Abstract: A nonvolatile semiconductor memory device comprises: a plurality of first memory strings; a first select transistor having one end thereof connected to one end of the first memory strings; a first line commonly connected to the other end of a plurality of the first select transistors; a switch circuit having one end thereof connected to the first line; and a second line commonly connected to the other end of a plurality of the switch circuits. The switch circuit controls electrical connection between the second line and the first line.

Abstract: A semiconductor memory device executes a writing operation based on a first bit assignment pattern at the time of writing. The first bit assignment pattern is created such that pieces of x-bit data assigned to adjacent threshold distributions have only a one-bit difference therebetween and an alignment of data on the same digit of 2x pieces of x-bit data corresponding to an alignment of 2x pieces of threshold distributions contains at least two transition points of “0” and “1”. The semiconductor memory device operates at the time of reading such that a read voltage corresponding to the transition points of “0” and “1” is applied to the word line on a page basis to determine x-bit data stored in the memory cell one-bit by one-bit based on the first assignment pattern. The page contains a set of data on the same digit bit in pieces of x-bit data stored in the memory cells connected to the word line.

Abstract: A semiconductor memory device can improve electrical properties by prohibiting a leakage current, which flows through a memory cell, in such a way as to turn off a drain select transistor, a source select transistor and a side transistor of an unselected memory cell block when the semiconductor memory device operates. The semiconductor memory device includes a memory cell block in which a plurality of memory cells, drain and source select transistors, and side word line transistors are connected in a string structure, a block decoder for outputting a block select signal in response to predecoded address signals and controlling the drain and source select transistors and the side word line transistors, and a block switch for connecting a global word line to word lines of the memory cell block in response to the block select signal.

Abstract: A memory system includes a NAND flash memory, a NOR flash memory and a SRAM memory on a single chip. Both NAND and NOR memories are manufactured by the same NAND manufacturing process and NAND cells. The three memories share the same address bus, data bus, and pins of the single chip. The address bus is bi-directional for receiving codes, data and addresses and transmitting output. The data bus is also bi-directional for receiving and transmitting data. One external chip enable pin and one external output enable pin are shared by the three memories to reduce the number of pins required for the single chip. Both NAND and NOR memories have dual read page buffers and dual write page buffers for Read-While-Load and Write-While-Program operations to accelerate the read and write operations respectively. A memory-mapped method is used to select different memories, status registers and dual read or write page buffers.

Abstract: A phase-change memory device is capable of reducing current consumption and preventing performance deterioration caused due to line load by improving a process of selecting memory cells for a write/read operation. The phase-change memory device has a plurality of cell matrixes and includes word line decoding units that are each shared by a plurality of cell matrixes arranged in a row direction and are configured to activate one of global row signals according to a first row address, local row switch units that are provided to the respective cell matrixes and are configured to connect local current lines to corresponding word lines in response to the activated global row signal, bus connecting units that are provided to the respective cell matrixes and are configured to connect the local current lines to global current lines, and enabling units configured to activate one of the global current lines according to a second row address.

Abstract: A flash memory apparatus includes a plurality of memory sectors and a plurality of path transistors, and each memory sector has a local low voltage line, and each path transistor corresponds to one of the memory sectors, and the path transistors are installed in an alignment direction of the memory sectors. One of the path transistors is installed between two adjacent memory sectors, whose gate is connected to a sector select signal line, and whose drain is connected to the local low voltage line of the corresponding memory sector, and whose source is connected to a global low voltage line, and the global low voltage line is installed at an angle substantially equal to 90 degrees across the gate, so as to save the area occupied by peripheral circuits in the path transistors, and lower the manufacturing cost of the flash memory apparatus.

Abstract: Embodiments are provided that include a memory system that includes a memory system, having an access device coupled between a global line and a local line and a voltage source coupled to the global line and configured to output a bias voltage on the global line when the memory system is in a non-operation state. The access device is selected when the memory system is in the non-operation state, and the access device is deselected when the memory system is in an other state. Further embodiments provide, for example, a method that includes coupling a global access line to a local access line, biasing the local access line to a voltage other than a negative supply voltage while a memory device is in a first state and uncoupling the global access line from the local access line while the memory device is in an other state.

