Abstract: Apparatuses and techniques are described for reading MRAM memory cells. In a cross-point memory array, each conductive line, such as a bit line or word line, is connected to a transistor pair comprising a pMOSFET in parallel with an nMOSFET. When selecting a memory cell to be read, a voltage of a first conductive line may be pulled up using the pMOSFET while a voltage of a second conductive line is pulled down, e.g., to 0 V, using the nMOSFET. This minimizes a capacitance while the selector is turned on. Further, when reading the selected memory cell, the parallel nMOSFET of the first conductive line may be turned on while the pMOSFET remains on. The nMOSFET adds a resistance which offsets a decreased resistance of the pMOSFET to allow accurate sensing of the voltage across the memory cell.

Abstract: Methods, systems, and devices related to auto-referenced memory cell read techniques are described. The auto-referenced read may encode user data to include a certain number bits having a first logic state prior to storing the user data in memory cells. Subsequently, reading the encoded user data may be carried out by applying a read voltage to the memory cells while monitoring a series of switching events by activating a subset of the memory cells having the first logic state. The auto-referenced read may identify a particular switching event that correlates to a median threshold voltage value of the subset of the memory cells. Then, the auto-referenced read may determine a reference voltage that takes into account a statistical property of threshold voltage distribution of the subset of the memory cells. The auto-referenced read may identify a time duration to maintain the read voltage based on determining the reference voltage.

Abstract: A preheating procedure for a non-volatile memory that can be used in a wide range of ambient temperatures is shown. The controller of the non-volatile memory operates the non-volatile memory to preheat the non-volatile to a temperature target. The controller avoids writing valid data to the non-volatile memory until preheating the non-volatile memory to the temperature target. The controller may write or read dummy data to or from the non-volatile memory until preheating the non-volatile memory to the temperature target.

Abstract: Methods, systems, and devices related to auto-referenced memory cell read techniques are described. The auto-referenced read may encode user data to include a certain number bits having a first logic state prior to storing the user data in memory cells. Subsequently, reading the encoded user data may be carried out by applying a read voltage to the memory cells while monitoring a series of switching events by activating a subset of the memory cells having the first logic state. The auto-referenced read may identify a particular switching event that correlates to a median threshold voltage value of the subset of the memory cells. Then, the auto-referenced read may determine a reference voltage that takes into account a statistical property of threshold voltage distribution of the subset of the memory cells. The auto-referenced read may identify a time duration to maintain the read voltage based on determining the reference voltage.

Abstract: Methods, systems, and devices related to auto-referenced memory cell read techniques are described. The auto-referenced read may encode user data to include a certain number bits having a first logic state prior to storing the user data in memory cells. Subsequently, reading the encoded user data may be carried out by applying a read voltage to the memory cells while monitoring a series of switching events by activating a subset of the memory cells having the first logic state. The auto-referenced read may identify a particular switching event that correlates to a median threshold voltage value of the subset of the memory cells. Then, the auto-referenced read may determine a reference voltage that takes into account a statistical property of threshold voltage distribution of the subset of the memory cells. The auto-referenced read may identify a time duration to maintain the read voltage based on determining the reference voltage.

Abstract: A trimming apparatus for adjusting an electric property of a trimming object circuit. The trimming apparatus includes a data input pad that receives an input of serial data, a shift register that outputs parallel setting data by shifting the received serial data, a trimming data generating circuit, and a cutting control circuit that controls application of an electric signal to the trimming data generating circuit. The trimming data generating circuit includes a plurality of trimming elements, each having a conductive part cuttable by a flow of the electric signal, a plurality of pull-up resistors respectively connected to high potential sides of the trimming elements, and a plurality of switches respectively connected to low potential sides of the trimming elements. The trimming data generating circuit is configured to generate trimming data for the trimming object circuit by switching the plurality of switches in accordance with a level of the setting data.

