the head or bottom element. The guide elements can be formed of two rows of several guide strips per guide rail, each of which extends in the insertion direction, which strips are punched out of a plate-shaped head or bottom element and are projectingly beveled in the direction toward an underside of the head element or a top of the bottom element. A distance of the guide strips of the guide rails is matched to the thickness of the printed circuit boards of the plug-in modules. The head or bottom element forms guide paths for the printed circuit boards of the plug-in modules between the rows of guide strips of the guide rails.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: October 20, 2009
    Assignee: RITTAL RES Electronic Systems GmbH & Co. KG
    Inventors: Eike Waltz, Werner Körber, Kurt Schaffer
  • Patent number: 7601912
    Abstract: A panel and housing assembly includes a housing provided with a locking slot, a panel provided with a receiving space, and a locking tenon mounted between the housing and the panel and having a first end provided with an elastic portion received in the receiving space of the panel and a second end provided with a locking portion inserted into and locked in the locking slot of the housing. Thus, the panel is locked onto the housing by compressing the locking tenon and unlocked from the housing by pressing the press plate of the locking tenon so that the panel and housing assembly is assembled and disassembled easily and quickly without needing aid of any hand tool, thereby facilitating a user assembling and disassembling the panel and housing assembly.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: October 13, 2009
    Assignee: Powercom Co., Ltd.
    Inventors: Wen-Hung Tseng, Hong-Wei Jhuang, Ying-Yi Fan
  • Patent number: 7595996
    Abstract: An expanding card mechanism for protecting a circuit board is disclosed. The expanding card mechanism includes an upper case, a lower case, a plastic frame rack, a plastic baffle and an interface joint. The main feature is that two sides of the plastic frame rack form two positioning guiding tracks, respectively, for matching an inside concave slot guiding tracks of the two sides on the lower case and the plastic frame rack is slid well in the lower case until positioning convex blocks of the plastic frame are locked in positioning pinholes of the lower case. Furthermore, the two positioning convex blocks of the plastic baffle matching the two corresponding positioning guiding slots of the plastic frame rack are fixed well to form foolproof protection, and the circuit board and the interface joint are equipped with the lower case.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: September 29, 2009
    Assignee: Compupack Technology Co., Ltd.
    Inventor: Ben Chen
  • Patent number: 7589977
    Abstract: A housing combination includes a housing (51) and a shielding enclosure (55). The housing has a peripheral wall and a receiving hole (511). The peripheral wall surrounds the receiving hole configured for receiving a surface contact card. A guiding element (52) is positioned in at least one part of the peripheral wall of the receiving hole. The shielding enclosure is disposed at one side of the housing, one part of the shielding enclosure exposed from the receiving hole configured for supporting the surface contact card.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: September 15, 2009
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Shih-Chieh Lin
  • Patent number: 7589978
    Abstract: An air inlet diffuser 10 is disclosed for attachment relative to an air inlet opening 106 of an electronics enclosure 100. The diffuser 10 extends into the electronics enclosure 100 and provides an increased surface area through which EMI attenuating apertures may be formed. The diffuser 10 also reduces the amount of structure that is disposed within the air inlet opening 106 thereby reducing impedance to airflow through the opening 106 into the enclosure 100. The increased surface are of the diffuser 10 allows for increasing the number of EMI attenuating apertures that may be utilized for a given inlet opening 106. In one embodiment, the total open area of the EMI apertures is greater than the open area of the air inlet opening. In such an embodiment, the EMI apertures provide low impedance to airflow through the diffuser 10 and increased airflow in conjunction with EMI attenuation may be realized.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: September 15, 2009
    Assignee: Flextronics AP, LLC
    Inventors: Paul Holdredge, James R. Hamstra
  • Patent number: 7583510
    Abstract: A transceiver cage assembly includes a housing (10) and a grounding device (20). The housing includes at least one receiving space for receiving at least one transceiver module. The grounding device mounted on the housing includes a flat main member (200), and at least one resilient member (220) protruding from the main member. The grounding device provides electrical connection between the housing and bezels.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: September 1, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Wan-Cheng Wang
  • Patent number: 7570496
    Abstract: An electromagnetic interference shielding apparatus for a signal transceiver employs two folded-edge mechanisms coupled together and an adhesive. The electromagnetic interference shielding apparatus includes a metal cover, a chassis having a waveguide output hole, and an adhesive. A first combination portion having a first curved section is disposed on an edge of the metal cover. A second combination portion having a second curved section corresponding to the first combination portion is disposed on an edge of the chassis. The adhesive is used to combine the first combination portion and the second combination portion. The waveguide output hole outputs a signal transmitted by the signal transceiver. The first combination portion and the second combination portion form a curved space that is used with the adhesive to prevent leakage of the transmitted signal and the interference of external noises.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: August 4, 2009
    Assignee: Microelectronics Technology Inc.