Abstract: Memory devices and methods are disclosed, such as those facilitating flexibility in applying differing biasing schemes to word lines. For example, one such memory device can include an architecture capable of partitioning word lines into one of a plurality of address spaces. Each address space has a corresponding configuration control bus. By identifying the address space to which a word line belongs, its appropriate configuration control bus may be selected and the control signals from the selected bus used to select the appropriate potentials for driving the word lines.

Abstract: A nonvolatile memory device includes a nonvolatile memory array including a plurality of charge retaining transistors arranged in rows and columns. The device has a plurality source lines formed in parallel with the bit lines associated with each column. Row decode/driver circuits are connected to blocks of the charge retaining transistors for controlling the application of the necessary read, program, and erase signals. Erase count registers, each of the erase count registers associated with one block of the array of the charge retaining transistors for storing an erase count for the associated block for determining whether a refresh operation is to be executed. Groupings on each column of the array of charge retaining transistors are connected as NAND series strings where each NAND string has a select gating charge retaining transistor connected to the top charge retaining transistor for connecting the NAND series string to the bit lines.

Abstract: A non-volatile semiconductor memory device capable of reducing program disturb and a method of programming the same are provided. A bit line connected to a non-selected memory cell in the same block as a selected memory cell enters a floating state by inactivating a bit line selection switch, so that voltage levels of an first conductivity type channel and a source/drain terminal formed in a pocket second conductivity type well below a memory transistor have an intermediate level of a voltage level of a selection line and the pocket P type well. Therefore, program disturb caused by FN tunneling and junction hot electrons can be inhibited.

Abstract: In one of the disclosed embodiments, a write algorithm is used to remove errors due to back pattern effects, cell-to-cell capacitive coupling, and program disturb in memory cells. Original data to be programmed is adjusted prior to an initial programming operation of the memory cells. The original data is then programmed into the memory cells in another programming operation. In an alternate embodiment, a read adjustment weight data value is associated with each series string of memory cells. The weight data value is used to compensate data read during an initial word line read. The weight data value is updated after each read and read adjustment such that the adjusted weight data value is used on the subsequent read operations.

Abstract: According to an one aspect of the present invention, it is provided a non-volatile semiconductor memory device comprising: a first N type well; a plurality of P type non-volatile memory cells arranged in matrix and formed in the N type well; a plurality of sub-bit lines, each of the sub-bit lines being connected to drains of the P type non-volatile memory cells in a respective one of columns of the matrix; a first P type well; and a plurality of N type selection transistors, each of the selection transistors selectively connecting a respective one of sub-bit lines to a corresponding one of main bit lines.

Abstract: The pipe effect can significantly degrade flash performance. A method to significantly reduce pipe current and (or neighbor current using a pre-charge sequence) is disclosed. A dedicated read order keeps the sensing node facing the section of the pipe which was pre-charged. The technique involves pre-charging several global bitlines (such as metal bitlines, or MBLs) and local bitlines (such as diffusion bitlines, or DBLs). The pre-charged global bitlines are selected according to a pre-defined table per each address. The selection of the global bitlines is done according to whether these global bitlines will interfere with the pipe during the next read cycle.

Abstract: A nonvolatile memory device includes a plurality of global word lines, a plurality of transistors configured to transfer voltages of the global word lines to a plurality of local word lines inside a cell block, and a voltage control unit configured to supply a first negative voltage to a global word line of the plurality of global word lines and configured to charge a bulk region of the plurality of transistors with a second negative voltage.

Abstract: Systems and methods for programming data to a memory device (MD). The methods involve receiving the data at MD (100) from an external data source. MD includes a memory cell array (MCA) for storing the data including numbers in data blocks (DB) or memory cell array planes (MCAP). Each DB (122a, 122b, 122c, 122d) and MCAP (1020a, 1020b, 1020c, 1020d) includes memory addresses (Ads) corresponding to locations of respective transistor circuits (2021, 2022, . . . , 202n, . . . , 202m) within the MCA (120, 1020a, 1020b, 1020c, 1020d). Two or more of the transistor circuits have different threshold voltages (TVs) with respect to each other. The methods further involve programming the data to each DB or MCAP in accordance with a first mode. In the first mode, each number is programmed to a different MA of each DB or MCAP based at least in part on the different TVs.