Abstract: Disclosed is a touch sensitive display device, including: a display panel configured to display an image according to received image data; a touch sensing unit configured to generate touch sensing signals in response to a touch; a data analyzing unit configured to determine a noise period from the image data; and a touch control unit configured to set a sensing period that is outside the noise period, and to calculate a touch position based on the touch sensing signals corresponding to the sensing period and not to the noise period.

Abstract: An operation method of a data storage apparatus includes performing a first read operation using an optimal read voltage on read-failed memory cells, performing ECC decoding operation on read data, performing a second read operation using an oversampling read voltage on the read-failed memory cells when the ECC decoding operation fails, determining whether potential error memory cells which are turned on through the optimal read voltage and are turned off through the oversampling read voltage are present in the read data, determining whether neighboring memory cells which share a bit line with the potential error memory cells and are coupled to neighboring word lines are in erased state when the potential error memory cells are present, and inverting bit values corresponding to the potential error memory cells in the read data from the read-failed memory cells through the first read operation when neighboring memory cells are in erased state.

Abstract: A semiconductor storage device includes a first memory area; a first selection circuit which selectively connects one of first lines to one of first bit lines of the first memory area, the first lines and the first bit lines extending in a first direction; a second memory area; a second selection circuit which selectively connects one of the first lines to one of second bit lines of the second memory area, the second bit lines extending in the first direction; and a third selection circuit which selectively connects one of the first lines to a global bit line and is arranged between the first selection circuit and the second selection circuit, and configured to select the first selection circuit and the second selection circuit. The first memory area, the first selection circuit, the third selection circuit, the second selection circuit, and the second memory area are aligned in this order in the first direction.

Abstract: There are provided a memory device and an operating method thereof. A memory device may include a memory block, peripheral circuits, and a control logic. The memory block may include a plurality of pages arranged in a vertical direction on a substrate. The peripheral circuits may perform a program operation on a selected page. The control logic may control the peripheral circuits to perform a first partial program operation of sequentially programming some of the pages up to a first page. The control logic may perform a first partial erase operation of erasing the other non-programmed pages. The control logic may perform a second partial program operation of partially programming the pages on which the first partial erase operation has been performed.

Abstract: Examples include techniques for a write zero operation. Example techniques include forwarding a write 0 command to a memory device to cause internal activations of column select lines of one or more blocks of memory to cause bit values or contents of the one or more blocks to have or store a value of 0.

Abstract: A semiconductor memory device includes a first electrode film and a second electrode film spreading along a first direction and a second direction, first insulating plates intermittently disposed along the first direction and each of two columns separated in the second direction from each other, second insulating plates provided between the two columns, intermittently disposed along the first direction and each of n columns, third insulating plates provided between one of the two columns and a column formed of the second insulating plates, intermittently disposed along the first direction, a first insulating member provided between the first insulating plate and the third insulating plate, and a second insulating member provided between the second insulating plate and the third insulating plate. The first electrode film is divided into two parts between the two columns. The second electrode film is divided into {(n+1)×2} parts between the two columns.

Abstract: Examples include techniques for a write zero operation. Example techniques include forwarding a write 0 command to a memory device to cause internal activations of column select lines of one or more blocks of memory to cause bit values or contents of the one or more blocks to have or store a value of 0.

Abstract: Apparatuses and methods for providing activation timings of sense amplifiers in a semiconductor device are described. An example apparatus includes: a first memory bank including at least one first sense amplifier that is enabled responsive to a first activation signal; a second memory bank including at least one second sense amplifier that is enabled responsive to a second activation signal; and a control circuit that receives a control signal. The control circuit includes a delay circuit that provides a delayed control signal by delaying the control signal, a first sense amplifier control circuit coupled to the first delay circuit and provides the first activation signal respective to the delayed control signal when the first memory bank is designated, and a second sense amplifier control circuit coupled to the delay circuit and provides the second activation signal respective to the delayed control signal when the second memory bank is designated.

