Abstract: A semiconductor memory device includes a first ferromagnetic layer magnetically pinned and positioned within a first region of a substrate; a second ferromagnetic layer approximate the first ferromagnetic layer; and a barrier layer interposed between the first ferromagnetic layer and the first portion of the second ferromagnetic layer. The second ferromagnetic layer includes a first portion being magnetically free and positioned within the first region; a second portion magnetically pinned to a first direction and positioned within a second region of the substrate, the second region contacting the first region from a first side; and a third portion magnetically pinned to a second direction and positioned within a third region of the substrate, the third region contacting the first region from a second side.

Abstract: A method for fabricating a semiconductor device includes forming a plurality of layers which are stacked as a bottom layer, an MTJ layer, and a top layer, patterning the top layer and the MTJ layer using an etch mask pattern to form a top layer pattern and an MTJ pattern, forming a carbon spacer on the sidewalls of the MTJ pattern and the top layer pattern to protect the MTJ pattern and the top layer pattern, and patterning the bottom layer using the carbon spacer and the etch mask pattern as an etch mask to form a bottom layer pattern.

Abstract: This application describes embodiments of MRAM cells that utilize a PMOS transistor as an access transistor. The MRAM cells are configured to mitigate the effects of applying asymmetric current loads to transition a Magnetic-Tunnel Junction of the MRAM cell between magnetoresistive states.

Abstract: An electronic device manufacturing process includes depositing a bottom electrode layer. Then an electronic device is fabricated on the bottom electrode layer. Patterning of the bottom electrode layer is performed after fabricating the electronic device and in a separate process from patterning a top electrode. A first dielectric layer is then deposited on the electronic device and the bottom electrode layer followed by a top electrode layer. The top electrode is then patterned in a separate process from the bottom electrode. Separately patterning the top and bottom electrodes improves yields by reducing voids in the dielectric material between electronic devices. One electronic device the manufacturing process is well-suited for is magnetic tunnel junctions (MTJs).

Abstract: Provided are a spin-injection element having high spin-injection efficiency, and a magnetic field sensor and a magnetic recording memory employing the element. The element comprises a barrier layer, a magnetic conductive layer, and a spin accumulation portion comprised of non-magnetic conductive material. In the element, a first spin accumulation layer (103) and the barrier layer (102) have respectively a body-centered cubic lattice structure. Due to this, the first spin accumulation layer (103) and the barrier layer (102) come into contact with each other through a boundary face with improved crystalline symmetry. Thereby, lattice matching is improved and scattering of the tunnel electrons in the ?1 band is prevented, resulting in improvement in the spin polarizability. Further, the characteristics of the device employing the spin injection element are improved.

Abstract: A MTJ is sensed by applying a first reference current, first programming the MTJ to a first value using the first reference current, detecting the resistance of the first programmed MTJ, and if the detected resistance is above a first reference resistance, declaring the MTJ to be at a first state. Otherwise, upon determining if the detected resistance is below a second reference resistance, declaring the MTJ to be at a second state. In some cases, applying a second reference current through the MTJ and second programming the MTJ to a second value using the second reference current. Detecting the resistance of the second programmed MTJ and in some cases, declaring the MTJ to be at the second state, and in other cases, declaring the MTJ to be at the first state and programming the MTJ to the second state.

Abstract: A resistance-based memory has a two-diode access device. In a particular embodiment, a method includes biasing a bit line and a sense line to generate a current through a resistance-based memory element via a first diode or a second diode. A cathode of the first diode is coupled to the bit line and an anode of the second diode is coupled to the sense line.

Abstract: Magnetic wires that include cobalt, nickel, and platinum layers show improved domain wall motion properties, when the domain walls are driven by pulses of electrical current. These wires exhibit perpendicular magnetic anisotropy, thereby supporting the propagation of narrow domain walls. The direction of motion of the domain walls can be influenced by the order in which the platinum and cobalt layers are arranged.

Abstract: A memory array includes a plurality of magneto-resistive changing memory cells. Each resistive changing memory cell is electrically between a source line and a bit line and a transistor electrically between the resistive changing memory cell and the bit line. The transistor has a gate electrically between a source region and a drain region and the source region being electrically between the r magneto-resistive changing memory cell and the gate. A word line is electrically coupled to the gate. A bit line charge accumulation sensing for magneto-resistive changing memory is also disclosed.