    Inventors: Ruei Yuen Chen, Fang Yu Kuo, Yi Hsiang Huang
  • Patent number: 7564699
    Abstract: A planar circuit housing (300) for containing a planar circuit (120) is disclosed. The planar circuit housing (300) comprises a support portion (341) for supporting edges of the planar circuit (120), the support portion (341) being provided on at least one housing internal surface substantially perpendicular to the planar circuit substrate (120); an upper cavity (380) in the housing (300) above the planar circuit (120); and a lower cavity (382) in the housing (300) below the planar circuit (120), the lower cavity (382) having the same sizes as the upper cavity (380) in directions parallel with the planar circuit substrate (120).
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: July 21, 2009
    Assignee: NTT DoCoMo, Inc.
    Inventors: Daisuke Koizumi, Kei Satoh, Shoichi Narahashi, Tatsuro Masamura
  • Patent number: 7561444
    Abstract: A mounting assembly for shielding EMI, the mounting assembly includes a drive bracket (10) and a shielding apparatus (30). The drive bracket includes a bottom wall (11), a first retaining wall (16), a second retaining wall (18), and a dividing wall (15), the first retaining wall defines a first hole (161), the second retaining wall defines a second hole (181), the dividing wall defines an upper hole (153) and a lower hole (151). The shielding apparatus includes a shielding cover (31) and a bezel (33), the shielding cover has a first flange (36) and a second flange (38), the first flange has a protuberance (361) engaged in the first hole, the second flange has a protuberance (381) engaged in the lower hole, the second shielding apparatus (40) engaged in the upper hole of the dividing wall and the second hole of the second retaining wall.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: July 14, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Yu-Wei He
  • Publication number: 20090175018
    Abstract: An electronic apparatus includes: a first circuit board having a mounting surface; a shield casing disposed so as to face the mounting surface of the first circuit board and cover an electronic component mounted on the mounting surface; a battery disposed so as to face the shield casing at a position next to the first circuit board in a first direction which is parallel to the mounting surface of the first circuit board; and a first rib provided on a surface of the shield casing so as to extend in the first direction, one end of the first rib being disposed at a position corresponding to the first circuit board in a second direction, the other end of the first rib being disposed at a position corresponding to the battery in the second direction, the second direction being perpendicular to the mounting surface.
    Type: Application
    Filed: December 19, 2008
    Publication date: July 9, 2009
    Applicant: KYOCERA CORPORATION
    Inventor: Masayuki Zaitsu
  • Patent number: 7554812
    Abstract: Parallel stacking mid-frame structural supports for use with a portable electronic device are presented including: a first side member; a second side member disposed substantially parallel to the first side member, the first member and the second member each configured with; a support feature for providing structural support when an applied load exceeding a predetermined threshold is exerted on the portable electronic device, and an attachment feature; a third side member mechanically contiguous with and disposed substantially perpendicular to the first side member; and a fourth side member mechanically contiguous with and disposed substantially perpendicular to the first side member. In some embodiments, the mid-frame structural support also includes: a first number of rib supports for supporting a printed circuit board (PCB), and a second number of rib supports for supporting the PCB. In some embodiments, the predetermined threshold is approximately 800 grams.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: June 30, 2009
    Assignee: Apple Inc.
