Abstract: A nonvolatile memory device, including a plurality of memory cell blocks, N memory cell blocks (N is an integer equal to or greater than 2) being arranged in a row direction, L memory cell blocks (L is an integer equal to or greater than 2) being arranged in a column direction, and each of the memory cell blocks including M memory cells (M is an integer equal to or greater than 2), a plurality of wordlines, a plurality of first control gate lines, a plurality of first control gate switches, a plurality of second control gate lines, and a plurality of bitlines.

Abstract: A one-time programmable (OTP) cell includes an access transistor coupled to an antifuse transistor. Access transistor has a gate oxide thickness that is greater than the gate oxide thickness of the antifuse transistor so that if the antifuse transistor is programmed, the voltage felt across the gate/drain junction of the access transistor is insufficient to cause the gate oxide of the access transistor to break down. The dual gate oxide OTP cell may be used in an array in which only one OTP cell is programmed at a time. The dual gate oxide OTP cell also may be used in an array in which several OTP cells are programmed simultaneously.

Abstract: A semiconductor memory device of the present invention provides, in a memory having an hierarchical bit line structure, a test mode which causes all switches for selecting hierarchical bit lines and a main bit line in an activated memory array to be connected all the time. With this configuration, it is possible to perform a disturb refresh test on a memory cell arrays basis regardless of the hierarchical bit line structure. Possibility of an erroneous read-out, which may be caused by connecting each of the hierarchical bit lines to one another and a consequent increase in a bit line load capacity, may be prevented by providing a timing control such that the switches are connected after a normal mode operation.

Abstract: A plurality of first sub-bit lines are each connected to a common source line via a corresponding first sub-bit line reset transistor with NMOS structure, and a plurality of second sub-bit lines are each connected to the common source line via a corresponding second sub-bit line reset transistor with NMOS structure. The plurality of first and second sub-bit line reset transistors have their respective gates receiving a sub-bit line reset signal. This sub-bit line reset signal becomes “H” for a predetermined period of time after read data is obtained during a read period.

Abstract: A non-volatile memory device is disclosed that can reduce the time required for the initialization process. A non-volatile memory device includes a non-volatile memory array having a plurality of pages. Each page includes a plurality of non-volatile memory cells, a first region for storing data, and a second region for storing control data that is associated with the data of the first region. The non-volatile memory device further includes a read out unit for reading out data from the pages, and a data buffer for temporarily storing data that has been read out from the pages by the read out unit. When reading out the control data, the read out unit reads out the second regions, across a plurality of pages, at one time.

Abstract: A memory array including a first region in which a first memory sub-array is located and a second region separated from the first region in which a second memory sub-array is located. The first and second memory sub-arrays have flash memory cells coupled to a plurality of word lines. A driver region separates the first and second regions and includes word line driver circuits coupled to the word lines of the first and second memory sub-arrays. A row decoder region adjacent the first region and separate from the driver region includes at least some sub-circuits of row decoder circuits located therein. The row decoder circuits are coupled to the word line driver circuits located in the driver region and are configured to activate driver circuits to drive word lines of the first and second memory sub-arrays in response to decoding address signals selecting the particular row decoder circuit.

Abstract: A semiconductor memory device includes memory cells, a memory cell array, bit lines, source lines, word lines, and select gate lines. Each of the memory cells includes a first MOS transistor having a floating gate and a control gate and a second MOS transistor having a stacked gate including a first gate electrode and a second gate electrode formed above the first gate electrode and having its drain connected to the source of the first MOS transistor. Each of the bit lines electrically connects the drains of the first MOS transistors in a same column. Each of the word lines connects the control gates of the first MOS transistors in a same row. Each of the select gate lines electrically connects the second gate electrodes of the second MOS transistors in a same row and is electrically isolated from the second gate electrodes.

