Abstract: A memory system is provided with technology for performing temperature dependent impedance mitigation, in addition to or instead of other techniques to compensate for differences in impedance. For example, the memory system comprises a plurality of non-volatile memory cells, a first pathway connected to the plurality of non-volatile memory cells, a second pathway connected to the plurality of non-volatile memory cells, and a control circuit connected to the first pathway and the second pathway. The control circuit is configured to compensate based on temperature for a temperature dependent impedance mismatch between the first pathway and the second pathway during a memory operation on the plurality of non-volatile memory cells.

Abstract: Methods, systems, and devices for operating a memory array are described. A memory controller may be configured to provide enhanced bandwidth on a command/address (C/A) bus, which may have a relatively low pin count, through use of a next partition command that may repeat an array command from a current partition at a different partition indicated by the next partition command. Such a next partition command may use fewer clock cycles than a command that includes a complete instruction and memory location information.

Abstract: First alternating stacks of first insulating strips and first spacer material strips is formed in a first device region, second alternating stacks of second insulating strips and second spacer material strips are formed in a second device region. Each of the first line trenches is filled with a respective laterally alternating sequence of memory stack structures and first dielectric pillar structures to form a three-dimensional NAND memory. Each of the memory stack structures includes a vertical semiconductor channel and a vertical stack of memory elements. Each of the second line trenches with a respective laterally alternating sequence of active region assemblies of lateral field effect transistors and second dielectric pillar structures to form a three-dimensional NOR memory. Each of the active region assemblies includes a source pillar, a drain pillar, and a tubular channel region. The spacer material strips include, or are subsequently replaced with, electrically conductive strips.

Abstract: A position of a memory cell to be accessed within a memory field of a memory device is identified. A region associated with the memory field within which the position is located is identified. A compensation parameter comprising a fixed electric step value for the region is identified. The compensation parameter may be selected from a set of compensation parameters or may be calculated based upon the position of the memory cell. The compensation parameter is applied to an action performed on a line connected to the memory cell during the access of the memory cell.

Abstract: Method(s) and structure(s) for a two-page read operation are described and provide a multiple page read. The two page read operation provides for reading two pages with in a block without reducing the control gates to a low voltage level. The two page read can read the first page using an incrementing voltage level at discrete steps and starting the second page read at the high state for the control gates from the first page read. The second page read then decrements the control gate voltages level through the steps. This should reduce energy consumption. The two-page read operation will also reduce the time as the time period to reset the control gates to a low state are not required in between the page read operations.

Abstract: When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.

Abstract: A memory device includes an array of vertical NAND strings of nonvolatile memory cells, on an underlying substrate. An erase control circuit is provided, which is configured to drive a plurality of bit lines electrically coupled to the array of vertical NAND strings of nonvolatile memory cells with respective erase voltages having unequal magnitudes during an operation to erase the nonvolatile memory cells in the array of vertical NAND strings. This erase control circuit may also be configured to drive a first of the plurality of bit lines with a first erase voltage for a first duration and drive a second of the plurality of bit lines with a second erase voltage for a second duration unequal to the first duration during the operation to erase the nonvolatile memory cells in the array of vertical NAND strings.

Abstract: A memory device includes: a memory cell array; a control logic circuit; and a row decoder. The row decoder is configured to activate string selection lines based on control of the control logic circuit. A program interval is formed between a first program operation and a second program operation. The control logic circuit includes a reprogram controller configured to control the row decoder so that a program interval differs in the memory cells connected to different string selection lines among the memory cells connected to a first wordline.

Abstract: The present disclosure includes memory blocks erasable in a single level cell mode. A number of embodiments include a memory comprising a plurality of mixed mode blocks and a controller. The controller may be configured to identify a particular mixed mode block for an erase operation and, responsive to a determined intent to subsequently write the particular mixed mode block in a single level cell (SLC) mode, perform the erase operation in the SLC mode.