Abstract: An embodiment of a method includes decreasing a difference of a voltage applied to a first select gate minus a voltage applied to a source while the first select gate is off, decreasing a difference of a voltage applied to a second select gate minus a voltage applied to a data line while the second select gate is off, and increasing a voltage of a signal applied to a selected access line that is coupled to an untargeted memory cell in a string of memory cells coupled to the first and second select gates to a program voltage after or substantially concurrently with decreasing the difference of the voltage applied to the first select gate minus the voltage applied to the source and with decreasing the difference of the voltage applied to the second select gate minus the voltage applied to the data line.

Abstract: Systems and methods are disclosed managing power and/or temperature in a data storage system. A hybrid data storage device comprises a disk component and a non-volatile semiconductor memory component. The data storage device further comprises a temperature sensor and a controller configured to receive a temperature signal from the temperature sensor indicating a temperature of at least a portion of the data storage device and, when the temperature is determined to be greater than a first temperature, manage power to the semiconductor memory according to a first power throttling state.

Abstract: A memory includes a number of storage elements connected to a pair of bit-lines, a bit-line pre-charging circuit, a sense amplifier connected to the pair of bit-lines through a column-select switch, a transition detection circuit connected to an output of the sense amplifier, and a local pre-charge control circuit connected to the transition detection circuit and having a local pre-charge control signal output connected to the bit-line pre-charging circuit.

Abstract: Provided are a non-volatile memory device, an electronic control system, and a method of operating the non-volatile memory device. A non-volatile memory device according to an embodiment of the present invention includes a first NAND cell array including a first group of pages, and a second NAND cell array including a second group of pages. A plurality of X-decoders are at least one-to-one connected to the first and second NAND cell arrays. A control logic controls the plurality of X-decoders to simultaneously sense data of a first page corresponding to a start address from among the first group of pages, and data of a second page subsequent to the first page from among the second group of pages.

Abstract: Techniques are presented to improve the performance, accuracy and power consumption of on-chip voltage biasing and transmission for highly loaded RC networks (such as wordlines or bitlines in NAND or 3D memory arrays) that are otherwise limited by the physics of RC time constant. When transitioning the near-end voltage of the network, an under-drive or over-drive level is applied, combined with feedback control to estimate when the far-end voltage approaches the desired level.

Abstract: Apparatuses, sense circuits, and methods for compensating for a voltage increase on a wordline in a memory is described. An example apparatus includes a bitline, a memory cell coupled to the bitline, a bipolar selector device coupled to the memory cell, a wordline coupled to the bipolar selector device, and a wordline driver coupled to the wordline. The apparatus further includes a model wordline circuit configured to model an impedance of the wordline and an impedance of the wordline driver, and a sense circuit coupled to the bitline and to the model wordline circuit. The sense circuit is configured to sense a state of the memory cell based on a cell current and provide a sense signal indicating a state of the memory cell. The sense circuit is further configured to adjust a bitline voltage responsive to an increase in wordline voltage as modeled by the model wordline circuit.

Abstract: A sense amplifier circuit comprising a pair of cross-coupled inverters and a data line charging circuit is disclosed. The cross-coupled inverters comprise a first inverter and a second inverter. The first inverter has a first pull-up transistor with a first pull-up terminal. The second inverter has a second pull-up transistor with a second pull-up terminal. The output of the first inverter is coupled to the input of the second inverter at a first sense amp node. The output of the second inverter is coupled to the input of the first inverter at a second sense amp node. The data line charging circuit has a first node connected to a data line and the first pull-up terminal. The data line charging circuit also has a second node connected to a complementary data line and the second pull-up terminal. The first and second pull-up transistors are coupled to different voltage levels when a sense amplifier enable signal is activated.

Abstract: A microcomputer includes a CPU, a protection information storage configured to store memory protection information specifying an access permission or a prohibited state to a memory space by a program executed by the CPU, a memory access control apparatus configured to determine whether or not to allow a memory access request from the CPU according to the memory protection information, and a reset apparatus configured to invalidate the memory protection information stored in the protection information storage according to a reset request signal output from the CPU to a switching of programs executed by the CPU, the reset request signal being based on a state of execution of the program by the CPU. The reset apparatus sets all valid bit storing fields of a plurality of protection setting registers of the protection information storage to invalid state in response to the reset request signal output by the CPU.

