Abstract: Numerous embodiments are disclosed for an analog neuromorphic memory system for use in a deep learning neural network. The analog neuromorphic memory system comprises a plurality of vector-by-matrix multiplication arrays and various components shared by those arrays. The shared components include high voltage generation blocks, verify blocks, and testing blocks. The analog neuromorphic memory system optionally is used within a long short term memory system or a gated recurrent unit system.

Abstract: A data erase operation is performed on the memory system. The directed data erase operation performed on the memory system erases blocks of the memory device including blocks that are indicated as not including user data. In some embodiments, a data erase operation may be performed on a memory system to erase those groups of memory cells (e.g., blocks) indicated as not including user data. In some embodiments, a data erase operation may be performed on a memory system to erase those groups of memory cells (e.g., blocks) indicated as valid without erasing those groups of memory cells (e.g., blocks) indicated as invalid. In some embodiments, a data erase operation that can be performed on a memory system may obtain information associated with failing scenes of groups of memory cells (e.g., blocks) prior to obtaining the information, and erase the blocks (e.g., invalid blocks) subsequently.

Abstract: Apparatuses and methods for reducing read disturb are described herein. An example apparatus may include a first memory subblock including a first select gate drain (SGD) switch and a first select gate source (SGS) switch, a second memory subblock including a second SGD switch and a second SGS switch, and an access line associated with the first and second memory subblocks. The apparatus may include a control unit configured to enable the first and second SGD switches and the first and second SGS switches during a first portion of a read operation and to provide a first voltage on the access line during the first portion. The control unit may be configured to disable the first SGD switch and the first SGS switches during a second portion of the read operation and to provide a second voltage on the access line during the second portion.

Abstract: According to one embodiment, a semiconductor memory includes: a first bit line; a first select transistor having a first terminal connected to the first bit line; a first memory cell connected to a second terminal of the first select transistor; a circuit connected to the first bit line and applying an erase voltage to be applied to the first memory cell to the bit line via the first terminal and the second terminal; and a diode connected to the first bit line and the first circuit.

Abstract: Methods of operating a memory, and memory configured to perform similar methods, might include performing a sense operation on a particular memory cell of a string of series-connected memory cells, discharging the respective access line for a second memory cell of the string of series-connected memory cells to a first voltage level, discharging the respective access line for the particular memory cell to a second voltage level higher than the first voltage level, and discharging the respective access line for a third memory cell of the string of series-connected memory cells to a third voltage level lower than the second voltage level and higher than the first voltage level.

Abstract: A nonvolatile memory device that performs a read operation during which row decoder circuitry applies a turn on voltage to a first ground selection line selected from a plurality of ground selection lines, applies a turn off voltage to at least one second ground selection line selected from the plurality of ground selection lines, the at least one second ground selection line being selected from the plurality of ground selection lines based on a read address associated with the read operation, and applies the turn off voltage to an unselected ground selection line among the plurality of ground selection lines after applying a prepulse voltage to the unselected ground selection line.

Abstract: A memory system includes a nonvolatile memory, an interface circuit, and a controller configured to upon receipt of a plurality of write commands for storing write data in the nonvolatile memory via the interface circuit, acquire compression-ratio information about the write data associated with each write command, determine a compression ratio of each write data based on the acquired compression-ratio information, and determine an execution order of the write commands based on the determined compression ratio.

Abstract: A memory device includes receiving, by a memory module, a first combined signal and a second combined signal from a memory controller and decoding, by the memory module, the first combined signal and the second combined signal to obtain a first chip enable signal, a first address latch enable signal, and a first command latch enable signal. Upon decoding, the first command latch enable signal and the first address latch enable signal are received substantially simultaneously as the first chip enable signal to reduce a setup time.

Abstract: A nonvolatile memory device includes a control logic circuit that receives a read command from outside the nonvolatile memory device, a memory cell array which includes a plurality of memory cells connected to a plurality of word lines, an address generator that generates a plurality of addresses based on read information from the outside of the nonvolatile memory device, an address decoder sequentially selects a plurality of pages in at least one word line, which correspond to the plurality of addresses, a page buffer circuit that is connected to the memory cell array through a plurality of bit lines, and prepares a plurality of sequential data from memory cells connected to the selected pages by the address decoder, and an input/output circuit that continuously outputs the plurality of sequential data from the page buffer circuit to the outside of the nonvolatile memory device through data lines.

