Abstract: A solid state semiconductor storage device with temperature control function comprises a non-volatile memory unit, a temperature sensing element, and a control unit. The temperature sensing element is used for sensing the operation temperature of the solid state semiconductor storage device so as to provide a temperature sensing signal to the control unit. According to the temperature sensing signal, the control unit controls the operation mode of the solid state semiconductor storage device for achieving the function of temperature control.

Abstract: A one-transistor type DRAM including a floating body storage element connected between a bit line and a source line and controlled by a word line comprises a plurality of source lines and word lines arranged in a row direction, a plurality of bit lines arranged in a column direction, a plurality of clamp bit lines and reference bit lines arranged in a column direction, a cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a clamp cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a reference cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, and a sense amplifier and a write driving unit connected to the bit line and configured to receive a clamp voltage and a reference voltage.

Abstract: A signal masking circuit includes a detection circuit, a delayed read data strobe signal generation circuit, a gating circuit, a counting circuit, and a masking circuit. The detection circuit detects a period of a logic “L” of a read data strobe signal. The gating circuit gates a delayed read data strobe signal, and generates a first masked read data strobe signal. The counting circuit counts the falls of the first masked read data strobe signal until the count reaches a predetermined number, and generates a masking signal for masking the first masked read data strobe signal. The masking circuit masks the first masked read data strobe signal, and outputs a second masked read data strobe signal.

Abstract: A semiconductor storage device comprises of a memory cell connected to a plate line and a bit line, a potential shift circuit which is connected to a bit line, temporarily changes in output voltage corresponding to the voltage change of the bit line when a voltage is applied to the plate line, a charge transfer circuit for transferring charge stored on the potential shift circuit corresponding to the temporary output voltage change of the potential shift circuit, and a charge accumulation circuit for generating a read voltage from a memory cell after accumulating the transferred charge.

Abstract: A memory device includes a memory array and a sense amplifier. The memory array includes a floating body cell configured to store a bit value. The sense amplifier includes a bit output configured to provide an output voltage representative of the bit value and a reference source configured to provide a reference voltage. The sense amplifier further includes a current mirror configured to provide a current to the first floating body cell based on the reference voltage, and a differential amplifier circuit configured to determine the output voltage based on the reference voltage and a voltage across the floating body cell resulting from application of the current to the floating body cell.

Abstract: A sense amplifier of a DRAM includes, in series between two terminals of application of a supply voltage, at least one first transistor of a first channel type, and an amplification stage formed of two parallel branches each including a second transistor of the first channel type in series with a transistor of a second channel type. The gates of the transistors of a same branch are connected to the junction point of the transistors of the other branch. Each branch including at least one first additional transistor of the first channel type in parallel with at least each second transistor of the first channel type.

Abstract: A semiconductor memory device has a memory cell having a hierarchical bit line structure for large capacity even in a small cell size. The semiconductor memory device comprises a unit cell configured to read/write data, a cell data sensing unit configured to adjust a current amount of a main bit line depending on a sensing voltage of a sub bit line when data are sensed, and a write control unit configured to store data in the corresponding unit cell depending on a current level applied from the main bit line to the sub bit line.

Abstract: A semiconductor memory device is provided to improve the tAA characteristics. The semiconductor memory device includes: a discrimination signal generating unit for generating a first discrimination signal denoting a write operation of the semiconductor memory device; a selective delay unit for delaying a command-group signal in response to a second discrimination signal; and a fuse unit for generating the second discrimination signal based on the first discrimination signal, the second discrimination signal determining whether the selective delay unit selectively delays the command-group signal in response to the first discrimination signal.

Abstract: A semiconductor memory device includes a memory cell array and a sense amp circuit. The memory cell array includes bit lines connected to memory cells operative to store first logic data and second logic data smaller in cell current than the first logic. The sense amp circuit has a clamp transistor operative to clamp a bit line voltage. The sense amp circuit is operative to detect data in a selected memory cell via the clamp transistor and the bit line. The sense amp circuit is operative to read data from the selected memory cell in at least the two of first and second read cycles while a control voltage is applied to a gate of the clamp transistor. Different control voltages are applied to the gate of the clamp transistor in the first and second read cycles.