    Inventors: Brian Lynch, Jan Moolsintong, Stephen Zadesky
  • Patent number: 7551448
    Abstract: The invention is directed to a method and apparatus for electrically interconnecting multiple electronic components together by disposing the electronic components between two opposing plurality of protrusions that hold the electrical components together and establish an electrical connection therebetween. Each plurality of protrusions may be disposed in an offset arrangement with the opposing protrusions. The opposing protrusions cause the electronic components to bend and adopt a deflected geometry when they are positioned between the opposing sets of protrusions. This bending results in the electronic components being biased against each other so that electrical contacts on each electronic component may be held together and thereby form an electrical connection. As a result, the opposing sets of protrusions can be used to electrically interconnect a plurality of electrical components in the absence of clamping, adhesion, soldering, or pinching.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: June 23, 2009
    Assignee: Cryovac, Inc.
    Inventor: William P. Roberts
  • Patent number: 7551450
    Abstract: An external storage apparatus capable of preventing erroneous assembly of components for which the assembly position is decided and of suppressing the occurrence of variations in its quality is provided. An external storage apparatus including a main body 11, a memory substrate 12 having a connector 24, a substrate holder 13 for fixing the memory substrate 12 to the main body under the state that the connector 24 projects outward, a cap 14 to be attachable and detachable to and from the substrate holder 13 for protecting the connector 24, wherein erroneous assembly restricting means 38, 37, 40 and 32 are provided between the main body 11, the memory substrate 12 and the substrate holder 13.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: June 23, 2009
    Assignee: Sony Corporation
    Inventors: Norio Sugawara, Takashi Ando, Hiroaki Yamanaka
  • Patent number: 7542299
    Abstract: A computer peripherals switch having a switching circuit contained within a body; a first computer cable electrically coupled to the switching circuit and integrally attached to the body; a second computer cable electrically coupled to the switching circuit and integrally attached to the body; a plurality of computer peripheral ports electrically coupled to the switching circuit and disposed on the body; wherein the first computer cable has a plurality of first computer connectors, each of which is matched to at least one of the ports in the plurality of computer peripheral ports, and wherein the switching circuit is configured to selectively couple the plurality of first computer connectors to the plurality of computer peripheral ports.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: June 2, 2009
    Assignee: Aten International Co., Ltd
    Inventor: Kevin Chen
  • Patent number: 7539021
    Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shifts along a integrate direction or a release direction. The retention device includes a fastener, a latching member, and a releasing member. The fastener is movably disposed on the case and has a stopping portion. The latching member is disposed on one side of the circuit board. The releasing member is movably disposed on the case and is located on one side of the fastener, and pushes the fastener to shift. The latching member shifts along the integrate direction with the circuit board, pushes the fastener to shift, and is blocked by the stopped portion. When the fastener is pushed by the releasing member to shift, the latching member is separated along the release direction, such that the circuit board is fixed on or detached from the case.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: May 26, 2009
    Assignee: Inventec Corporation
    Inventor: Ying-Chao Peng
  • Patent number: 7532487
    Abstract: A grounding structure of a liquid crystal module is disclosed. The grounding structure is adapted for protecting a control printed circuit board of the liquid crystal module from electro-magnetic interference. In one embodiment, the grounding structure comprises: i) a frame configured to receive the control printed circuit board, ii) a grounding conductive sheet, wherein one end of the grounding conductive sheet is electrically connected to the control printed circuit board, and the other end comprises a first engaging member and iii) a metal bezel configured to lock around the frame, the metal bezel including a second engaging member, wherein the second engaging member engages with the first engaging member.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: May 12, 2009
    Assignee: Hannstar Display Corporation
    Inventors: Ching-Kun Lai, Mei-Hui Lin, Chung-Te Lee
  • Patent number: 7532473
    Abstract: A cooling apparatus is used for cooling an electronic element. The cooling apparatus includes a fan and a fan duct. The fan is for generating airflow. The fan duct including an inlet, an outlet, and a first metal net fixed in one of the inlet and the outlet, is for guiding the airflow. The inlet is for allowing air to enter the fan duct. The outlet is for allowing air to flow out from the fan duct. The first metal net defines a plurality of guiding holes for the airflow to pass through, and a maximum distance in a traverse direction of each of the guiding holes is smaller than one twentieth of a wavelength of an electromagnetic wave emitted from the electronic element. An electronic device using the cooling apparatus is also disclosed.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: May 12, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Szu-Wei Kuo
  • Patent number: 7532482
    Abstract: Remote enclosure systems have now been designed and are described herein that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: May 12, 2009
    Assignee: Purcell Systems, Inc.