Abstract: A nonvolatile semiconductor memory includes: a memory cell array constituted by word lines, bit lines, and electrically erasable/rewritable memory cell transistors, which have respective tunnel insulating films and are arranged at the intersections of the word lines and the bit lines; and a word line transfer transistor, which is separated by an element isolation region, has a source diffusion layer, a channel region, a gate insulating film on the channel region, and a drain diffusion layer, and is connected to a word line and a gate electrode formed on the gate insulating film via a word line contact plug formed in the drain diffusion layer.

Abstract: A method for reading a memory cell, wherein the memory cell comprises two source/drain regions and a gate, wherein the source/drain regions are each connected to a respective local bitline, and, wherein one of the source/drain regions of a neighboring memory cell is connected to one of the local bitlines, the other source/drain region of the neighboring memory cell being connected to another local bitline, comprising the steps of connecting the local bitline that connects the source/drain region of the memory cell and the source/drain region of the neighboring memory cell to a first global bitline, connecting the local bitline that connects the other source/drain region of the memory cell to a second global bitline, connecting the local bitline that connects the other source/drain region of the neighboring memory cell to one of a plurality of local power rails, applying a gate potential to the gate of the memory cell, applying a potential to the first global bitline and applying another potential to the secon

Abstract: A semiconductor memory device includes memory cells, a memory cell array, word lines, a row decoder, first metal wiring layers, and metal wiring lines. The memory cell includes a first MOS transistor having a charge accumulation layer and a control gate. Each word line is formed by connecting commonly the control gates in a same row. The row decoder selects any one of the word lines. The first metal wiring layers are provided for the word lines in a one-to-one correspondence. The first metal wiring layers are electrically connected to the corresponding ones of the word lines and transmit a first row select signal for the row decoder to select one of the word lines. The metal wiring lines are formed at a plurality of levels. The first metal wiring layers are made of the metal wiring lines located at the level of the lowest layer.

Abstract: An exemplary NAND string memory array includes at least one plane of memory cells, said memory cells comprising thin film modifiable conductance switch devices and which cells are arranged in a plurality of series-connected NAND strings, and NAND strings including a series select device at each end thereof. Another exemplary NAND string memory array includes a group of more than four adjacent NAND strings within the same memory block each associated with a respective global bit line not shared by the other NAND string of the group. Another exemplary NAND string memory array includes NAND strings on identical pitch as their respective global bit lines.

Abstract: The non-volatile, programmable fuse apparatus has a pair of p-channel transistors coupled in a latch configuration. A supercell is coupled between each transistor and ground. Each supercell is comprised of a plurality of non-volatile memory cells that are each programmed substantially similarly for each supercell. The supercells are programmed in a complementary fashion. The output state of the apparatus is determined by the state of the supercell to which the output is coupled.

Abstract: Disclosed herein is a block switch of a flash memory device in which a voltage higher than a predetermined operating voltage is generated to drive path transistors in order to stably apply the predetermined operating voltage to a selected cell block of the flash memory device. The block switch generates a high voltage clock signal of a high voltage level according to a control signal and a clock signal, and raises the voltage level of an output terminal to a predetermined level according to the high voltage clock signal. Accordingly, a high voltage can be outputted even at a low power supply voltage. There is no need for a decoder for high voltage as in a precharge and self-boosting mode. A voltage can be directly applied to word lines without a precharge operation. It is thus possible to reduce an operating time.

Abstract: The present patent relates to flash memory devices with improved erase function, and method of controlling an erase operation of the same.

Abstract: An integrated circuit memory device includes a memory cell array including first and second bit lines that extend side-by-side, a plurality of page buffers, a first isolation device electrically coupled to an end of the first bit line, and a second isolation device electrically coupled to an end of the second bit line. The second isolation device is arranged farther from the plurality of page buffers than the first isolation device. A first connection line is electrically coupled at a first end thereof to the first isolation device, and is electrically coupled at a second end thereof to one of the plurality of page buffers. A second connection line is electrically coupled at a first end thereof to the second isolation device, and is electrically coupled at a second end thereof to a farther one of the plurality of page buffers. The second connection line is arranged immediately adjacent to the first bit line.