Abstract: Memory devices are described herein along with method for operating the memory device. A memory cell as described herein includes a first electrode and a second electrode. The memory cell also comprises phase change material having first and second active regions arranged in series along an inter-electrode current path between the first and second electrode.

Abstract: In a memory readout circuit for use in a phase-change memory device comprising phase-change elements as memory cells, a sense amplifier sets readout voltage, which is applied to a selected phase-change element selected among the phase-change elements by a column selecting switch, to voltage equal to or higher than hold voltage of the selected phase-change element but lower than transition voltage of the selected phase-change element in a readout cycle. The selected phase-change element is read out as a dynamic state in the case where the selected phase-change element is in a set state.

Abstract: A design structure comprising a differential fuse sensing system, which includes a fuse leg configured for introducing a sense current through an electrically programmable fuse (eFUSE) to be sensed, and a differential sense amplifier having a first input node coupled to the fuse leg and a second node coupled to a reference voltage. The fuse leg further includes a current supply device controlled by a variable reference current generator configured to generate an output signal therefrom such that the voltage on the first input node of the sense amplifier is equal to the voltage on the second input node of the sense amplifier whenever the resistance value of the eFUSE is equal to the resistance value of a programmable variable resistance device included within the variable reference current generator.

Abstract: A semiconductor device comprises a first memory cell comprising more than seven transistors and storing data in a latch circuit; and a second memory cell storing data in a capacitor; a sense amplifier having about the same circuit configuration of the first memory cell and detecting data stored in the second memory cell.

Abstract: A semiconductor memory device includes a sense amplifier SA, a pair of bit lines BLT, BLB, a transfer switch SW provided between the sense amplifier SA and the pair of bit lines BLT, BLB, a precharge circuit PC that precharges the sense amplifier SA and the pair of bit lines BLT, BLB at the same potential, and a control circuit CTL. The control circuit CTL sets the transfer switch SW in the off state in the state before data is written or read, and turns on the transfer switch SW when writing or reading data via the pair of bit lines BLT, BLB. With this arrangement, a defective current flowing to the sense amplifier SA can be decreased, even when a word line WL and a bit line BL are shortcircuited.

Abstract: A hybrid circuit for a memory includes: a skewed static logic gate circuit; a dynamic pre-discharge device coupled with the skewed static logic gate circuit for operating the static logic gate circuit as a dynamic circuit.

Abstract: A memory device includes a refresh generator and a refresh command generation circuit. The refresh generator generates a refresh signal for a refresh operation enable. The refresh command generation circuit logically combines the refresh signal and a reset signal to produce a refresh command. The refresh command generation circuit produces the refresh command only when either the refresh signal or the reset signal is enabled.

Abstract: A semiconductor memory device includes a bank, a data transfer line, a precharge control circuit, and a precharge line. The bank includes a multiplicity of cell mats arranged in a matrix form. Each of the cell mats has a plurality of unit cells. The data transfer line arranged between the cell mats transfers a data signal outputted from a selected cell mat among the cell mats. The precharge control circuit disposed on the edge of the bank controls the precharge of the data transfer line. The precharge line arranged between first and second cell mats transfers a precharge voltage to the precharge control circuit. The first and the second cell mats are disposed in the center of the bank.

Abstract: A semiconductor memory device which has a normal memory cell array and a redundant memory cell array for replacing a failure bit in the normal memory cell array, having: a memory cell array having a plurality of word lines, a plurality of bit line pairs crossing the word lines, and a plurality of memory cells placed at the crossing positions; and a plurality of sense amplifier circuits which are placed between adjacent memory cell arrays and are shared by bit line pairs of memory cell arrays on both sides. And a current interrupting circuit for disconnecting the sense amplifier and the bit line pairs in a column having a failure is formed respectively between the sense amplifier circuit and the bit line pairs on both sides. By this current interrupting circuit, short-circuit current from the sense amplifier circuit to the shorted area can be suppressed.