Abstract: A semiconductor memory device includes a sense amplifier which senses identical multilevel data, which is stored in a memory cell, a plurality of number of times at a time of read, and a n-channel MOS transistor which has a current path one end of which is connected to the sense amplifier and the other end of which is connected to a bit line. The device further include a control unit which applies a first voltage to a gate electrode of the n-channel MOS transistor, thereby setting the n-channel MOS transistor in an ON state, and applies a second voltage which is higher than the first voltage, to the gate electrode during a period after first sense and before second sense.

Abstract: A row address decoder includes a first main word line decoding unit decoding first and second row addresses to generate first to fourth main decoding signals. When a data storage test is performed, the first to fourth main decoding signals are enabled at first to fourth timings, respectively. The row address decoder also includes a second main word line decoding unit decoding third and fourth row addresses to generate fifth to eighth main decoding signals. When a data storage test is performed, the fifth to eight main decoding signals are enabled at first to fourth timings, respectively. A main word line enable signal generating unit decodes the first to fourth main decoding signals and the fifth to eighth main decoding signals to generate first to sixteenth main word line enable signals that are enabled at different times.

Abstract: Various embodiments of a semiconductor integrated circuit apparatus are disclosed. In one exemplary embodiment, the apparatus may include a memory cell array having a plurality of memory cell blocks, a plurality of word line selection sections corresponding to the plurality of memory cell blocks, a block selection unit configured to provide a driving signal to the plurality of word line selection sections for driving the plurality of memory cell blocks, and a plurality of global line groups, each corresponding to one of the plurality of word line selection sections. Each of the global line groups may include a plurality of signal lines configured to provide a voltage signal to the corresponding word line selection section.

Abstract: An integrated circuit having a logic element that includes an array of storage elements convertibly functioning as either a configuration random access memory (CRAM) or a static random access memory (SRAM) is provided. The logic element includes first and second pairs of data paths having dedicated multiplexers. In one embodiment, the first and second pairs of data paths are multiplexed into bit lines of a row of the array. The logic element also includes a data path control block generating control signals for each of the dedicated multiplexers. The control signals determine whether the storage elements function as a CRAM or a SRAM. A method for selectively configuring a memory array between a CRAM mode and SRAM mode are provided.

Abstract: A nonvolatile memory device includes a word line group including a plurality of middle word lines and an edge word line having charge storage patterns on a substrate. A peripheral line is disposed on one side of the word line group so that the edge word line is between the peripheral word line and the middle word lines. The peripheral line includes an insulating layer and a gate electrode. Charge storage patterns of the middle and edge word lines are separated from each other, and a charge storage pattern of the edge word line extends on one side to be connected to the insulating layer of the peripheral line. Methods of forming nonvolatile memory devices are also disclosed.

Abstract: Memory devices and methods facilitate flexibility in applying differing biasing schemes to word lines. For example, one such memory device can include an architecture capable of partitioning word lines into one of a plurality of address spaces. Each address space has a corresponding configuration control bus. By identifying the address space to which a word line belongs, its appropriate configuration control bus may be selected and the control signals from the selected bus used to select the appropriate potentials for driving the word lines.

Abstract: A program method of nonvolatile memory devices, which can solve an under program problem by preventing a drop of a verify voltage in the program, and verify operations. According to an aspect of the method, a program operation is performed on a selected memory cell block. Electric charges charged to a channel of memory cell strings included in unselected memory cell blocks are discharged. A verify operation is performed on the selected memory cell block.

Abstract: A flash memory device includes a plurality of memory cell blocks, an operating voltage generator, a block switching unit and a voltage supply circuit. Each of the plurality of memory cell blocks includes select lines and word lines, and has pass word lines included between the select lines and the word lines. The operating voltage generator outputs operating voltages to global select lines, global word lines and global pass word lines. The block switching unit connects the global word lines to the word lines and the select lines in response to a block select signal. The voltage supply circuit is connected to the select line and the pass word line, and is configured to supply the select line and the pass word line with a ground voltage in response to a block select inverse signal.