Abstract: A method and apparatus provide a magnetic memory including magnetic junctions on a substrate. The apparatus include an RIE chamber and an ion milling chamber. The chambers are coupled such that the magnetic memory is movable between the chambers without exposing the magnetic memory to ambient. The method provides magnetic junction layers and a hard mask layer on the magnetic junction layers. A hard mask is formed from the hard mask layer using an RIE. The magnetic junction layers are ion milled after the RIE and without exposing the magnetic memory to an ambient after the RIE. The ion milling defines at least part of each magnetic junction. A magnetic junction may be provided. The magnetic junction includes pinned, nonmagnetic spacer, and free layers. The free layer has a width of not more than twenty nanometers and is switchable when a write current is passed through the magnetic junction.

Abstract: A magnetic tunnel junction memory cell includes a ferromagnetic reference layer, a ferromagnetic free layer, and a non-magnetic barrier layer separating the ferromagnetic reference layer from the ferromagnetic free layer. The magnetic tunnel junction cell has an asymmetric energy barrier for switching between a high resistance data state and a low resistance data state. Memory devices and methods are also described.

Abstract: According to one embodiment, a magnetic memory element includes a memory layer, a first nonmagnetic layer, a reference layer, a second nonmagnetic layer, and an adjustment layer which are stacked. The adjustment layer is configured to reduce a leakage magnetic field from the reference layer. The adjustment layer is formed by stacking an interface layer provided on the second nonmagnetic layer, and a magnetic layer having magnetic anisotropy perpendicular to a film surface. Saturation magnetization of the interface layer is larger than that of the magnetic layer.

Abstract: A magnetic random access memory (MRAM) cell includes an embedded MRAM and an access transistor. The embedded MRAM is formed on a number of metal-interposed-in-interlayer dielectric (ILD) layers, which each include metal dispersed there through and are formed on top of the access transistor. A magneto tunnel junction (MTJ) is formed on top of a metal formed in the ILD layers that is in close proximity to a bit line. An MTJ mask is used to pattern the MTJ and is etched to expose the MTJ. Ultimately, metal is formed on top of the bit line and extended to contact the MTJ.

Abstract: In a particular illustrative embodiment, a magnetic tunnel junction (MTJ) structure is disclosed that includes a bottom electrode, a fixed layer, a tunnel barrier layer, a free layer, and a top electrode. The bottom electrode is coupled to a bottom surface of the fixed layer and extends along at least one sidewall of the fixed layer.

Abstract: A magnetic memory device comprises a magnetic wire extending in a first direction, a pair of first electrodes operable to pass a current through the magnetic wire in the first direction or in an opposite direction to the first direction, a first insulating layer provided on the magnetic wire in a second direction being substantially perpendicular to the first direction, a plurality of second electrodes provided on the first insulating layer and provided at specified interval in the second direction, and a third electrode electrically connected to the plurality of second electrodes.

Abstract: Provided is a semiconductor resistive memory device. The resistive memory device includes a plurality of unit cells. A source line and a data input/output line of the unit cells may be selectively connected to have a substantially same voltage level for equalization when the unit cells are in inactive or unselected state. The equalization may decrease current consumption and protect write error, and protect leakage current.

Abstract: A write driver circuit for a magnetic random access memory includes a memory cell array including a plurality of magnetic memory cells in which a pair of magnetic memory cells adjacent to each other in a direction of a bit line share a source line, and each magnetic memory cell is connected between the bit line and the source line. The write driver circuit includes a switching unit connected between a terminal for supplying a positive recording voltage and a terminal for supplying a negative recording voltage to selectively supply current generated by the positive recording voltage or the negative recording voltage to the bit line according to a write enable signal and a data signal.

Abstract: The present disclosure concerns a multilevel magnetic element comprising a first tunnel barrier layer between a soft ferromagnetic layer having a magnetization that can be freely aligned and a first hard ferromagnetic layer having a magnetization that is fixed at a first high temperature threshold and freely alignable at a first low temperature threshold. The magnetic element further comprises a second tunnel barrier layer and a second hard ferromagnetic layer having a magnetization that is fixed at a second high temperature threshold and freely alignable at a first low temperature threshold; the soft ferromagnetic layer being comprised between the first and second tunnel barrier layers. The magnetic element disclosed herein allows for writing four distinct levels using only a single current line.

Abstract: A memory device includes a magnetic tunnel junction (MTJ) bitcell. The MTJ bitcell includes a first MTJ and a second MTJ. The memory device further includes programming circuitry configured to generate a non-reversible state at the bitcell by applying a program signal to a selected one of the first MTJ and the second MTJ of the bitcell. The non-reversible state corresponds to a value of the MTJ bitcell that is determined by comparing a first value read at the first MTJ and a second value read at the second MTJ.