Abstract: A circuit measures current passing through a memory cell in a NAND flash memory. The circuit includes a decoder and an analog mixer. The decoder is configured to select at least one data line coupled to page buffers and column decoders in accordance with a controlling signal. The analog mixer is configured to output current passing through the selected data line, or to couple all of the data lines to a means for measuring current in accordance with a total current measurement controlling signal.

Abstract: A 4-transistor non-volatile memory (NVM) cell includes a static random access memory (SRAM) cell structure. The NVM cell utilizes a reverse Fowler-Nordheim tunneling programming technique that, in combination with the SRAM cell structure, allows an entire array to be programmed at one cycle. Equalize transistors are utilized to obtain more uniform voltage on the floating gates after an erase operation. Utilization of decoupling pas gates during a read operation results in more charge difference on floating gates of programmed and erased cells.

Abstract: A memory device is provided which has: a memory cell to store data; a word line to select the memory cell; a bit line connectable to the selected memory cell; a precharge power supply to supply a precharge voltage to the bit line; a precharge circuit to connect or disconnect the precharge power supply to or from the bit line; and a current limiting element to control the magnitude of a current flowing between the precharge power supply and the bit line at least by two steps according to an operation status.

Abstract: An array of non-volatile memory cells arranged in logical columns and logical rows, and associated circuitry to enable reading or writing one or more memory cells on a row in parallel. In some embodiments, the array of memory cells may include a phase change material. In some embodiments, the circuitry may include a write driver, a read driver, a sense amplifier, and circuitry to isolate the memory cells from the sense amplifier with extended refresh.

Abstract: A data bus sense amplifier circuit can include a first sense amplifier block configured to provide first amplified signals by sensing inputted signals, a second sense amplifier block configured to provide second amplified signals by sensing the first amplified signals, and a sense amplifier control unit configured to provide first and second enable signals which control activations of the first and second sense amplifier blocks, respectively, wherein the sense amplifier control unit controls the first enable signal to be synchronized with the second enable signal so that the first enable signal is inactivated.

Abstract: A semiconductor device of this invention includes a first circuit for initializing a predetermined circuit in accordance with the level of a power source voltage, a second circuit for controlling the output from the first circuit by activation or deactivation, and an activation control circuit for activating or deactivating the second circuit in accordance with external input.

Abstract: A memory device having a memory core is described. The memory device includes a clock receiver circuit, a control interface, a data interface, a delay locked loop circuit, a read pipeline circuit and a circuit to provide an internal clock signal. The clock receiver circuit receives an external clock signal. The control interface receives a command that specifies a read operation to the memory device. The data interface transfers data between the memory device and an external set of signal lines. The delay locked loop circuit, coupled to the clock receiver circuit, to generate the internal clock signal using the external clock signal. The read pipeline circuit provides read data accessed from the memory core to the data interface. The circuit provides the internal clock signal to the read pipeline circuit in response to receipt of the command that specifies the read operation.

Abstract: A cell array selection circuit, a cell array bit line precharge circuit, and a sense amplifier bit line precharge circuit are provided in a semiconductor storage apparatus. In a standby state of read/write operation, the cell array selection circuit is controlled to an inactive state, and the bit line precharge circuits are controlled to an active state. In an active state of read/write operation, the cell array selection circuit to be selected is controlled to an active state, and the cell array bit line precharge circuit and the sense amplifier bit line precharge circuit are controlled to an inactive state. Cell array selection transistors, sense amplifier bit line precharge transistors, and control signals supplied to gate electrodes of the transistors are set in which change in potential provided on a cell array bit line pair when the states of the transistors change is cancelled.

Abstract: A method processes parallel electrical signals, using parallel processing circuits that process successive cycles of electrical signals according to a rule for allocating electrical signals to the processing circuits. The method comprises, between the processing cycles, a step of modifying the rule for allocating electrical signals to the processing circuits, so that a processing circuit processes electrical signals of different ranks during different processing cycles. The method can be applied particularly to secure a memory during read phases of the memory and of an integrated circuit with a microprocessor using such a memory.