Abstract: An integrated circuit includes a supply terminal to receive a supply voltage and a test terminal that operates in an input mode and an output mode. A test interface of the integrated circuit operates in a normal mode requiring a serial write to the test terminal to access test locations in the integrated circuit. The test interface also operates in an automatic mode in which addresses for test locations are auto incremented by toggling the supply voltage from a high voltage level to a low voltage level and back to the high voltage level. In an input mode, with the supply voltage at the low voltage level, the test pin receives configuration and address information. In output mode, with the supply voltage at the high voltage level, the test pin supplies test information corresponding to the address information received.

Abstract: A nonvolatile semiconductor memory device includes a selection transistor and a memory transistor that are formed on a well for each of a plurality of memory cells. At a time of a data read from the memory transistor, a first voltage is applied to the well and a source of the memory transistor, and a second voltage is applied to a gate of the selection transistor included in a non-selected memory cell among the plurality of memory cells. The first voltage is smaller than an absolute value of the second voltage.

Abstract: A semiconductor storage device includes a first semiconductor extending above a substrate and including a first part and a second part, a first word line at a first level above the substrate and facing the first part of the first semiconductor, a second word line at the first level above the substrate and facing the second part of the first semiconductor, a first cell transistor including a first area of the first part of the first semiconductor that faces the first word line, and a second cell transistor including a second area of the second part of the first semiconductor that faces the second word line, wherein during an operation of reading data from the first cell transistor, a first voltage that is less than a threshold voltage of the second cell transistor and greater than or equal to zero voltage is applied to the second word line.

Abstract: A flash memory storage apparatus and a reading method thereof are provided. The flash memory storage apparatus includes a memory cell array and a memory control circuit. The memory cell array includes at least one memory cell string coupled between a bit line and a source line. The memory control circuit is coupled to the memory cell array and configured to control a read operation of the memory cell array during the reading period. The reading period includes a pre-charge period and a discharge period. The source line performs a pre-charge operation on the bit line via a signal transmission path during the pre-charge period. The bit line performs a discharge operation on the source line via the same signal transmission path during the discharge period. The signal transmission path includes the memory cell string.

Abstract: According to one embodiment, a semiconductor memory device includes: a memory cell array; a plurality of bit lines respectively connected to memory cells; a word line commonly connected to the memory cells; and a control circuit. The control circuit programs a first memory cell of a first state and a second memory cell of a second state by using a first program pulse. The control circuit applies a first voltage to a first bit line connected to the first memory cell, and applies a second voltage lower than the first voltage to a second bit line connected to the second memory cell at a first time within a first period during which the first program pulse is applied. The control circuit applies the second voltage to the first and second bit lines at a second time within the first period.

Abstract: According to one embodiment, a memory controller transmits a first instruction to a memory device. The memory device includes cell transistors; word lines coupled to gates of the cell transistors; a first data latch; and a second latch. The first instruction instructs application of a positive voltage to one of the word lines. The memory controller transmits a second instruction after the transmission of the first instruction and before transmitting a third instruction. The third instruction instructs output of data from the memory device. The second instruction is different from the third instruction and a fourth instruction instructing copy of data from the first data latch to the second data latch.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes: first memory cells, first word lines, a first row decoder, and a driver circuit. The first row decoder includes first transistors capable of coupling the first word lines to first signal lines, and a first block decoder supplying a first block selection signal to the first transistors. When the controller issues a data read command, the first block decoder asserts the first block selection signal to allow the first transistors to transfer a first voltage to a selected first word line, and a second voltage to unselected other first word lines. After data is read, the first block decoder continues asserting the first block selection signal, and the driver circuit transfers a third voltage.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first blocks including a memory cell capable of storing data of one bit, a second block including a memory cell capable of storing data of two or more bits. The semiconductor memory stores first data in a first latch circuit, and second data in a second latch circuit, and writes the first data into one of the first blocks in page units, and the second data into one of the first blocks in page units. The semiconductor memory writes data of at least two pages into the second block, using the first data stored in the first latch circuit and the second data stored in the second latch circuit.