Abstract: Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) bit cells are disclosed. The bit cells include a source line formed in a first plane and a bit line formed in a second plane. The bit line has a longitudinal axis that is parallel to a longitudinal axis of the source line, and the source line overlaps at least a portion of the bit line.

Abstract: A domain wall motion type MRAM has: a magnetic recording layer 10 being a ferromagnetic layer having perpendicular magnetic anisotropy; a pair of current supply terminals 14a and 14b connected to the magnetic recording layer 10 for supplying a current to the magnetic recording layer 10; and an anti-ferromagnetic layer 45 being in contact with a first region R1 of the magnetic recording layer 10. The first region R1 includes a part of a current supply region RA of the magnetic recording layer 10 that is between the pair of current supply terminals 14a and 14b.

Abstract: The variable resistance nonvolatile storage device reduces variations in a resistance value of a variable resistance element (100) in the low resistance state, performs stable operations, and includes an LR write circuit (500) (i) applying a voltage to a memory cell (102) so that a resistance state of the variable resistance element included in the memory cell is changed from high to low, and (ii) including a first driving circuit (510) and a second driving circuit (520) which apply voltages to the memory cell and which have connected output terminals. When applying a voltage to the memory cell, the first driving circuit supplies a first current, and the second driving circuit (i) supplies a second current when a voltage at the output terminal of the first driving circuit is higher than a reference voltage VREF, and (ii) is in a high impedance state when the voltage is lower than the VREF.

Abstract: A write circuit is adapted to provide a same logical bit to each of a multitude of memory cells for storage. Each of the multitude of memory cells stores either the bit or a complement of the bit in response to the write circuit. A read circuit is adapted to receive the bits stored in the multitude of memory cells and to generate an output value defined by the stored bits in accordance with a predefined rule. The predefined rule may be characterized by a statistical mode of the bits stored in the plurality of memory cells. Storage errors in a minority of the multitude of memory cells may be ignored at the cost of lower memory density. The predefined rule may be characterized by a first weight assigned to bits 1 and a second weight assigned to bits 0.

Abstract: A semiconductor memory device in accordance with an embodiment includes a memory cell array having memory cells disposed at an intersection of first lines and second lines; and a control circuit configured to execute a read operation, thereby determining a resistance state of the selected one of the memory cells. The read operation is an operation configured to execute a sensing operation multiple times and aggregate determination results thereof. The sensing operation is configured such that a first voltage is applied to selected ones of the first lines and a second voltage lower than the first voltage is applied to a single selected one of the second lines. The control circuit suspends application of the first voltage to the first line connected to the selected one of the memory cells determined to be in a first resistance state in one of the sensing operations, and executes the next sensing operation.

Abstract: A probabilistic programming current is injected into a cluster of bi-stable probabilistic switching elements, the probabilistic programming current having parameters set to result in a less than unity probability of any given bi-stable switching element switching, and a resistance of the cluster of bi-stable switching elements is detected. The probabilistic programming current is injected and the resistance of the cluster state detected until a termination condition is met. Optionally the termination condition is detecting the resistance of the cluster of bi-stable switching elements at a value representing a multi-bit data.

Abstract: Asymmetric switching is defined for magnetic bit cell elements. A magnetic bit cell for memory and other devices includes a transistor coupled to an MTJ structure. A bit line is coupled at one terminal of the bit cell to the MTJ structure. At another terminal of the bit cell, a source line is coupled to the source/drain terminal of the transistor. The bit line is driven by a bit line driver that provides a first voltage. The source line is driven by a source line driver that provides a second voltage. The second voltage is larger than the first voltage. The switching characteristics of the bit cell and MTJ structure are improved and made more reliable by one or a combination of applying the higher second voltage to the source line and/or reducing the overall parasitic resistance in the magnetic bit cell element.

Abstract: A storage element includes: a storage layer which retains information by a magnetization state of a magnetic substance; a magnetization pinned layer having magnetization which is used as the basis of the information stored in the storage layer; and an interlayer of a non-magnetic substance provided between the storage layer and the magnetization pinned layer. The storage element is configured to store information by reversing magnetization of the storage layer using spin torque magnetization reversal generated by a current passing in a laminate direction of a layer structure including the storage layer, the interlayer, and the magnetization pinned layer, and when the saturation magnetization of the storage layer and the thickness thereof are represented by Ms (emu/cc) and t (nm), respectively, (1489/Ms)?0.593<t<(6820/Ms)?1.55 holds.