Abstract: Apparatuses and techniques are described for managing power consumption in a memory device. When a multi-plane read command is received, a control circuit determines whether the blocks identified by the read command are fully or partially programmed. If they are fully programmed, the read command is executed while applying a common read pass voltage to the unprogrammed word lines of the respective blocks. If the blocks are not all fully programmed, the control circuit determines a last-programmed word line. If the last-programmed word lines are not equal in each block, the read command is executed while applying a base read pass voltage to the unprogrammed word lines of one or more higher-programmed blocks and a lower read pass voltage to the unprogrammed word lines of one or more lower-programmed blocks.

Abstract: Strings of non-volatile memory cells include one or more joint regions adjacent to dummy non-volatile memory cells. During erase operations, different voltage levels are used for different dummy word lines coupled to respective dummy non-volatile memory cells. For example, a selection circuit may set a voltage level of a particular dummy word line to a voltage level greater than a different dummy word line. In another example, the selection circuit may determine a voltage level for a given dummy word line based on a distance between a non-volatile memory cell coupled to the given dummy word line and a selection device included in a string of non-volatile memory cells. Electron holes generated using the dummy word lines during erase operations may neutralize undesired trapped charges in a non-volatile memory string, thereby reducing disparity in erase times for different strings in the non-volatile memory circuit.

Abstract: A memory device includes a memory array comprising a plurality of planes, a plurality of voltage generation systems, and a controller. Each voltage generation system of the plurality of voltage generation systems is electrically coupled to a corresponding plane of the plurality of planes. The controller is configured to turn on each voltage generation system of the plurality of voltage generation systems in response to a first command to access a first plane of the plurality of planes. The controller is configured to operate the voltage generation system of the plurality of voltage generation systems corresponding to the first plane of the plurality of planes at a first clock frequency, and operate the remaining voltage generation systems of the plurality of voltage generation systems corresponding to the other planes of the plurality of planes at a second clock frequency less than the first clock frequency.

Abstract: A method for writing to a storage memory is provided. The method includes determining erase block size for each of a plurality of erase blocks of the storage memory, wherein at least two of the plurality of erase blocks have differing erase block sizes. The method includes forming a plurality of data segments and writing the plurality of data segments across the plurality of erase blocks of the storage memory, with at least one of the plurality of erase blocks storing portions of two or more of the plurality of data segments.

Abstract: Integrated circuit (5) includes substrate (10) with surface (20) and structure (30) including base levels (45.i, 45.(i+1)), terminating cells (48, 49), and block (40) of standard cells arranged in rows (42.i, 42.(i+1)), and another type of block (60) outside block (40). Standard cells at at least two edges of block (40) have the following protections: (1) block (60) has strip of separation (41.j) having at least a minimum width from the edges of block (40), and protected by one of the following: (2) terminating cells (48, 49) reduce context effect and some terminating cells (48) are placed at at least one end of rows (42.i, 42.(i+1)) of standard cells within first-named block (40), and (3) the terminating cells (48, 49) reduce context effect and some terminating cells (49) are at one end of a column of standard cells within block (40). Other structures, devices, and processes are also disclosed.

Abstract: A write request is received to write byte-addressable data corresponding to a first entry of a plurality of entries in a page table, and the byte-addressable data is written in a buffer of a host memory. A read request is received to read byte-addressable data corresponding to a second entry of the plurality of entries in the page table, and a read command is sent to a device using a memory device interface to read the byte-addressable data from a Storage Class Memory (SCM) of the device. According to another aspect, control circuitry of the device uses a block device interface for receiving commands from a host to read and write data in blocks in the SCM. The control circuitry also uses a memory device interface for receiving read commands from the host to read byte-addressable data from the SCM.

Abstract: A storage device includes a controller and a memory. In response to a request of a host, the controller generates: (A) a first list as a result of counting: (1) the number of first page numbers included in a first range among page numbers included in a logical address received from the host and (2) the number of second page numbers included in a second range not overlapping the first range, (B) generates a second list as a result of respectively grouping the first page numbers and the second page numbers based on the first list, and (C) translates the logical address to a physical address based on the second list and the first map data. The memory stores the first map data to be provided to the controller. The first map data matches the first page numbers and the second page numbers with respective physical addresses.