Abstract: The present disclosure includes apparatuses, methods, and systems for data relocation in memory. An embodiment includes a controller, and a memory having a plurality of physical units of memory cells. Each of the physical units has a different sequential physical address associated therewith, a first number of the physical units have data stored therein, a second number of the physical units do not have data stored therein, and the physical address associated with each respective one of the second number of physical units is a different consecutive physical address in the sequence. The controller can relocate the data stored in the physical unit of the first number of physical units, whose physical address in the sequence is immediately before the first of the consecutive physical addresses associated with the second number of physical units, to the last of the consecutive physical addresses associated with the second number of physical units.

Abstract: According to an embodiment, a semiconductor memory device includes first and second groups each including a plurality of memory cells, and a control circuit. The control circuit is configured to successively apply a first voltage and a second voltage which is higher than the first voltage to a memory cell in the first or second group, and to apply a third voltage to the memory cell after applying the second voltage. When the memory cell is included in the first group, the control circuit applies the third voltage to the memory cell a time earlier with respect to a time when the second voltage is applied than when the memory cell is included in the second group. Each of the first and second groups corresponds to a data erase unit or a unit larger than the data erase unit.

Abstract: The semiconductor memory device includes a memory cell array, a peripheral circuit and a control logic. The memory cell array includes a plurality of memory cells. The peripheral circuit performs a program operation for the plurality of memory cells in the memory cell array. The control logic controls the peripheral circuit and the memory cell array such that, during the program operation for the plurality of memory cells, pre-bias voltages are applied to a plurality of word lines coupled to the plurality of memory cells to precharge channel regions of the plurality of memory cells. Furthermore, different pre-bias voltages are applied to the plurality of word lines depending on the relative positions of the word lines.

Abstract: Method for writing objects into an object storage. Performing, on a protocol end point: receiving a client request for inserting an object into the object storage, wherein the object has a name and object data; generating a unique ID (UID) for the object; sending, to a name server (NS), a request for creating a guard entry (GE). The GE has a lifetime that defines when the name-object pair is inserted into the object storage. A request to an object server (OS) atomically creates a Garbage Collection Entry and assigns space for the object data. The GCE has a lifetime that defines when the object data is inserted into the object storage; sending, to the OS, object data for writing to storage; sending, to the NS, a request for writing the name; and sending response to the client, to report success after requests to the NS and the OS are successful.

Abstract: A technique for determining performance characteristics of electronic devices and systems is disclosed. In one embodiment, the technique is realized by measuring a first response on a first transmission line from a single pulse transmitted on the first transmission line, and then measuring a second response on the first transmission line from a single pulse transmitted on at least one second transmission line, wherein the at least one second transmission line is substantially adjacent to the first transmission line. The worst case bit sequences for transmission on the first transmission line and the at least one second transmission line are then determined based upon the first response and the second response for determining performance characteristics associated with the first transmission line.

Abstract: Read Apparent Voltage (RAV) is an anomality in which an apparent threshold voltage of a storage cell transistor does not equal the actual threshold voltage of that same transistor by a large enough magnitude that the binary state of transistor is not read correctly. An infector page may cause the RAV anomality within a different infected page. To determine whether any page is an infector, each page is programmed, a page within each block is read, an acting infector page within an acting infector block is set, a possible infected page within a possible infected block is set, the acting infector page is read a predetermined plurality of instances, the possible infected page is read, a raw bit error rate (RBER) of the read of the possible infected page is determined, and the acting infector page is set as an actual infector page based upon the determined RBER.

Abstract: Provided herein may be a storage device and a method of operating the same. A storage device for protecting the storage device from physical movement may include a nonvolatile memory device, a sensor unit configured to collect information about physical movement of the storage device, and a memory controller configured to perform a device lock operation of protecting data in the nonvolatile memory device, based on a sensor value acquired from the sensor unit.