Abstract: A sense amplifier having an amplifier stage with decreased gain is described. The sense amplifier includes a first input/output (“I/O”) node and a second complementary I/O node. The sense amplifier includes two amplifier stages, each for amplifying a signal on one of the I/O nodes. The first amplifier stage, having a first conductivity-type, amplifies one of the I/O node towards a first voltage. The second amplifier stage, having a second conductivity-type, amplifies the other I/O node towards a second voltage. The sense amplifier also includes a resistance circuit coupled to the second amplifier stage to reduce the gain of the second amplifier stage thereby reducing the rate of amplification of the signal on the corresponding I/O node.

Abstract: A fuse information control device having a delay circuit to delay an active signal, includes a fuse circuit that outputs fuse information in response to a fuse information control signal, and a fuse information control signal generating unit that generates the fuse information control signal in response to one of the active signal and internal delay signals of the delay circuit.

Abstract: The present invention provides a semiconductor memory and a control method therefor, the semiconductor device including a first current-voltage conversion circuit (16) connected to a core cell (12) provided in a nonvolatile memory cell array (10), a second current-voltage conversion circuit (26) connected to a reference cell (22) through a reference cell data line (24), a sense amplifier (18) sensing an output from the first current-voltage conversion circuit and an output from the second current-voltage conversion circuit, a compare circuit (28) comparing a voltage level at the reference cell data line with a predefined voltage level, and a charging circuit (30) charging the reference cell data line, if the voltage level at the reference cell data line is lower than the predefined voltage level during pre-charging the reference cell data line. According to the present invention, the pre-charging period of the reference cell data line can be shortened, and the data read time can be shortened.

Abstract: A memory capable of suppressing reduction of data determination accuracy is provided. This memory includes a memory cell connected to a bit line for holding data and a bipolar transistor whose base is connected to the bit line. In data reading, the memory reads the data by amplifying a current, corresponding to the data of the memory cell, appearing on the bit line with the bipolar transistor.

Abstract: A computer memory includes a primary self-timing signal path defined by a model wordline signal path and a model bitline signal pair path. The primary self-timing signal path is defined to generate and transmit a model bitline signal pair. The computer memory also includes a control block defined to receive the model bitline signal pair from the primary self-timing signal path. The control block is defined to sense when a distinctive differential exists between the signals of the model bitline signal pair. The control block is further defined to generate and transmit a sense enable signal to a memory core upon sensing the distinctive differential between the signals of the model bitline signal pair.

Abstract: A flash memory device is programmed by loading first data into a page buffer of a first mat. Second data is loaded into a page buffer of a second mat while programming the first data in a first memory block of the first mat.

Abstract: A semiconductor memory device having a memory cell including a flip-flop; and a memory cell power supply circuit for supplying a low voltage cell power supply voltage to the memory cell. The memory cell power supply circuit supplies a cell power supply voltage in a first period and a different cell power supply voltage in a second period, a predetermined first power supply voltage in a case where the cell power supply voltage is supplied in a data read cycle and in a case where data is not written to a memory cell to which the cell power supply voltage is supplied in a write cycle, and a second power supply voltage higher than the first power supply voltage in a case where data is written to a memory cell to which the cell power supply voltage is supplied in a write cycle.

Abstract: A circuit for generating a write data mask signal in a synchronous semiconductor memory device includes an output unit and a reset control unit. The output unit controls a write data mask operation of the synchronous semiconductor memory device, latches a write data mask signal, and outputs an internal write data mask signal, in response to an internal clock signal. The reset control unit generates a reset signal for resetting the internal write data mask signal, in response to a write column disable signal indicating an activation end point of a column selection line signal generated when a write operation including the write data mask operation is performed. While the synchronous semiconductor memory device performs a gapless write data mask operation included in a gapless write operation, the reset signal is deactivated so that the write data mask signal is not reset.