Abstract: A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells.

Abstract: A flash memory device that includes a voltage generator circuit configured to generate a program voltage, a pass voltage, and a high voltage; a plurality of planes configured to perform a program operation in response to the program, pass, and high voltages and to verify the program operation, respectively; and control logic configured to control the planes in response to verification results from the planes, wherein the control logic controls the planes so as to interrupt the program and pass voltages or the high voltage from being applied to program-passed planes.

Abstract: Example embodiments relate to a variable resistance semiconductor memory device including: a plurality of memory blocks belonging to different memory sectors and alternately arranged in a memory bank including the memory sectors so as to be adjacent to each other; and a line selecting unit simultaneously selecting word lines of the plurality of memory blocks and simultaneously selecting bit lines of the memory blocks belonging to the same memory sector among the plurality of memory blocks in an access operation mode.

Abstract: A semiconductor memory device includes a memory cell array, which includes a cell array having multiple cell blocks. Each cell block includes source and word lines arranged in one direction, bit lines arranged in a perpendicular direction, and memory cells having corresponding floating bodies. Adjacent memory cells share source or drain regions to form common source or drain regions, respectively. The source regions are arranged in a word line direction and connected to corresponding source lines, and the drain regions are arranged in the bit line direction and connected to corresponding bit lines. Gates of the memory cells are arranged in the word line direction and are connected to form the word lines. The source lines are formed on a layer of the word lines, and the bit lines are formed at a different layer to be insulated from the word and source lines.

Abstract: A variable resistive memory device includes memory sectors, memory cells in each of the memory sectors, sub-wordlines including a first in signal communication with at least a first pair of the memory cells in a first sector and a second in signal communication with at least a second pair of the memory cells in a second sector, local bitlines where each is in signal communication a memory cell, a local bitline selecting signal generator in signal communication with local bitline selecting signal paths, a first local bitline selecting signal path in signal communication with a first pair of the local bitlines, and a second local bitline selecting signal path in signal communication with a second pair of the plurality of local bitlines, where a first of the first pair of local bitlines is in signal communication with a first of the first pair of the memory cells in the first sector and a second of the first pair of local bitlines is in signal communication with a second of the second pair of the memory cells in

Abstract: A memory array is shown, including memory cells with source and drain doped regions, and global bit lines coupled to the doped regions via select transistors. The connections of the select transistors are configured such that the respective loading capacitances of two global bit lines respectively coupled to the source and the drain of a memory cell to be read do not vary with the memory cell to be read. A method of operating the memory array is also shown, including, in reading a selected memory cell, applying voltages to the gate, the drain and the source thereof respectively from a word line, a first global bit line and a neighboring second global bit line, and turning on a select transistor coupled to a third global bit line separate from the first and the second ones by at least one other global bit line.

Abstract: A non-volatile storage device is disclosed that includes a set of connected non-volatile storage elements formed on a well, a bit line contact positioned in the well, a source line contact positioned in the well, a bit line that is connected to the bit line contact, and a source line that is connected to the source line contact and the well.

Abstract: Memory architecture, such as for a flash EEPROM memory embedded within a processor or other large scale integrated circuit, and including differential sense circuitry. The memory includes an array of memory cells in rows and columns, and organized into sectors, each sector split into portions. Columns of the array are grouped into small groups from which a final stage column decode selects a column from the group based on the least significant bits of the column address. Adjacent groups of columns are paired, with a selected column from each group coupled to a differential input of the sense amplifier, but with one of the selected columns associated with an unselected sector portion and thus serving as a dummy bit line. Conductor routing is simplified, and chip area is reduced, by maintaining unselected column groups adjacent or nearby to selected column groups.

Abstract: A flash memory array and a method for performing read operation therein are disclosed. The flash memory array comprises a plurality of memory segment, a data cache and a plurality of data handlers coupled between a pair of memory segment and between a memory segment and the data cache. A read operation of selected bitlines of a selected memory segment is performed by a segment data handler coupled to the selected memory segment locally and the read data is transmitted to the data cache. A segment data handler is configured to get read data from the selected bitlines by first pre-charging the bitlines and sensing the bitlines. Further, the read data is transmitted to the data cache through all of the segment data handlers in a sequential manner, if present between the selected memory segment and the data cache.