Abstract: A method of operating a nonvolatile memory device is provided where the nonvolatile memory device includes a plurality of cell strings, and each cell string includes a plurality of multi-level cells. a voltage of a selected word line is sequentially changed to sequentially have a plurality of read voltages for determining threshold voltage states of the plurality of multi-level cells. A voltage of an adjacent word line adjacent to the selected word line is sequentially changed in synchronization with voltage changing time points of the selected word line. A load of the selected word line is reduced and an operation speed of the nonvolatile memory device is increased by synchronizing the voltage change of the selected word line and the voltage change of the adjacent word line in the same direction.

Abstract: A memory system includes a plurality of memory devices, each including a plurality of memory blocks; and a controller configured to evaluate performance grades of the plurality of memory blocks, form super blocks spanning the plurality of memory devices by selecting memory blocks, among the plurality of memory blocks, to be included in each of the super blocks based on the performance grades, and write-access an opened super block, among the super blocks.

Abstract: Techniques for reducing neighbor word line interference (NWI) of memory cells which are formed in a two-tier stack having a lower tier and an upper tier separated by an interface. In one approach, an upward word line programming order is used for a top portion of the top tier, and a downward word line programming order is used for a bottom portion of the top tier and for the bottom tier. Additionally, for memory cells which receive NWI from both adjacent word lines, options include programming fewer bits per cell, performing multi-pass programming and/or use lower verify voltages. Options also include increasing a control gate length of the memory cells and increasing a height of a dielectric region adjacent to the memory cells.

Abstract: A memory device includes a first memory cell array, a second memory cell array disposed in a first direction with respect to the first memory cell array, a first contact plug extending in the first direction through the first memory cell array, and a second contact plug extending in the first direction through the second memory cell array. The first memory cell array includes first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the first electrode layers in the first direction. The second memory cell array including second electrode layers stacked in the first direction, and a second semiconductor pillar extending in the first direction through the second electrode layers. The first contact plug is electrically connected to the first semiconductor pillar, and the second contact plug is electrically connected to the second semiconductor pillar and the first contact plug.

Abstract: Disclosed is a computer memory including a memory array, an address decoder, and a wordline enable circuit. The wordline enable circuit includes a plurality of memory cells, each cell corresponding to a memory row of the memory array. Each memory cell stores a flag indicating whether a data row of the corresponding memory row should have a value of zero. The wordline enable circuit additionally includes multiple outputs, each corresponding to a memory row of the memory array. The wordline enable circuit outputs a signal having the first value (e.g., 1 or HI) through an output corresponding to the input address in response to receiving an input signal having the first value and the flag being stored by the memory cell corresponding to the input address having a first flag value.

Abstract: A memory system includes a nonvolatile memory which includes a memory cell array, and a memory controller which includes a first ECC circuit, and a second ECC circuit having an error correction capability higher than that of the first ECC circuit, and is configured to perform ECC operation on data read from the nonvolatile memory using the first ECC circuit and the ECC circuit. During the ECC operation, the first ECC circuit corrects an error in first read data which is read out of the nonvolatile memory. The memory controller determines whether the hard error occurs in the memory cell array in a case where the first ECC circuit is unable to correct the error. In a case where the hard error occurs, the second ECC circuit performs error correction using second read data that excludes a bit where the hard error occurs.

Abstract: The disclosure relates in some aspects to a read scrub design for a non-volatile memory that includes a block comprising N wordlines partitioned into a first sub-block comprising a first subset of the N wordlines and a second sub-block comprising a second subset of the N wordlines different than the first subset. In some aspects, the disclosure relates to detecting a trigger event associated with a read command performed on the first sub-block. A target sub-block test is then performed in response to a detection of the trigger event to determine whether to add the first sub-block to a read scrub queue. If the first sub-block is added to the read scrub queue, a sister sub-block test is then performed to determine whether to add the second sub-block to the read scrub queue.

Abstract: Apparatuses and methods involving accessing distributed sub-blocks of memory cells are described. In one such method, distributed sub-blocks of memory cells in a memory array are enabled to be accessed at the same time. Additional embodiments are described.