Abstract: A non-volatile semiconductor storage device array organization for wide program operations is achieved. The device includes a memory cell array region in which a plurality of C columns and R rows of memory cells comprise one UNIT, arranged in a “diffusion bit” array organization which is comprised of R rows of word lines running in a first direction, and C columns of diffusion sub bit lines running in a second direction, and C columns of sub control gate lines running in the same second direction and a sense amplifier/page buffer area shared by several UNIT's through a bit decode circuit, wherein the diffusion sub bit lines in each of the UNIT's are connected to main bit lines which are in turn connected to the sense amplifier/page buffer area, wherein the bit decode circuit selects one diffusion sub bit line column of memory cells in every E columns.

Abstract: A programming voltage is applied to source and drain in order to generate hot-hole injection at one end of the channel of a memory cell. The undesired programming of a neighboring memory cell is avoided by the application of an intermediate inhibit voltage to an adjacent bitline. This is done by precharging all the bitlines to the inhibit voltage, either by successively applying the inhibit voltage to every bitline individually or by applying both the upper and the lower programming voltage to one half of the bitlines and then short-circuiting all the bitlines to produce an intermediate voltage.

Abstract: A non-volatile semiconductor memory device disclosed herein includes arrays of memory cells arranged along rows and columns. The columns are divided into at least two column regions and each row is divided into two electrically isolated word lines that are arranged in the column regions. The memory device further includes a determining circuit for judging which column region a data loaded on a register belongs to during a program operation, and a selecting circuit for choosing one of the rows in response to the row address information and driving one or all of the word lines in the selected row with a program voltage according to the judging.

Abstract: A semiconductor non-volatile storage device of the present invention which lets a memory cell directly drive up to a local bit line, wherein the output of the local bit line is received by a gate electrode of a separately-provided signal amplifying transistor, and the signal amplifying transistor is used to drive a global bit line having a large load capacity. Since an amplifying transistor having a drive power higher than a memory cell drives the parasitic capacity of a global bit line, information stored in a memory cell can be read out at high speed. Therefore, the storage device is used for storing program codes for controlling microcomputers or the like to thereby enhance a system performance.

Abstract: A non-volatile semiconductor memory device provides for higher integration by reducing the area of occupation of direct peripheral circuits, in which the memory cell of an AND type flash memory includes a selection gate, a float gate, a control gate that functions as a word line, and an n-type semiconductor region (source, drain) that functions as a local bit line. A pair of local bit lines adjacent to each other in a memory mat are connected with one global bit line at one end in the direction of the column of the memory mat, and a selection MOS transistor, formed by one enhancement type MOS transistor and one depletion type MOS transistor; is connected in series with each of the pair of local bit lines. One of the local bit lines is selected by turning the selection MOS transistor on/off.

Abstract: A nonvolatile semiconductor memory device is disclosed that comprises plural sectors each including a memory cell array, plural word line drivers provided in each one of the sectors to drive respective word lines, and sector switches provided one for each sector. The sector switches are connected to the plural word line drivers in the corresponding sector, adapted to provide a negative voltage to be applied to the word lines to the plural word line drivers when the corresponding sector is selected for an erase operation. The sector switches only include transistors directly connected to an output signal line to provide the negative voltage to the word line drivers. A decoding circuit shared by one or more sectors is adapted to control the sector switches to allow a sector switch in a selected sector to output the negative voltage and allow a sector switch in an unselected sector to output a voltage different from the negative voltage.

Abstract: A memory array including a first region in which a first memory sub-array is located and a second region separated from the first region in which a second memory sub-array is located. The first and second memory sub-arrays have flash memory cells coupled to a plurality of word lines. A driver region separates the first and second regions and includes word line driver circuits coupled to the word lines of the first and second memory sub-arrays. A row decoder region adjacent the first region and separate from the driver region includes at least some sub-circuits of row decoder circuits located therein. The row decoder circuits are coupled to the word line driver circuits located in the driver region and are configured to activate driver circuits to drive word lines of the first and second memory sub-arrays in response to decoding address signals selecting the particular row decoder circuit.