Abstract: At least one data-line pair has a first data line aligned with a first column of memory cells and a second data line aligned with a second column of memory cells. The first data line is coupled to the second column of memory cells and the second data line is coupled to the first column of memory cells.

Abstract: A memory cell array of a memory comprises a main memory cell array, including local bit lines, word lines and memory cells, and a selected array, including a global bit line, a bit line transistor (BLT) control line, a transistor and a fixed value memory cell. The local bit lines comprise first and second local bit lines. Each memory cell for storing data corresponds and is connected to one local bit line and one word line. The transistor is coupled to the global bit line, first local bit line and BLT control line, and selectively turns on to connect the global bit line to the first local bit line. The fixed value memory cell coupled to the global bit line, second local bit line, and BLT control line is programmed to a fixed value so that a threshold voltage thereof is greater than a threshold voltage of the transistor.

Abstract: The invention provides a voltage applying structure having a reduced area penalty with respect to a data line. A wiring forming a global data line and a local data line formed in a p-type well region are connected via a select transistor. Two select lines are formed on a gate electrode of the select transistor. One select line is electrically connected to the gate electrode of the select transistor, however, the other select line is not connected to the select transistor. That is, an insulator film is formed between the select line and the gate electrode. As mentioned above, two select lines shorter than a gate length are provided on one select transistor. The select line is structured such as to be connected to the other select transistor.

Abstract: An integrated circuit device (e.g., a logic device or a memory device) having a memory cell array including a plurality of bit lines (e.g., first and second bit lines) and a plurality of bit line segments (e.g., first and second bit line segments) wherein each bit line segment is selectively and responsively coupled to or decoupled from its associated bit line via an associated isolation circuit. The memory cell array further includes a plurality of memory cells, wherein each memory cell includes a transistor having a first region, a second region, a body region, and a gate coupled to an associated word line via an associated word line segment. A first group of memory cells is coupled to the first bit line via the first bit line segment and a second group of memory cells is coupled to the second bit line via the second bit line segment.

Abstract: A method of programming a non-volatile memory device includes applying a power supply voltage to a drain select line, applying a high level voltage to a drain-side pass word line or a source-side pass word line, and applying a pass voltage to unselected word lines and a program voltage to a selected word line. The high level voltage is applied to the drain-side pass word line or the source-side pass word line before applying the pass voltage to the unselected word lines and the program voltage to the selected word line.

Abstract: A memory structure includes a first memory cell and a second memory cell located at an identical bit line and adjacent to the first memory cell. Each memory cell includes a substrate, a source, a drain, a charge storage device, and a gate. A method for programming the memory structure includes respectively providing a first gate biasing voltage and a second gate biasing voltage to the gates of the first memory cell and the second memory cell, boosting an absolute value of a channel voltage of the first memory cell to generate electron and hole pairs at the drain of the second memory cell through gate-induced drain leakage or band-to-band tunneling, and injecting the hole of the generated electron and hole pairs into the charge storage device of the first memory cell to program the first memory cell.

Abstract: A device with non volatile memory cells, with optimized programming, of the type comprising a sector of matrix memory cells organized in rows and columns, with the columns organized in a plurality of global bit-lines associated with at least one plurality of local bit-lines and respectively enabled by a first select signal and by at least one second select signal generated by a decoder, these columns being associated with at least one program load PL controlled by a logic circuit and suitable for applying a programming pulse to a plurality of cells belonging to the enabled bit-lines, comprising a plurality of discharge transistors, each associated with a corresponding column controlled by a control signal complementary to the control signal of the adjacent discharge transistor.

Abstract: In a semiconductor device, a first transistor of an SOI structure has a source region, a drain region, a body region positioned between the source region and the drain region, and a gate electrode positioned above the body region. A first capacitor of the SOI structure has a first terminal electrically connected to a gate electrode of the first transistor, and a second terminal. The semiconductor device stores data in a nonvolatile manner in accordance with carriers accumulated in a first node electrically connecting the gate electrode of the first transistor and the first terminal of the first capacitor.