Abstract: A computer memory includes a sense enable control module for generating a sense enable signal for a memory core. The sense enable control module includes an active side for transmitting the sense enable signal for the memory core, and a calibration side for determining when the sense enable signal is to be transmitted by the active side. Both the active side and the calibration side are defined to receive a timing signal. The active side is defined to transmit a delayed version of the timing signal as the sense enable signal for the memory core. The calibration side is defined to adjust the delay amount associated with the delayed version of the timing signal to be transmitted by the active side based on a determined sufficiency of the delay amount.

Abstract: A semiconductor memory device and a self-refresh method in which the semiconductor memory device includes a plurality of input/output ports having respective independent operation, a period of self-refresh through one of the plurality of input/output ports being subordinate to a kind of operation through another input/output port. Whereby, a refresh characteristic in a multi-port semiconductor memory device including a dual-port semiconductor memory device may be improved.

Abstract: A sense amplifier enable signal generator has two stages. Each stage offsets transistor performance variation in the other stage to produce an enable signal output relatively immune from the effects associated with transistor mismatches. In one embodiment, a memory device comprises a plurality of memory cells, sense amplifier circuitry and the enable signal generator. The sense amplifier circuitry is coupled to one or more of the memory cells and senses the state of the one or more memory cells when enabled. The enable signal generator has first and second stages and generates an enable signal applied to the sense amplifier circuitry. The enable signal generator counteracts delay variation when generating the enable signal so that operation of the enable signal generator is substantially unaffected by transistor performance variation in either stage of the enable signal generator.

Abstract: Systems and methods for reducing instability and writability problems arising from relative variations between voltages at which memory cells and logic components that access the memory cells operate by inhibiting memory accesses when the voltages are not within an acceptable operating range. One embodiment comprises a pipelined processor having logic components which receive power at a first voltage and a set of SRAM cells which receive power at a second voltage. A critical condition detector is configured to monitor the first and second voltages and to determine whether the ratio of these voltages is within an acceptable range. When the voltages are not within the acceptable range, an exception is generated, and an exception handler stalls the processor pipeline to inhibit accesses to the SRAM cells. When the voltages return to the acceptable range, the exception handler resumes the pipeline and completes handling of the exception.

Abstract: A trial programming process is performed for a first set of one or more non-volatile storage elements to test usage of the non-volatile storage system. Based on this trial programming, a programming signal is calibrated by adjusting its initial magnitude. The calibrated programming signal is then used to program a second set of non-volatile storage elements (which may or may not include the first set).

Abstract: A flash memory device includes a flash cell array, a first flash fuse cell fusing circuit, a second flash fuse cell fusing circuit, a third flash fuse cell fusing circuit and a plurality of fuse sense amplifying circuits. The first, second and third flash fuse cell fusing circuits all share bit lines with a flash cell array and have flash fuse cells. The first flash fuse cell fusing circuit may be used to control a connection between the flash cell array and an external logic circuit. The second flash fuse cell fusing circuit may be used to change an address of a defective cell into an address of a redundancy cell. The third flash fuse cell fusing circuit may be used to control a DC level for adjusting a reference value used in a manufacturing process of the flash memory device. The fuse sense amplifying circuits are coupled to the bit lines to read data from the bit lines, respectively.

Abstract: A semiconductor memory device includes a memory-cell array, a read bit line, a write bit line, a sense amplifier, a first sense line, a second sense line, a first bit line switch, and a second bit line switch. The memory-cell array is laid out to form an array. The read bit line is shared by plural memory cells and connected to a data output node. The write bit line is shared by plural memory cells and connected to a data input node. The sense amplifier is configured to sense a difference in electric potential. The first sense line is connected to one of the input terminals. The second sense line is connected to the other input terminal. The first bit line switch is configured to control electrical connection and disconnection. The second bit line switch is configured to control electrical connection and disconnection.

Abstract: An input/output sense amplifier (IOSA) controller of a semiconductor memory device includes an auto pulse generator and a latch enable signal generating circuit. The auto pulse generator generates an auto pulse signal having a first pulse shape. The latch enable signal generating circuit generates a first latch enable signal having a second pulse shape in response to an auto pulse signal in normal mode, and generates a second latch enable signal having a level shape that is enabled for long duration in response to the write enable bar signal in test mode. Accordingly, the semiconductor memory device including the IOSA controller may safely test a characteristic of the IOSA.