    Inventors: William Miller, Kelly Johnson
  • Patent number: 7529104
    Abstract: An upper side plate portion (122) of an upper case comprises an insertion hole (122C) for a setscrew (130) and a resilient deformable portion (124) having a rib (125). When the upper case is attached to a lower case using the setscrew (130), the restoring force of resilient deformation of the resilient deformable portion (124) crimps the rib (125) to a lower side plate (112) of the lower case with a pressure force (W10). Accordingly, only the attachment of both cases with the setscrew (130) crimps the rib (125) of the upper case to the lower side plate (112) of the lower case with the pressure force (W10) and reduces the surface resistance value in a contact portion with the rib (125) in the lower side plate (112) below a predetermined value. Thus, the conduction between the upper case and the lower case can be easily and reliably ensured.
    Type: Grant
    Filed: February 3, 2005
    Date of Patent: May 5, 2009
    Assignee: Pioneer Corporation
    Inventor: Hideo Ito
  • Patent number: 7525809
    Abstract: A packaged electrical system includes an enclosure and a main interior volume for component supports. The component supports may support electrical, electronic, power electronic and similar components, as well as switchgear and the like. A main power wireway is provided adjacent to the main interior volume of the enclosure for accommodating three phase power conductors. A network and control power wireway is formed separately from the main power wireway. The network and control power wireway may be formed toward the rear of the main interior volume, and may accommodate plug-in connections between component supports and network conductors and control power conductors. The network and control power wireway is thus accessible through a separate door from the main power wireway.
    Type: Grant
    Filed: November 11, 2005
    Date of Patent: April 28, 2009
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Herberto Bergmann, Arnaldo Hiroyuki Omoto, Luis Ricardo Luzardo Pereira, José Batista Ferreira Neto, David L. Jensen, Chester Malkowski, Jr.
  • Patent number: 7518880
    Abstract: A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: April 14, 2009
    Assignee: Bi-Link
    Inventor: Frank J. Ziberna
  • Patent number: 7511963
    Abstract: This metal housing (2) is particularly intended to contain electronic or similar components. It includes a side wall (8) furnished with a ledge (20) having a bore (16) to receive a fixing screw (6). The side wall (8) has, at the bore (16), a recessed zone (10) whose concavity is oriented toward the outside of the housing (2), the ledge (20) intended to receive the screw (6) overhanging the recessed zone (10).
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: March 31, 2009
    Assignee: Continental Automotive France
    Inventor: Gautier Louchart
  • Patent number: 7508678
    Abstract: A computer peripherals switch having a switching circuit contained within a body; a first computer cable electrically coupled to the switching circuit and integrally attached to the body; a second computer cable electrically coupled to the switching circuit and integrally attached to the body; a plurality of computer peripheral ports electrically coupled to the switching circuit and disposed on the body; wherein the first computer cable has a plurality of first computer connectors, each of which is matched to at least one of the ports in the plurality of computer peripheral ports, and wherein the switching circuit is configured to selectively couple the plurality of first computer connectors to the plurality of computer peripheral ports.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: March 24, 2009
    Assignee: Aten International Co., Ltd.