Abstract: The PROM area is adjacent to the normal memory cell area. The data writing (normal writing) and the data reading (normal reading) for normal memory cell areas and the data writing (redundant writing) for the PROM area are carried out from the side of the normal memory cell areas. The data reading (redundant reading) for the PROM area is carried out from the side of the PROM area. In the PROM area, the PROM cells having the same structure as that of the normal memory cells are connected to the redundant sub bit lines. In the redundant writing, in the select gate area, the redundant sub bit lines and main bit lines are connected. In the redundant reading, in the redundant gate area having the same layout as that of the select gate area, the redundant sub bit lines are connected to redundant bit lines.

Abstract: A semiconductor memory device includes memory cells, write bit lines, read bit lines, latch circuits, a n-channel MOS transistor, and voltage setting circuits. The memory cell includes a first MOS transistor having a charge accumulation layer and a control gate. The first MOS transistors are connected commonly to the write bit lines and read bit lines. The latch circuits are provided for the write bit lines and hold write data for the memory cells. The n-channel MOS transistor transfer “1” data to the latch circuits in a data latch operation. The voltage setting circuits supply a potential corresponding to “0” data to the write bit lines in a read operation. In a data latch operation, the latch circuit corresponding to the write bit line connected to the memory cell into which “0” data is to be written latches the potential supplied to the write bit lines in a read operation.

Abstract: A flash memory device has an improved pre-program function. The flash memory device comprises memory cell blocks each including wordlines, bitlines, and memory cells sharing common source lines; an erase controller generating a pre-program control signal in response to an erase command; and a voltage selection circuit selecting one of first and second common source voltages in response to one among the pre-program control signal, a read command, and a program command and outputting the selected voltage to a global common source line.

Abstract: A semiconductor memory device that includes a memory cell array with memory cells arranged in rows and columns. The memory cells can also be formed in blocks. A plurality of word lines are applied voltages received by a plurality of drive lines, the plurality of word lines being classified into an arbitrary word line determined arbitrarily, secondary adjacent word lines located adjacent to both word lines adjacent to the arbitrary word line, and residual word lines other than the arbitrary word line in the secondary adjacent word lines. A plurality of transfer transistors are utilized to select the plurality of word lines or blocks. Among the plurality of transfer resistors, transfer transistors for the residual word lines are arranged at both adjacent locations and an opposite location around a transfer transistor for the arbitrary word line.

Abstract: A dual data rate dynamic random access memory (DDR DRAM) device may operate in dual DDR modes via a mode selection circuit configured to enable a Dual Data Rate (DDR) 1 mode of operation for the DDR DRAM or a DDR2 mode of operation for the DDR DRAM.

Abstract: A memory device formed by an array of memory cells extending in rows and columns. The device is formed by a plurality of N-type wells extending parallel to the rows; each N-type well houses a plurality of P-type wells extending in a direction transverse to the rows. A plurality of main bitlines extend along the columns. Each P-type well is associated to a set of local bitlines that extend along the respective P-type well and are coupled to the drain terminals of the cells accommodated in the respective P-type well. Local-bitlines managing circuits are provided for each P-type well and are located between the main bitlines and a respective set of local bitlines for controllably connecting each local bitline to a respective main bitline.

Abstract: An electronic memory, typically a flash EPROM, contains an array of memory sections (40), each containing an array of memory cells (54). Global bit lines (60) fully traverse the memory. Local bit lines (58) partially traverse the memory. Data stored in the memory is sensed with an arrangement that utilizes impedance matching to achieve high sensing accuracy with low noise sensitivity. The impedance matching may be provided solely from the sections and lines of the memory or partially from a separate reference memory section (102) that contains reference memory cells (104).