Abstract: A non-volatile memory device includes: a memory cell array including a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a row decoder configured to selectively control the plurality of word lines, a page buffer including a plurality of latches corresponding to the plurality of bit lines, respectively, and a control circuit configured to control the non-volatile memory device to enter a suspend state after terminating a verify operation of a program loop of a program operation of the plurality of memory cells in response to a suspend request being generated during an execution operation of the program loop.

Abstract: A non-volatile storage system comprises non-volatile memory cells arranged in physical blocks, and one or more control circuits in communication with the non-volatile memory cells. The one or more control circuits are configured to write data to a physical block of the non-volatile memory cells with a scheme to reduce read disturb if a logical block associated with the physical block has a read intensity greater than a threshold.

Abstract: Techniques are provided for pre-charging NAND strings during a programming operation. The NAND strings are in a block that is divided into vertical sub-blocks. During a pre-charge phase of a programming operation, an overdrive voltage is applied to some memory cells and a bypass voltage is applied to other memory cells. The overdrive voltage allows the channel of an unselected NAND string to adequately charge during the pre-charge phase. Adequate charging of the channel helps the channel voltage to boost to a sufficient level to inhibit programming of an unselected memory cell during a program phase. Thus, program disturb is prevented, or at least reduced. The technique allows, for example, programming of memory cells in a middle vertical sub-block without causing program disturb of memory cells that are not to receive programming.

Abstract: An information security management system and a multifunction printer thereof are provided. The multifunction printer includes an image capturing module, an image processing module, an output module and a transmission module. The image capturing module captures a data image of a document paper. The image processing module is coupled to the image capturing module and encodes the data image to generate first encoded data. The output module is coupled to the image processing module and prints second encoded data related to the data image. The transmission module is coupled to the image processing module and transmits one of the first and second encoded data. The multifunction printer deletes the first encoded data from a memory after transmitting the first encoded data, and deletes the second encoded data from the memory after transmitting/outputting the second encoded data.

Abstract: A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block.

Abstract: Methods and apparatus for writing nonvolatile 3D NAND flash memory using multiple-page programming. A method is provided for multiple-page programming of an array having a block that includes page groups and each page group includes cell strings that form pages. The method includes deactivating drain select gates (DSGs) and source select gates (SSG), applying a programming voltage to a selected word line, and applying a middle high voltage to unselected word lines. The method also includes repeating multiple programming operations while maintaining the word line voltage levels from a first programming operation to a last programming operation. Each programming operation includes loading data onto bit lines and pulsing a drain select gate associated with a selected page group to load the data into a selected page of the selected page group.

Abstract: According to an embodiment, a management device includes a counter storage unit, a first management information storage unit, and an update unit. The first management information storage unit stores a first management table capable of storing first management information about each of a predetermined number of first areas. The first management information indicates whether each second area included in a corresponding first area has data written therein. In response to writing of first data into the nonvolatile memory, when a state of a target second area indicated in the first management information about a target first area is an unwritten state, the update unit changes the state of the target second area to a written state; while when the state of the target second area indicated in the first management information is the written state, the update unit updates the counter value for the target first area.

Abstract: When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.

Abstract: A method is provided for operating a memory device. The method includes counting, from among memory cells, a number of first off-cells with respect to a first reading voltage and a number of second off-cells with respect to a second reading voltage, comparing the number of first off-cells and the number of second off-cells, and determining, based on a result of the comparing, whether a programming error exists in a storage region in which the memory cells are included.

Abstract: Provided herein may be a memory device, a memory system, and a method of operating the memory device. When all of normal operation loops associated with a program operation or an erase operation of a memory cell fail, a retry operation of repeating at least one of the normal operation loops is performed in consideration of the degraded state of at least one of a source select transistor, a drain select transistor, and a dummy cell.

Abstract: Some embodiments include apparatuses, and methods of operating the apparatuses. Some of the apparatuses include a data line, a first memory cell string including first memory cells located in different levels of the apparatus, first access lines to access the first memory cells, a first select gate coupled between the data line and the first memory cell string, a first select line to control the first select gate, a second memory cell string including second memory cells located in different levels of the apparatus, second access lines to access the second memory cells, the second access lines being electrically separated from the first access lines, a second select gate coupled between the data line and the second memory cell string, a second select line to control the second select gate, and the first select line being in electrical contact with the second select line.