Abstract: A non-volatile memory cell includes a floating gate transistor having a floating gate. A method for operating the non-volatile memory cell includes, during a program operation, performing an initial program searching operation to identify a first initial value of a threshold voltage of the floating gate transistor, coupling the floating gate of the floating gate transistor to a first program voltage to raise the threshold voltage of the floating gate transistor, performing a program searching operation to identify a first variation of the threshold voltage, generating a second program voltage according to the first variation of the threshold voltage, and coupling the floating gate of the floating gate transistor to the second program voltage to raise the threshold voltage of the floating gate transistor.

Abstract: A non-volatile memory device using existing row decoding circuitry to selectively provide a global erase voltage to at least one selected memory block in order to facilitate erasing of all the non-volatile memory cells of the at least one selected memory block. More specifically, the erase voltage is coupled to the cell body or substrate of memory cells of the at least one selected memory block, where the cell body is electrically isolated from the cell body of non-volatile memory cells in at least one other memory block. By integrating the erase voltage path with the existing row decoding circuitry used to drive row signals for a selected memory block, no additional decoding logic or circuitry is required for providing the erase voltage to the at least one selected memory block.

Abstract: According to one embodiment, a semiconductor storage device is disclosed. The device includes a memory cell array including memory cells, bit lines connected to the memory cell array, sense amplifier units provided to correspond to bit lines and arranged in a matrix of M rows and N columns, data latches provided to correspond to sense amplifier units and arranged in a matrix of S rows and T columns. M, N, S, and T are positive integers, satisfying M<S, N>T, and S×T=M×N. A dimension of each of the sense amplifier units in an arrangement direction of the N columns is smaller than a dimension of each of the data latches in an arrangement direction of the T columns.

Abstract: A semiconductor memory device includes a first wiring, a first memory transistor connected to the first wiring, a first transistor connected between the first wiring and the first memory transistor, a second transistor connected between the first wiring and the first transistor, and second to fourth wirings respectively connected to gate electrodes of the first memory transistor, the first transistor, and the second transistor. From a first timing to a second timing, a voltage difference between the first wiring and the third wiring is maintained at a predetermined value, a voltage difference between the third wiring and the fourth wiring is maintained at a predetermined value, a voltage of the first wiring becomes larger than a voltage of the third wiring, and the voltage of the third wiring becomes larger than a voltage of the fourth wiring.

Abstract: A memory control method for a rewritable non-volatile memory module is provided according to an exemplary embodiment of the disclosure. The method includes: reading a first physical unit based on a first read voltage level to obtain first data; reading the first physical unit based on a second read voltage level to obtain second data; reading the first physical unit based on a third read voltage level to obtain third data; obtaining a first reference value which reflects a data variation status between the first data and the second data; obtaining a second reference value which reflects a data variation status between the first data and the third data; reading the first physical unit based on a fourth read voltage level to obtain fourth data according to the first reference value and the second reference value; and decoding the fourth data by a decoding circuit.

Abstract: Circuit designs and operating techniques for a storage device that includes, in one implementation, a memory device including a plurality of memory blocks, each memory block including a plurality of memory cells coupled to a plurality of corresponding word lines; and a memory controller configured to store data in memory cells included in a main area coupled to a selected word line of the plurality of word lines, and store word-line information in a spare area coupled to the selected word line to indicate that a program operation has been performed on the main area.

Abstract: Apparatuses and techniques are provided for programming memory cells while reducing widening of a threshold voltage distribution due to changes in the temperature between the time of programming and the time of a subsequent read operation. One technique is based on a correlation between program speed and temperature coefficient (Tco). A different verify test is used for different memory cells which have a common assigned data state according to the program loop number and the temperature. Another technique is based on sensing the memory cells to measure their subthreshold slope and classifying the memory cells into groups. The sensing can occur as a separate operation before programming or as part of the programming of user data. The subsequent programming of the memory cells involves adjusting the verify test of each memory cell based on its group and the temperature.

Abstract: A request to add content to a system data structure can be received. A first set of blocks of a common pool of blocks are allocated to the system data structure and a second set of blocks of the common pool of blocks are allocated to user data. A determination can be made as to whether a garbage collection operation associated with the first set of blocks of the common pool allocated to the system data structure satisfies a garbage collection performance condition. Responsive to determining that the garbage collection operation satisfies the garbage collection performance condition, a block from the common pool can be allocated to the first set of blocks allocated to the system data structure.