Abstract: A semiconductor device has a memory cell array having the arrangement of a plurality of cores, each of which comprises one block or a set of a plurality of blocks, each block defining a range of memory cells serving as a unit of data erase. The semiconductor device has a bank setting memory circuit configured to select an optional number of cores of the cores as a first bank and to set the remaining cores as a second bank, so as to allow a data read operation to be carried out in one of the first and second banks while a data write or erase operation is carried out in the other of the first and second banks.

Abstract: A L0 cache is provided that includes a plurality of memory cells, full swing signal bit lines coupled to the plurality of memory cells to output full swing data signals, small signal global bit lines coupled to the full swing signal bit lines to provide small signal data signals, and an alignment device to align signals on the small signal global bit lines.

Abstract: A method and apparatus for discharging global bitlines in a flash memory to a voltage sufficiently low to avoid drain disturb for non-selected cells in a programming operation. A discharge device allows discharge of global bitlines coupled to local bitlines before a programming operation.

Abstract: An erasing current is distributed to reduce a load of an internal power circuit and to decrease the number of drivers for erase. A semiconductor data processing device has: a memory array having nonvolatile memory cells arrayed in a matrix and divided into a plurality of erase blocks each instructed to be erased together; and a control circuit, wherein the control circuit controls both of two kinds of erasing voltages applied to the nonvolatile memory cell in the erase block instructed to be erased together to select an erase sector from the erase block for performing erase for each erase sector, thereby performing the erase for each erase sector in time division. Time division erase can distribute an erasing current. Two kinds of erasing voltages are used to select the erase sector. No specific drivers need be provided for each erase sector.

Abstract: A semiconductor memory device including (A) a global line; (B) a memory array having (i) a local line, (ii) a decoder connected to the global line and the local line, and (iii) a memory block and a redundant block each constructed by a plurality of memory cells each having a gate electrode formed on a semiconductor layer via a gate insulating film, a channel region disposed below the gate electrode, a diffusion region disposed on both sides of the channel region and having a conductive type opposite to that of the channel region, and a memory functional unit formed on both sides of the gate electrode and having the function of retaining charges, the memory array having the function that when the decoder is usable, the global line is selectively connected to one of the local lines in accordance with address information and, when a defective block is included in the memory blocks and the decoder is unusable, the local line is separated from the global line and the defective block is replaced with the redundant

Abstract: A method for operating a non-volatile memory cell device, the method including providing an array of memory array cells connected to word lines and local bit lines, the local bit lines being connected to global bit lines via select transistors, the array being divided into isolated sectors, providing a sense amplifier operative to sense the memory array cells via a sensing path that includes at least one of the local bit lines, at least one of the select transistors, at least one accessed global bit line, and a YMUX, providing a reference cell located in a reference mini-array, the reference cell being connected to the YMUX and being connected to the sense amplifier via another sensing path, driving both the memory array cells and the reference cells with a common bit line (BL) driver connected to the memory array cells and the reference cells via the YMUX through accessed global bit lines, and matching the sensing path of the memory array cell and the sensing path of the reference cell to the sense amplifier

Abstract: A semiconductor storage device comprises memory cells that store data by accumulating or releasing an electric charge; a memory cell array having a matrix arrangement of the memory cells; a plurality of word lines connected to memory cells aligned on rows of the memory cell array; a plurality of sub-bit lines connected to memory cells aligned on columns of the memory cell array; a bit line select circuit selecting the sub-bit line of a column; a main bit line connected to the sub-bit line selected by the bit line select circuit; a sense line detecting the potential of the sub-bit line selected by the bit line select circuit via the main bit line and reading data out of the memory cell; a write driver applying a voltage to the sub-bit line selected by the bit line select circuit via the main bit line and writing data into the memory cell; and a first switching element connected to the main bit line and turning on when the current flowing in the memory cell is detected externally via the sub-bit line without th