Abstract: A non-volatile memory device includes a memory cell array from which data is read via a plurality of bitlines, which includes a plurality of memory cells having gates respectively connected with a plurality of wordlines, a first type global wordline decoder configured to selectively apply n different voltages, where n is an integer greater than or equal to 3, to a corresponding wordline of the plurality of wordlines in a program mode, and a second type global wordline decoder configured to selectively apply (n?1) different voltages to a corresponding wordline of the plurality of wordlines in the program mode, the second type global wordline decoder having fewer switching elements than the first type global wordline decoder.

Abstract: The present invention relates to a nonvolatile semiconductor memory, and more specifically relates to a nonvolatile semiconductor memory with increased program throughput. The present invention provides a nonvolatile semiconductor memory device with a plurality of block source lines corresponding to the memory blocks, arranged in parallel to the word lines, a plurality of global source lines arranged in perpendicular to the block source lines; and a plurality of switches for selectively connecting corresponding ones of the block source lines and the global source lines.

Abstract: A NAND flash memory cell string having scaled down select gates. The NAND flash memory cell string includes a first select gate that has a width of 140 nm or less and a plurality of wordlines that are coupled to the first select gate. Gates associated with the plurality of wordlines are formed of p+ polysilicon. A second select gate that has a width of 140 nm or less is coupled to the plurality of wordlines.

Abstract: A semiconductor device comprises a transistor comprising a gate, a source, a drain, and a gate insulating layer, and an auxiliary line formed over the drain and electrically insulated from the drain. During a turn-off operation of the transistor, voltage to increase a resistance of the drain is supplied to the auxiliary line.

Abstract: A semiconductor memory device includes first to third memory cell units each including a first select transistor, a second select transistor and a plurality of memory cell transistors which are connected in series in a first direction between the first select transistor and the second select transistor, the first and second select transistors of the respective memory cell transistors being disposed to neighbor in a second direction crossing the first direction. Those of the memory cell transistors, which neighbor the first and second select transistors, are used as select memory cell transistors.

Abstract: The non-volatile memory device may include one or more main strings each of which may include first and second substrings which may separately include a plurality of memory cell transistors; and a charge supply line which may be configured to provide charges to or block charges from the first and second substrings of each of the main strings, wherein each of the main strings may include a first ground selection transistor which may be connected to the first substring; a first substring selection transistor which may be connected to the first ground selection transistor; a second ground selection transistor which may be connected to the second substring; and a second substring selection transistor which may be connected to the second ground selection transistor. A method of programming a target cell of the memory device includes activating selection transistors connected to a main string and substring of the target cell.

Abstract: A memory array comprises a semiconductor body having a plurality of trenches aligned generally in parallel. The trenches contain semiconductor material, such as doped amorphous silicon, and act as source/drain lines for the memory array. Insulating liners lie between the semiconductor material within the trenches and the semiconductor body. A plurality of word lines overlie the plurality of trenches and channel regions in the semiconductor body in an array of cross points. Charge trapping structures lie between the word lines and the channel regions at the cross points, providing an array of flash memory cells. The charge trapping structures comprise dielectric charge trapping structures adapted to be programmed and erased to store data. A method for manufacturing such devices includes patterning and forming the sources/drain lines with insulating liners prior to formation of the charge trapping structure over the channel regions.

Abstract: A relaxed metal pitch architecture may include a bit line and a first active area string and a second active area string. The bit line may be directly coupled to the first active area string and to the second active area string. The relaxed metal pitch architecture may be applied to a non-volatile memory structure.

Abstract: A plurality of first transistors formed on a substrate share a gate electrode. Isolation regions isolate the plurality of first transistors from one another. In the region where the plurality of first transistors, an impurity region is formed in such a manner that it includes the source and drain regions of the plurality of first transistors and that the depth of the impurity region is greater than the depth of the source and drain regions. The impurity region sets the threshold voltage of the first transistors.

Abstract: A cache and TLB layout and design leverage repeater insertion to provide dynamic low-cost configurability trading off size and speed on a per application phase basis. A configuration management algorithm dynamically detects phase changes and reacts to an application's hit and miss intolerance in order to improve memory hierarchy performance while taking energy consumption into consideration.