Abstract: A semiconductor memory device includes: a memory cell array including multiple first lines, multiple second lines crossing the first lines, and memory cells arranged at intersections between the first lines and the second lines and including variable resistive elements; and a control circuit which controls resistance values of the variable resistive elements in a way that a cell voltage is applied to the memory cell arranged at an intersection between a selected first line and a selected second line by applying first and second voltages to the selected first and second lines, respectively. The control circuit applies a voltage gradually raised or lowered from a first initial voltage as the first voltage to the selected first line, and a pulsing voltage as the second voltage to the selected second line.

Abstract: In one embodiment, there is provided a non-volatile magnetic memory cell. The non-volatile magnetic memory cell comprises a switchable magnetic element; and a word line and a bit line to energize the switchable magnetic element; wherein at least one of the word line and the bit line comprises a magnetic sidewall that is discontinuous.

Abstract: A spin transistor includes a first ferromagnetic layer, a second ferromagnetic layer, a semiconductor layer between the first and second ferromagnetic layers, and a gate electrode on or above a surface of the semiconductor layer, the surface being between the first and second ferromagnetic layers. The first ferromagnetic layer comprises a ferromagnet which has a first minority spin band located at a high energy side and a second minority spin band located at a low energy side, and has a Fermi level in an area of the high energy side higher than a middle of a gap between the first and second minority spin bands.

Abstract: A method of adjusting a resistive change element using a reference is disclosed. The method comprises inspecting a resistive change element to determine a first state; comparing the first state to a reference wherein said reference provides stimulus parameters corresponding to a transition from the first state to a second state; and applying the stimulus parameters to the resistive change element. A resistive change memory cell array is also disclosed.

Abstract: A magnetic memory device includes a track in which different non-magnetic layers are respectively formed on upper and lower surfaces of a magnetic layer. One of the two non-magnetic layers includes an element having an atomic number greater than or equal to 12. Accordingly, the magnetic layer has a relatively high non-adiabaticity (?).

Abstract: A large scale memory array includes a uniform pattern of uniformly sized dummy bit cells and active bit cells. Sub-arrays within the large scale memory array are separated by the dummy bit cells. Signal distribution circuitry is formed with a width or height corresponding to the width or height of the dummy bit cells so that the signal distribution circuitry occupies the same footprint as the dummy bit cells without disrupting the uniform pattern across the large scale array. Edge dummy cells of a similar size or larger than the standard size bit cells may be placed around the edge of the large scale array to further reduce pattern loading affects.

Abstract: A memory circuit according to an embodiment includes: a first transistor including a first source/drain electrode, a second source/drain electrode, and a first gate electrode; a second transistor including a third source/drain electrode connected to the second source/drain electrode, a fourth source/drain electrode, and a second gate electrode; a third transistor and a fourth transistor forming an inverter circuit, the third transistor including a fifth source/drain electrode, a sixth source/drain electrode, and a third gate electrode connected to the second source/drain electrode, the fourth transistor including a seventh source/drain electrode connected to the sixth source/drain electrode, an eighth source/drain electrode, and a fourth gate electrode connected to the second source/drain electrode; and an output terminal connected to the sixth source/drain electrode.

Abstract: A STT-RAM MTJ is disclosed with a MgO tunnel barrier formed by natural oxidation and containing an oxygen surfactant layer to form a more uniform MgO layer and lower breakdown distribution percent. A CoFeB/NCC/CoFeB composite free layer with a middle nanocurrent channel layer minimizes Jc0 while enabling thermal stability, write voltage, read voltage, and Hc values that satisfy 64 Mb design requirements. The NCC layer has RM grains in an insulator matrix where R is Co, Fe, or Ni, and M is a metal such as Si or Al. NCC thickness is maintained around the minimum RM grain size to avoid RM granules not having sufficient diameter to bridge the distance between upper and lower CoFeB layers. A second NCC layer and third CoFeB layer may be included in the free layer or a second NCC layer may be inserted below the Ru capping layer.