Abstract: A flash memory device can include a local row decoder circuit that is configured to drive word lines coupled to a bank of a flash memory responsive to separate read and write control signals provided thereto from outside the local row decoder circuit. Multiple local row decoder circuits can, therefore, be controlled by a single global row decoder circuit that provides the separate read and write control signals to each of the local row decoder circuits. By locating the combinatorial logic circuits used for decoding addresses in the global row decoder circuit, rather than in the local row decoder circuits, the local row decoder circuits may have reduced size, thereby allowing further reductions in the size of the flash memory device. For example, in some embodiments according to the invention, a NAND logic circuit used for address decoding is located in the global row decoder circuit, thereby allowing the area allocated to the local row decoder circuit to be reduced.

Abstract: There is provided a method of programming a non-volatile memory which can solve the problem of the data write system of the existing flash memory that a load capacitance of bit lines becomes large, the time required by the bit lines to reach the predetermined potential becomes longer, thereby the time required for data write operation becomes longer and power consumption also becomes large because the more the memory capacitance of memory array increases, the longer the length of bit lines becomes and the more the number of bit lines increases.

Abstract: A semiconductor memory device includes a memory cell including a gate electrode formed on a semiconductor layer via a gate insulating film, a channel region disposed under the gate electrode, diffusion regions disposed on both sides of the channel region and having a conductive type opposite to that of the channel region, and memory functional units formed on both sides of the gate electrode and having a function of retaining charges; a switching transistor circuit including a negative voltage switching circuit for applying a negative voltage to the gate electrode of the memory cell, and a switching transistor connected to an output of the negative voltage switching circuit and a first voltage source for outputting a voltage having a voltage level lower than zero volt; a pull-up circuit connected to a control terminal of the switching transistor and selectively connected to a second voltage source for outputting a voltage having a voltage level higher than zero volt; and a pull-down circuit connected to the f

Abstract: A semiconductor integrated circuit device includes a global bit line, first and second section bit lines, a first transistor which connects the global bit line with the first section bit line, a second transistor which connects the global bit line with the second section bit line, a section selection circuit which selects one of the first and the second transistors, and a data latch circuit. The data latch circuit includes a data amplifier circuit which amplifies readout data from the first and the second section bit lines, a first data holding circuit which holds readout data and programming data to the first section bit line, and a second data holding circuit which holds readout data and programming data to the second section bit line.

Abstract: The layout structure of a dual port SRAM (Static Random Access Memory) includes a read bit line adjacently positioned to a complementary read bit line, and a write bit line positioned adjacent to a complementary write bit line, to provide a shield between the read and write lines for preventing cross-talk caused during read and write operations.

Abstract: The number of electrons existing in a channel region within a NAND cell unit is reduced, and erroneous write-in characteristics are improved by the present invention. A nonvolatile semiconductor memory includes a control gate line drive circuit, which writes simultaneously in all memory cell transistors connected to a selected control gate line, performs write-in by maintaining a low channel voltage for a selected memory transistor in a selected memory cell unit when a plus voltage is applied to the selected control gate line, and restricts write-in utilizing a voltage self-boosted from the channel voltage for an unselected memory transistor.

Abstract: A cross-point memory includes a plurality of memory cells, a plurality of global word lines, a plurality of local word lines, and a plurality of global bit lines. At least a given one of the global word lines is configurable for conveying a write current for selectively writing a logical state of one or more of the memory cells. Each of the local word lines is connected to at least one of the memory cells for assisting in writing a logical state of the at least one memory cell corresponding thereto. Each of the global bit lines is connected to at least one of the memory cells for writing a logical state of the memory cell corresponding thereto. The memory further includes a plurality of selection circuits, each of the selection circuits being operative to electrically connect a given one of the local word lines to a given one of the global word lines in response to a control signal applied thereto.