Abstract: A nonvolatile semiconductor storage device includes a plurality of cell transistor pairs including a pair of cell transistors sharing a first node connected to a bit line or a source line, and a dummy gate line laid in parallel with gate lines of the cell transistors, the dummy gate line applying an off voltage to a dummy transistor between the cell transistor pairs. The gate lines and the dummy gate line may be laid at equal intervals. A plurality of impurity diffusion layers corresponding to the first node and second nodes of the cell transistors may be formed at equal intervals in a continuous active region.

Abstract: A vehicle control module is provided and includes a hybrid memory and a processor. The hybrid memory includes: application memory that stores application code; boot memory that stores a first RMTS code, where the first RMTS code includes first risk functions; and ETM that temporarily stores a second RMTS code. The second RMTS code includes second risk functions. The processor: based on an operating mode of the vehicle control module, executes the application, first RMTS and second RMTS codes; erases the ETM prior to installation of the vehicle control module in a vehicle or delivery of the vehicle; and based on the first RMTS code, permits execution of the first RMTS code prior to and subsequent to installation of the vehicle control module in the vehicle and the second RMTS code prior to installation of the vehicle control module in the vehicle or delivery of the vehicle.

Abstract: Provided is a method performed by a nonvolatile memory device, the method may include: initiating a first program operation corresponding to a first program loop among a plurality of program loops; receiving a suspend command for an urgent read operation during the first program operation; determining a recovery timing from either of a first timing contemporaneous with the receiving the suspend command, and a second timing after completion of the first program operation, based on the suspend command; and initiating a recovery at the determined recovery timing by applying a recovery voltage to a selected word line.

Abstract: A method of fast erasing a low-current EEPROM array. The EEPROM array comprises bit line groups, word lines, common source lines, and sub-memory arrays. Each sub-memory array includes a first memory cell and a second memory cell. The first memory cell is connected with one bit line of a first bit line group, a first common source line, and a first word line. The second memory cell is connected with the other bit line of the first bit line group, the first common source line, and a second word line. The first and second memory cells are operation memory cells and symmetrically arranged at two sides of the first common source line. The source or the drain is floated during erasing to perform the fast bytes-erasing with low current, low voltage and low cost.

Abstract: A memory device includes a first memory area, a second memory area, a third memory area and a controller. The first memory area has a plurality of first memory cells sharing a first channel area. The second memory area has a plurality of second memory cells sharing the first channel area. The third memory area having a plurality of third memory cells sharing a second channel area, the second channel area being different from the first channel area, the first channel area and the second channel area being connected to a bit line. The controller is configured to input a voltage for the second memory cells to the second memory cells and a voltage for the third memory cells to the third memory cells, when a controlling operation is performed on the first memory cells, the voltages for the second and third memory cells having different magnitudes.

Abstract: According to one embodiment, a semiconductor memory device includes first to nth string units (n being a natural number of 3 or more), a plurality of layers of word lines, and (n?1) layers of select gate layers. The first to nth string units each includes a memory string. The memory string includes a plurality of memory cells and a plurality of select transistors connected in series in a first direction. The (n?1) layers of select gate layers include first to (2×(n?1))th select gates electrically isolated from each other. The first string unit is selected by the first to (n?1)th select gates. The kth string unit (k being not less than 1 and not more than n) is selected by the kth to (n+k?2)th select gates. The nth string unit is selected by the nth to (2×(n?1))th select gates.

Abstract: Apparatus having a plurality of strings of series-connected memory cells, and methods of their operation, where each string of series-connected memory cells of the plurality of strings of series-connected memory cells may be selectively connected to a common data line through a corresponding respective select gate, a first set of access lines may each be coupled to a respective memory cell of each string of series-connected memory cells of the plurality of strings of series-connected memory cells, and a second set of access lines may each be coupled to a respective memory cell of each string of series-connected memory cells of only a portion of the plurality of strings of series-connected memory cells.