Abstract: A three-dimensional semiconductor device includes first and second extended regions disposed on a substrate spaced apart from each other, a memory block disposed on the substrate between the first and second extended regions, and first and second main separation structures disposed on the substrate spaced apart from each other. The first extended region, the memory block and the second extended region are disposed between the first and second main separation structures. The memory block includes data storage regions and word lines. The word lines extend from the memory block and pass through the first and second extended regions. A distance between the first and second main separation structures located on both sides of the first extended region is greater than a distance between the first and second main separation structures located on both sides of the memory block.

Abstract: A semiconductor memory device includes a cell wafer including a first plane and a second plane which are disposed to be adjacent to each other in a first direction and each include a plurality of memory cells; and a peripheral wafer including a row decoder which simultaneously controls the first and second planes and first and second page buffer circuits which control the first and second planes, respectively. The cell wafer includes, on one surface thereof bonded to the peripheral wafer, a first pad which is coupled in common with the first plane and the second plane, and the peripheral wafer includes, on one surface thereof bonded to the cell wafer, a second pad which is coupled with the row decoder and is bonded to the first pad.

Abstract: The present invention relates to a programming circuit and a programming method of a flash memory, the programming circuit includes a programming transistor and a storage cell connected in series, a gate of the programming transistor is connected to a word line, a gate of the storage cell is connected to a control gate, one end of the programming transistor is connected to a bit line, the other end of the programming transistor is connected to one end of the storage cell, and the other end of the storage cell is connected to a source line. By programming the flash memory by the programming circuit and method of the present invention, the efficiency of latter stage programming can be improved without increasing channel current, thereby improving the efficiency of the entire programming process, shortening the total programming time, and improving the performance of the flash memory.

Abstract: An integrated circuit (IC) device includes: a channel region that extends on the substrate to penetrate a plurality of word lines; a bit line contact pad that contacts an upper surface of the channel region; a bit line that contacts the bit line contact pad and extends on the bit line contact pad in a direction parallel to the main surface of the substrate; a common source line that partially fills a word line cut region and has a height lower than that of the channel region; and a common source via contact that contacts an upper surface of the common source line in the word line cut region.

Abstract: Some embodiments include an integrated assembly having a base comprising sense-amplifier-circuitry, a first deck over the base, and a second deck over the first deck. The first deck includes a first portion of a first array of first memory cells, and includes a first portion of a second array of second memory cells. The second deck includes a second portion of the first array of the first memory cells, and includes a second portion of the second array of the second memory cells. A first digit line is associated with the first array, and a second digit line is associated with the second array. The first and second digit lines are comparatively coupled with one another through the sense-amplifier-circuitry.

Abstract: According one embodiment, a memory device includes: a memory cell array; a voltage generation circuit generating one or more voltages supplied to the memory cell array; an input/output circuit receiving an address indicating a region in the memory cell array; and a control circuit controlling operations of the memory cell array. The voltage generation circuit generates the voltages during reception of the address.

Abstract: An apparatus includes non-volatile memory and a control circuit configured to program the non-volatile memory. The control circuit is configured to change a programming order. In one aspect, the control circuit changes the order in which word lines are programmed from one point in time to another. In one aspect, the control circuit uses one order for programming one set of word lines and a different order for a different set of word lines. The sets of word lines could be in different sub-blocks, memory blocks, or memory dies. Such programming order differences can improve performance of error recovery.

Abstract: A data storage circuit for storing data from volatile memory in response to a power loss, the data storage circuit including an input for receiving a power loss signal in response to a power loss from at least one power source, an input configured to receive data from a volatile memory, a single block of non-volatile matrix of memory cells and a driver circuit coupled to said single row of non-volatile matrix of memory cells. The driver circuit is configured to write data to and read data from said single block of non-volatile matrix of memory cells. The single block of non-volatile matrix of memory cells can be provided as a single row electrically erasable programmable read only memory (EEPROM).

Abstract: The present disclosure includes apparatuses and methods to transfer data between banks of memory cells. An example includes a plurality of banks of memory cells and a controller coupled to the plurality of subarrays configured to cause transfer of data between the plurality of banks of memory cells via internal data path operations.