Abstract: An example magnetic recording device includes a laminated body. The laminated body includes a first ferromagnetic layer with a magnetization substantially fixed in a first direction; a second ferromagnetic layer with a variable magnetization direction; a first nonmagnetic layer disposed between the first ferromagnetic layer and the second ferromagnetic layer; a third ferromagnetic layer with a variable magnetization direction; and a fourth ferromagnetic layer with a magnetization substantially fixed in a second direction, wherein at least one of the first and second direction is generally perpendicular to the film plane. The magnetization direction of the second ferromagnetic layer is determinable in response to the orientation of a current, by passing the current in a direction generally perpendicular to the film plane of the layers of the laminated body and the magnetization of the third ferromagnetic layer is able to undergo precession by passing the current.

Abstract: There is disclosed a memory element including a layered structure including a memory layer that has a magnetization perpendicular to a film face; a magnetization-fixed layer; and an insulating layer provided between the memory layer. An electron that is spin-polarized is injected in a lamination direction of a layered structure, a magnitude of an effective diamagnetic field which the memory layer receives is smaller than a saturated magnetization amount of the memory layer, in regard to the insulating layer that comes into contact with the memory layer, and the other side layer with which the memory layer comes into contact at a side opposite to the insulating layer, at least an interface that comes into contact with the memory layer is formed of an oxide film, and the memory layer includes at least one of non-magnetic metal and oxide in addition to a Co—Fe—B magnetic layer.

Abstract: A spin-torque transfer memory random access memory (STTMRAM) cell is disclosed comprising a selected magnetic tunnel junction (MTJ) identified to be programmed; a first transistor having a first port, a second port and a gate, the first port of the first transistor coupled to the selected MTJ; a first neighboring MTJ coupled to the selected MTJ through the second port of the first transistor; a second transistor having a first port, a second port, and a gate, the first port of the second transistor coupled to the selected MTJ; a second neighboring MTJ coupled to the selected MTJ through the second port of the second transistor; a first bit/source line coupled to the second end of the selected MTJ; and a second bit/source line coupled to the second end of the first neighboring MTJ and the second end of the second neighboring MTJ.

Abstract: A spin-torque transfer memory random access memory (STTMRAM) element, employed in a STTMRAM array, receives electric current for storage of digital information, the STTMRAM element has a magnetic tunnel junction (MTJ). The MTJ includes an anti-ferromagnetic (AF) layer, a fixed layer having a magnetization that is substantially fixed in one direction and that comprises a first magnetic layer, an AF coupling layer and a second magnetic layer, a barrier layer formed upon the fixed layer, and a free layer. The free layer is synthetic and has a high-polarization magnetic layer, a low-crystallization magnetic layer, a non-magnetic separation layer, and a magnetic layer, wherein during a write operation, a bidirectional electric current is applied across the STTMRAM element to switch the magnetization of the free layer between parallel and anti-parallel states relative to the magnetization of the fixed layer.

Abstract: A memory device includes at least one magnetic random access memory cell, which includes: (1) a magnetic tunnel junction having a first end and a second end; and (2) a strap electrically coupled to the second end of the magnetic tunnel junction. The memory device also includes a bit line electrically coupled to the first end of the magnetic tunnel junction. During a write operation, the bit line is configured to apply a first heating current through the magnetic tunnel junction, and the strap is configured to apply a second heating current through the strap, such that the magnetic tunnel junction is heated to at least a threshold temperature according to the first heating current and the second heating current.

Abstract: A SRAM cell having two cross-coupled inverters formed by CMOS technology and first and second chalcogenic elements integrated with the SRAM cell to add nonvolatile properties to the storage cell. The PCM resistors are programmed to the SET state and the RESET state, and upon power-up the SRAM cell takes on the data contained in the PCM cells.

Abstract: A phase change memory with an operating current that can be gradually increased or gradually decreased. The phase change memory has a phase change storage element, a transistor, and a control circuit. The transistor is operable to adjust the operating current flowing through the phase change storage element. The transistor has a first terminal coupled to a voltage source, a second terminal coupled to the phase change storage element, and a control terminal receiving a control signal from the control circuit. The control circuit is specially designed to limit the transistor in a linear region.

Abstract: According to one embodiment, a semiconductor memory device includes plural magneto-resistance elements. In the semiconductor memory device, each of the magneto-resistance elements includes: a first magnetic layer formed on a semiconductor substrate, the first magnetic layer having an easy axis of magnetization perpendicular to a film surface thereof; a non-magnetic layer formed on the first magnetic layer; a second magnetic layer formed on the non-magnetic layer, the second magnetic layer having an easy axis of magnetization perpendicular to a film surface thereof; and a sidewall film provided so as to cover a sidewall of each of the magneto-resistance elements with a protective film interposed therebetween, the sidewall film providing a tensile stress to the magneto-resistance element along the easy axis of magnetization.