    Inventor: Kevin Chen
  • Patent number: 7508679
    Abstract: An electrical tool with an adjustable housing geometry has a motor part, a handle part situated so that it is displaceable relative to the motor part via a connection, and a power supply block that is replaceable using a detachable connection, the power supply block being configured as the handle part, and the connection simultaneously forming the detachable connection.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: March 24, 2009
    Assignee: Robert Bosch GmbH
    Inventor: Heiko Roehm
  • Patent number: 7508682
    Abstract: A housing for an electrical circuit having a metal base with an open top and a metal lid which overlies the open top of the base and forms an interior chamber adapted to contain an electronic circuit. The outer periphery of the lid is attached to the base by friction stir welding to thereby form a hermetically sealed chamber dimensioned to contain an electronic circuit. An electronic port is electrically connected to the electronic circuit and accessible exteriorly of the housing.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: March 24, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Harsha Badarinarayan, Kazutaka Okamoto, Frank Hunt
  • Patent number: 7504591
    Abstract: An electromagnetic shielding gasket is provided, which is capable of reducing the amount of projection from the inner surface of a first opposing wall having gasket holding holes and is less likely to come off through the gasket holding holes in the direction from the inner surface side toward the outer surface side of the first opposing wall. A communication device as an electronic device has a device body having a plural number of sub-casings and electromagnetic shielding gaskets 1. A first opposing wall 102a disposed on the sub-casing of the device body includes a plural number of gasket holding holes 104 and gasket guiding holes. The electromagnetic shielding gasket 1 has a gasket body 2 and a plural number of fitting parts 4 and come-off stopping parts 3. The fitting parts 4 are guided in the gasket guiding holes and then fitted in the gasket holding holes.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: March 17, 2009
    Assignee: Uber Co., Ltd.
    Inventor: Teizou Awaji
  • Patent number: 7505376
    Abstract: A power supply module removably disposed within an automated data storage and retrieval system. An automated data storage and retrieval system which includes one or more power supply modules removably disposed therein. An accessor movably disposed with an automated data storage and retrieval system comprising a gripper mechanism which can be releaseably attached to a power supply module. A method to supply power to an automated data storage and retrieval system. A method to monitor the operation of a power supply module removably disposed within an automated data storage and retrieval system.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: March 17, 2009
    Assignee: International Business Machines Corporation
    Inventors: Robert George Emberty, Craig Anthony Klein
  • Patent number: 7502230
    Abstract: A keyboard, video and mouse (KVM) switch comprises an enclosure; a switching circuit contained within the enclosure; a set of connector ports disposed on the enclosure and electrically coupled to the switching circuit; a set of plugs electrically coupled to the switching circuit, the set of plugs comprising: a video plug disposed on the enclosure for directly coupling to a video port of a first computer system; and at least one peripheral plug attached to the enclosure for coupling to at least one peripheral port of the first computer system; and a cable connector electrically coupled to the switching circuit, for coupling to a second computer system via a detachable cable; wherein the switching circuit switches to operatively couple each connector port to the set of plugs and the cable connector.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: March 10, 2009
    Assignee: Aten International Co., Ltd.
    Inventors: Chih-Hsien Chang, Kevin Chen
  • Patent number: 7501721
    Abstract: A reduced-noise switching power supply includes a conductive surface disposed transversely in an air space between a line filter system component and a switching system component. The conductive surface does not encase either the line filter system component or the switching system component.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: March 10, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Rick Geveshausen, Rick Shaw
  • Patent number: 7498524
    Abstract: Enclosures and gasket assemblies for reducing EMI for computer systems and other electronic devices are disclosed. In an exemplary embodiment a gasket assembly for reducing EMI may comprise a soft core sizable to extend along at least the length of an opening in an EMI housing. The gasket assembly may also comprise a plurality of fingers positionable at spaced-apart positions along the entire length of the opening in the EMI housing, the plurality of fingers maintaining conductivity between mating surfaces of the EMI housing.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: March 3, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Colin E. Brench
  • Patent number: 7498664
    Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.
    Type: Grant
    Filed: December 14, 2005
    Date of Patent: March 3, 2009
    Assignee: LSI Corporation
    Inventors: Choshu Ito, William M. Loh, Rajagopalan Parthasarathy