Abstract: A storage device includes a memory and a controller. The controller controls the memory such that, in response to a request for a first read operation on the memory while a first write operation is performed on the memory, the first write operation is suspended, and the first read operation is performed, the suspended first write operation is resumed after the first read operation is completed, and second write operation subsequent to the first write operation is performed on the memory after the resumed first write operation is completed. The controller throttles an amount of data communicated to the memory device for the second write operation or for a second read operation subsequent to the first read operation, based on a frequency that the first write operation is suspended.

Abstract: A memory system includes a memory device comprising a plurality of memory blocks; and a controller suitable for controlling the memory device, wherein the controller comprises a real time clock (RTC) management circuitry suitable for generating a sudden power-off (SPO) occurrence cycle using first and second RTC values when a first SPO occurs, and then comparing the SPO occurrence cycle to a threshold value to determine whether to delay dummy page generation; and a dummy page generation circuitry suitable for generating a dummy page using one or more free pages or an incomplete program page, excluding valid pages, from a memory block, among the plurality of memory blocks, according to the determination result of the RTC manager, the incomplete program page indicating a page in which a program operation is interrupted due to an SPO.

Abstract: Apparatuses and methods have been disclosed. One such apparatus includes strings of memory cells formed on a topside of a substrate. Support circuitry is formed on the backside of the substrate and coupled to the strings of memory cells through vertical interconnects in the substrate. The vertical interconnects can be transistors, such as surround substrate transistors and/or surround gate transistors.

Abstract: A semiconductor memory device includes a control circuit configured to charge a first node to a first voltage based on a resistance of a memory cell when first data is stored, write second data after the first node is charged to the first voltage, charge a second node to a second voltage based on a resistance of the memory cell when second data is stored, and determine, based on the first and second voltages, whether the first data is different from the second data. The circuit includes a first element including a first end coupled to the first node, and a second end coupled to a third node between the first and second nodes, a second element including first and second ends coupled to the first node, and a third element including a first end coupled to the second node and a second end coupled to the third node.

Abstract: A plurality of block configurations may be employed for read while write operations. In one apparatus example, a plurality of block configurations may be employed. Block configurations may include an arrangement of similarly doped semiconductor switches. Block configurations may select a respective tile of a memory array, a particular memory cell of the respective tile, and select a memory operation to apply to the particular memory cell. Immediately adjacent block configurations within a particular slice of the memory array may be substantially mirrored and immediately adjacent block configurations in separate immediately adjacent slices of the memory array may be substantially similar. Similarly doped diffusion regions for similarly doped semiconductor switches in substantially mirrored block configurations may be arranged to electrically share a common potential signal value level. Other apparatus and methods are also disclosed.

Abstract: A semiconductor memory device includes a switching controller, a voltage generator and control logic. The switching controller is connected to a local word line. The voltage generator, connected to the switching controller, is configured to generate an operating voltage according to an input clock signal and transfer the operating voltage to the switching controller. The control logic is configured to control operations of the voltage generator and the switching controller. The control logic is configured to detect an amount of leakage current of the local word line by counting a number of pulses of the input clock signal.

Abstract: A method for reading an array of memory cells includes enabling a current to flow through even data lines of the array of memory cells. The method includes blocking a current from flowing through odd data lines of the array of memory cells. The method includes sensing data stored in memory cells coupled to the even data lines.

Abstract: Semiconductor devices are provided. A semiconductor device includes a stack of alternating gates and insulating layers. The semiconductor device includes a dummy cell region. The semiconductor device includes a plurality of bit lines and a plurality of auxiliary bit lines. Some of the plurality of auxiliary bit lines have different respective lengths. Related methods of forming semiconductor devices are also provided.

Abstract: A semiconductor device includes a bit line, a source line, and a memory string coupled between the bit line and the source line. The memory string includes at least one drain select transistor, a plurality of memory cells, at least one source select transistor, and a dummy transistor coupled between the bit line and the drain select transistor or between the source line and the source select transistor.