Abstract: A magnetic storage device includes a laminated structure and a third magnetic body. The laminated structure includes a first magnetic body, a nonmagnetic body, and a second magnetic body which are laminated. The third magnetic body is provided at any of a first magnetic body side and a second magnetic body side. Resistance of the laminated structure is changed based on a difference between magnetization directions of the first magnetic body and the second magnetic body. A projection of the third magnetic body onto the first magnetic body at least partly overlaps the first magnetic body. The first magnetic body and the third magnetic body are magnetically coupled. A planar shape of the first magnetic body is a shape that is long in a first direction. A length of the third magnetic body is shorter than a length of the first magnetic body in the first direction.

Abstract: Write verify methods for resistance random access memory (RRAM) are provided. The methods include applying a reset operation voltage pulse across a RRAM cell to change a resistance of the RRAM cell from a low resistance state to a high resistance state and applying a forward resetting voltage pulse across the RRAM cell if the RRAM cell has a high resistance state resistance value less than a selected lower resistance limit value. The method also includes applying a reverse resetting voltage pulse across the RRAM cell if the RRAM cell has a high resistance state resistance values is greater than a selected upper resistance limit value. The reverse resetting voltage pulse has a second polarity being opposite the first polarity.

Abstract: A spin logic device which includes an electron confinement layer confining an electron gas in a two-dimensional area (2DEG) subtended by a direction x and a direction y, the latter perpendicular to the former. The spin logic device is configured for the 2DEG to support a persistent spin helix (PSH) formed therein with a given spin component oscillating with periodicity ? along direction x but not oscillating along direction y. Majority logic circuit of the spin logic device includes: at least one input device energizable to create respective local spin-polarizations of the 2DEG in first regions of the confinement layer. The input device is configured to detect in a second region of the confinement layer an average spin-polarization of the 2DEG diffused through resulting PSHs, wherein a projection of a distance between the second region and first regions onto direction x is equal to n ?/a, n integer, a equal to 2 or 4.

Abstract: A magnetic resistance memory apparatus capable of implementing various levels and a method of driving the same are provided. The magnetic resistance memory apparatus includes a first magnetic device that includes a fixed layer having a fixed magnetization direction, a tunnel layer disposed on the fixed layer, and a first free layer disposed on the tunnel layer having a variable magnetization direction, and a second magnetic device disposed on the first magnetic device including a plurality of free layers insulated with a spacer layer interposed.

Abstract: A differential read write back sense amplifier circuit and corresponding methods. A memory array comprises a plurality of memory cells arranged in rows and columns; a plurality of read word lines coupled to the memory cells; a plurality of write word lines coupled to the memory cells arranged along rows of the memory array; a plurality of read bit line pairs coupled to the memory cells arranged in columns; a plurality of write bit line pairs coupled to the memory cells arranged in columns; and at least one differential read write back sense amplifier coupled to a read bit line pair and coupled to a write bit line pair corresponding to one of the columns of memory cells, configured to differentially sense small signal read data on the read bit line pair, and output the sensed data onto the write bit line pair. Corresponding methods are disclosed.

Abstract: A spin transfer torque magnetic random access memory (STT-MRAM) device includes magnetic tunnel junctions (MTJs) with reduced switching current asymmetry. At least one switching asymmetry balance layer (SABL) near the free layer of the MTJ reduces a first switching current Ic(p-ap) causing the value of the first switching current to be nearly equal to the value of a second switching current Ic(ap-p) without increasing the average switching current of the device. The SABL may be a non-magnetic switching asymmetry balance layer (NM-SABL) and/or a magnetic switching asymmetry balance layer (M-SABL).

Abstract: A magnetic memory element includes: a first magnetization free layer; a non-magnetic layer; a reference layer; a first magnetization fixed layer group; and a first blocking layer. The first magnetization free layer is composed of ferromagnetic material with perpendicular magnetic anisotropy and includes a first magnetization fixed region, a second magnetization fixed region and a magnetization free region. The non-magnetic layer is provided near the first magnetization free layer. The reference layer is composed of ferromagnetic material and provided on the non-magnetic layer. The first magnetization fixed layer group is provided near the first magnetization fixed region. The first blocking layer is provided being sandwiched between the first magnetization fixed layer group and the first magnetization fixed region or in the first magnetization fixed layer group.