Abstract: Techniques for sensing a semiconductor memory device are disclosed. In one embodiment, the techniques may be realized as a semiconductor memory device comprising a plurality of memory cells arranged in an array of rows and columns and data sense amplifier circuitry coupled to at least one of the plurality of memory cells. The data sense amplifier circuitry may comprise first amplifier circuitry and resistive circuitry, wherein the first amplifier circuitry and the resistive circuitry may form a feedback loop.

Abstract: Apparatus and methods level shift a direct current (DC) component of a voltage rail signal from a first DC level to a second DC level such that voltage rail noise can be determined. The actual voltage rail noise can be compared to an expected amount of noise for analysis and validation of simulation models. Such assessment can be used to validate simulation models used to refine a design of an integrated circuit or as part of built-in self test.

Abstract: Subject matter disclosed herein relates to accessing memory, and more particularly to operation of a partitioned bitline.

Abstract: A semiconductor device including a memory block, which includes memory cells coupled to bit lines. The semiconductor device further includes a first sensing circuit coupled to an even bit line and configured to sense current flow through the even bit line in response to an even bit line control signal and an even discharge signal. The semiconductor device further includes a second sensing circuit coupled to an odd bit line and configured to sense current flow through the odd bit lines in response to an odd bit line control signal and an odd discharge signal. The first sensing circuit and second sensing circuit are configured to supply a ground voltage to the odd bit line when sensing the current flow through the even bit line, and to supply the ground voltage to the even bit line when sensing the current flow through the odd bit line.

Abstract: A sense amplifier circuit for a nonvolatile memory that includes a first amplifier to perform a switching operation to output a first signal on a sense amplifier based logic (SABL) node depending on the state of a sensing enable signal, a second amplifier to perform a switching operation to output a second signal on the SABL node depending on the state of the sensing enable signal, a current mirror that sinks current on the SABL node depending on the sensing enable signal and a bit line signal, and an inverter arranged to output the signal on the SABL node as a data signal.

Abstract: A data output circuit of a semiconductor device includes: a pattern data generation unit configured to generate pattern data in response to a bank selection signal, a variable delay unit configured to delay a source signal, which is generated in response to the bank selection signal, by a delay time corresponding to a delay control signal, a pattern control signal generation unit configured to generate a pattern control signal in response to an output signal of the variable delay unit, and a delay time control block configured to generate the delay control signal in response to the phases of the pattern control signal and the pattern data.

Abstract: Memory cells which have read noise are identified during a programming pass and an amount of programming is increased for noisy memory cells compared to non-noisy cells. The read noise is indicated by a decrease in the threshold voltage of a cell when the cell is repeatedly read. In one approach, during the programming pass, a cell enters a temporary lockout state when it passes a first verify test and is subject to one or more additional verify tests. Data is stored to identify the cell as a noisy cell or a non-noisy cell based on the one or more additional verify tests. Or, the cells are subject to the one or more additional verify tests at the end of the programming pass. In a subsequent programming pass, the noisy cell is programmed using a stricter verify condition. Or, the noisy cell is kept in an erased state.

Abstract: Memory cells which have read noise are identified during a programming pass and an amount of programming is increased for noisy memory cells compared to non-noisy cells. The read noise is indicated by a decrease in the threshold voltage of a cell when the cell is repeatedly read. During the programming pass, a cell enters a temporary lockout state when it passes a first verify test. In this state, the cell is subject to one or more additional verify tests. If the one or more additional verify tests indicate that the threshold voltage of a cell has decreased, the cell is noisy and is soft programmed before being permanently locked out. In contrast, programming of a non-noisy cell is concluded after the first verify test without further programming.

Abstract: Embodiments disclosed herein may relate to applying verify or read pulses for phase change memory and switch (PCMS) devices. The read pulses may be applied at a first voltage for a first period of time. A threshold event for the phase change memory cell may be detected during a sense window. The sense window may close after the expiration of the first period of time for which the read pulses are applied.