Abstract: A data erasure device is for a non-volatile semiconductor memory device, which includes cells in which data is written by an application of a first voltage and erased by an application of a second voltage differing from the first voltage. The data erasure device includes a controller. The controller applies a second voltage to the cells over first time period with multiple occurrences to set the cells into a first erasure state, and applies the second voltage to the cells over second time period, which is longer than the first time period, to set the cells in a second erasure state deeper than the first erasure state. The controller changes a number of occurrences of applying the second voltage over the first time period to each of the cells or each of multiple cell groups having the cells according to respective erasure states of the cells.

Abstract: Methods, systems, and devices for multiple memory die techniques are described. A memory device may include multiple memory dies and may be configured to communicate with a host device. For example, each memory die may be coupled with a set of data pins that includes respective subsets of data pins (e.g., a set of eight data pins having two subsets of four data pins). Further, each memory die may have one or more auxiliary pins used for channel coding information for data communicated over one or more of the subsets of data pins. In some cases, each memory die may include one or more additional auxiliary pins, which may be used for channel coding information for a respective subset of data pins or multiple subsets of data pins. The channel coding information associated with the auxiliary pin(s) may include error detection code information, data coding information, or any combination thereof.

Abstract: A methodology and structure for selectively erases a group of strings in a vertical NAND memory array to account for the slow to erase memory cells in the inner strands compared to the outer strands in the group. Erase signals can be applied through both the drain side connections and the source side connections in a first step to erase the outer strings. A second erase signal can be applied to the inner strands to erase the inner strands. The second signal can be applied from just the drain side connections or through both the drain side connections and the source side connections. In another embodiment, the erase signals are applied from both the source side connections and the drain side connections to the inner strings and only from the source side connections to the outer strings.

Abstract: A semiconductor stacked device include a first plurality of device layers separated from one another by a first plurality of dielectric layers, a first electrically conductive via coupled to a contact portion of a device layer of the first plurality of the device layers, a second plurality of device layers separated from one another by a second plurality of dielectric layers, and a second electronically conductive via coupled to a contact portion of a device layer of the second plurality of the device layers. The first electronically conductive via extends to a frontside of the semiconductor stacked device and the second electrically conductive via extends to a backside of the semiconductor stacked device. The first plurality of device layers form a stair pattern in a first direction and the second plurality of device layers form a stair pattern in a second direction inverted from the first direction.

Abstract: Numerous embodiments are disclosed for an analog neuromorphic memory system for use in a deep learning neural network. The analog neuromorphic memory system comprises a plurality of vector-by-matrix multiplication arrays and various components shared by those arrays. The shared components include high voltage generation blocks, verify blocks, and testing blocks. The analog neuromorphic memory system optionally is used within a long short term memory system or a gated recurrent unit system.

Abstract: A data erase operation is performed on the memory system. The directed data erase operation performed on the memory system erases blocks of the memory device including blocks that are indicated as not including user data. In some embodiments, a data erase operation may be performed on a memory system to erase those groups of memory cells (e.g., blocks) indicated as not including user data. In some embodiments, a data erase operation may be performed on a memory system to erase those groups of memory cells (e.g., blocks) indicated as valid without erasing those groups of memory cells (e.g., blocks) indicated as invalid. In some embodiments, a data erase operation that can be performed on a memory system may obtain information associated with failing scenes of groups of memory cells (e.g., blocks) prior to obtaining the information, and erase the blocks (e.g., invalid blocks) subsequently.

Abstract: Apparatuses and methods for reducing read disturb are described herein. An example apparatus may include a first memory subblock including a first select gate drain (SGD) switch and a first select gate source (SGS) switch, a second memory subblock including a second SGD switch and a second SGS switch, and an access line associated with the first and second memory subblocks. The apparatus may include a control unit configured to enable the first and second SGD switches and the first and second SGS switches during a first portion of a read operation and to provide a first voltage on the access line during the first portion. The control unit may be configured to disable the first SGD switch and the first SGS switches during a second portion of the read operation and to provide a second voltage on the access line during the second portion.

Abstract: According to one embodiment, a semiconductor memory includes: a first bit line; a first select transistor having a first terminal connected to the first bit line; a first memory cell connected to a second terminal of the first select transistor; a circuit connected to the first bit line and applying an erase voltage to be applied to the first memory cell to the bit line via the first terminal and the second terminal; and a diode connected to the first bit line and the first circuit.