Abstract: A single memory array (10) has an isolation circuit for isolating segments of a same bit line (Seg1 BL0, Seg2 BL0) from each other. The isolation circuit (16) permits memory cells located in one segment (12) of an array to be read while memory cells of another segment (14) of the array are being erased. In one example, the isolation circuit (16) electrically couples the segments during a read or program of memory cells located on the second segment (Seg2 BL0). Program information stored in the single memory array may always be accessed while a portion of the same array is erased. Dynamic variation of the size of the isolated bit line segment occurs when multiple isolation circuits are used to create more than two array segments.

Abstract: A memory device includes a predecoder that receives a row address and responsively generates a plurality of memory block selection signals, a plurality of word line selection signals, a plurality of source line selection signals, and a plurality of sub-block selection signals including respective groups of signals that correspond to respective levels of a hierarchy of sub-blocks in a plurality of memory blocks. The device further includes a global decoder that receives the sub-block selection signals and responsively generates segment activation signals for respective segments of memory blocks that correspond to respective sub-blocks at a lowest level of the hierarchy of sub-blocks.

Abstract: A semiconductor memory includes a plurality of memory array partitioned into first and second memory banks in correspondence with one of a plurality of mask options such that the first memory bank includes at least one but less than all of the plurality of memory arrays and the second memory bank includes a corresponding remainder of the plurality of memory arrays. A first horizontal global row decoder is configured to receive a first subset of addresses for the first memory bank and in response provide a first plurality of predecoded row address signals on a first plurality of lines extending only across the at least one but less than all of the plurality of memory arrays. A second horizontal global row decoder is configured to receive a first subset of addresses for the second memory bank and in response provide a second plurality of predecoded row address signals on a second plurality of lines extending only across the corresponding remainder of the plurality of memory arrays.

Abstract: A NOR-type flash memory device includes a global decoder circuit that is coupled to global wordlines. The global decoder circuit drives the global wordlines using wordline voltages that will be applied to local wordlines in each operation mode, and has wordline select switches each corresponding to the global wordlines. A local decoder circuit couples the local wordlines to the global wordlines in response to a sector select signal, and a sector generates a control signal in accordance with address information for selecting a memory cell array. A switch circuit includes a plurality of depletion MOS transistors each being coupled between corresponding first and second wordline. The depletion MOS transistors are commonly controlled by a control signal. Each of the wordline select switches is made of two NMOS transistors.

Abstract: The preferred embodiments described herein provide a memory device and method for storing and reading data in a write-once memory array. In one preferred embodiment, a plurality of bits representing data is inverted and stored in a write-once memory array. When the inverted plurality of bits is read from the memory array, the bits are inverted to provide the data in its original, non-inverted configuration. By storing data bits in an inverted form, the initial, un-programmed digital state of the memory array is redefined as the alternative, programmed digital state. Other preferred embodiments are provided, and each of the preferred embodiments described herein can be used alone or in combination with one another. For example, the embodiments in which data bits are inverted can be used alone or in combination with the embodiments in which data is redirected.

Abstract: An integrated semiconductor memory includes a DRAM memory, in which primary sense amplifiers (SA) are coupled to a bit line (BL) of a respective cell block and can be connected to a common local data line (LDQ) by means of a respective assigned CSL switch in response to a CSL signal and in which an MDQ/LDQ switch arrangement connects a main data line (MDQ) to the local data line (LDQ) of a respective cell block in response to an MDQ/LDQ switch signal. In the case of the semiconductor memory, a control input of each CSL switch is connected to an AND element, which ANDs the CSL signal with the MDQ/LDQ switch signal and thereby activates the CSL switches only in cell blocks in which a word line has been activated.

Abstract: A nonvolatile memory device with simultaneous read/write has a memory array formed by a plurality of cells organized into memory banks, and a plurality of first and second sense amplifiers. The device further has a plurality of R/W selectors associated to respective sets of cells and connecting the cells of the respective sets of cells alternately to the first sense amplifiers and to the second sense amplifiers.