Abstract: The present disclosure includes methods, devices, and systems for outputting data particular quantization of data from memory devices and systems. Outputting data particular quantization of data can include enabling a particular one of a plurality of different quantizations of data. The particular one of the plurality of quantizations of data can then be output.

Abstract: A memory includes a redundant sense amplifier and a plurality of sense amplifier pairs. Each sense amplifier pair includes a first sense amplifier and a second sense amplifier. Each sense amplifier pair drives a common load line. The memory is configured to implement column redundancy using a single redundant sense amplifier without requiring local read lines for each sense amplifier.

Abstract: Methods and systems for time-based cell decoding for PCM memory. Generally, the higher the PCM element resistance, the longer it takes for a read output to change state. PCM memory output is determined using differentiated timings of read outputs changing state, rather than differentiated values of read outputs. In some single-bit single-ended sensing embodiments, a reference, with resistance between the resistances corresponding to a pair of adjacent logical states, is stored in multiple reference cells; a “vote” unit emits a clock signal when a majority of the reference cell read outputs transition at the vote unit. Timing units produce different binary outputs depending on whether a data read output or the clock signal changes state first at the timing unit. Time-based decoding provides advantages including improved temperature and drift resilience, improved state discrimination, improved reliability of multibit PCM, and fast and reliable sensing.

Abstract: A system on chip (SoC) includes one or more core logic blocks that are configured to operate on a lower supply voltage and a memory array configured to operate on a higher supply voltage. Each bitcell in the memory has two ferroelectric capacitors connected in series between a first plate line and a second plate line to form a node Q. A data bit voltage is transferred to the node Q by activating a write driver to provide the data bit voltage responsive to the lower supply voltage. The data bit voltage is boosted on the node Q by activating a sense amp coupled to node Q of the selected bit cell, such that the sense amp senses the data bit voltage on the node Q and in response increases the data bit voltage on the node Q to the higher supply voltage.

Abstract: A circuit including a memory circuit, the memory circuit includes a first plurality of memory arrays and a first plurality of keepers, each keeper of the first plurality of keepers is electrically coupled with a corresponding one of the first plurality of memory arrays. The memory circuit further includes a first current limiter electrically coupled with and shared by the first plurality of keepers.

Abstract: In a static random access memory (SRAM) device having a hierarchical bit line architecture, a local sense amplifier (SA) circuit includes P-channel transistors which precharge local bit lines connected to memory cells, P-channel transistors each having a gate connected to a corresponding one of the local bit lines and a drain connected to a corresponding one of global bit lines, and N-channel transistors each having a gate connected to a corresponding one of the global bit lines and a drain connected to a corresponding one of the local bit lines. As a result, restore operation to a non-selected memory cell during write operation can be achieved without the need of a fine timing control, the speed of read operation by a feedback function can be increased, and the area can be reduced.

Abstract: A system on chip (SoC) provides a memory array of self referencing nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node Q is formed between the two ferroelectric capacitors. The first plate line and the second plate line are configured to provide a voltage approximately equal to first voltage while the bit cell is not being accessed. A clamping circuit coupled to the node Q. A first read capacitor is coupled to the bit line via a transfer device controlled by a first control signal. A second read capacitor coupled to the bit line via another transfer device controlled by a second control signal. A sense amp is coupled between the first read capacitor and the second read capacitor.

Abstract: A system connects a signal driver to a first control line that is connected to a first non-volatile storage element, charges the first control line while the signal driver is connected to the first control line, disconnects the signal driver from the first control line while the first control line remains charged from the signal driver, connects the signal driver to a second control line that is connected to a second non-volatile storage element, charges the second control line using the signal driver while the signal driver is connected to the second control line, and disconnects the signal driver from the second control line. The disconnecting of the signal driver from the first control line, the connecting the signal driver to the second control line and the charging of the second control line are performed without waiting for the first non-volatile storage element's program operation to complete.