Abstract: A redundant memory array has r columns of redundant memory cells, r redundant senses, and a redundant column decoder. Redundant address registers store addresses of defective regular memory cells. Redundant latches are provided in n groups of r latches. Redundancy comparison logic compares addresses of defective regular memory cells with an external input address. If the comparison is true, what is provided is: a DISABLE_LOAD signal to disable the regular senses for one of the n groups of m columns, an ENABLE_LATCH signal to one of the n groups of m columns to disables corresponding regular senses, and one or r REDO signals to a respective one of the r redundant latches in one of the n groups that is disabled. The selected one of the redundant latches activates one of the r redundant senses to access a redundant column.

Abstract: The present invention provides a self-refresh period adaptable for testing cells that are weak against hot temperature stress. An apparatus for controlling a self-refresh operation in a semiconductor memory device includes a first period selector for generating one of a period-fixed pulse signal having a constant period and a period-variable pulse signal having a variable period based on a temperature of the semiconductor memory device in a test mode; and a self-refresh block for performing the self-refresh operation in response to an output of the first period selector.

Abstract: Methods and apparatuses to decrease power consumption and reduce leakage current of integrated circuits are disclosed. New leakage power saving techniques for various types of integrated circuits, including cache memory circuits, are discussed. Embodiments comprise methods and apparatuses to reduce power consumption in integrated circuits by using virtual voltage rails, or virtual power rails, to supply power to integrated circuit loads. The methods and apparatuses generally involve using one or two virtual power control devices to “head” and “foot”, or sandwich, the integrated circuit loads from firm power supply rails. In these method embodiments, one or more elements sense the voltage of the virtual power rails, or nodes, and make adjustments to control the voltage at certain “virtual” voltage potentials. While controlling the voltage in this manner, the virtual power control devices may serve to restrict unnecessary current flow through the integrated circuit loads.

Abstract: A circuit is for generating an internal enabling signal for the output buffer of a memory as a function of external commands for enabling the memory and for outputting data. The circuit may be input with the external command for enabling the memory and with internally generated flags signaling when the memory is being read and when a read operation of data from the memory ends. The circuit may generate a first intermediate signal having a null logic value when the memory is enabled and the read operation of data from the memory ends. The circuit may further generate the internal enabling signal as a logic NOR between the first intermediate signal and a logic OR between the external command enabling the memory and the external command for outputting data.

Abstract: A semiconductor memory device includes first and second cell arrays which have memory cells arrayed in row and column directions, first and second bit lines which are connected to the memory cells arrayed in the column direction, and first and second sense amplifiers which are connected to the first, second bit lines, respectively. The device also includes first and second dummy cell arrays which have dummy cells arrayed in the row and column directions, a dummy word line which is connected to the dummy cells arrayed in the row direction, first and second dummy bit lines which are connected to the dummy cells arrayed in the column direction and receive an output from the dummy word line, and first and second sense amplifier activation circuits which activate the first, second sense amplifiers in accordance with first and second control signals output from the first and second dummy bit lines, respectively.

Abstract: A sense amplifier of a DRAM includes, in series between two terminals of application of a supply voltage, at least one first transistor of a first channel type, and an amplification stage formed of two parallel branches each including a second transistor of the first channel type in series with a transistor of a second channel type. The gates of the transistors of a same branch are connected to the junction point of the transistors of the other branch. Each branch including at least one first additional transistor of the first channel type in parallel with at least each second transistor of the first channel type.

Abstract: A semiconductor memory device includes an over driver for driving a pull-up power line of a bit line sense amplifier by an over driving signal, a normal driver for driving the pull-up power line of the bit line sense amplifier by a normal driving signal, and a driving signal generating circuit, in response to a write signal, for generating a driving signal to drive the over driver for a predetermined interval and thereafter to drive the normal driver.