Abstract: A semiconductor device comprises a first region and a second region. The first region includes a plurality of memory cells each of which holds respective data and a plurality of sense amplifiers that respectively amplify the data in the plurality of memory cells, based on a first voltage. The second region is provided along one side of the first region and includes a first power supply generation circuit that generates the first voltage, based on a second voltage. The second voltage being supplied to the first power supply circuit by a first power supply interconnect extends on the first region in a first direction parallel to the one side of the first region.

Abstract: A system for controlling a refresh operation of a plurality of stacked semiconductor chips includes a first semiconductor configured to output a refresh signal for performing a refresh operation, and a semiconductor chip discrimination signal, and a plurality of second semiconductor chips configured to perform a refresh operation at different timings in response to the refresh signal, and the semiconductor chip discrimination signal.

Abstract: A semiconductor memory device includes at least one memory cell block and at least one connection unit. The at least one memory cell block has a first region including at least one first memory cell connected to a first bit line, and a second region including at least one second memory cell connected to a second bit line. The at least one connection unit is configured to selectively connect the first bit line to a corresponding bit line sense amplifier based on a first control signal, and configured to selectively connect the second bit line to the corresponding bit line sense amplifier via a corresponding global bit line based on a second control signal.

Abstract: A non-volatile memory device which includes a sensing mode selector configured to select a sensing mode according to environment information. A page buffer senses a data state of a memory cell in one of a plurality of sensing methods, depending upon the selected sensing mode.

Abstract: Systems and methods are described herein that reduce the read latency of a cache by separating read and write column select signals that cause the cache to initiate certain read and write operations, respectively.

Abstract: A memory device includes a data line sense amplifier configured to receive a sense amplifying power source voltage and a sense amplifying ground voltage through a sense amplifying power source line and a sense amplifying ground line, respectively, and sense-amplify data loaded on a pair of data lines, and a pre-charging unit configured to pre-charge and equalize the sense amplifying power source line and the sense amplifying ground line with a sense amplifying pre-charge voltage, generate the sense amplifying pre-charge voltage by voltage dividing the sense amplifying power source voltage and the sense amplifying ground voltage through a voltage dividing path including the sense amplifying power source line and the sense amplifying ground line, and apply the sense amplifying power source voltage to the sense amplifying power source line and the sense amplifying ground voltage to the sense amplifying ground line in response to a sense amplifying pre-charge control signal.

Abstract: A low voltage sensing scheme reduces active power down standby leakage current in a memory device. A clamping device or diode is used between a Psense amplifier control line (e.g. ACT) and Vcc and/or between an Nsense amplifier control line (e.g. RNL*) and Vss (ground potential). The clamping diode is not enabled during normal memory operations, but is turned on during active power down mode to reduce leakage current through ACT and/or RNL* nodes. The clamping device connected to the ACT node may reduce the voltage on the ACT line during power down mode, whereas the clamping device connected to the RNL* node may increase the voltage on the RNL* line during power down mode to reduce sense amplifier leakage current through these nodes. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: Methods of programming a memory, memory devices, and systems are disclosed, for example. In one such method, each data line of a memory to be programmed is biased differently depending upon whether one or more of the data lines adjacent the data line are inhibited. In one such system, a connection circuit provides data corresponding to the inhibit status of a target data line to page buffers associated with data lines adjacent to the target data line.

Abstract: A semiconductor memory device including a bit line connected to a memory cell and a sense amplifier configured to drive a voltage level of a global bit line in response to a voltage level of the bit line. The sense amplifier provides data that is complementary to data stored in the memory cell to the global bit line and provides the complementary data of the global bit line to the memory cell during an active operation of the memory cell.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: A semiconductor memory includes a first memory cell including: a first resistance change element and a first select transistor. The semiconductor memory includes a second memory cell including: a second select transistor and a second resistance change element. The semiconductor memory includes a third memory cell including: a third select transistor and a third resistance change element, the third memory cell acting as a reference cell. The semiconductor memory includes a fourth memory cell including: a fourth resistance change element and a fourth select transistor, the fourth memory cell acting as a reference cell.